Acer reported June consolidated revenue of NT$27.818 billion (US$864.8 million), up 6.3% from May, as the Taiwanese PC maker posted its strongest second-quarter revenue in 13 years. Second-quarter consolidated revenue reached NT$85.296 billion, rising 28.2% year on year, while first-half revenue climbed 23.3% to NT$157.727 billion.
India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.
SuperAlloy Industrial posted June consolidated revenue of NT$749 million (US$23.36 million), up 17.93% from May and 21.46% from a year earlier. The Taiwan-based materials maker said the increase helped lift second-quarter 2026 revenue to NT$1.98 billion, a 15.45% rise from a year earlier, while first-half 2026 revenue reached NT$3.852 billion, up 6.02%.
As AI server supply chains move into the component stocking phase, the market for high-end passive components has heated up sharply, with tight supply of multilayer ceramic capacitors (MLCCs) drawing close attention across the industry. Taiwan passive-component makers posted strong revenue in the second quarter of 2026, and with order backlogs at major MLCC suppliers in Japan and South Korea rising rapidly, Taiwan firms are expected to capture spillover orders from AI server applications in the second half of the year.
SK hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging density, thermal control, and tighter integration with AI accelerators.
Optical leader Largan Precision said on July 9 that customer demand for new smartphones is picking up in the second half, while Chairman En-Ping Lin highlighted that strong technology and yield remain the decisive edge in a tougher market. He also said the company's high-end variable aperture lens will ramp in the third quarter, and periscope lens upgrades are set for 2027.
Ed Chi, vice president of research at Google DeepMind, said AI's next milestone will be its evolution from the fast, pattern-recognition-oriented thinking associated with System 1 toward the deeper reasoning capabilities of System 2. As large language models evolve into large reasoning models, the industry is now entering a new era of AI agents.
GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory (HBM), advanced packaging, and liquid-cooled server racks. As the industry races to expand computing capacity, GPUs have largely defined the conversation. That dynamic, however, may be beginning to change as CPUs diverge from the rims of AI narration, and increasingly emerge as a critical component of AI infrastructure.
Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was intended to improve capital efficiency and optimize its ownership structure, while Egis remained an important shareholder with about 12% of iCatch after the transaction.
Flexible circuit board maker Complex Micro Interconnection (CMI) said June 2026 revenue rebounded as consumer electronics shipments increased, even as shortages in automotive components and notebook memory continued to affect customers. The company also reported second-quarter revenue of NT$597 million (US$18.55 million), up 3.6% from the prior quarter.
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