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Jun 1
Interview: Sharp CEO taps Foxconn ecosystem for brand revival
Sharp President and CEO Tetsuji Kawamura said the company has eased some long-standing management pressures, but its main challenge now is to expand its brand, develop new businesses, and accelerate globalization simultaneously. He outlined the strategy in an interview with DIGITIMES.
India's corporate giants race to build backbone of its AI economy
Jun 2, 06:59
India's biggest business groups are ramping up spending on digital infrastructure, with Reliance Industries and Adani Group focusing on data centers, energy, and artificial intelligence. Their plans point to a wider shift in the Indian industry toward building the infrastructure needed for AI domestically.
Chinese consumer electronics and tech brands have made significant strides in quality and innovation over the past few years, yet trust remains a persistent challenge in Western markets. Ongoing geopolitical tensions and media framing have added further complexity to that dynamic.
AI holds enormous potential to benefit the environment, but it simultaneously consumes massive amounts of water and energy. One generative AI data center can use up to 5 million gallons of water a day, and AI as a whole draws as much power as 100,000 households. A single AI query can use up to 1,000 times more electricity than a traditional Google search. The result is an urgent paradox: AI is becoming one of the most sophisticated tools ever built to combat climate change, yet it is also one of the fastest-growing strains on the planet's resources.
Agentic AI is reshaping corporate procurement by moving beyond decision support to autonomous execution. Pactum is using it to automate tasks such as requisition handling, supplier communication, and compliance checks, helping enterprises manage procurement more efficiently across large supplier networks.
Lenovo expands Tianjin AI server hub with 2027 mass production plan
Jun 2, 06:58
Lenovo Group is stepping up its AI infrastructure push. Lenovo chairman and CEO Yuanqing Yang said on May 28 at the 2026 World Intelligence Expo that the company will invest in Tianjin to build a next-generation AI computing product R&D and manufacturing center, with mass production planned for 2027, as Lenovo seeks a larger share of the AI infrastructure market.
Formosa Plastics Group (FPG) is stepping up its transformation into higher-value businesses, with AI, semiconductors, and power grid opportunities emerging as key new growth engines as the petrochemical industry faces a downcycle that started in 2023.
Microsoft used Nvidia GTC to preview Surface Laptop Ultra and its broader Windows platform strategy ahead of Build, highlighting a shift toward on-device AI agents and developer workloads. The company emphasized deeper Windows 11 integration with Nvidia hardware, aiming to unify performance, security, and AI tooling across next-generation PCs.
Artificial intelligence is reshaping how industries define talent. In the next phase of AI, the most valuable workers may not be those who train models, but those who understand demand, define problems, judge value, and oversee the direction of AI development, according to National Taiwan University electrical engineering professor Hung-Yi Lee.
LianDe Holdings-KY moved into AI server liquid-cooling components and secured a spot in a US chipmaker supply chain, the firm announced, with product validation underway and volume production slated to begin in the second half of 2026. The company has developed a liquid-cooling floating fitting designed to pair with quick disconnects used between coolant lines and servers to support liquid-cooled AI servers.
RoboSense Technology, an AI-driven robotics technology company, announced a historic first quarter of the year in which the robotics business exceeded 50% of total LiDAR shipments for the first time in the company's history. Its dual-engine strategy across ADAS and robotics continues to drive growth, building on its first-ever profitable quarter in the fourth quarter of 2025.
PCB maker Zhen Ding said AI is driving a structural shift in electronics, redefining the role of printed circuit boards from passive signal connections to critical platforms for high-performance computing and system integration. Chairman Charles Shen made the remarks at the company's 2026 annual shareholders' meeting.