DeepSeek is preparing a new fundraising round and a possible Shanghai listing as surging computing costs force one of China's best-known artificial intelligence startups to rethink its long-standing resistance to outside capital.
A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives to discuss AI applications, semiconductor supply chains, smart manufacturing and innovation. Terry Tsao, SEMI's global marketing chief and head of the organization's operations in Taiwan, told DIGITIMES before the event that IBM has already demonstrated 2nm chip manufacturing capability in the lab, but the biggest challenge for its licensed partner, Japanese chipmaker Rapidus, to achieve mass production in Hokkaido will be yield.
OnePlus is exiting the North American and European markets for its future product launches, while sales of new Realme products will be suspended within its home market of China. The changes to both Oppo sub-brands signal the challenges low- to mid-tier brands face amid rising component costs and a tough global smartphone market this year.
Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom in Singapore to build panel-level advanced packaging (PLP) manufacturing capacity, with the planned investment totaling US$400 million.
China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed interconnects, and computing efficiency dominating WAIC 2026.
Vietnam has opened direct access to green electricity for companies, easing a major obstacle for Foxconn and its suppliers as global electronics makers shift production away from China. The change could help global supply chains expand in Vietnam while also increasing pressure on the country's power system, renewable capacity, and environmental management.
Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products crowd out capacity. With supply tight across the chain, customers are now focusing on securing shipments first, even as new price-hike notices arrive in the third quarter of 2026.
As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.
