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BenQ Materials targets CPO in semiconductor push

Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27

Sep

6

2026

TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy

I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales

K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors

Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands

TWM, SYSTEX debut at smart building expo

Tongtai doubles semiconductor orders on AI data-center demand

Taiwan thermal supplier I-Chiun launches AI chip cooling venture targeting US$19.2B liquid-cooling market

Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027

Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem

G20 AI agenda: US champions light-touch regulation while data center backlash, China rivalry intensify

Trumpf CTO says advanced packaging reshapes semiconductor equipment race

K-Safety Expo 2026: Beyond AI, Korea re-engineers the human layer of industrial safety

Google's quantum boss says five years; his engineer says not so fast

Sep

5

2026

Exclusive: South Korea's safety AI boom is being built from the top down, BEXCO says

NYCU wins Nobel laureate for Taiwan job card

Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics

Taiwan semiconductor output targets NT$8 trillion

Topco targets optical comms, cooling as copper gives way

TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain

Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race

Exclusive: Taiwan's first tokamak to begin plasma testing by end of 2026

Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics

Samsung SDI nears solid-state battery mass production, eyes China supply chain

SiPh, optical lens demand ignite laser race

Google TPU splits training, inference as CPU becomes next focus

Micron looks to lock in Taiwanese construction capacity with long-term deals

Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC

Taiwan auto parts makers face exit-or-overseas dilemma

Jmem Tek's PQC security chip nears mass production

Taiwan satellite ground equipment output grows 13%, nears NT$300B

Marketech profits hit record in 1H26 on overseas orders

Adata expands AI business with TRUSTA, Industrial brands

Sep

4

2026

Cisco targets zero engineers writing code by end-October

CPO testing shifts to mid-stage to avoid costly failures, Chroma says

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives

From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026

The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom

How agentic AI and 'AI physics' are reshaping chip design

South Korea taps chip windfall for next tech push

Samsung turns to chips, OLED for next phase of Vietnam expansion

MSScorps August revenue hits new high on silicon photonics gains

Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp

SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology

G20 approves guidelines calling for more business-friendly AI regulation

Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027

Lite-On makes US$170 million strategic investment in DCX for AI cooling push

India tablet market grows as business demand shifts toward premium devices

K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap

China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge

CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough

Taiwan to expand AI compute capacity as supercomputer at research institute hits full load

Ennostar accelerates AI optical communications with micro LED

Kyocera completes Nagasaki plant for semiconductor ceramics and packages

Fujitsu says useful quantum computers may need far fewer qubits than expected

China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls

Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins

Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications

China Motor unit Greentrans launches Taiwan-made quadruped robots

Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains

Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing

Processor, memory boom could push chip supply chain out of sync, says Yole

Moonshot AI reportedly files for Hong Kong IPO, targets US$3B

AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

Silicon Valley overflow fuels semiconductor boom in California's Capital Region

Acer broadens lineup with e-paper displays and scooters, ahead of PC industry headwinds

Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers

Silicon photonics testing shift could reshape how CPO suppliers win business

Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab

India's refurbished smartphone market gains as prices push buyers toward premium used devices

Acer bets on RTX, GoogleBook as on-site AI demand grows

LB Semicon starts Qualcomm shipments as DDI dependence fades

Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in

Nvidia sets an October launch for RTX Spark PCs, gives local AI a router

OpenAI says Astra crosses critical cybersecurity threshold, adding tighter safeguards

Adobe names Anil Chakravarthy as next chief executive

Analysts read Nvidia's Hugging Face deal as a hedge, not a software bet

Nvidia's Hugging Face terms pay out its chip rivals and reserve US$1 billion to keep the staff

Nvidia buys the front door to open AI with a US$12.93 billion Hugging Face deal

D-Wave, quantum computing's oldest company, is now building a second kind of machine

K-Safety Expo 2026: South Korea's safety AI moves from watching danger to acting on it

K-Safety Expo 2026: Inside Korea's push to make safety smarter, faster, more predictive

India PC shipments rise as channel buying lifts second quarter sales

China's GPU makers found scale as profit came from elsewhere

Taiwan's tech council allocates NT$3.76 billion for quantum host

ESA backs European rocket startups to diversify launch supply

Acer wowed IFA with AI, gaming hardware

China speed hits brakes as regulators tighten safety rules

ENE Technology eyes 4Q26 drone scale-up with satellite link

Taiwan to expand industrial land for AI hardware boom

Nanya, ESMT hit record August revenue on higher contract prices

Young Liu urges 'Made with Taiwan' supply chain rethink

Acer unveils IFA lineup with AI, slim notebooks, sustainability

Electroninks, Merck, Qualipoly build advanced packaging ecosystem

Sep

3

2026

CHPT spans wafer to system-level testing

SanDisk pushes HBF ecosystem as AI inference reshapes token economics

Infineon sees AI data centers, physical AI as growth drivers

Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise

Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty

Turing Drive highlights overseas expansion, extends invitation to global automakers

China chip tool makers expand beyond import substitution at CSEAC 2026

KEPCO seeks US$18 billion from Samsung, SK Hynix to fund Korea's power grid

Fei-Fei Li's World Labs unveils Atlas world model for 3D AI, robotics

Niching validates 500-ton press for large heat spreaders

Semiconductor sustainability shifts to cost control as fab resource demand surges

Broadcom says CPO fits scale-out better than scale-up

Microsoft unveils two-segment reporting structure, standalone Azure financials

CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue

Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools

Huawei, Xiaomi to launch new foldable smartphones ahead of Apple

Solomon leverages AI vision and optical tech to tap semiconductor inspection market

TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning

SK Hynix weighs Kioxia production tie-up in Japan

Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs

Taiwan's supply chain is 'one of a kind,' MediaTek CEO says

Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips

AUO unit eyes TSMC ecosystem as merger benefits emerge

China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration

AI substrate shortages widen as Unimicron signals capacity support through 2029

Win Semiconductors unveils 0.1μm GaN for AI, satellite links

UniVista expands China EDA stack with AI agents, native 3DIC tools

CXMT's 'Hefei Project' exposed in Samsung DRAM theft case

BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack

TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling

Google to expand Taipei AI infrastructure center as Taiwan ties deepen

Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028

China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027

HPE has already bought the supply behind its raised fiscal 2027 plan

HPE's constraint has shifted from demand to memory

Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America

Broadcom's custom AI silicon takes over the income statement as revenue climbs 86%

VinFast reportedly pauses India manufacturing work on three EVs, a year after opening its Tamil Nadu plant

CPO material race widens as Taiwan eyes key role

Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028

Alpha Networks, ITRI develop B5G/Pre-6G Massive MIMO base stations

JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times

Column: From automation to autonomy—what robotics still needs to make the leap

SB Energy eyes US listing as Nvidia commits US$1.5 billion

Analysis: India's fast-growing FWA market may widen, but suppliers still face margin pressure

PlayNitride sees 3.2T AI links opening a new front for Micro LED, but auto weakness weighs on 2H26

Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too

SK Hynix wafer purchases jump 104% on AI demand

Global smartphone outlook cut again as foldables shine

Thailand AiPASS unlocks premium AI after lessons

Samsung to add 1,612 new equipment units at Vietnam chip plant

LCY Advanced Materials launches wet chemicals for AI chip packaging

Macronix boosts sustainability spending to NT$780 million

MiniMax, Z.ai revenues surge on API demand but adjusted losses widen

TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus

SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing

Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI

Sep

2

2026

Sandisk says HBF can match HBM bandwidth with up to 16x the capacity

Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth

Lam Research exec says automated preventive maintenance key to fabs of the future

DRAM giants target 3D stacking to break memory wall and power bottlenecks

Fresh off Nasdaq listing, Pasqal turns to Taiwan's photonics industry to help it scale

EU EV battery recycling still lacks a profitable model

Taiwan's semiconductor ecosystem has the UK taking notes

Nvidia and Micron top NT$4.4T in Taiwan investment

Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand

Samsung, SK Hynix inventories surge as valuation reserves fall

Semicon Taiwan 2026 to test cloud AI investment boom

Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand

World's first legged robot standard sets global benchmark for humanoids, robot dogs

Indium CEO: packaging, cooling and power are next AI bottlenecks

India reportedly readies AI agent payments on UPI, its national payment rails

TSMC moves into Baipu Industrial Park, boosts advanced packaging

TSMC reportedly asks suppliers to develop 5μm HBM microbumps

Certain Micro targets AI test-interface demand with three Semicon products

China's Galactic Energy puts PALLAS-1 in orbit, raising stakes in reusable rocket race

Energy and water: How to tackle the fab resource crunch

IBM's quantum pitch to chip audience: bottleneck is now manufacturing

MediaTek pushes advanced packaging and supply chain to keep pace with AI

Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

Operations shake-up: how SpaceX is reengineering its AI data center strategy

Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center

Manus resumes independent operations after Meta deal collapses

Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC

SDC to expand foldable iPhone OLED mass production in September

European chip ambitions hinge on more than subsidies, says TSMC

ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants

Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout

China moves to curb overseas price wars as automakers accelerate global expansion

Taiwan doesn't just want a quantum lab — it wants a quantum fab

TCL CSOT bets on InP laser chips as supply tightens

MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments

GoPro to merge with Starman Optical in US$285 million deal, pivoting deeper into AI and defense markets

AI demand push expands wafer industry's growth outlook

Anthropic launches Claude Fable 5.1 and Mythos 5.1, cuts agentic-task costs by up to 45%

Taiwan materials makers see new opening in chip packaging shift

TSMC says Europe chip strategy is shifting from plans to demand creation

Gemtek deepens partnership with India's Dixon Technologies to expand optical transceiver, connectivity footprint

Dell says enterprise AI customers accelerated even faster than its record orders suggest

Dell's AI server boom lifts profitability across its whole business

Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership

UMC targets 12-inch TFLN to break 400G SiPh bottleneck

Apple's M6, M5 Ultra break rule tying process to chip strength

How Taiwan is closing its semiconductor materials gap — three shifts to watch

Deep Dive: CXMT challenges Pentagon as Trump-Xi meeting nears

Micro LED maker PlayNitride targets Micro LED optical communications within two years

Innolux targets advanced packaging with debut of Chip Last tech

Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%

AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks

US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles

China memory-module makers report surging profits, strained cash flow

LG fights Chinese brands with innovation, business model shifts

Commentary: Malaysia wants foreign automotive investment to leave more behind

Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference

Qisda builds physical AI ecosystem from land to space

Nvidia pushes into HBM base dies as NVHBM battle heats up

'Chinamaxxing' fuels China tech tourism as visitors flood Huaqiangbei

Taiwan eyes satellite communications to cut sea cable reliance

Global quantum industry accelerates as Taiwan eyes Asia hub

Tmytek to list on Innovation Board in September on antenna module growth

Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration

Plug and Play plans US$100 million Taiwan fund, hopes one of its next five unicorns is Taiwanese

Sep

1

2026

Taiwan carbon fee joins UK CBAM qualifying list

Taoyuan eyes northern AIDC hub, touts Tatan and LNG cooling edge

SK Hynix touts up to 5.15x inference gains with custom HBM

Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain

Safety rewired: AI, robots on the front line at K-Safety Expo 2026

Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing

Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains

Autonomous driving expands into Physical AI, creating new openings for Taiwan firms

Imec CEO: AI era pushes broader ties between chip, model and CSP players

AI server demand lifts Japanese capacitor shipments by 22% in first half of 2026

ASE CEO describes AI resource squeeze as a short-term problem

Micron opens Tainan plant after 6.5 months amid labor dispute

Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers

Chinese smartphone brands raise prices as component costs climb

South Korea CCL exports surge 42% on AI demand

Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand

Tim Cook concludes 15-year Apple tenure, John Ternus takes over

K-Safety Expo 2026 to open in Busan, spotlighting AI-driven safety technologies

Foxlink, Yongwei to sell Shinfox stake, cede control

Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground

Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan

BYD's overseas business overtakes China for the first time as price war erodes domestic margins

BYD widens overseas lead over Geely, but profits still lag

ASML says High NA EUV has reached its first high-volume logic product

Trymax lands multi-year AOI order as InP laser capacity race tightens

Tmytek moves toward Taiwan listing as millimeter-wave demand nears mass production

Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables

SEMI lifts 2028 wafer fab equipment forecast to US$220 billion

Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs

Chinese court freezes US$318M in Nexperia assets, further escalating corp rift

Imec maps chip scaling to 2040, says AI's next gains need full-stack integration

China's memory chipmakers post a record 1H — but not all of it came from chips

LG Energy Solution secures long-term US lithium supply

Apple reshuffles leadership, shifts Schiller out of App Store

TSMC delays CoWoS orders as CoPoS plans take shape

Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers

Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race

JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts

XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6

Samsung locks 70% of memory output as HBM spot prices soar

Cisco: CPO is ready for mass deployment amid surging AI data-center demand

Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll

South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain

Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale

China's humanoid robot cost cuts run into three bottlenecks

India expands chip ambitions with full Semicon 2.0 notification

China reportedly moves space computing from concept towards commercial deployment

Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide

Taiwan's G2C+ Alliance members target global markets

Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts

Nvidia's MediaTek investment signals broader push to shape AI infrastructure

Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption

China's Xenomi LLM brings quantum computing into AI agent decision-making

Buima returns to profit in the second quarter on battery module demand

Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap

Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion

Taiwan workplace AI use reaches 96% as employers push skills upgrades

Samsung weighs HBM4 bonuses as memory, foundry teams align

AI server cooling specialist Nidec expands Vietnam capacity, forms liquid-cooling team

Humanoid robots gain a sense of touch, lifting tactile sensor adoption above 60%

Taiwan manufacturing moves into the prosperity zone as US export growth slows

Acme sees years of SiC growth as data center demand builds

OpenAI compresses Jalapeno design to 9 months

Luxnet eyes orders through 2028, DCI revenue set to double in 2027

Kaimei sees 2H26 momentum strengthen as AI demand lifts orders and resistor price hikes take effect

Silergy data center business surges as new products scale up

LGD launches PFAS exit roadmap, targets full phaseout by 2035

Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push

Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story

AI Macs, Part 2: Mac mini, Mac Studio gain enterprise AI ground; Apple still lacks the platform

China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics

SK Hynix explores Intel as second source for HBM base dies

John Ternus takes over an Apple with one growth engine, no obvious second

Analysis: Tim Cook hands Ternus a slower-growing but far richer Apple than the one Steve Jobs left him

Aug

31

2026

Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond

China urges pragmatism over hype in rapidly expanding humanoid robotics market

Smart manufacturing, robotics drive renewed growth in industrial PCs

Taiwan drone bill dispute leaves NT$240 billion procurement plan in limbo

Gudeng sees double-digit advanced packaging growth from 2027

U-Best races to launch PFAS-free coatings by 1Q27

Marvell sees 2027 acceleration in scale-up optics

Nvidia demand nearly doubles as supply meets only 70%

TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration

AI Macs, Part 1: OpenAI reportedly buys tens of thousands of Macs for reinforcement learning

Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector

Update: SK Hynix breaks silence on Japan expansion rumors

TSMC sees SiPh going mainstream in 2027

Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding

ASE: CPO scale-out demands deeper supply-chain coordination for mass production

The 72.4% dominance: China's battery lead is now a chemistry problem for South Korea

Gudeng chairman says trust underpins Taiwan supply chains amid Unimicron row

Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates

US weighs limits on China's access to chips in overseas data centers

The architect of Apple's China machine also built its hardest problem

Cook made sustainability an Apple feature; the ledger he leaves John Ternus is mixed

Taiwan vendors chase India's wireless broadband opportunity, with Alpha Networks in the lead

Kingboard Laminates raises prices again as CCL shortages deepen

MetaX posts first-half profit while China's AI GPU rivals split

CXMT's global DRAM push runs into US curbs

OpenAI to pull its models from Cursor, highlighting tension with SpaceX's Elon Musk

Samsung Galaxy Z Fold8 demand surges, straining UMC 22nm DDI supply

Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging

South Korea risks 'HBM 2.0' trap in emerging CPO market

CXMT starts LPDDR6 mass production for Xiaomi 18 Fold, claiming global first

US rallies 24 nations to compete for 6G

Asus launches physical AI business group, shifting from EMS to humanoid robots

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Taiwan manufacturing know-how is key physical AI asset

SiFive BigSky brings RISC-V into data centers with CUDA, Nvidia links and enterprise Linux

Commentary: Malaysia's China dilemma sits at the heart of GATE 2026

Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift

Chinese robotaxis head for Seoul as Pony.ai and FutureLink plan a 200-vehicle fleet

Musk tackles key AI power bottleneck with in-house turbine foundry

AI smart glasses race heats up as MEMS enable wearability

China's silicon wafer makers report profit gains of varying quality

Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace

Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6

France draws Taiwanese investment projects worth EUR7.5 billion

Lightel posts record first-half revenue, profit as LEO satellite demand rises

Samsung launches Galaxy S26 FE with lower price

India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers

Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff

China optical display investment shrinks 80% in 1H26

USI advances optical interconnect push with ELSFP laser module

Repon to ship Vera Rubin rails in August, ramp ASIC in September

Tex Year's specialty chemicals push could reshape its growth mix as AI and optics expand

MCE expands auto electronics capacity to defend Malaysia's domestic market

AI pushes autonomous driving toward a more pragmatic commercial model