Apple is positioning AI as the foundation of its next growth phase, combining a privacy-focused AI strategy with expanded US semiconductor sourcing to support future products and services. However, regulatory barriers in Europe and China could determine the pace at which the company monetizes its AI ecosystem globally.
Apple's June quarter showed the strength of its core hardware business. Still, it also exposed a looming challenge: rising memory prices, tight supply of advanced chips, and heavier AI investment could squeeze margins in the coming quarter. The company said demand remains strong, even as costs and constraints intensify.
Amazon reported stronger-than-expected second-quarter results as accelerating growth at its cloud computing business underscored rising demand for artificial intelligence services. While the company lifted its capex forecast and projected third-quarter revenue slightly below market expectations, management said expanding infrastructure remains necessary to address sustained AI demand.
Apple reported stronger-than-expected fiscal third-quarter results, driven by robust iPhone and Mac demand, but warned that supply constraints and rising memory costs would weigh on growth in the current quarter. The company forecast September-quarter revenue growth of 9%-11%, below Wall Street expectations, sending its shares lower in after-hours trading despite record June-quarter revenue and profit.
DIGITIMES Intelligence said its observations at the 2026 World Artificial Intelligence Conference (WAIC) show the automotive industry's transformation moving from software-defined vehicles (SDV) toward AI-defined vehicles (AIDV). This shows that physical AI is becoming the key driver of change as carmakers shift from adding functions to building full AI capabilities.
The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when its first standard factory building begins operations in the second half of 2026, signaling a potential turning point for a development that has struggled for nearly two decades to establish an industrial foothold.
ams OSRAM is developing Micro LED-based optical data links for AI data centres, positioning the technology as a high-density, scalable alternative to copper interconnects. To support adoption, the company has built a high-precision simulation platform that evaluates Micro LED optical links under real AI workloads.
The TAIONE Open Source Foundation was officially launched on the 30th and said it will deploy NT$300 million in private-sector resources over the next three years to advance open-source AI engineering, talent development, sovereign AI, and enterprise adoption. The move was framed as a way to fill a gap in Taiwan's AI strategy as global competition shifts from chips and compute into models, toolchains, software ecosystems, and standards.
TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's existing US$165 billion investment in the country. The announcement has sparked widespread speculation, with some viewing the move as bowing to pressure from the US government, while others see it as a carefully weighted decision balancing customer demand in the US with Taiwan's national security concerns.
Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and upgraded chips at the same time to meet different customer needs. Supply chain sources say the two chipmakers will no longer rely on a single product for flagship phones in 2026, but instead offer two separate specifications.
Coretronic said its robotics subsidiary, Coretronic Intelligent Robotics (CIRC), is focusing on four development priorities as a large domestic government drone procurement plan remains unapproved, leaving suppliers facing a demand gap. The company said the strategy is designed to reduce the impact of uncertainty over the government buying schedule on its drone business.
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