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UMC’s Singapore fab to break ground in April

Chiali Chen, Taipei; Heidi Chu, DIGITIMES Asia Wednesday 21 March 2001 0

Ground-breaking for the new 12-inch fab in Singapore in which United Microelectronics Corporation (UMC) and Infineon Technologies are investing US$3.6 billion will begin on April 12, UMC chairman John Hsuan recently announced. The fab is slated to begin...

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