Foxconn Interconnect Technology (FIT) announced on September 7, 2026, that it has secured a patent license from competitor Amphenol for high-speed backplane connector solutions. The two companies also issued a joint statement, saying the collaboration marks an important milestone in advancing core technologies for the AI era and will let them offer customers a more complete service package.
As humanoid robots increasingly move from demonstrations toward factories and commercial deployments, competition is expanding beyond finished robots into the components that determine their cost, weight and ability to move precisely.
This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's era of pervasive digital connectivity, from smart glasses to cars to phones, this event is expected to give us a glimpse into the hardware supply chain behind these devices, and increasingly behind the global AI infrastructure build-out.
Industrial computer maker Ennoconn Technologies said its business recorded growth in August 2026 across all three of its main business units, supported by stronger demand for Physical AI applications and continued progress in semiconductor high-tech fab construction projects. The company also said its public tender offer for Kontron AG had been completed, raising its stake to about 48.36%.
Advantech will open its new North America headquarters campus in Tustin, California, on October 21, Taipei time, adding localized manufacturing and service capacity as demand linked to AI deployment continues to rise in the US. The industrial computer maker said the site will support faster delivery, more customization and stronger technical support for regional customers.
Huawei's September 7 product launch was more than a Mate XT 2 and Kirin 9050 Pro refresh. HarmonyOS 7 and an upgraded Celia reveal a broader strategy: make the operating system the control layer connecting on-device AI, applications, user data, and multiple devices.
Kinko announced its consolidated revenue for August 2026 on September 8, reaching NT$557 million, up 6.2% from NT$524 million in July and surging 106.8% from NT$269 million(US$17.58 million) a year earlier. It marked the company's largest year-on-year monthly revenue increase so far in 2026.
Intel's PC CPU prices have continued to rise since the end of 2025, and supply chain sources said the company is expected to raise them by another 10%. Its low-margin small-core line is likely heading toward end-of-life (EOL) as CEO Lip-Bu Tan reshapes the business to cut low-margin products and lift overall profitability.
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.
Chicony Electronics said August 2026 revenue came under pressure as higher raw-material costs and shortages of key semiconductor components slowed customer orders, with notebook shipments weakening in particular. The Taiwan-based supplier also said it had secured an exclusive position in the supply chain of a well-known U.S. robotics startup, with shipments expected to begin in 2027.
Malaysia is evaluating Huawei Technologies' Ascend 910C accelerators as the compute backbone of its MYR2 billion (US$494 million) sovereign AI initiative, which is designed to keep national data under domestic control, Bloomberg reported on Sept. 7, citing people familiar with the matter. The number of chips under consideration remains unclear, and no supplier decision has been announced.
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