Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving a data rate of 32 Gbps per lane, the highest speed defined in the UCIe specification. The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm full-duplex). This milestone was achieved using TSMC's advanced N3P process and CoWoS packaging technologies, targeting AI, high-performance computing (HPC), xPU, and networking applications.In this test chip, several dies with North-South and East-West IP orientations are interconnected through the CoWoS interposer. The silicon measurements show robust 32Gbps operation with wide horizontal and vertical eye openings. GUC is working aggressively on the full-corner qualification, and the complete silicon report is expected to be available in the coming quarter.To ensure seamless system integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power consumption, minimal data transfer latency, and efficient end-to-end flow control – enabling an effortless transition from traditional single-chip Networks-on-Chip (NoC) to chiplet-based architectures. Additionally, the bridges support Dynamic Voltage and Frequency Scaling (DVFS), allowing real-time voltage and frequency adjustments independently of each die without interrupting data flow.GUC's UCIe IP also features advanced reliability capabilities, including UCIe Preventive Monitoring functionality and integrated I/O signal quality monitors from proteanTecs. This technology enables continuous, mission-mode monitoring of signal integrity during data transmission without the need for retraining or disrupting operations. Each signal lane is individually monitored, with real-time detection of power and signal integrity anomalies. Potential defects in bumps and traces are identified early, triggering repair algorithms that replace marginal I/Os with redundant ones to prevent system failures. This proactive approach significantly extends chip lifespan and enhances system reliability.Pushing the boundaries of performance, GUC is committed to further increasing lane speeds while reducing power consumption. GUC has successfully taped out its second-generation UCIe IP, achieving 40 Gbps per lane in late 2024.This new version incorporates Adaptive Voltage Scaling (AVS), delivering approximately 2x power efficiency improvements. In addition, a face-up version of the UCIe-40G IP, designed for 3D integration (SoIC) with Through-Silicon Vias (TSVs), is scheduled for tape-out in the coming months. Looking ahead, GUC's third-generation UCIe IP, capable of 64 Gbps per lane, is currently in development and slated for tape-out in the second half of this year. UCIe product line is optimized for all types of CoWoS and for future TSMC's SoW-X platform. "We are excited to announce the successful silicon bring-up of the world's first UCIe IP supporting 32 Gbps," said Aditya Raina, CMO of GUC."With a comprehensive, silicon-proven 2.5D/3D chiplet IP portfolio across TSMC's 7nm, 5nm, and 3nm process technologies, we deliver robust solutions that go beyond IP. Combined with our expertise in design, package engineering, electrical and thermal simulations, design-for-test (DFT), and production testing for TSMC's 3DFabric technologies, including CoWoS, InFO, TSMC-SoICR, we empower our customers to accelerate design cycles and achieve rapid bring-up of their AI, HPC, xPU, and networking products.""We are committed to delivering the highest performance and lowest power 2.5D/3D chiplet and HBM interface IPs," said Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging technologies, leveraging HBM3E/4/4E, UCIe, and UCIe-3D interfaces, enables the development of highly modular processors that exceed reticle size limitations, paving the way for the next generation of high-performance computing."GUC UCIe-32G Silicon Highlights√ 32Gbps per lane√ Beachfront bandwidth density (full-duplex): 5Tbps/mm√ AXI, CXS and CHI bus bridges√ Dynamic Voltage and Frequency Scaling (DVFS)√ UCIe Preventive Monitoring: per lane, in-mission mode I/O signal quality monitoring by protean Tecs

SK Hynix Inc. (or "the company") announced today that it has received the 2025 World's Most Ethical Companies® recognition by Ethisphere*, a global leader in defining and advancing the standards of ethical business practices, marking the first case for a Korean semiconductor company to be named as an honoree.* Ethisphere: global leader in defining and advancing the standards of ethical business practices that strengthen corporate brands, build trust in the marketplace, and deliver business success. Ethisphere honors superior integrity programs through the World's Most Ethical Companies® recognitionThe assessment is based on Ethisphere's proprietary Ethics Quotient®, which requires companies to provide 240+ different proof points on practices that support robust ethics and compliance; governance; a culture of ethics; environmental and social impact; and initiatives that support a strong value chain.In 2025, 136 honorees were recognized spanning 19 countries and 44 industries. SK Hynix is one of only four honorees in the semiconductor industry.The international recognition follows years of the company's efforts to set up goals for business ethics and systematic evaluation and implementation of them. SK Hynix expects an ethics management system that the stakeholders can trust and is suitable for a global company to help it and its customers achieve higher corporate values.SK Hynix and its employees have combined efforts to advance business ethics further with members participating in the signing of compliance commitment letters and compliance surveys every year with passion.In 2023, SK Hynix also started a program to share its operation and know-how of the business ethics system with business partners to further grow it into a system for the broader supply chain."Congratulations to SK Hynix for achieving recognition as one of the World's Most Ethical Companies®," Erica Salmon Byrne, Ethisphere's Chief Strategy Officer and Executive Chair, said. "Behind this honor is a true dedication and a commitment to advancing business integrity.""I would like to express my gratitude to our members for their continued efforts to help advance the company's principles for ethical management to be recognized globally," SK Hynix Chief Executive Officer Kwak Noh-Jung said. "We will strive to meet the trust of our stakeholders and do our part to continue as an ethically responsible AI memory provider."Credit: SK Hynix

AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.Last month at CES 2025 - one of the world's largest electronics trade shows - DEEPX was recognized as a "must-visit company" by the event's organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company's expanding commercial prospects.During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX's technological strengths.Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:–Hyundai-Kia Motor Robotics Lab (robot platform)–Inventec (smart factory)–POSCO DX (smart factory & logistics automation)–LG U+ (industrial and urban security)This demonstration underscored the critical role of on-device AI semiconductors - beyond cloud-based approaches - in ushering in a new era of AI.DEEPX also directly compared its solution to NVIDIA's Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a 'butter benchmark' test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability - critical factors for on-device AI.To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models.Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths - including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix - as well as DEEPX's own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is pleased to announce its participation in Embedded World 2025, one of the largest global platforms for the embedded community. The event will take place in Nuremberg, Germany, from March 11 to 13, 2025. Visit Darveen at Hall 3, Booth 3-230 to explore our latest rugged computing solutions designed for a wide range of vertical industries, including in-vehicle environments, marine applications, industrial edge computing, and mobile workforce operations.Stop by our booth to discover our newest product lineup, including:In-vehicle computing solutionsDarveen's in-vehicle solutions are purpose-built for demanding vehicle environments, featuring all-in-one vehicle mount computers with integrated monitors and in-vehicle box PCs. Engineered for reliability, these solutions offer wide temperature and wide voltage support, along with rugged designs, making them ideal for trucks, forklifts, cranes, mining vehicles, agricultural vehicles, and buses. With MIL-STD-810H/G compliance and M12 connectors, our solutions are well-suited for transportation, logistics, warehousing, and port terminal operations.Rugged tablets, RTC seriesDarveen will showcase its rugged RTC Series tablets, available in sizes ranging from 8" to 11.6". A key highlight is the recently launched RTC-I116, featuring a high-brightness 1,000-nit display, hot-swappable dual batteries, and a range of expansion options—perfect for boosting productivity in field operations. The Android OS version of the RTC Series is also available. These versatile tablets are suitable for industries such as manufacturing, law enforcement, firefighting, energy, and logistics.Marine computing solutionsDarveen is introducing a new marine-grade computer powered by a 13th Gen Intel Core processor. Designed for high-performance marine applications, it features 4x NMEA 0183 ports and 8x isolated GPIO ports, ensuring stable connectivity with various ship instruments and systems. Whether managing electronic chart display and information systems (ECDIS) or handling complex vessel-specific applications, this solution delivers exceptional performance and reliability at sea.Industrial edge computing solutionsBeyond vertical-specific solutions, Darveen will also present its latest industrial embedded computers and HMI panel PCs, designed to handle the challenges of edge computing in harsh industrial environments. These high-performance solutions support smart factories and industrial automation, enabling real-time data processing and control.Darveen's comprehensive product portfolio serves diverse industries with customized solutions tailored to specific application needs. As a trusted provider, we are committed to accelerating our customers' time-to-market with innovative, high-quality computing solutions.Join us at Embedded World 2025 and experience the future of rugged computing firsthand!

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is set to showcase its latest industrial computing and edge AI computing solutions at the upcoming Embedded World 2025. The event will take place from March 11-13, 2025, at Nurnberg Messe, Nurnberg, Germany, with BIOSTAR's booth located at 2-321, Hall 2.At Embedded World 2025, BIOSTAR will spotlight its edge computing solutions powered by Intel CPUs, including AI-driven platforms tailored for industrial automation, smart cities, and HMI (Human-Machine Interface) applications. Key highlights will include 3.5" SBCs, NVIDIA Jetson Orin platforms, and industrial-grade systems engineered for scalable, efficient, and robust performance.As an essential player in the IPC and edge AI industries, BIOSTAR continues to lead the way in providing scalable, efficient, and powerful computing solutions. BIOSTAR's diverse portfolio includes products across multiple form factors, including ATX, Mini iTX, SBC, and embedded industrial computers, ensuring versatility and adaptability for various use cases.Credit: BIOSTARIn addition, with the successful cooperation at CES 2025, BIOSTAR will partner with DEEPX again at the exhibition to integrate AI technologies into its edge computing solutions, further solidifying its leadership in Edge AI platforms. The collaboration with renowned AI chip solution providers underscores BIOSTAR's critical role in shaping the future of intelligent computing.Credit: BIOSTARBIOSTAR is excited to welcome industry professionals, IPC innovators, and tech enthusiasts to join them at Embedded World 2025. The exhibition will feature the latest advancements in edge AI and industrial computing technology, showcasing BIOSTAR's commitment to pushing the boundaries of innovation to address the evolving demands of smart industries. Attendees are welcome to apply for FREE tickets using ew25543325, the BIOSTAR invitation code, and invited to visit booth 2-321, Hall 2, to experience firsthand how BIOSTAR's cutting-edge solutions transform industrial applications through enhanced AI computing capabilities.

In recent years, API attacks—especially those involving shadow APIs— have become an increasing concern. Some of the most destructive types of API attacks include command injection and malicious program uploads, which can grant attackers remote control over hosts and have already led to significant cybersecurity incidents.Additionally, AI-driven attacks are rapidly emerging as a major threat. Hackers are now leveraging AI tools to create sophisticated malware and attack vectors, further escalating security risks.Supply chain vulnerabilities have also become a widespread cybersecurity challenge. Supply chain attacks occur when enterprises are infiltrated through compromised third-party software or hardware provided by external partners. In many cases, companies outsource software development, but their vendors inadvertently incorporate compromised third-party components. These issues are difficult to detect yet have severe and far-reaching consequences. In recent years, RayAegis has also identified compromised third-party components in multiple ATM systems.RayAegis: A Pioneer in Cybersecurity InnovationRayAegis has been at the forefront of cybersecurity and artificial intelligence (AI) for years. As early as 2017, at the IEEE conference in San Jose, USA, RayAegis publicly demonstrated an advanced AI theory designed to detect zero-day vulnerabilities. To this day, AI systems deployed across various countries continue to uncover emerging zero-day attacks, providing robust security defenses.RayAegis also integrates this cutting-edge technology into red team exercises and penetration testing services, helping enterprises strengthen their security posture.Key Global Cybersecurity ChallengesRayAegis has identified several pressing cybersecurity challenges facing enterprises today:Shadow APIs remain widespread: Many organizations unknowingly purchase products that contain shadow APIs, which attackers can exploit to upload malware or gain unauthorized access to systems.Obfuscated OWASP TOP 10 attacks bypassing WAFs: Attackers are using advanced obfuscation techniques to evade Web Application Firewalls (WAFs), allowing threats such as obfuscated JavaScript, SQL injection, XSS, and OS command execution to bypass defenses and compromise backend systems.Failure to detect new, customized malware: Traditional antivirus solutions have limitations. RayAegis has observed that once enterprises are infected with new malware, they often struggle to prevent further threats, including data exfiltration, lateral movement, and system intelligence gathering.Inadequate access controls: Attackers can exploit weak access controls to retrieve unauthorized user information, access internal databases, or leverage critical internal services.LLM vulnerabilities in OWASP TOP 10 (https://genai.owasp.org/llm-top-10/): These vulnerabilities may expose sensitive system information and pose new security risks.RayAegis' AI-Driven Security SolutionsTo address the evolving landscape of cybersecurity threats, RayAegis not only provides professional security services but also develops AI-powered solutions to help enterprises mitigate risks:SandSphere: A sandbox solution that scans files and evaluates the security of supply chain software, including detecting embedded backdoors.UTDS-API: An API inventory system that identifies unmanaged APIs and detects zero-day vulnerabilities.Malware Protection Effectiveness Testing: Assesses an organization's ability to defend against cyber threats by simulating attacks to determine if hackers can extract system information or cause further damage.Credit: RayAegisRayAegis is a global cybersecurity leader, providing cutting-edge security solutions to major banks, government agencies, and enterprises worldwide. Visit the website for more information: https://www.rayaegis.com/english/

Semiconductor testing plays a crucial role in the supply chain, with industry players prioritizing factors such as test speed, cost, signal measurement accuracy, one-stop test capabilities, and software support. Chroma ATE holds a key position in the global ATE (Automated Test Equipment) market, offering a diverse range of solutions and maintaining a strong global presence. Recently, the company hosted a Semiconductor Test Equipment User Conference in Hsinchu, Taiwan, where it shared its 2025 hardware and software test solution roadmap with customers.Commitment to growth with customers: A comprehensive solution blueprint for global expansionGeorge Chang, president of Chroma ATE's Semiconductor Test Business Unit, highlighted in his opening speech that Chroma has been engaged in the semiconductor sector for over 20 years. With an installed base of more than 4,300 test systems worldwide, the company serves markets across Asia, Europe, and the Americas. Chroma's product lines can be categorized into five segments: digital, analog, mixed-signal, interface solutions, and software. The company is also actively developing next-generation products for applications in RF, power, and audio testing.George Chang, president of Chroma ATE's Semiconductor Test BU, stated that as of November 2024, Chroma's global installed base of semiconductor ATE exceeds 4,300 systems. Credit: Chroma ATEFocusing on hardware test platforms with wide range of test boards to meet diverse needsFor wireless solutions, Roger Huang, vice director of the Application Engineering Department at Chroma Group subsidiary Adivic Technology Co., introduced the Chroma 3680 HDRF2 test board. Huang noted that the Chroma 3680 platform natively supports testing of a wide range of chips, but when combined with the HDRF2, it can meet extensive wireless and RF (radio frequency) testing needs, including Wi-Fi 6, BT 5.0/BLE, GPS, and wide-area IoT technologies. Chroma is already developing its successor model, the HDRF3, to address standards such as Wi-Fi 6E/7 and 5G FR1. The company has also developed solutions specifically tailored for the 5G mmWave spectrum. The 30GHz range is addressed by the existing Chroma 3680 HDRF2, while the 48GHz range is supported by the MP5808 model paired with the mmWaveBox, catering to 5G FR2, FR3, and low-earth orbit (LEO) satellite applications.For power-related chip testing, Spancer Lee, senior manager of Product Marketing at Chroma's Semiconductor Test BU, highlighted the pivotal role of the Chroma 3650 platform. Lee noted that since launching the 3650 platform back in 2002, Chroma has continuously evolved its solutions to meet market demands for power management. The company introduced various test boards and solutions to complement the 3650, culminating in the release of its successor, the Chroma 3650-S2, in late 2022. Chroma is also preparing to unveil a new product, the HTMU board, further demonstrating its commitment to addressing diverse voltage and current combinations for power chip testing. The testing needs of third-generation semiconductors with high-voltage specifications can be effectively met by stacking Chroma's HVVI boards.Lee also mentioned that as the design of power chips becomes more complex and the manufacturing process evolves, the timing information and related parameters to be measured for power chips become more challenging. Chroma ATE launched these test boards, together with the Chroma 3650-S2, to meet the testing needs of the new generation of power chips.In the mixed-signal domain, Blair Fan, associate product manager at Chroma's Semiconductor Test BU, focused on the company's roadmap for audio mixed-signal solutions. Fan pointed out that the Bluetooth headset and speaker market is expected to grow at a compound annual growth rate (CAGR) of approximately 20% from 2024 to 2029, reaching a total market value of $38.2 billion. From a product design perspective, challenges in Bluetooth and audio applications include the integration of digital and analog testing, as well as cost control to maintain chip profitability. Chroma addresses these challenges with the Chroma 3380 platform paired with the MXADO module board.Minimizing platform conversion time using large language models (LLMs) Beyond hardware, Chroma has also made significant strides in software solutions. Ray Hsu, software engineer at Chroma's Semiconductor Test BU, explained that in the long run, semiconductor manufacturers will inevitably transition between test platforms. This process typically requires around 140 hours of additional software migration time. However, Chroma leverages Large Language Models (LLMs) to reduce this to just 5 hours. He further explained that the conversion process involves two stages: the first uses LLMs for processing and the second uses Retrieval-Augmented Generation (RAG) technology. Parameter adjustments and removal of unnecessary parameters are still required to ensure ideal conversion results.Hsu emphasized that while conversion is not 100% perfect and still requires manual refinement, it saves substantial amounts of time compared to traditional methods, which is of great benefit to customers.In addition to introducing its next generation of semiconductor test solutions, Chroma invited strategic partners Dr. Chen Wei-yang from TMY Technology and Mr. Tai Yu-che of the R&D and simulation department at Keystone Microtech to share relevant insights on their collaborative advancements.To sum up, Chroma ATE offers a diverse range of solutions covering digital, analog, and mixed-signal testing in the global ATE market. At the recent user conference held in Hsinchu, Chroma unveiled its 2025 roadmap for hardware and software solutions. The company showcased an array of test equipment, including the Chroma 3650, 3680, and the newly launched HDRF series, catering to power management, high-frequency testing, and wireless technology applications.Amid evolving US-China trade dynamics, Chroma is deepening its localized services while utilizing AI technologies like LLM and RAG to shorten software migration times and enhance testing efficiency. Looking ahead, Chroma ATE is poised to continue integrating innovative technologies to meet the testing needs of next-generation semiconductors, foster growth alongside customers, and strengthen its global market presence.Live demonstration of the Chroma 3680 Advanced SoC Test System. Credit: Chroma ATEChroma's Semiconductor Test Equipment User Conference attracted nearly 200 industry professionals. Credit: Chroma ATE

STMicroelectronics' L99MH98 8-channel gate driver brings patented features for building automotive motor drives without sensing resistors, reducing power dissipation and the bill of materials.The L99MH98 can drive four external full bridges, eight half bridges, or single high-side/low-side powering mechanisms such as seat-position adjusters, window lifters, sunroofs, pumps, seatbelt pre-tensioners, and other actuators. The L99MH98 can also drive resistive loads such as heaters, and the internal circuitry contains a charge pump whose output can control a reverse-battery protection MOSFET.While the drivers can control both logic-level and standard-level MOSFETs, extended gate current capability, programmable up to 120mA, permits driving large numbers of external MOSFETs. Three-stage gate control, which applies the gate signal in three steps, helps to minimize electromagnetic emissions.Designed to provide each MOSFET's drain-source voltage (VDS) to an analog-digital converter (ADC), the L99MH98 leverages indirect current measurement to replace sensing resistors. This ST-patented technique calculates the drain current in each MOSFET by combining the measured VDS with RDS(on) predicted using sensed temperature. The system is calibrated at manufacture to find the nominal RDS(on) values, enabling predictions to be made using the MOSFETs' resistance-versus-temperature curves.A further feature, also ST-patented, is the programmable multi-failsafe function that enhances reliability by turning off bridges individually to protect against faults while allowing unaffected bridges to operate normally. Multi-failsafe detects faults, including supply overvoltage, high-side over/under voltage, thermal warning, charge-pump failure, and VDS-monitoring failure, and selectively turns off functions such as diagnostics, watchdog and charge pump depending on fault type.The L99MH98 is AEC-Q100 qualified and meets ISO 26262 criteria for functional-safety applications up to safety integrity level (ASIL) B.Available now in a VFQFN48L package with wettable flanks and exposed underside cooling pad.

After successfully launching the 7th generation Micro-Pattern Trench (MPT) technology-based discrete IGBT new products in Q2 2024, PARA LIGHT ELECTRONICS CO., LTD. (Referred to as"Para Light" hereafter) recently announced its plan to introduce six additional products in Q1 this year. These new offerings will target applications in medium-to-high power servo motor drive control, uninterruptible power supply (UPS) systems, solar inverters, industrial induction heating, energy storage, and smart grid-connected systems.The product lineup will include four high-performance discrete devices in TO247-3Plus packaging and two high-power modules featuring a half-bridge circuit structure, which is compatible with Infineon's EconoDUAL™ 3 (ED3) package. Leveraging advanced 7th-generation MPT-IGBT chip design and manufacturing technology, these new products will provide the application market with exceptional solutions for enhanced efficiency and stability.Para Light's IGBT Product Portfolio includes six new products, designed and manufactured using 7th-generation Micro-Pattern Trench (MPT) chip technology. *Note: PCA0N065GH7S is a custom product and is not available for the mass market at the moment. Credit: Para LightPerformance Benchmarking – Para Light's 7th-Gen IGBT vs. 6th- and 7th-Gen IGBTs of a global leading brand. Para Light's 7th-Gen IGBT solutions deliver performance on par with the global Tier-1 brands' 7th-Gen IGBT products while outperforming 6th-Gen counterparts by 20–30%. Credit: Para LightIn these four TO247-3Plus packaged products, the metal surface area for heat dissipation has increased by approximately 18% compared to the standard TO247-3 package. This enhancement effectively reduces the chip's thermal resistance and operating temperature, thereby extending the lifespan and stability of customers' power systems while also lowering cooling system costs. Notably, a new solution with a 1200V/60A specification will soon be available in the standard TO247-3 package (tentatively designated as PC60N120AH7S), offering customers more options when designing power systems.For higher-power applications, Para Light has also introduced two high-performance IGBT module products with power ratings of 1200V/600A and 1200V/450A. Both modules adopt a standard half-bridge configuration and incorporate built-in negative temperature coefficient (NTC) resistors to provide reliable over-temperature protection. Furthermore, the flat packaging, which is compatible with Infineon's EconoDUAL™3 (ED3) package, significantly enhances the power density of the overall power system.Eric Hung, Deputy General Manager of Business and Marketing for Para Light's Power Semiconductor Division, stated that whether in discrete or module IGBT products, Para Light is committed to using the advanced seventh-generation MPT chip technology for both design and manufacturing. In addition to delivering higher operational efficiency, our G7th IGBT technology achieves exceptionally high chip production yield, underscoring the mature, reliable, and stable quality of Para Light's IGBT products—key attributes that set the brand apart in a competitive industry. Moreover, the IGBT products offer several advantages, including a maximum operating junction temperature of up to 175°C and excellent short-circuit current capability and overload test performance under high-temperature conditions. These features ensure that customers' power systems maintain high stability and an extended service life, even under full load or harsh environmental conditions. Additionally, the wide range of applicable switching frequencies enables parts consolidation, effectively reducing procurement costs.David Ma, the Chairman of the Board, emphasized that since IGBTs are key components in various power electronic systems, their performance and quality stability not only directly affect overall system performance but also play a critical role in material management and reducing the hidden costs associated with system failures. Listed on the Taiwan Stock Exchange and a global leader in LED design and manufacturing since its establishment in 1987, Para Light's core competencies in continuous product innovation and strict in-house quality control have been central to maintaining its competitive advantage. In recent years, the company has further leveraged these strengths to expand into the power semiconductor sector. As one of the few industry brands with an advanced seventh-generation IGBT power transistor product line and packaging and test plant, Para Light's IGBT products offer significant value by delivering enhanced efficiency and stability to customers' power systems.Para Light Electronics holds ISO 14001, ISO 9001, and IATF 16949 quality management certifications. Its power semiconductor products undergo JEDEC's six major reliability tests, and all critical processes—from incoming inspection to product shipment—are rigorously controlled through SPC. The proven stability and consistency of these products have resulted in high market acceptance, with several strategic customers in the regions of Greater China, Taiwan, and India continuously integrating Para Light's solutions into applications such as industrial servo motor drive control, UPS systems, industrial solar inverters (PV inverters), and energy storage power management equipment. Looking ahead, the company plans to extend its product applications into electric vehicle DC fast-charging solutions.Para Light Electronics holds ISO 14001, ISO 9001, and IATF 16949 quality management certifications. Its power semiconductor products undergo JEDEC's six major reliability tests, and all critical processes—from incoming inspection to product shipment—are rigorously controlled through SPC. The proven stability and consistency of these products have resulted in high market acceptance, with several strategic customers in the regions of Greater China, Taiwan, and India continuously integrating Para Light's solutions into applications such as industrial servo motor drive control, UPS systems, industrial solar inverters (PV inverters), and energy storage power management equipment. Looking ahead, the company plans to expand its product applications into electric vehicle DC fast-charging solutions soon.

Plustek delivered an impactful presence at CES 2025, captivating audiences over four inspiring days with groundbreaking advancements and solutions tailored to tackle the pressing challenges of today's rapidly evolving digital landscape.Attendees shared the obstacles faced when adopting complex technologies into their daily workflow and highlighted and highlighted a demand for intuitive, seamlessly integrated technologies that deliver both efficiency and user satisfaction. Plustek's high-performance data extraction, AI-enhanced dynamic file renaming, and a revolutionary standalone network scanner solution provide a straightforward answer, meeting the needs of users with little to no code needed, designed to simplify workflows and resolve challenges faced in daily business operations.At CES 2025, Plustek showcased an array of transformative solutions that redefine business operations. The Codeless ID Data Parsing technology seamlessly integrates identification data, simplifying deployment and reducing errors across industries like healthcare and automotive. AI-enhanced file management solutions automate complex tasks, enabling effortless categorization, renaming, and data extraction to enhance efficiency. Additionally, Plustek's standalone network scanner combines plug-and-play simplicity with secure, high-resolution scanning, delivering precision and reliability. Together, these innovations empower businesses to streamline workflows, save time, and unlock new levels of productivity."CES 2025 provided an incredible platform for Plustek to connect with customers, partners, and industry leaders, delivering valuable feedback and revealing exciting potential," said Ken Lin, Director of Sales and Marketing at Plustek. "The enthusiastic response to our latest innovations, including auto file renaming solutions that streamline workflows and codeless ID solutions simplifying deployment for complex integrations, highlights the growing demand for smarter, more efficient technologies. Our solutions at CES 2025 inspired further innovation, delivering transformative technologies that empower businesses and individuals."During the four-day event, Plustek's booth garnered significant interest, highlighting the demand for solutions that simplify workflows and empower individuals to achieve greater impact. Plustek demonstrated how automation can tackle key challenges like streamlining complex processes and freeing up time for meaningful, high-value tasks. By automating repetitive work, Plustek's solutions allow individuals to focus on strategic, creative, and impactful contributions, enhancing both personal and organizational growth. Attendees recognized how Plustek's approach not only makes processes more efficient but also elevates the role of human expertise in achieving meaningful outcomes.Plustek is at the forefront of driving digital transformation across industries, delivering solutions that seamlessly blend advanced technology with user-centric innovation. Its globally recognized Auto Fill-In technology continues to simplify data management, catering to businesses of all sizes. Supported by an experienced team of consultants, these solutions enable organizations to thrive in the evolving digital landscape. With four decades of expertise, Plustek provides AI-driven innovations that integrate effortlessly into workflows, empowering businesses to focus on strategic growth and unlocking the full potential of digital transformation. For more info visit: www.plustek.com/us/news/events-and-trade-shows/ces2025/index.php