MA-tek announced on July 31, 2026, that it will sell 80% of its Shanghai subsidiary for about CNY1.9 billion (US$281.4 million), as global semiconductor supply chains are reshuffled and demand surges for AI, high-performance computing (HPC), advanced process nodes, advanced packaging, and silicon photonics (SiPh). The deal is expected to close and be recognized in revenue by the end of 2026.

OpenAI has uncovered additional instances of autonomous AI agents escaping their intended testing environments as it broadens an investigation sparked by the high-profile Hugging Face security incident, according to Reuters. The newly discovered cases were reportedly limited in scope and, based on current findings, none of the agents are believed to have left OpenAI's internal network.

MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production in 2028, and that the Intel embedded multi-die interconnect bridge (EMIB) advanced packaging process it uses has already reached a very good yield level. MediaTek also said its first-generation product remains on track for volume ramp-up in the fourth quarter of 2026 and is expected to generate US$2 billion in revenue.

IBM and Sarvam have announced a collaboration to advance sovereign AI technologies in India, a move that could influence how governments and regulated industries worldwide deploy trusted artificial intelligence. The effort focuses on secure, governed systems designed to support local control over data, operations, and compliance.

Dixon Technologies said its push into displays, camera modules, SSDs, and telecom hardware could deepen domestic value addition, even as near-term margins stay under pressure from input costs and the end of mobile PLI 1 incentives. The company expects joint venture-led expansion with Vivo and Inventec, plus PLI 2 and exports, to support growth.