In order to improve service, the global testing certification institution, DEKRA, established Taiwan's first high frequency EMI noise absorber automatic storage anechoic chamber. Breaking from traditional manual placement, the site can be automatically controlled like a stage and the high frequency EMI noise absorber can be elevated in 1 minute and 40 seconds. Not only can it shorten the 1 hour site configuration time, it can also reduce human errors in placement, helping customers to save time and costs and improve testing accuracy.DEKRA established Taiwan's first high frequency EMI noise absorber automatic storage anechoic chamber, which only needs 1 minute and 40 seconds to complete the automatic deployment and storage of the high frequency EMI absorberKilian Avilés, Senior Vice President of DEKRA Asia Pacific and Managing Director of Taiwan, stated that with the trend of digitization, smartification, and implementation of IoT, the EMC in our environment is getting more complicated. Therefore, the need for global EMC and RF testing is reaching new heights. So, in recent years, DEKRA has been actively establishing more anechoic chambers and expanding more advanced lab equipment. DEKRA has created various anechoic chambers in Hsinchu, Huaya and Linkou, to provide customers with complete electromagnetic compatibility (EMC) testing services for electromagnetic interference (EMI) and electromagnetic susceptibility (EMS).Daniel Lee, General Manager of DEKRA Taiwan Product Testing Operations, stated that besides creating Taiwan's first automatic high frequency EMI noise absorber storage function for anechoic chamber, the new 10-meter anechoic chamber in Linkou is also integrated one multi-use turntable system in 3 meter and 6 meter diameter concentric circles. The turntables can be used flexibly depending on the size of the product. The testing service covers products from consumer electronics, mobile phones, computers, to large products, even servers can be tested. The chamber utilizes dual-antenna testing, which can complete horizontal and vertical polarized testing at the same time, greatly reducing testing times. Furthermore, in order to save the customer's time and protect the products, the anechoic chambers are designed with no barriers so that trucks can drive directly into the lab to place the products, eliminating the time and trouble needed for manual transportation. Daniel Lee further emphasized that with the corporate principle of "Customer Focus", DEKRA is continuously upgrading its lab equipment and service procedures, in order to provide the customers with more customized, professional and digitized services and testing certification service.the new 10-meter anechoic chamber

As global warming continues to intensify, and due to the impacts of El Niño and La Niña, abnormal climate events such as the Australian bushfires are increasing in frequency. For this reason, sustainable development has risen to the forefront for countries and corporations. For example, following international pressure at the 26th United Nations Climate Change Conference (COP26), both China and India have agreed to set net-zero carbon emission targets for 2060 and 2070, respectively. Merry Electronics, whose business philosophy focuses on "transparent and sustainable operations, and a sense of responsibility towards the wellbeing of our country and society," has recently announced that it will become Taiwan's first electro-acoustic solution provider to join the RE100 initiative.As a world-leading electro-acoustic solution provider, Merry Electronics has long placed emphasis on global environmental issues despite being in the electro-acoustic industry—an industry that traditionally consumes less energy and produces fewer carbon emissions. The company began to work on its carbon inventory as early as 2007, and obtained the ISO14064 (Greenhouse Gas Accounting and Verification) to confirm its emission inventory and understand the energy consumed in the manufacturing of its products and workplace environments. Since 2009, the company has invested in the research of renewable materials, made plans to implement a carbon footprint in 2014, and evolved by introducing the ISO14067 certification system. Moreover, in 2016, the introduction of ISO 50001 energy management systems to the company's headquarters in Taiwan systematically implemented company-wide energy conservation and carbon reduction measures by continuously updating energy conservation equipment.Merry Electronics stated that corporate sustainability has always been embedded in the company's core values. Since its inception, the company has integrated green concepts into its product design, raw material procurement, product manufacturing, marketing processes, and services when developing electro-acoustic products for its clients. This ensures that its entire supplier-to-client processes meet green requirements. In addition, the company has always complied with the latest international laws and client requirements to actively and gradually eliminate toxic substances for humans or the environment. The company has also invested heavily in sustainable supply chain management, which increases product performance and reduces energy consumption, to achieve sustainable operations while ensuring that its products comply with green standards.In terms of sustainable supply chain management, the company has enhanced its supply resilience, reduced its carbon footprint from the procurement and transportation of raw materials and parts, and minimized its environmental impact. Furthermore, Merry Electronics prioritizes suppliers with local production plants and requests that they all follow a strict code of conduct to avoid the social costs caused by climate change and resource depletion.Reducing Energy Consumption and Increasing the Renewable Energy RatioOver the years, Merry Electronics has gradually replaced old chilled water and air conditioning units with COP value and energy-conserving systems that reduce consumption and help realize environmental sustainability. For instance, replacing the central air conditioning system of Merry Electronics Shenzhen in 2020 saved 45.2% of energy compared to the previous system. In addition, the installation of a heat exchange system to reduce indoor temperatures, setting air conditioners to 26 degrees, and the continuous use of LED light bulbs have further helped conserve electricity.According to the 2020 sustainability report by Merry Electronics, despite energy consumption density reaching 2.89 (GJ/million NTD) in 2020 (a 38.63% increase from 2.08 in 2019), energy management performance was affected by several events, including Merry Electronics Vietnam's first year of production, Merry Electronics Thailand's first year of official mass production, Merry Electronics Shenzhen's projects with affiliated companies, and the impacts of the COVID-19 pandemic on management activities. In 2020, Taiwan's R&D headquarters used 1,312.58 kWh of electricity, a slight decrease of 9.18 kWh (a 0.69% reduction) compared to 2019. If factors such as monthly temperature and labor hours are included in a regression analysis, 2020 had an average of 4.29% energy decrease in terms of energy conservation benefits.Merry Electronics stated that all of its production bases have implemented green factory plans. In addition to setting an annual electricity conservation target of 1.5%, the concept of renewable energy has been integrated into the operations of all factories by proactively monitoring carbon emissions from products and workplaces. There are also plans to install solar energy equipment in suitable areas. The 30-year renewable energy project will begin in 2021. By 2030, 60% of the company's total energy consumption will come from renewable energy sources; in 2040, this percentage will reach 90%, and finally 100% in 2050.Promoting a Design Framework for Sustainability to Enhance Product PerformanceIn addition to reducing energy consumption and increasing the ratio of renewable energy usage, Merry Electronics is also working to lower its environmental impact by increasing efficiency. The focus of the company's Design Framework for Sustainability begins with product design through goals such as the integration of miniaturized functions, human factors and ergonomics, differentiation of software/firmware, smart electro-acoustic platforms, and batteries. In 2020, Merry Electronics established short-, mid-, and long-term strategies for sustainable product design to further improve production technologies and product design capabilities, save on manufacturing materials, use renewable materials and low-impact packaging, and implement phased reductions for decreasing power consumption to ensure that products can contribute their sustainable value to the society and environment.According to the 2020 sustainability report by Merry Electronics, the design and structural optimization of circuits in new products has reduced the overall outer diameter by 10% and lowered power consumption, allowing an increase from 6.5 to 8.6 hours of use with the same battery capacity. Furthermore, the cases of e-sports gaming headsets are made of 12% recycled plastics, while the charge/discharge conversion efficiency of 1000Whr energy storage products was found to be 0.9-3.9% superior to other products in the market after internal testing.Merry Electronics plans to continue implementing the three major strategies outlined above to provide customers with exceptional solutions while creating products that have sustainable value to the environment and society.The newly designed Merry Electronics building was inspired by the concept of "intangible sound." The building highlights the accompaniment behind a main melody, alternately fusing into a minimalistic and modern design.

Driven by leading edge investment, global semiconductor equipment billings increased 38% year-over-year to US$26.8 billion in the third quarter of 2021, and an 8% rise from the prior quarter to register the fifth consecutive quarter-over-quarter record high, according to the SEMI report on December 1st 2021. This is continuously on track to register a rare three consecutive years of record highs in fab equipment spending from 2020. Strong demands for IC chips across a wide range of markets including high performance computing (HPC), 5G communications, artificial intelligence (AI) and automotive applications have fueled this tremendous increase of growth for semiconductor equipment. The equipment market's booming growth is the envy of industries around the world.An interview with Peter Karl Loewenhardt, Senior Vice President at Tokyo Electron Taiwan (TEL in Taiwan), takes a closer look at why this industry is so exciting. Co-optimized devices driven by huge demands of 5G, AI and HPC chips, as well as the impact of the Covid-19 pandemic, accelerated the Digital Transformation of Society which is accelerating the whole industry.This brings new challenges for equipment makers and supply chains that not only need to deliver leading edge process technology, but also excellent manufacturability to be able to have repeatable performance in every device. Nowadays, rapidly evolving manufacturing technologies have become more and more key as the complicated nature of all these devices has grown, as well as continuously reducing the impact on the environment of all these processes. "It is now all these areas that TEL is focused on, and we are excited to contribute to our customers and to the industry," he adds.The global shortage of chips that has forced automakers to limit or halt production has brought attention to Taiwan's supply chains in semiconductor manufacturing. It is very impressive that some Taiwan foundries have been very successful at gaining and maintaining their customer's trust, continually developing new technologies and making them well manufactured both in the advanced and legacy nodes and being able to support a large number of products and customers all at the same time. Being competitive in all these areas at the same time while also being profitable is how some Taiwan foundries have become very successful and will remain successful, Loewenhardt observed.Atomic level-controlled processing technologies aiming at next generation film deposition and removal technologyTalking about new developments in advanced nodes, as simple feature size shrinking can no longer alone meet requirements anymore, new 3D structures and material systems have become important as new devices emerge. With intense collaboration with customers, TEL actively provides process solutions for 3-dimensional structures. From atomic level-controlled deposition/coating to atomic level-controlled removal, this technology becomes a unique tool for producing or removing very thin, highly conformal coatings with a thickness controlled at the atomic level. TEL has developed and continues to develop technologies to address these challenges.Apart from 3D structures, regarding future trends there is a growing importance of Advanced Packaging and Systems integration. Heterogeneous integration of different dies together in 3D can help continue the density increase in a more economically feasible way, as well as continually advancing the on-chip technologies. TEL has developed wafer bonder equipment for 3D integration. This area will continue to get a lot of attention going forward.Sustainable Development Goals reducing the impact on the environmentThe Sustainable Development Goals (SDGs) highlight the world's shared plans and environmental issues and are a call to action for governments, industrial players, civil society and the technical community to achieve a better and more sustainable future. Semiconductor fabs consume large amounts of electricity, water, and chemicals. As a leading equipment manufacturer, TEL contributes by focusing on semiconductor production equipment that can manufacture devices in a way that reduce the impact on the global environment.On the other hand, Digital Transformation, in particular, plays a significant role in achieving the SDG targets by improving the efficiency and effectiveness of sustainable development. TEL recently established a Digital Design Square in Sapporo as a new base for further digital transformation activities enabling AI technologies.For example, in developing a baseline process for a low-stress film, whereas engineers typically took about 50 experiments to get to the desired baseline process, using Machine Learning technologies the optimal process conditions were arrived at in only 3 experiments, thereby using less wafers and resources. This was not only faster, but also minimized the use of electricity, gases, and silicon substrates, resulting in significant savings of energy and resources. Faster, and less impact on the environment.Other examples using technology come from all the product areas TEL has items in various stages of development which are; reducing wet clean chemistry usage; reducing deposition heater power; idling components when not being used; sharing components. Relentlessly improving TEL tools' manufacturing performance thereby increasing customer's output so there is less waste.Additionally, TEL has set its Sustainable Development Goals to add focus on how to deliver leading edge technology while also having the industry's equipment and processes reduce the impact on the environment. TEL last year revised its mid-term environmental goals for 2030 to be industry leading. The intention is to take the lead in achieving SDGs to support aggressive information and communication technologies in the Digital Transformation of society while also reducing the impact on the environment. Achieving SDGs are now critically important for the semiconductor industry, and TEL will continuously work on advanced node devices and contribute to SDGs for building a resilient supply chain in which economic activities do not stop under any circumstances.Peter Karl Loewenhardt, Senior Vice President at Tokyo Electron TaiwanPhoto: Company

With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network communications, automotive applications and manufacturing are also becoming more stringent. However, traditional packaging methods cannot keep up with the new market demands. Therefore, wafer level packaging and Fan Out Panel Level Packaging (FOPLP) have gradually become the focus of 5G, AIoT and high performance computing (HPC) companies when purchasing chips. Redistribution layers (RDL) is a core technology during the production of these chips, an it has also become a key area of focus of the industry in recent years. However, FOPLP demands a relatively high level of customization in its equipment. The Vice President of Sales at Manz, Adam Jian, stated that companies who intend to introduce this technology must focus on design and integration verification when selecting an equipment supplier.The Director of Technology at Manz, Dr. Eric Lee, explained the importance of RDL to semiconductors. He pointed out that the size of semiconductors is quickly decreasing. Traditional wire bonding and flip chip packaging can no longer be applied to these smaller chip sizes to improve the efficiency of electronic systems. Therefore, the company developed Fan-In WLP for packaging on wafers, achieving the goals of miniaturized packaging and lowering costs. Although Fan-In WLP possesses the advantages described above, there are still many potential problems during production. The biggest challenge is with soldering. If existing solder balls are used, the dimensions of these solder balls make it impossible to place them on miniaturized chips. On the other hand, the use of smaller solder balls would incur additional costs. In order to solve this problem, semiconductor companies began developing Fan-Out packaging.The technology is split into Fan Out Wafer Level Packaging (FOWLP) and Fan Out Panel Level Packaging (FOPLP). FOPLP has become the focus of the market due to its suitability for mass production and miniaturization and its low cost. Dr. Eric Lee stated that currently chip substrates still use organic materials. Because 10 microns is the limit for wire production and the size stability is relatively poor, producing thin circuits on the substrates is relatively difficult. Panel level RDL uses comparatively less material, therefore the thickness can be greatly reduced to between 2 to 10 microns. Alongside the large surface area glass substrate production technology, the packaging process can provide thin circuits and cover large surface areas. He compared FOWLP and FOPLP, which both use RDL technology for packaging. FOPLP can be used for 500mm x 500mm or 600mm x 600mm surface areas, which are 4 to 6 times larger than the current 300mm x 300mm wafer substrate. Therefore, it can provide cost advantages to companies with high yield rates and good integration capabilities.Regarding integration, Dr. Eric Lee also stated that it is another advantage of FOPLP. Currently, chips that use RDL for integration include power chips, radio frequency chips, base band chips and application processors with high pin counts in mobile phones. Additionally, in order to provide compact sizes and high efficiency, the applications of System in a Package (SIP) are quickly increasing, and the thin circuits and large surface area of FOPLP can satisfy the needs of SIP. He mentioned that the constantly miniaturizing semiconductor production process is nearing its physical limits. Therefore, packaging is now regarded as an area of focus for extending Moore's Law. RDL can help SIP conduct heterogeneous integration. In future 5G and AI integrated application electronics, MCUs, memory, and other digital computing components and sensors can be integrated, thereby reducing the signal transmission distance. Additionally, the thinner packaging can help with heat dissipation, thereby providing better efficiency and performance than existing packaging methods.Although FOPLP has many advantages, it is difficult for semiconductor companies to introduce the technology. The current wafer level packaging used by the companies has different surface areas and materials compared to FOPLP. Therefore, it can easily cause warping in the boards, uneven coatings, and other problems. Furthermore, because the packaging sizes have not been standardized, the production processes of each packaging company are different. Companies must find their own solutions and suitable equipment. Therefore, in the semiconductor RDL production equipment sector, Manz is focused on designed services, which can satisfy the need for customization in the market. However, Adam Jian specifically pointed out that semiconductor companies do not only require a single machine for FOPLP, instead they need a partner who can provide turnkey solutions. He stated that to reach the mass production standards for FOPLP yield, companies need more than RDL packaging equipment. The surrounding machinery must also support the functions. He used the coating process as an example. Uneven coating has always been a big problem for packaging companies. In response to this problem, Manz developed patented technologies for electroplating equipment, which can provide a coating evenness of 95%, greatly improving the yield and efficiency of production.Adam Jian said that Manz has been deploying FOPLP technology for many years and started offering related services in 2015, and has successfully applied this technology in real-world applications. Besides semiconductor companies, other companies have also incorporated the technology in recent years. For example, LED companies plan to use panel level packaging to electroplate circuits onto glass, optimizing the performance of MiniLED displays. Passive component suppliers hope to use the capacity and inductance of the product to expand the application scope. Facing the diverse needs of the market, Adam Jian stated that besides continued investments in technology development, in the future, Manz will actively expand the reach of its partnerships to help companies in different fields construct high performance FOPLP production systems, seizing the numerous opportunities in smart devices.Vice President of Sales at Manz, Adam Jian (left) and Director of Technology at Manz, Dr. Eric Lee (right)

BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics and semiconductor manufacturing market. BTU's high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. For semiconductor packaging applications where warpage of very thin substrates is a concern BTU offers the Pyramax TrueFlat configuration.The Pyramax TrueFlat operates without the use of a vacuum pump or specialty tooling and uses convection heat transfer for superior thermal uniformity. BTU's Pyramax TrueFlat is the market leader for the controlled reflow of very thin substrates with extensive install base throughout Taiwan and Asia.BTU and its distributor welcome you at booth I2716 in SEMICON Taiwan 2021 International Semiconductor Show.Pyramax is also offered in a vacuum reflow configuration, the Pyramax Vacuum, where the convection oven is configured with a vacuum chamber in the reflow zone. Vacuum reflow has been proven to be a reliable solution for virtually eliminating solder voids. Solder voids have been identified as a reliability issue for some critical applications.For front-end semiconductor processing the BTU BDF 300 is the market leading solution for 300mm horizontal diffusion furnaces. The BDF is offered in 3 tube configuration and features full cassette to cassette automation and maximum process temperature of 1200 degrees C, making it the tool of choice for power semiconductor applications. The BDF, Bruce Diffusion Furnace, is also offered in 200mm and 150mm/100mm models, the BDF 200 and BDF 41 respectively.BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), and sintering. These continuous furnaces are available with air atmospheres, inert atmospheres, reducing atmospheres and operate at temperatures up to 1180 degrees C. These controlled atmosphere furnaces excel in applications where precise control of temperature (-/-2 degrees across the belt width) is required.BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. In Taiwan BTU maintains direct sales, service and marketing offices. Information about BTU International is available at www.btu.com. BTU also operates fully functional process labs in the US and China.To learn about Pyramax high-performance reflow oven, visit booth I2716 in SEMICON Taiwan 2021.

As enterprises continue to digitize at an even faster pace, global data is also on a slope of substantial growth. According to research from IDC, the total global amount of data will climb to 175ZB by 2025, far exceeding the total of 33ZB in 2018. Given the increasing demand from enterprises for massive data storage, Chenbro Micom launched the RM25324 high-density storage server chassis. In its just 2U height, it supports installation of up to 24 3.5" SATA/SAS interface hard disk drives.Considering the application requirements of various industries, RM25324 can also use in combination with other control modules. It supports the installation of 48 2.5" SATA/SAS hard disk drives or NVME flash memory drives. The backside of the chassis also supports the installation of two 2.5" SATA hard drives as an optional package, and it is optimized for warm and cold data tiering. In other words, the usage model of this product is very flexible and diversified, meaning that it can meet various applications, such as cold and hot data storage, security monitoring, NVR/DVR, data warehousing, database, file servers, among others.To create a more convenient user environment, Chenbro has added many exclusive patented designs to the RM25324 high-density storage server chassis: First, to facilitate maintenance by IT personnel, a large number of its products adopt a tool-less maintenance design, such as tool-less slide rail kits and hard disk drive brackets. Second, the chassis adopts a side load design on both sides. When paired with the original manufacturer exclusive slide rails, only about 50% of the server needs to be pulled out of the chassis to install or replace a hard disk drive. Traditional 2U storage servers, in comparison, mainly adopt a flip-up design and must be completely removed from the chassis to replace or add hard drives. The RM25324 high-density storage server chassis obviously takes the user environment and operation into consideration. Restrictions, obviously very convenient in maintenance.In addition, to ensure the reliability and convenience of the side load design of the chassis, the Chenbro design team endeavored to find the best pull-out angle and worked to improve the heat dissipation performance and durability and longevity of the load. Not only does RM25324 installed six 6-cm high-speed hot-swappable cooling fans in high-density storage server chassis but the suspension design can effectively reduce impact from fan vibration and smoothly introduce cool air from the data center at the front, effectively reducing the temperature of the internal electronic components in the chassis and thereby ensuring that the equipment can maintain stable operation.In terms of other specifications, the RM25324 high-density storage server chassis supports standard ATX motherboards and supports seven low-profile PCI slots, making it convenient for enterprise users to install a network or other expansion cards. As for the power supply, two 800W 80+, Platinum power supplies that support mutual backup use to maintain high energy conversion efficiency while reducing overall energy consumption.With the rapid increase in the data value, enterprises are paying more attention to data storage and analysis by the day. The RM25324 high-density storage server chassis can support a variety of hard disk specifications, making it the first choice on the market for mechanical design and convenient maintenance. Naturally, it is currently the optimal choice for building a large-capacity storage environment.

National Telecom (NT), The WhiteSpace (The WSP), Delta Electronics (Thailand) and Chunghwa Telecom signed a memorandum of understanding (MOU) for collaboration in a 5G private network in December 2021. The joint project will support the "Thailand 4.0" innovative manufacturing plan and assist Thailand in accelerating the use of 5G Innovative applications to introduce technologies such as the Internet of Things (IoT), information security, artificial intelligence (AI) and big data. In addition, the project will help realize innovative application services, such as Thailand's smart manufacturing, remote collaboration, and smart medical care.NT is a state-owned enterprise 100% owned by the Ministry of Finance of Thailand. It has obtained 2100 MHz, 2300 MHz, 26 GHz and other frequency band licenses in Thailand's 5G release. The WhiteSpace (The WSP) is the largest MVNO (Mobile Virtual Network Operator) service provider in the Thai market, dedicated to 5G new application services and innovative development of the Internet of Things.This four-party multinational cooperation promotes 5G enterprise private networks and innovative application services in the Thai market. It focuses on solving the pain points of digital transformation for enterprises in the post-epidemic era and leverages Chunghwa Telecom's abundant technical energy, service best practices, and solution ecosystem partners to support Thailand. Moreover, it will assist the Thai government in creating a 5G innovative application service ecosystem to make Thailand a leader in "industrial transformation" and "technological innovation" among the five North ASEAN countries (Thailand, Cambodia, Myanmar, Laos, and Vietnam).Firstly, this cooperation between Chunghwa Telecom, NT and The WSP is to introduce a 5G private network to actualize AR remote collaboration for application in assembly training, operation assistance, and visual equipment control at the main office and first plant of Delta Electronics (Thailand) in Bangpoo Industrial Estate, Thailand. This will complete digital transformation for the post-epidemic era. In the future, this joint plan will extend to the local government, manufacturing, tourism, medical or financial industries in Thailand. Chunghwa Telecom will provide their own MEC Intelligent A+, as well as design and planning experience. NT will provide the local 5G core network. Lastly, The WSP will provide local marketing and operation experience, and work together to create innovative application services for Delta's smart factories.Delta Electronics (Thailand) Factory No. 1 in ThailandChunghwa Telecom is cultivating regional partnerships as part of the government's Southbound policy for a long time. It has joined forces with telecommunications companies such as Thailand's National Telecom, Vietnam's Viettel Group, Singapore's Singtel, as well as other cross-border telecom companies. It is also calling for more high-quality partners from Taiwan to join the new Southbound national team.Nattawut Satrawaha, Senior Executive Vice President – Wireless Communication 2 of NT, stated: "5G innovative application services will play a key role in technology and serve as an enabler in the post-epidemic era. Thailand, as the center of the five North ASEAN countries (Thailand, Cambodia, Myanmar, Laos and Vietnam), occupies a very important position in terms of geography, transportation, and economic and trade relations. Through this cooperation, we can help Thailand to become a regional center for talents, logistics, and cash flow. In the future, we can also work together to serve corporate customers in the ASEAN market."Chaiyod Chirabowornkul, the Chairman of The WhiteSpace (The WSP) pointed out: "The WhiteSpace delighted to be part of this big step in developing 5G private network initiative in Thailand. 5G private network can demonstrate the strength of 5G and lay down groundwork for 5G ecosystem. We foresee 5G private network as a future of MVNO in Thailand.We would like to thank NT for the opportunity and trust in our partnership to start with the POC. We would like to thank CHT International in their willingness to bring their 5G solution to Thailand and trust us as a local partner. We believe with this partnership we can bring 5G private network to be very attractive and effective solution for large enterprise in Thailand. "Curtis Ku, Senior Director, Thailand Country of Delta Electronics Thailand, said: "Delta Thailand is delighted to pioneer 5G for smart factory applications in Thailand with Chunghwa Telecom. As a top electronics company and innovative solutions provider in Thailand, 5G connectivity offers us many opportunities in Internet of Things (IoT), information security, artificial intelligence (AI), and big data, which will accelerate our smart manufacturing transformation. This groundbreaking project at Delta's main plant is an excellent learning model for local manufacturers, which supports the Thailand 4.0 development policy, and a firm platform to build further Taiwan-Thailand business collaboration for mutual benefit."Sarah Wu, President of Chunghwa Telecom International Business Group, remarked: "Chunghwa Telecom has been cultivating the new southward development plan for a long time, our mission has been to actively form alliances with high-quality international partners to develop various innovative application services, and to call on more Taiwanese manufacturers to join the new southward national team. We are convinced that through this cooperation, Taiwan will reach a new milestone in the expansion of the ASEAN market, and usher in a new digital transformation service energy for Thailand and the ASEAN market."CHT(Thai) GM Arthur Yang, Delta(Thai) Senior Director Kurtis Ku, CHT-I President Sarah Wu,NT SEVP Nattawut Satrawaha, WSP CEO Pakorn Pannachet and Chairman Chaiyod Chirabowornkul (left to right)

The global server market will be in short supply in 2021. From the perspective of the larger trend, the growth of cloud services dominates the development of the server industry, especially in this post-pandemic era. It continues to drive home office, remote teaching, online shopping, and audio-visual applications, leading to higher demand for data centers and cloud services. Another major trend is 5G applications. With its characteristics of high-bandwidth communications, wide-area connectivity, and low latency, 5G applications are regarded as a boost to the development of smart cities and the IoT, and it also drives strong growth in servers.Chenbro OTS products with high compatibility and high differentiationAs cloud and 5G drive rapid increases in demand for global data centers and servers, global server chassis leader Chenbro Micom is actively developing business opportunities in the server chassis market by developing innovative and forward-looking products. In fact, server chassis have certain thresholds and difficulties: they must carry different components, such as motherboards, cooling systems, power supplies, and be installed in bodies of different sizes, which is an extremely large demand for system stability.Chenbro said that the compatibility of the internal mechanism and electromechanical integration of the chassis, along with detailed craftsmanship and quality of production, are of great benefit to the stability of the server system. Therefore, its server chassis products have the dual characteristics of "high compatibility" and "high differentiation". Compatibility of the server chassis and the motherboard usually requires much verification, and verification itself often requires huge amounts of time and efforts. Therefore, when pairing Chenbro server chassis with motherboards of different manufacturers, various motherboards are pre-tested for items such as mechanical compatibility, system function testing, and heat resistance. This means that customers will have more flexibility in their selection of servers for deployment.Chenbro further pointed out that, in its design, development, and production of a series of OTS standard products, it has found inspiration in the toy "Lego". Using a modular design, Chenbro develops mechanical products that function somewhat like Lego blocks, allowing customers to choose products according to their application needs and import them quickly to meet the demands of the high-diversity, low-volume server industry market. As a result, Chenbro possesses products that fully demonstrate flexibility, agility, diversity, and high compatibility. This has allowed it to achieve the goal of "Compatible yet Differentiated, Made Easy", and provide customers with high-quality products and services.Value-added edge computing products for concept engineering applicationsIDC predicts that the edge computing server market will be driven by the diverse business needs of users in the telecommunications, energy, manufacturing, and transportation industries, to become one of the fastest-growing sub-markets of the server market. As there are more diverse scenarios in the applications of edge computing at the data-generation end, the demand for edge customized servers that have specific external sizes, low-energy-consumption capabilities, broad working temperature, and other specified designs, will see accelerating growth, so as to adapt to complex and diverse deployment environments and business needs.Chenbro stated that using "concept engineering" for product design and innovating products from the perspective of customers and end users helps them maximize the performance of various components in the server chassis. Chenbro gave further explanation using the recently launched RM252 and RM352 series products as examples. These edge computing server chassis products developed by "concept engineering" have their design based on O-RAN architecture, use a 450mm ultra-short depth chassis, provide FIO (front-end I/O) and RIO (rear-end I/O) connection mechanisms, adopt a flexible fan configuration, and have built-in dual redundant power supplies with hot-swappable functionality; such design and functionality makes them suited for fields with constraints in deployment space, such as telecommunications racks or small-scale data centers.A wellspring of product innovationAs 5G, AIoT, and edge computing have transformed the industry once again, innovative research and development of server products has received increasing attention. What can easily be underestimated as a server's "coat" holds within it Chenbro's 38 years of intensive R&D and innovation. Chenbro said that as it moves into the future, it will continue to promote the coexistence of "high compatibility" and "high differentiation" in OTS product innovation. It will absorb the lessons of its "concept engineering" product development experience, and continue to enhance its electromechanical integration capabilities, and thereby develop diversified products to meet customer needs.To maximize the compatibility of its chassis, Chenbro has upheld the slogan "Whatever's inside, Chenbro outside". Regardless of how the needs of industry can change and influence server configuration, Chenbro is the best choice of server chassis. Chenbro will continue to provide diverse server chassis products according to user needs that also consider actual use and operation scenarios.

Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid adhesives, silicone hotmelt solutions and silicone die-attach films (DAF) deliver improved performance, durability, uniformity and processability vs. traditional organics. Dow's high-performance technologies are engineered to address top trends in advanced semiconductor packaging, including ever-thinner, smaller and more-complex designs, by mitigating stress from mismatched coefficients of thermal expansion (CTEs) that can cause warpage. They also provide greater durability and reliability for applications exposed to harsh environmental conditions in industries such as aerospace and automotive electronics.In addition to displaying posters, example applications and demos at its booth, Dow will participate in the TechXPOT conference at the show. Roderick Chen, technical service and development specialist for Dow, will present on "Novel Silicone Hotmelt Solutions for Microelectronics" at 1:40 p.m. China Standard Time (CST) on Tuesday, December 28."While advanced packaging designs are essential to meet increasing demand for higher performance and expanded functionality in electronics, they can also place greater thermal, electrical and mechanical stresses on the chip," said Jayden Cho, Dow's global segment leader for Displays & Microelectronics. "To address this situation and help customers improve quality, consistency and processability, Dow has developed an array of novel silicone technologies specifically designed for side-by-side and stacked chip configurations and MEMS devices. Our breakthrough silicone products surpass organics by optimizing thermal stability, stress relaxation and durability in many different types of packaging."Differentiated Silicone TechnologiesDow's new silicone technologies provide fresh solutions to enable complex packaging designs, such as multi-stacked packages and coreless substrates. They also have important advantages over organics and can help customers resolve issues such as warpage, delamination, bleed-out and premature failure that can occur with epoxies and other incumbent materials.The new DAF solutions, which are cured silicone films, offer excellent uniformity for precise thickness and eliminate fillets and bleed-out that commonly occur with epoxy adhesives. Low modulus ensures good sensing accuracy, especially for environmental sensors.Dow's hybrid solutions combine silicone and organics in a unique formulation. These adhesives deliver enhanced mechanical properties that silicone alone can't achieve, such as higher modulus and strong adhesion to various surfaces. Potential applications include flip chip packaging, which can experience delamination after harsh reliability testing when epoxy mold underfill is used. The hybrid solutions also feature excellent optical properties, enabling them to be used in optical devices.The company's silicone hotmelt technologies, offered in three formats (film, cartridge and tablet), provide excellent adhesion to a variety of substrates, as well as stress relief for warpage mitigation.*The hotmelt film can be vacuum laminated for chip encapsulation or bonding over a large area, which is a simpler process than molding. It is especially valuable for substrates that warp easily, such as flexible, coreless packaging.*The silicone hotmelt cartridge solution for compression molding provides better workability and thermal stability compared to commercial liquid silicone hotmelts for chip encapsulation and soft molding.*The hotmelt tablet technology is designed for transfer molding, where it provides properties similar to those of conventional epoxy molding compound (EMC), plus exceptional thermal stability to at least 250oCDow invites attendees at SEMICON Taiwan to stop by its booth (#I2616) for additional information on these novel silicone technologies.To learn more, visit Dow at www.dow.com.

Fusion Worldwide, the premier global open-market sourcing distributor of electronic components and finished products, is celebrating its 20th anniversary.Since its founding in 2001, Fusion Worldwide has grown from four people in an office in Andover, Mass., to over 380 people covering 20 locations across the globe. In addition, it has amassed yearly revenues of over US$1 billion and ships on average 5 billion units."Our journey from where we were 20 years ago to where we are today is the result of the dedication our employees have to both the organization and its customers. We've been able to capitalize on the growth of the open market and its essential role in the supply chain by creating long-standing relationships with some of the world's largest OEMs and CMs," said Peter LeSaffre, Founder and CEO of Fusion Worldwide.With a mission to solve supply chain shocks, Fusion Worldwide has implemented an aggressive growth strategy to support customers where they are. In addition, it has developed an unparalleled supplier network and sourcing strategy that focuses on closely monitoring the market to help to mitigate the effects of supply chain disturbances for its customers."The success we've had over time comes from within. We've worked hard to accomplish our vision by going global and bringing our company to where our customers are so we can provide local service. It's been an exciting journey, and we're looking forward to the next 20 years," continues LeSaffre.Throughout its history, Fusion Worldwide has been continuously recognized as one of the world's top distributors by SourceToday, Electronics Sourcing and ESM China.Fusion Worldwide celebrates 20 years in the electronics sourcing industry.