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Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging
Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands...
Wednesday 2 September 2026
Keywave Technology innovative radar sensors spark a smart sensing revolution
Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions...
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package? Interested in knowing how to increase the glass panel size for manufacturing AI multichip packages? If so, visit iCometrue® at Booth M0957, Hall 1, 4F, Taipei...
Monday 31 August 2026
Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined Failure Analysis for Advanced Packaging," Tescan will present a correlative workflow that connects defect localization, rapid access to regions of interest (ROIs), site-specific sample preparation, and nanoscale characterization.
Thursday 27 August 2026
ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At Booth L0716 (TaiNEX 1, Level 4)...
Monday 24 August 2026
iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package while scaling up glass panel sizes? If so, visit iCometrue at Booth M0957, Hall 1, 4F, Taipei Nangang Exhibition Center during SEMICON Taiwan 2026!
Thursday 20 August 2026
Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film
Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026...
Tuesday 11 August 2026
ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.
ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor industry events. The exhibition will take place from 2 to 4 September 2026 at TaiNEX 1 & 2 in Taipei, Taiwan. Visitors can visit ViTrox at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006.
Thursday 23 April 2026
The Rise of Battery-Efficient Tracking Devices in IoT
Tracking devices play a critical role in the Internet of Things (IoT) by enabling real-time monitoring and data collection across various industries. As IoT applications expand, the demand for energy-efficient solutions becomes increasingly important. This article explores the rise of battery-efficient tracking devices and their transformative impact on IoT ecosystems.
Thursday 16 April 2026
Unveiling ASUS liquid-cooling AI Infrastructure through building AI supercomputer Nano4 projects at NCHC
Amidst the reality of global oil prices continuously skyrocketing due to war, the global market is facing the formidable challenges posed by the turbulence impacting the global economy in 2026. Major Taiwanese electronics manufacturers and supply chains are pivoting to review comprehensive AI strategies...