Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, has been honored by Global Connector Technology (GCT) as the winner of its Distributor of the Year Award for 2021.
STAr Technologies, a leading supplier of semiconductor reliability test systems, announced the shipment of the all-in-one SMU-per-pin test system, the STAr Pluto-hiVIP, to benchmark the semiconductor test reliability system industry. The system is configured for low/high current dynamic AC electromigration and burn-in testing for high pin count devices such as TSV, copper-pillar, micro-bump, etc...
AMICCOM released a new generation of low current sub1-GHz wireless SOCs in March 2022, named A9129F6, A9139F6, and A9159F6. AMICCOM continues to integrate the existing RFICs with MCU and roll-out highly integrated SOC products...
AMICCOM Electronics Corporation (AMICCOM) has announced a new 2.4GHz wireless transceiver SOC named A8131M0. The A8131M0 supports data rate 250kbps to 2Mbps with FSK modulation. This chip integrates high performance Arm Cortex-M0, built-in 128Kbyte/256Kbyte flash memory, 32Kbytes SRAM, 23 GPIOs and various digital interfaces, and 2-wire ICE can be developed with Keil C.
Relimetrics, a leader in AI-based quality inspection for manufacturing processes, has announced that the detection accuracy and availability of its software systems will be guaranteed and that this guarantee is backed by the Munich Re Group, one of the world's leading providers of reinsurance, primary insurance and insurance-related risk solutions.
As global brands have adopted ESG into their corporate strategy, related policies have also been extended to the global supply chain. ESG rankings have become a trending topic...
Introduced in the 1960s, offshoring became a primary cost-savings business strategy for industries to outsource manufacturing operations to Asia. However, as supply chain constraints intensified within the past couple of years, many businesses have considered transferring operations back to nearby countries...
NeoGene Tech, a Guangzhou-based technology platform provider of designing and fabricating ultra-thin vapor chamber devices for 5G smartphone application, has announced its Level 3 PWS (Print Wick Structuring) COMBO technology has overcome the bottleneck and limitation of traditional copper mesh wick technology in two-phase working fluid transportation and circulation efficiency inside a big-area...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D and 3D Advanced Packaging Technology (APT). The platform supports TSMC's CoWoS-S, CoWoS-R, and InFO technologies...
The emergence of 5G, Artificial Intelligence (AI) and Internet of Things (IoT) technologies can unlock digital transformation to meet the needs of various industries such as manufacturing, healthcare, urban infrastructure, etc...
