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Tuesday 23 September 2025
Henkel Adhesives highlights portfolio of Semiconductor Packaging Materials to foster collaboration with Taiwan
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage
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Wednesday 3 December 2025
TUVIT powering industrial IT security and cybersecurity with testing, compliance and certification
The European Union Artificial Intelligence Act (EU AI Act) is set to be fully implemented in 2026, and the Cyber ??Resilience Act (CRA) is scheduled for 2027. Adding the Radio Equipment Directive Delegated Act (RED-DA) already took effect on August 1, 2025, those three legislative measures collectively emphasize mandatory requirements for information security and cybersecurity.These regulations strengthen the comprehensive lifecycle management mechanisms for critical applications, IT components and telecommunications, impacting corporate strategies for complying with international information security standards while providing new opportunities for next-generation technological innovation. As a globally leading standards testing and certification  organization, TUV NORD combines multiple international standards to meet comprehensive regulatory requirements, helping global enterprises address major challenges in AI, cybersecurity, and information security regulations.Eric Behrendt, Global Key Account Manager of TUV Information stechnik GmbH (TUVIT), and Chia-Hung Lin, Director of the Information Security Business Division at TUV NORD Taiwan, were jointly interviewed. This interview coincided with the relocation of TUV NORD Taiwan's testing laboratory to its new address in Kaohsiung City. Taking advantage of the new facility's inauguration. In addition to inviting industry customers to celebrate together, they introduced TUVIT's global organizational developments and its comprehensive assessment and verification services, helping Taiwan customers understand new information security standards and the laboratory's development to seize new market opportunities.TUVIT is an independent subsidiary within the TUV NORD Group, dedicated to the Digital and Semiconductor Business Unit, focusing on information security and data infrastructure resilience technologies. Established in 1995, TUVIT provides cybersecurity verification, testing, and consulting services, specializing in establishing information and networking security technology, testing hardware, software and certifying information security management systems. With the global industry's growing emphasis on and attention to semiconductor chips and network equipment information security standards compliance, TUVIT has established a robust information security environment to advance technological progress and ensure digital security.In partnership with TUV NORD Taiwan, TUVIT assists Asian semiconductor, electronics manufacturing, and OEM/ODM manufacturers in obtaining certifications for various international and national information security standards. This will include Germany Federal Office for Information Security (or named BSI) IT Baseline Protection to enhance cybersecurity with a structured framework for organizations to protect their IT systems effectively.TUV NORD Taiwan laboratory offers services for CC, FIPS 140, and FIDOTUV NORD Taiwan, together with TUVIT, has collaborated to help assisted 12 semiconductor customers in the Asia-Pacific region (across more than 20 factories) achieving the German BSI Common Criteria safety certification. TUV NORD Taiwan's Kaohsiung testing laboratory is the only laboratory in Taiwan equipped to certify three major international cybersecurity standards including Common Criteria (CC), the U.S. National Institute of Standards and Technology (NIST) FIPS 140-3 standard, and the Fast Identity Online (FIDO) standard.TUV NORD Taiwan has further expanded its services to include financial and industrial PC sectors, in addition to its existing work in semiconductors and networking, to help Taiwanese electronics manufacturers meet global compliance requirements. This expansion offers a broader range of services like product safety, information technology, and vendor assessment audits to support companies in navigating complex global standards.Meanwhile, TUVIT also has expanded more actively into emerging fields such as artificial intelligence and quantum computing certification services, which are key technologies poised to redefine problem-solving, innovation, and competitive landscapes. TUVIT supports companies in implementing these new requirements and contributes to the safety and reliability of emerging technologies in the post quantum era.As AI technologies become increasingly integrated into everyday business operations, ensuring ethical, transparent, and secure AI systems is very important. The AI Act is the first legal framework on AI, which addresses the risks of AI and positions Europe to play a leading role globally. Since 2018, BSI has reacted quickly to the rapid development in the field of artificial intelligence and created a framework that keeps pace with technological developments. This also includes intensive testing and the implementation of countermeasures. TUVIT carried out these tests and began developing and applying initial testing methods for AI applications at an early stage, Behrendt highlighted. He proudly stated that TUVIT continues to work closely with BSI to ensure compliant in AI devices keeping pace with rapid technological advancements.NIST Post-Quantum Cryptography Standards become a key role in Information security certificationUsing Quantum Key Distribution (QKD) technology as an example, Behrendt noted that the threat of quantum computer attacks on classical cryptographic mechanisms must be considered to ensure future-proof protection of information. QKD offers a promising solution by harnessing the principles of quantum mechanics to establish secure keys. TUVIT assists enterprises in following NIST-adopted Post-Quantum Cryptography (PQC) standards, providing industry testing and certification services to ensure their systems can withstand future quantum computer attacks.Of course, this also involves enterprises' information systems requiring continuous assessment and upgrades to adapt to the practical operational needs of new PQC algorithms. Current cutting-edge technological developments involving data transmission and remote data exchange all require secure certification mechanisms for assurance. TUVIT is working with global technical partners to develop testing technologies and equipment, enabling related certification work and standard development to proceed in parallel.Beyond facing new challenges such as QKD technology, customers currently face multiple certification requirements including CRA and EU AI Act standards, which inevitably leaves them feeling overwhelmed. Behrendt recently participates in three or more technical consultation meetings with customers regarding CRA standards almost every week. He observes that many customers neglect preparations from the initial stages of product design planning. He especially reminds customers of the importance of a secure internal product development framework that considers information security planning.Large or middle scale manufacturers meet multiple product line launch requirements by leveraging a common product development or manufacturing platforms that incorporates information security standards from the start. This enhances the security of specific environments and allows for the reuse of verification results when certifying products manufactured in those environments, thereby simplifying subsequent product certification processes, saving time and costs.Furthermore, regarding CRA and AI Act, he provides several strategic recommendations. First, priority attention should be given to CC for IT security evaluation and IEC 62443 for industrial automation system information security standards. Currently, these fundamental cybersecurity standards have become prerequisites for new products entering international markets. Furthermore, for consumer electronics product cybersecurity requirements, all security requirement items will require to follow ETSI/EN 303 645 IoT network security standards as important cybersecurity requirement guidelines.Since Taiwan's electronics industry consists major OEM/ODM manufacturers for global brands, TUV NORD Taiwan supports Taiwan's electronics supply chain by providing premium testing, inspection, certification, and consulting services to meet the specifications requested by global branding customers. These services help ensure that products comply with safety , quality, and cybersecurity standards across various industries, and contribute to market access and customer confidence.Behrendt sincerely advises Taiwan OEM/ODM customers that from the first day of designing products under CRA, they must consider security and information security design. If these requirements are not considered, ultimately they will still need to go back to resolve these compliance challenges. Once these basic requirements are overlooked, regulatory agencies for these new standards will impose high penalty as punishment, which will cause product brand name value and enterprises to suffer significant losses. Therefore, he recommends that enterprises need to take seriously and genuinely prepare response plans early and avoid violations. Passing certification and presenting evidence of proven effectiveness is the best product compliance strategy.FIPS 140-3 Cryptographic Module and Software Testing Compliance GuidelinesGovernment agencies in the United States and Canada require FIPS 140-series certification for cryptographic products, while Taiwan's requirements align with this international standard. This certification is mandatory for products used to protect sensitive information and ensures that cryptographic modules have been independently tested and validated for security.Since cryptographic applications involving information exchange and sharing are not limited to hardware or software, as long as they participate in encryption and decryption operations, they need to pass FIPS 140-3 certification. For example, the systems including operating system software, semiconductor chips, network routers, firewalls, and other hardware devices all require to grant the requiring certification.TUV NORD Taiwan's cryptographic module testing laboratory in Kaohsiung is the only local laboratory specifically providing testing and consulting services for this standard. Teddy Tsui, Senior Manager and FIPS 140 Lab Director, introduced that TUV NORD Taiwan laboratory obtained FIPS laboratory certification in 2014. This laboratory is also the only one in Taiwan recognized by NIST, serving ASIA customers for over ten years with expertise in the cybersecurity field. Currently, the laboratory can perform FIPS 140-3 testing for three types of cryptographic validation including hardware cryptographic modules, software algorithms, and entropy sources. Meanwhile, this lab also provides customer consulting and educational training.Credit: TUV NORDTsui explained that the Cryptographic and Security Testing (CST) laboratory only conducts testing and issues test reports for a FIPS 140 standard certification. But the NIST is the authority that issues the formal certification or validation. Talking about the time consuming for hardware cryptographic modules, the process will include checking design process documentation, functional testing, and even code inspection are required.The average time for a FIPS 140-3 certification for hardware cryptographic modules is approximately from 18-month to 2-year, largely due to a backlog caused by the transition from FIPS 140-3 and the high volume of requests, which contributes to the extended waiting period. But software algorithm testing is relatively faster. The laboratory uses software verification programs, expecting to complete testing in two to three weeks. Since NIST released three PQC standards for algorithms that can resist quantum computer attacks in August 2024: FIPS 203 (for key encapsulation), FIPS 204 (for digital signatures), and FIPS 205 (for hash-based digital signatures). These algorithms are now available for certification testing.NIST estimates that quantum computers could threaten current cryptography in the next 10 years, leading to risks for long-term sensitive data through the "harvest now, decrypt later" attack. This involves attackers collecting encrypted data today and decrypting it in the future when a powerful enough quantum computer becomes available.Tsui also frankly stated, FIPS 140 standards for software algorithm testing will require re-testing when PQC algorithms are updated. Customers will face challenges in migrating their systems. The main challenges include the complexity of inventorying all cryptographic systems, integrating the new algorithms into products, and the long timeline for the transition, which requires careful management and strategic planning.TUV NORD Taiwan Leverages Localization Advantages with Rich Experience Serving Taiwanese ManufacturersFurthermore, Chia-Hung Lin, Director of the Information Security Business Division at TUV NORD Taiwan, especially emphasized the importance of information products passing CC verification. The requirement starts from the entire product development lifecycle to ensure cybersecurity every stage of the manufacturing process receives complete protection.The evaluation process of CC certification will include Site Certification where product development or manufacturing occurs. This is ensuring that the physical and procedural environment where a product is developed or manufactured meets security standards, protecting design data and products throughout their lifecycle. These audits are crucial steps in the evaluation, as it validates the developer's claims about product security and confirms the integrity of the entire supply chain, not just the final product itself. Meanwhile, Site Certification also saves time and money for re-audits by allowing a single certification to cover multiple products developed or manufactured at that site. Currently, the major semiconductor fabs and OSAT vendors in Taiwan have obtained Site Certification with TUV NORD Taiwan's assistance.Among the experience of serving Taiwanese customers for decades, most notably, Lin pointed out one real case for customer support in Taiwan. The COVID-19 pandemic induced systemic disruptions by semiconductor shortage for the auto industry during the years in 2020. At that time, Taiwan government has implemented strict border quarantine for all passengers. A Taiwanese semiconductor fab manufacturing automotive chips urgently needed certification but caused delays for the quarantine policy with TUVIT German auditors and professionals. TUV NORD Taiwan's team overcame difficulties and communicated with the government, resulting in a breakthrough that allowed German auditors perform audits on time to certify this Taiwanese customer. This case becomes an important case in TUV NORD Taiwan's customer support history.TUV NORD Taiwan maintains an important market reputation and actively maintains long-term relationships with customers. Combined with the unique and important value demonstrated by the localized laboratory - not just testing equipment, but also the extensive practical experience and know-how accumulated over the years - TUV NORD Taiwan's services have earned customer trust. With Global information security product opportunities to increase Asian manufacturing by helping companies diversify supply chains, TUV NORD Taiwan aims to partner with Taiwan clients to leverage new business opportunities that arise from information security standards. This partnership focuses on helping customers to seize the critical business opportunities on the growing importance of cybersecurity by ensuring compliance with standards, protecting sensitive data, and maintaining business resilience.Credit: TUV NORD
Thursday 13 November 2025
HQ Pack - global full-service provider of high-tech packaging from design to reuse
HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries.The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection.The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time. Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own.Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.
Thursday 13 November 2025
Prodrive Technologies - delivering high-performance camera, compute, and motion control solutions
Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise. The company empowers semiconductor equipment manufacturers and customers across multiple industries to accelerate innovation and achieve operational excellence.Headquartered in the Netherlands, with regional hubs in the USA, Japan, and China, Prodrive Technologies serves the semiconductor, medical, life sciences, energy, infrastructure, and industrial markets. Its customer-centric approach, deep engineering expertise, and vertically integrated manufacturing enable fast time-to-market, superior quality, and scalable systems.The company's portfolio spans optical and e-beam cameras, embedded computing systems, high-precision motion control and drives, and RF plasma power solutions. These offerings are available as off-the-shelf products, customized systems, or turnkey solutions.With its broad product range, flexible business model, and decades of experience in the semiconductor sector, Prodrive Technologies is now also exploring opportunities in Taiwan. As home to the world's largest semiconductor foundry and a growing ecosystem of equipment manufacturers, Taiwan represents a potentially strategic market where Prodrive's innovation, quality, and speed-enabled by its unique vertical integration-can create significant value.
Thursday 13 November 2025
Boschman - providing packaging solutions for auto & industrial power modules
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology.The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.
Thursday 13 November 2025
Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects
Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive manufacturing technology that allows for parallel transfers high-resolution conductive patterns to enable the rapid and precise printing of micrometer scale interconnections. This technology offers high-speed low-cost manufacturing, is well suited for process equipment to create complex 3D structures and achieve further miniaturization of electronic devices. The rapidly growing opportunities in AI-driven electronics push the technology forward. These unique solutions have considerable potential, and on May 16, 2025, Fonontech received the good news of a $9.5 million seed round investment.Currently, Fonontech equipment is being used to address wire bonding speed issues in chip packaging. Wire bonding is a viable solution for connecting chips to external pins or for silicon interlayer structures in advanced packaging. This process is typically used in back-end chip manufacturing, particularly flip-chip bonding. Fonontech equipment offers higher pin density, optimized electrical performance, and smaller package sizes.While conventional wire bonders can only print one line at a time, Fonontech Impulse Printing technology is much faster. Because its parallel printing solution can transfer contacts covering an entire area at a time, the speed increase is astonishing. According to on-site testing and monitoring, Fonontech Impulse Printing technology can achieve speeds up to 100 times faster than wire bonders.Currently, Fonontech equipment can successfully bonding with a minimum size of 20 micrometers, and in the future it will further achieve a dimensional accuracy down to a few micrometers. In the booth of Fonontech showcased the Impulse Printing demo kit, a scaled down version of the industrial equipment. In addition to selling the equipment itself, the company also integrates Impulse Printing print head modules into customers' production lines for special tailored applications.The equipment can be used for transfer printing onto wafers, PCBs, or other manufacturing processes, such as connecting signal pins on the side of a display chip to the signal contacts on the back side of the display panel. The bestselling point of this equipment is speed and cost effectiveness to reduce material waste and carbon emissions. The company's product is marketed as a replacement for wire bonding machines. Furthermore, the company currently is developing Taiwan market and running ongoing collaborative projects through testing and verification with potential clients.
Thursday 13 November 2025
HITEC Power Protection - a reliable and secure dynamic UPS solution provider
HITEC Power Protection develops, manufactures, and provides dynamic uninterruptible power (UPS) solutions to support the most vital of manufacturing and business critical applications. Founded in 1956, its products are widely used in industries with high power reliability requirements, such as semiconductor fabs, banking, aviation, healthcare, and government defense, to ensure that critical missions and processes receive uninterrupted and stable power supply. HITEC Power Protection provides equipment to ensure safe, reliable, and adjustable power to support the operational needs of businesses and critical government facilities. Taking ESG and sustainability into consideration, HITEC Power Protection provides customers with solutions to meet the demanding and complex operational needs of the high-tech industries by providing immediate, reliable backup power and voltage regulation during outages.The company has accumulated over 60 years of experience in industries requiring high power stability, primarily using flywheel energy storage technology. This technology stores energy in a mechanical flywheel to ensure immediate emergency response and stable power supply in the event of power anomalies. Once an emergency power outage is detected, the flywheel energy storage system will be activated to deliver stored instantly, and within 5 seconds transfers smoothly to an integrated diesel generator to provide long term emergency power. HITEC Power Protection was introduced to the Taiwanese market in 1985 and has successfully installed over 200 units. Its customers primarily include well-known semiconductor manufacturing fabs and the display panel makers. As Taiwan's industrial demand for power stability continues to rise, the business opportunities of HITEC Power Protection continue to grow.The current product line provides a continuous power generation capacity of approximately 2,880 kW at 60 Hz per unit. And the features include power safety and protection functions, such harmonic filtration, surge protection, load stabilization, and short-circuit current protection, which outperform typical static UPS systems. HITEC Power Protection provides 100% emergency power to all manufacturing and supporting equipment, implementing precise UPS capacity design to ensure a stable power supply to customer's power loads. This not only reduces unstable power risks but also overall lowers installation and ongoing maintenance costs. After engaging the market with Taiwanese industrial clients, HITEC Power Protection is now further targeting the needs of reliable backup power systems for major government critical public facilities, such as disaster prevention and instant response systems for critical infrastructure like tunnels and airports, with the ultimate goals of improving public service quality, bolstering private sector disaster preparedness, and significantly enhancing the overall resilience of Taiwanese society.
Thursday 13 November 2025
Powertrim - power module manufacturing service and equipment provider
Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers product design support, prototyping, and manufacturing services for power modules used in electric vehicles, the energy industry, and industrial applications. The rapidly growing automotive industry is driving significant demand for compound semiconductors and back-end packaging to support the growth of power modules, creating a strong demand for power module packaging and manufacturing technologies. The company offers full support to allow power module manufacturers to predictably build quality products at the most competitive price.The Powertrim Flex Line, the flagship manufacturing platform, provides high performance handling, assembly and testing technology for automated power module manufacturing. With its modular architecture, the Flex Line covers the core trim and form processes as well as adjacent process steps like laser marking, laser de-flashing, optical inspection, quality control, testing, loading and unloading.The main focus of Powertrim Technologies is in providing power module back-end packaging equipment and tooling. Through different modular machine designs, they are assembled into production configurations that meet the customized needs of various power module products. The company also provides the well-designed tools to help customers implementing both prototyping, qualification and rapid serial or mass production of power modules.Furthermore, electrification of the automotive transmission system by either battery or hybrid electric motors, new industrial power applications and the massive growth of renewable energy solutions accelerate the need for power modules. With these, Powertrim provides manufacturing equipment, supporting a wide range of power electronics applications, and is strategically collaborating with supply chain partners to centralize services and resources for the EV market, a move designed to meet fluctuating demands efficiently.The existing flagship production line implements a system designed to adapt quickly to changes in product type and quantity, allowing for the efficient production of a variety of power module products on one single machine, hence Flex Line. With this concept, the company is capable of switching between complex product sizes in under 15 minutes. In addition, it can also provide a series of optional add-on units, including loading/offloading modules, laser marking & de-flashing, automatic optical inspection, MES integrated system, which providing software linking to ERP/MES enterprise software platforms. These different arrangements can be flexibly matched and assembled to meet the manufacturing needs.With a presence in the Netherlands, known for its cutting edge semiconductor front-end and back-end equipment, Powertrim Technologies combines precision engineering with scalable automation to unlock markets such as automotive, energy and industrial power applications. At Semicon Taiwan 2025, Powertrim aims to work together with Taiwanese customers to create new opportunities.
Thursday 13 November 2025
Tempress - Diffusion and thin film deposition equipment manufacturer
Tempress is a leading manufacturer of diffusion and thin film deposition equipment, with over 55 years of experience in thermal process technology. We support innovators in semiconductors, power, MEMS, photonics, memory, life sciences, and coating industries in producing high-value materials and devices.Our production systems are built for R&D applications but also for  automated, high-volume production and meet the rigorous standards of modern chip manufacturing. Tempress solutions cover essential thermal processes such as oxidation, annealing, diffusion, and LPCVD, offering precise temperature control to achieve optimal properties in silicon wafers.Tempress established an early presence in Taiwan (1999), earning recognition across the region's semiconductor sector. Our local experts ensure smooth coordination between customers and our product team in the Netherlands, providing hands-on support and technical guidance.We collaborate globally with universities and research institutes to drive innovation and continuously improve our technology. At Tempress, we deliver more than equipment-we build lasting partnerships backed by dependable service and worldwide support.
Thursday 13 November 2025
Trymax - Plasma-based etching, stripping and curing process equipment maker
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes. These equipment are used in the production of wide-bandgap semiconductor power devices such as silicon carbide (SiC) and gallium nitride (GaN), as well as other important processes such as communication power amplifiers (PAs).Trymax has been established for over 25 years and has a considerable customer base and brand recognition in the Taiwanese market. At Semicon Taiwan 2025, the company primarily serves to promote its products and connect with key clients. With a product portfolio ranging from 100mm to 300mm wafer size, Trymax's clients are on both sides of the Taiwan Strait becoming major suppliers to the manufacturers of power amplifiers and RF components. In the global presence, Trymax has significant market shares at foundries, IDMs and wafer level packaging houses for end applications in Power semiconductor, automotive, MEMS, LED and CMOS.Trymax's NEO series plasma dry descum systems are suitable for cleaning and activation processes in the semiconductor industry, offering high efficiency, uniformity, and repeatability. These systems utilize RF/microwave power to generate high-energy, disordered plasma under vacuum conditions. They can process a wide range of substrate sizes and offer a variety of processing technologies for flexible customer selection, meeting the needs of diverse semiconductor process technologies.Trymax continuously innovates to support its customers’ needs. In addition to the compound semiconductor processes, it is also widely used in application fields such as MEMS microelectromechanical systems, microfluidic devices, SOI substrate manufacturing, advanced packaging and optoelectronic displays. Among them, the global installed capacity of NEO system equipment has exceeded 300 sets.
Thursday 13 November 2025
Invest in Holland - supporting foreign companies in establishing and expanding their businesses in the Netherlands
Invest in Holland /Netherlands Foreign Investment Agency (NFIA) is the national investment promotion service of the Netherlands. It operates as part of the Dutch Ministry of Economic Affairs, supporting foreign companies in establishing and expanding their businesses in the Netherlands. The organization works with a network of regional partners and has a global presence through its worldwide network of offices, including one in Taipei, to facilitate foreign investment and economic development. With 25 offices worldwide, Invest in Holland has over 40 years of service experience. The Taipei office assists Taiwanese companies in developing their businesses and R&D IN EUROPE and expanding the opportunities in the Netherlands. The services include to provide customized information on the Netherlands, relevant business locations, Dutch legislation and tax regulations, labor law, permit procedures, government incentives and much more through in-person or digital meetings. With a population of over 18 million people, the Netherlands economy relies on international trade. It is highlighting the importance of foreign investment to strengthen its innovation ecosystems and achieve future economic goals. The network of Invest in Holland actively promotes this idea by focusing on sectors like high-tech industries, and sustainable energy, where collaborations between companies, government, and knowledge institutions drive innovation and economic resilience. Right now, more than 230 Taiwanese companies have setup their European headquarter or R&D center in the Netherlands. Many of which companies are in the Semiconductor and ICT-related sector, eg CHROMA, DELTA ELECTRONICS, MIC, ADVANTECH, and etc.Invest in Holland actively creates opportunities for industrial clusters to develop in the Dutch market by attracting Taiwanese companies and fostering collaboration between businesses, high-tech research institutions, and government, enabling Taiwanese companies to quickly integrate into the local operation and accelerate business development. One important thing, Invest in Holland's services are entirely free for all foreign companies, both new and established, that are looking to expand their operations into the Netherlands. This is a benefit provided by the Netherlands government and its network of partners. These public services offer guidance, practical solutions for establishment, and connections to the right resources and partners to help international businesses succeed in the European market.