Global Electronics Association survey data show that demand across the global electronics manufacturing industry maintained steady expansion in the first half of 2026, with orders, shipments, and capacity utilization strengthening in most months. Capacity utilization, in particular, reached an all-time high since the survey began in June.
MediaTek has reportedly landed major orders for Google TPU products in recent years, even appearing to challenge Broadcom's position. At a recent earnings call, MediaTek also raised its 2027 ASIC market share target to 15% to 20%, and industry watchers largely credit that goal to the breadth of MediaTek's ASIC services.
The intensifying US-China technology rivalry is moving beyond export controls and semiconductor restrictions. What comes next could matter more: the formation of competing international AI ecosystems.
As SpaceX accelerates its push into space-based AI data centers and NVIDIA brings Jetson GPUs into lunar exploration missions, the race to build computing infrastructure beyond Earth is moving from proof-of-concept experiments toward actual deployment.
As physical AI and robotics draw unprecedented market attention, a key bottleneck is clogging the deployment pipeline: quality, real-world physical data. To move applications from the lab to real-world deployment, companies are getting creative in overcoming this obstacle while balancing affordability, stability, and data volumes.
