ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products, today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5) solid state drives (SSD) utilizing the SATA III interface. They include the ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs...
With the deep integration of the new generation of information technology and manufacturing industry, and the digital transformation and upgrading, digitalization is currently intensively filling every link of production and manufacturing...
United Microelectronics Corporation (UMC) announced today that the Science Based Targets initiative (SBTi) has approved its emissions reduction targets, making the Company the first semiconductor foundry globally to obtain SBTi validation of climate goals. This marks a critical step in UMC's roadmap to achieve net zero emissions by 2050.
Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has hired Mike Slater as its new vice president of global business development. In his new role, Slater will oversee the company's worldwide customer and supplier development strategy.
As Industrial 4.0 and smart manufacturing emerge, the integration of virtuality and reality has become the mainstream. This trend has subsequently brought changes to the landscape of industrial products, from concept design, product design, mold design to manufacturing and production. The process entails CAD models all the way down to different simulations at every stage...
DEKRA and VicOne, a subsidiary dedicated to vehicle security established by a global cybersecurity leader Trend Micro Incorporated, announced their partnership in providing joint solutions for automotive suppliers to compliance with new international regulations and standards in vehicle security...
The rising demands of 5G smartphone, electrical vehicles and data centers drive semiconductor components rapid expansion. The industries increase the investments of advanced packaging technologies to response the trending multi-chip or multi-module packaging technologies. The IDMs, foundry and OSAT service providers increase the capital expenditure for development of wafer level packaging...
The 5G industries are ramping up competition to drive innovation and diversify the global telecoms supply market. Surprisingly, in the fierce competition of recent years, Taiwan networking solution providers grab the benefits from market share gains, robust customer demand and a new wave of outsourcing from global telecoms...
STREAM education is a novel educational concept of a new generation, combining science, technology, reading and writing, engineering, arts and mathematics. It brings inspiration and invention to help students improve their practical problem-solving skills...
In the wake of the continuous advancement of semiconductor manufacturing processes, sensing technology has been popularized, which empowers the rise of many new technologies and drives the demand for sensors. According to Yole Developpement, aside from mobile applications, the emergence of other application demands has been seen, such as automotive, healthcare and security...