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Friday 29 October 2021
DataVan launches DataVan Central for endpoint management
DataVan, the world-renowned POS terminal provider, announced the launch of DataVan Central, an UEM (Unified Endpoint Management) solution connecting multiple DataVan devices through cloud to monitor real-time device status. This efficient remote management solution is believed to reduce update and maintenance costs for administrator. Meanwhile DataVan also released a short video to introduce DataVan Central on DataVan's Youtube channel (https://www.youtube.com/watch?v=Uh6flFzvvG0)."DataVan Central is a powerful IoT platform synchronously connecting numerous DataVan Devices, including POS, KIOSK, Box PC, and Panel PC, to provide real-time device status and alarm notification," said Crystal Chan, Sales Director at DataVan. "DataVan Central is helpful to reduce manpower and business travel cost through remote update and repair instead of on-site maintenance. In addition, it offers higher safety and reliability for endpoint device management due to contactless management."Chan also indicates that DataVan Central can demonstrate real-time device efficiency with data visualization showing on the built-in dashboard. These concise charts are advantageous to monitor device health and arrange device management ahead to keep devices at their best.Powerful and convenient DataVan Central is currently a free optional for clients who purchase DataVan's operating system, and it can be directly installed in operating system before shipping. "The pandemic really impacted our business environment. Therefore, DataVan would like to support our clients to together face this challenge," said Kris Hsu, General Manager at DataVan. "DataVan Central, as an ideal solution to endpoint management, can help clients concentrate on core marketing and business strategies, which is beneficial for business opportunity, industrial transformation, and innovation."Please visit DataVan official website to explore more DataVan Central features.DataVan Central platform
Thursday 28 October 2021
Introducing AI computing into cloud and edge computing servers, Chenbro facilitates smart transportation applications
With the high bandwidth, low latency and expansive connectivity of 5G, the combination of edge computing, 5G and AI will maximize the digitization of smart cities and become one of the driving forces of growth for the server market in the future. Within the architecture of smart transportation applications, "cloud computing" is equivalent to the brain and can handle relatively complex processes, while "edge computing" acts as the nerve endings, which can directly handle real time computing processes at the site of data generation and adopt appropriate responses. Introducing AI computing into cloud and edge is the next step in the overall development of smart cities and smart transportation. It can realize the implementation of AI smart applications from the edge to the cloud.AI integrated with edge computing upgrades smart transportation applicationsEdge computing in smart transportation is the delivery of real time transportation information to edge computing servers for preliminary assessment through the 5G network. The data is then standardized for further analysis and handling. The edge computing servers are also capable of running AI processes and can store, filter and process the transportation data. Using the edge computing capabilities, feedback can be monitored in real time, thus realizing smart management for transportation.Chenbro has introduced the RM352 3U GPGPU Short Depth Edge Computing Server Chassis that can be fitted with up to 4 GPUs or FPGA accelerators, which can improve the performance of edge AI computing and machine learning. The edge computing server chassis also provide FIO (front I/O) and RIO (rear I/O) connection mechanisms, which are easy to maintain and manage and can satisfy different application needs. Many edge computing devices must be built in a limited space; therefore, Chenbro uses the 450mm ultra-short chassis to meet the requirements of edge computing deployment, combining high-performance computing, sufficient storage and network kits in a shallow-depth and small-sized chassis for flexible applications in the deployment of edge computing devices.Cloud servers with AI computing analyze smart transportation big dataDuring the data processing of smart transportation, information can be acquired and sent back to the cloud server for deep learning when the recognition and judgment accuracies of AI edge computing equipment need to be improved. Cloud servers rely heavily on computing performance. Servers using GPUs/GPGPUs can satisfy the deep learning needs of AI in the big data era, especially for the application of image recognition in vehicle flow identification or smart transportation data analysis.Chenbro launched the SR113 4U Rackable Tower Server Chassis, a GPGPU server chassis specialized for AI processing and deep learning. It can support up to 5 GPGPU cards. The AI processing server can use high performance computing to satisfy large scale processing needs and use pretrained deep learning models to analyze data. Maintaining high performance computing and chassis heat dissipation mechanisms are the keys to cloud server stability. In order to improve the cooling effects, the server chassis is designed with 4 pre-installed fans and 2 additional fans can be installed in the rear for CPU cooling and 2 exterior fans can be installed for GPU cooling. Chenbro provides AI processing server chassis with good cooling and tested integrated electromechanical components through powerful hardware technical support.From edge to cloud, hardware performance improvements accelerate AI implementationEdge computing will not replace cloud computing. In fact, edge computing supplements cloud computing. Currently, the trend of the two technologies working together is becoming more apparent, especially with the introduction of AI. Smart and high performance edge computing will be the last step in implementing AI applications. Therefore, Chenbro is actively investing in the development of edge computing servers and AI server chassis. Recently, Chenbro has introduced server chassis products that can be installed with a GPU card in the RM238 and RM245 series 2U Versatile Storage Server Chassis. These products can satisfy the application needs of customers from terminals to clouds, assisting customers in implementing AI in smart transportation and various aspects of smart cities.As 5G, AI and edge computing technologies revolutionize the industry, Chenbro will continue the development of AI and edge computing server chassis and realize support for multi-platform motherboards and GPU cards through the design concept of "compatibility". Chenbro provides compatible server chassis and helps system integrators choose different motherboards based on corporate user needs. Besides providing OTS standard products to white box server providers, system integrators and channel partners, Chenbro also designs customized server solutions according to the needs of different customers and develops new products with its partners. Through many years of research and development and manufacturing experience, Chenbro has developed diverse service models to satisfy customer needs and to seize the new business opportunities of the 5G and AIoT age.Chenbro has developed diverse service models to satisfy customer needs and to seize the new business opportunities of the 5G and AIoT age
Wednesday 27 October 2021
Pegatron to offer one-stop-shop 5G O-RAN service using Microsoft Azure
In 2019, Pegatron Corporation officially founded its O-RAN technology team as a successor to its highly successful x86 design legacy. The new team is dedicated to the development of 5G O-RAN CU and DU base station products. The company also hopes to enter the 5G network scene by providing one-stop-shop 5G O-RAN solutions that target everything from multi-access edge computing (MEC), network administration, to network applications.To this end, Pegatron has invested considerable R&D resources into its hardware and software solutions as well as kept close working relationships with major international vendors, among which includes Microsoft, a key strategic partner for many Pegatron projects. Pegatron and Microsoft have already entered into multiple major collaboration frameworks for 5G O-RAN such as the Affirmed 5GC core network, the Azure IoT Edge implementation in Pegatron products, and more recently a collaborative project that massively boosts Taiwanese digital resilience. The project is the result of the joint collaboration from Pegatron, Microsoft, Wave-In Communication, and the Hsinchu City Government to create a disaster relief application package that uses the Azure Space satellite communication service as the underlying framework. The application package will remain operational during power outages caused by earthquakes, tsunamis, and typhoons, ensuring that the communication protocols used by police and firefighters remain available at all times and that emergency relief services are not interrupted.Building smart factories using proprietary Pegatron base stations and MECsPegatron says that since the company founded its O-RAN team, they have been utilizing their accumulated x86 hardware development energy and long-time partnerships with international vendors to create a proprietary PEGATRON branded stand O-RAN 5G base station. Besides product development, the O-RAN team has also been tasked with two important goals. The first is to help the company set up its basic 5G infrastructure to support distributed global production bases, while the second is to implement 5G applications within the company to accelerate internal digital transformation efforts.The PEGATRON base station comes equipped with a variety of important features. For example, it supports network function virtualization infrastructure (NFVI), making it compatible with the cloud infrastructure standards laid out in O-RAN, allowing for vastly improved system usability and expandability. It is also worth noting that the Affirmed Networks Standalone (SA) core network, which is part of the Azure for Operators suite, is also built on a virtualized SA core network and virtualized wireless testing platform, making it perfectly compatible with the PEGATRON base station. This means that point-to-point application solutions in dedicated 5G enterprise networks using the PEGATRON base station will be able to retain even greater flexibility and adaptability with different hardware in an even wider array of environments. Pegatron also designed its 5G O-RAN enterprise network in accordance with the 3GPP standard and incorporated support for MEC servers to more effectively make use of the high bandwidth and low latency of the 5G protocol.It is estimated that Pegatron's O-RAN team will be able to accomplish two major milestone goals by the end of 2021. The first is to finish deployment of the proprietary O-RAN base stations for the 5G enterprise network in Pegatron's demonstration factory by the year's end. The second is to have Pegatron products pass domestic product inspections alongside the National Development Council's plan to construct an Open Testing and Integration Centre (OTIC) laboratory and establish product standards for domestically manufactured base stations.As for Pegatron's factories, they produce thousands of different products each year and are constantly undergoing production line adjustments. Physical wiring constraints from the past age of ethernet connections have made such adjustments major rewiring projects that can take upwards of 2 to 3 weeks. But now with 5G infrastructure becoming standard within the company, factories are expected to be able to complete production line adjustments in as short as 2 to 3 days. Wireless 5G technology will also assist the company with the collection of big data in its production lines, allowing for constant analysis and optimization as all production statistics become digitized. The high bandwidth of 5G technology will also allow Pegatron to implement AI visual recognition quality inspection solutions that are constantly optimized through deep learning on MEC servers to conduct simultaneous mounting, assembly, and overall visual quality testing on finished motherboard products.A completed 5G application ecosystem with Microsoft Azure integrationWith Pegatron entering the Microsoft ecosystem, many Azure cloud services are also becoming easily accessible for both Pegatron and its clients. Currently, the PEGATRON base station is already supported by the Azure for Operators suite (a cloud native 5G core network). Since the suite is considered a mature product in overseas markets, this will make the PEGATRON base station a trusted and preferred product for many clients, shortening its time-to-market duration. At the same time, many artificial intelligence applications in recent years have turned to the Azure Applied AI service to reduce their edge computation complexity by containerizing their linguistic, visual, or audio processing. The trend has significantly cut down on development time, allowing for faster market expansion through accelerated 5G solution deployment.By contrast, Pegatron has found itself lacking in application know-how to implement point-to-point 5G O-RAN solutions despite being highly capable in the field of hardware development. This is why the company has turned to the massive Azure ecosystem for answers by using the Azure IoT Device suite as the first step in the company's plan to integrate Azure services into its fold. The most notable example of this would be the IoT Device Management function offered by Azure IoT Edge. The management utility can be used to remotely test smart factory deployments located in any corner of the globe, making it a perfect fit for smart factories application scenariosPegatron also hopes to integrate the Azure Stack HCI to enhance its server cluster features. The company plans to integrate its services with the Azure Stack Hub to satisfy mass computation demands for edge computation.Pegatron's latest Azure Space integration package has also been an media darling in recent news. The service will not only allow disaster response teams to utilize domestic 5G O-RAN base stations to keep internal communication channels clear during times of emergency but also ensure external communication availability by working with Microsoft's satellites. Both of these measures will significantly enhance the overall digital resilience of the communication infrastructure in Taiwan.Last but not least, another surprising revelation from Pegatron came during the virtually held Mobile World Conference in June. The company debuted a single server simultaneously connected to two DUs, allowing for exceptional computation resource efficiency and reaching download bandwidths of up to 1.7 Gbps and upload bandwidths of up to 400 Mbps. In the future, Pegatron will continue to invest in 5G O-RAN to provide customers with comprehensive solutions, accelerate deployment of innovative applications, and ultimately help partners realize a vision of a digitally transformed enterprise.
Tuesday 26 October 2021
Carbon neutrality trend is pushing forward - iST and DEKRA iST push LTS to help electronics industry to approach carbon reduction goals
At the end of September this year, Mark Liu, Chairman of TSMC, was interviewed by the media. He made the promise to reduce carbon emissions by 20% by 2030 and achieve net zero emissions by 2050. When the interview was released, it became the focus of the industry. This was not just because of TSMC's astonishing sales, but also because the reductions of carbon emission by 20% equivalent to a single factory equal the annual carbon emissions of Taipei City. More importantly, because of the close interconnectivity of the semiconductor industry chain, TSMC's actions will influence every link of the supply chain. Using the 2030 goal as an example, the suppliers who do not comply with TSMC's demands will most likely lose orders. Therefore, carbon reductions have transformed from an additional action into a necessary matter for corporate survival.Although the carbon reduction actions of TSMC have rocked the semiconductor industry, Allan Tseng, Vice President of Reliability Engineering Division of iST, stated that several international brands have also set clear carbon reduction targets in recent years, including Microsoft, Google and Apple. The International Standards Organization has also already stipulated two greenhouse gas standards, ISO 14064 for organizations and ISO 14067 for products. Besides carbon reduction standards, another important standard for brands is ISO 50001 for energy management. The main purpose of this standard is to help corporations set energy reduction performance, and the performance must be achieved through a structural method. This requires the cooperation of related supply chains and for these supply chains, the easier method that provides significant results is to change the assembly process.Regarding the energy savings for assembly processes, the RoHS, passed by the EU in 2003 and officially implemented in 2006, must be mentioned. This directive limits the use of 6 hazardous materials in various equipment and devices. Among these materials, lead (Pb) is the primary material used in the soldering of circuit boards. Therefore, this directive has a substantial impact on electronic devices. Despite the big influence, the directive must still be followed. In the manufacturing process, the biggest difference between leaded and lead-free (Pb-free) is temperature. Solder containing lead can be soldered at 183-celsius degrees, while lead-free (Pb-free) solder needs to reach 217 to 220-celsius degrees. The high temperature leads to high energy consumption and can deform the PCB and large components.LTS solves the problems with lead-free processes, iST lowers the barrier for entryChiahao Chuang, CLR_BLR Engineering Dept. Manager of iST, then pointed out that a common problem during the assembly process is when a good IC is unable to pass testing after being mounted on the board after SMT. The most common problem in this situation is board warpage. He explained that there are many reasons for warpage. iST's Board Level Reliability (BLR) lab has found that a common reason for the warpage has been a System in Package (SiP) problem. This type of packaging integrates different chips into one package. However, because the different components of the materials and functions have different heat expansion constants, the board will become warped. This is especially apparent for materials that do not change linearly to heat, but changes exponentially to heat. This means that when the temperature reaches a certain level, the degree of bend will increase suddenly. In advanced manufacturing processes, warpage is a common situation. If the amount of warpage complies with the SMT controllable range, then adjustments to the SMT stencil design are possible. Products with greater warpage can also be corrected using the fixture in the manufacturing process.The warpage for larger chips in SiPcan reach several hundred μm. In later assembly stages, the warpage cannot be corrected with stencil design or soldering temperature, and the product will be returned to initial IC design remodification.In the past, in order to prevent poor soldering due to board warpage, iST's BLR lab would first use the internal Shadow Moiré simulation to confirm the warpage data and reduce the wasted soldering and short circuit problems through the adjustment of solder printing stencil design and reflow temperature. However, this method can only solve the warpage problem in the final stage. In order to prevent the warpage from reoccurring, the root problem must be dealt with, which is to reduce the manufacturing temperature. Therefore, due to the combination of this need and the aforementioned energy saving trend, Low Temperature Soldering (LTS) technology leapt into the market.Before talking about LTS, solder paste must be mentioned first. Early solder pasts were mainly made of tin (Sn) and lead (Pb). After the introduction of lead-free regulations, tin (Sn), silver (Ag) and copper(Cu) are widely used; then companies began using Sn with bismuth (Bi) for LTS. However, Sn with Bi will become brittle after soldering, so the companies began introducing various exclusive solder pastes. Currently, LTS primarily uses Sn, bismuth (Bi), silver (Ag) and other material combinations. The low temperature of LTS can solve the warpage problem and improve energy savings in the manufacturing process by 40% according to Intel in the iNEMI (International Electronics Manufacturing Initiative) report. Although the benefits are LTS are apparent, changes in the manufacturing process will influence every part of the process. So, without mandatory energy savings in manufacturing in the overall industry, the assembly companies will not change if they are not required to do so.However, with the changing times, not only are the customers demanding energy savings, the component companies are also changing their methods. The most significant example is the introduction of LTS processes in large CPU and GPU companies. With the pressure from upstream and downstream links in the supply chain, investments in LTS by assembly plants have become necessary. Allan Tseng state that for many companies, LTS is still a new technology. Both component and system companies are still unfamiliar with the technology and market regulations. Therefore, iST and DEKRA iST have separately introduced LTS verification platforms to help different companies to reduce the technological barrier for entry and assist with the smooth shipment of products.Chiahao Chuang further mentioned that the LTS verification platform of iST is mainly used to test the reliability of components and board levels. The electronics reliability analysis (RA) can be categorized into low strain rate testing and high strain rate testing. Low strain rate testing is mainly aimed at the effect of the aforementioned temperature and other environmental changes on the products. High strain tests responses to collision, such as a mobile phone falling on the ground. In terms of the heat cycle of the low strain, LTS performed better than lead-free (Pb-free) solder pastes. However, for high strain, the endurance of LTS is slightly worse. Therefore, there will be higher risks for equipment and assembly processes with LTS in the future. For high strain rate testing, including warpage, vibrations, and IC and PCB connection pull and push forces, items closely related to handheld products must be tested. Currently, although handheld devices are not yet required to use LTS, some IC companies have already started investing in R&D. In response to this, iST is already providing complete board level reliability testing services.DEKRA iST assists LTS in optimizing modular system product testing benefitsBesides components and board levels, LTS also has a relatively large impact on system plants. DEKRA iST will provide testing services related to this aspect. Bruce Liu, Engineering Development Office Senior Technical Manager of DEKRA iST, pointed out that in the iNEMI report, although products using LTS currently account for less than 1%, by 2027, the market share of LTS will reach 20% due to the push for environmental protection in various industries. There are three driving forces for companies to introduce LTS. The first is the aforementioned carbon reduction trend. With the quickening global climate change in recent years, companies in various industries are also accelerating their carbon reduction actions, with LTS being considered one of the best methods for carbon reduction in electronic products. The second is the improvement of yield and product reliability during the manufacturing process. The high temperature currently required by lead-free (Pb-free) solder pastes may cause cracks in motherboards or breaks in IC circuits during the manufacturing process. Additionally, due to the demand for thinner and more compact consumer products, the side effects of temperature will be amplified inside the smaller spaces, which will affect the lifespan of products. The low temperature characteristic of LTS can solves these problems. The third is the optimization of manufacturing efficiency. In order to prevent high temperatures damaging components during soldering, traditional SMT must use wave soldering to solder through-hole electronic parts onto the circuit board. When using LTS solder paste, the low temperature can simultaneously complete the soldering of SMT and through-hole electronic parts, and will not cause heat damage to the components and motherboards. By eliminating a step in the manufacturing process, the goals of assembly cost reduction and process efficiency improvement can be achieved.How can existing manufacturing processes be transformed into LTS processes? Bruce Liu stated two important points. The first point is that handheld or outdoor products using LTS must pass reliability assurance (RA) and failure analysis (FA). Because LTS is an old concept, new innovation technology, the soldering joint strength on the motherboard and whether it satisfies customer expectations and market needs must be verified through the two methods For RA and FA, DEKRA iST provides thermal stress testing and mechanical stress testing, which are the aforementioned high and low stress tests. Thermal stress testing uses the stress caused by a hot and cold cycle to degrade the soldering joints. Mechanical stress testing uses vibration or drop to test the strength of the soldering joints. These two tests are required test items for brands. Furthermore, by using failure analysis tools, the stress test compares the soldering joint quality before and after the test to ensure that the product complies with the reliable requirements. Bruce Liu said, with DEKRA iST's past experiences, the performance of LTS under mechanical or thermal stress is generally still not as good as existing high temperature lead-free solder paste. Therefore, companies which produce LTS have attempted to add elemental additions to reach or even surpass the strength of high temperature lead-free pastes.The second point is for indoor products with lower risks of vibration, drop and high temperature variation; LTS is more suitable because of the better environmental conditions, especially for products with lifespans between 2 to 5 years or products with adhesive protecting the soldering joints internally. If this type of product needs to be used in outdoor environments, the environmental temperature must be below 40-celcius degrees and the internal temperature of the product must not exceed 85-celcius degrees. Additionally, Bruce Liu also suggested that if the solder balls in the components use LTS, it must be treated carefully. When both the solder paste and the solder balls use LTS, the solder joints may easily be induced abnormal hot-tearing through solidified process, causing the failure risk of the product to increase.Complete professional services to help corporations implement ESGMichael Peng, Inter Connection Eng. Dept. Manager of DEKRA iST, stated that with the driving forces of energy conservation and carbon reduction trends and manufacturing performance, LTS is slowly becoming the focus of the global electronics industry. However, because the technology is rather advanced and there is insufficient data related to the soldering joint reliability and comparison of different low temperature soldering pastes, Taiwanese companies are worried that the various components on assembled motherboards will be incompatible. Therefore, most companies are still waiting to see the developments. However, as mentioned above, the upstream and downstream of the current industry chain have already been activated and the introduction of LTS has become a necessary step. So, companies must accelerate their adoption.In order to help Taiwanese companies accelerate their adoption of LTS, iST and DEKRA iST have already begun their market deployment, providing LTS testing and verification services for different links in the industry chain, such as components, board levels, and motherboards. Allan Tseng stated that his company and DEKRA iST own the largest reliability assurance laboratory in Taiwan. iST currently leads the world in the reliability analysis and verification of components and board levels. With extensive production capabilities and experience, DEKRA iST is also one of the leaders in the industry for system analysis and testing technologies. Facing various solder paste products launched by different companies in the current market, iST and DEKRA iST can provide professional and objective reports from a third party perspective using their years of experience.Anton Hsu, Sales Division Assistant Vice President of DEKRA iST, pointed out that consumer products have higher market sensitivity from the perspective of market analysis. Their transformation speeds are also higher. Currently, not only has several laptop, internet connectivity and other large product manufacturers developed LTS strategies, CPU and other component manufacturers have also taken action. As for enterprise equipment, such as servers, because there are more considerations for stability, their transformation is relatively slower. However, LTS has been deemed as an unavoidable trend for the future. Looking at the overall market, LTS will start experiencing large growths in 2022. He suggests Taiwan companies should utilize the many years of experience accumulated by iST and DEKRA iST to choose appropriate partners with professional data. Companies should record and optimize the figures of carbon footprint to implement the ESG goal of energy conservation and carbon reduction.Low Temperature Solder (LTS) can assist in carbon reductionVice President of Reliability Engineering Division of iST, Allan TsengiST, CLR_BLR Engineering Dept. Manager, Chiahao Chuang.DEKRA iST, Eng. Develop. Office Senior Technical Manager, Bruce LiuDEKRA iST, Inter Connection Eng. Dept. Manager, Michael PengDEKRA iST, Sales Division Assistant Vice president, Anton Hsu
Friday 22 October 2021
FSP provides high reliable power supplies in smart transportation
The world is currently undergoing a wave of smart transformation, including in the transportation sector. As an established player in the power supply industry, FSP has started to target smart transportation and all its moving parts that includes launching high-quality, highly integrated, and highly reliable total solutions that have experienced numerous cases of successful market adoption in recent years.Generally speaking, transportation systems have more traditionally operated in mostly isolated environments with limited cross-system integration requirements and without much advancement in technology. However, the creation and implementation of the 5G system in 2020 have brought about brand-new possibilities for smart transportation. The environment now demands integration and connectivity across systems which provide more added value. Learn about the strengths FSP has to offer, the product lines and options, and future plans for the company.FSP's Strengths & RoleIn regards to overall architecture, smart transportation will rely on an Internet of Things-based construction and structural design. This will entail front-end devices capturing environmental or equipment information and sending the data upstream to another back-end platform. Common front-end smart transportation systems include devices like:-CCTVs-Traffic signs-Water level sensors-Wind direction sensors-Edge Computer-Digital Signage-Charger system-Edge data center-LED lightingThere is an increase of diversity in the front-end devices and the multitude of functions they serve. Therefore, the power supplies within these devices are also faced with an unprecedented level of obstacles to overcome. This is where FSP steps in and plays a significant role in smart transportation.You may be interested to know that FSP has taken the lead and released a series of power supply solutions targeting smart transportation systems. For example, with parking lots comes a distinct set of challenges and opportunities for improvement. Today, a complete parking system consists of systems and devices that work together to offer functions like vehicle, plate, and parking space management, charging and timing functionality, parking management, and traffic management. A power supply will be necessary to power up all of these devices and provide these types of functions and possibilities. To fulfill this need, FSP is offering highly integrated solutions in the form of adapters, open frames, IPC power supplies and UPS systems designed for CCTVs and edge computer at the entrance and exits of parking lots.As for power management systems, FSP stands by the claim that these products are fully compliant with the stringent operating temperature and communication protocol requirements that are in place. Furthermore, FSP has modular, miniaturized, and highly efficient CRPS and Slim product lines that are ideal for parking management systems, edge data centers and cloud platforms.In addition to improving parking lot systems, FSP also has solutions for the omnipresent traffic control systems and smart street lights. These aspects are thought to be important infrastructures for the smart cities of the future. The reason being is that they'll all demand efficient, compact, and highly integrated power supply solutions. FSP's comprehensive product line has superior digitization, communication, modularity, and reliability, promising to be the solution to provide stable power for smart cities in the 5G era and ensure uninterrupted uptime.The strengths and benefits FSP bring to the table are undeniable and clear. For instance, there are a wide variety of products being offered, the company has extensive related knowledge and skills, and there is the possibility for micro customization in need.Products & solutions to considerFor a smart parking lot to function properly, it'll require the combination of a central control center and a field system. Together, they can effectively integrate all the controllers and subsystems in the parking lot to provide drivers with maximum convenience when parking their vehicles. There is a large amount of information generated for smart parking lots to run properly and you, therefore, need a system that will smoothly operate for information processing. The FSP Group offers power supply options for all equipment in the field to improve overall operating efficiency.The reality is that every system or device in the parking lot ecosystem requires a different power supply solution. The good news is that FSP can provide corresponding solutions depending on each individual scenario and the required uses. There are several products within smart transportation you should know about and consider. For instance, within the parking lot category you'll find:-LPR Camera-Parking Ticket Machine-Automatic Pay Station-Central Control ComputerWithin the smart street light category, there is both the monitor and lighting that is necessary and that FSP can provide. FSP also has a comprehensive power supply product line for traffic management systems that can ensure maximum system uptime. Smart street lights are thought to be one of the essential infrastructures for the smart cities of the future to work. They are predicted to be used in a variety of scenarios all while each containing different power supply requirements.Future plansAs for smart transportation, FSP only supports smart parking lots, smart street lights, and smart traffic control. However, they aren't prepared to stop innovating and making the world a better and more functional place to live and operate anytime soon. In addition to existing efforts to improve product performance and applications, FSP is also actively looking for cross-field integration opportunities.You now have a better idea of how FSP provides highly reliable power supplies in smart transportation and what the future will look like and be in this area. With the help, skills, expertise, and knowledge of FSP, the future appears bright, and there's a strong chance that you'll see these smart cities and transportation systems come to life in the very near future.FSP Smart Transportation solutions
Thursday 21 October 2021
G.SKILL announces world's fastest DDR5-6600 CL36 Trident Z5 memory kits
G.SKILL International Enterprise, the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the world's fastest DDR5 memory kit at an extreme speed and low latency of DDR5-6600 CL36-36-36-76 32GB (2x16GB). This is the world's first DDR5 memory kit to reach such high level of frequency speed and extremely efficient low timings, achieved with high-performance Samsung DDR5 ICs.Follow the link to view the Trident Z5 series product video: https://www.youtube.com/watch?v=bqgqI60cNEIReaching new performance horizons with Samsung DDR5 ICIn the never-ending quest for memory performance, G.SKILL is proud to reveal the latest addition of ultra-high DDR5 frequency to the flagship Trident Z5 family. While reaching an extreme frequency speed of DDR5-6600, this memory kit specification is also created with an ultra-low timing at CL36-36-36, compared to the typical CL40-40-40 timing of DDR5, making this the ultimate performance choice for gamers, enthusiasts, and overclockers.The screenshot below shows a G.SKILL memory kit validated with the use of high performance Samsung DDR5 ICs.Designed for ultimate DDR5 performanceThis high-end specification will be included in the Trident Z5 family, created with a sleek and futuristic exterior that assimilates hypercar elements into the iconic Trident heatspreader design. Featuring a black brushed aluminum strip inset into a metallic silver or matte black body, and topped with a sleek piano black top bar on the Trident Z5 series or a translucent RGB light bar optimized for smooth lighting on the Trident Z5 RGB series, the Trident Z5 family DDR5 memory is the ideal choice for gamers, overclockers, content creators, and enthusiasts to build a high-performance system.About G.SKILLEstablished in 1989 by PC hardware enthusiasts, G.SKILL specializes in high performance memory, SSD products, and gaming peripherals designed for PC gamers and enthusiasts around the world. Combining technical innovation and rock solid quality through our in-house testing lab and talented R&D team, G.SKILL continues to create record-breaking memory for each generation of hardware and hold the no. 1 brand title in overclocking memory.G.SKILL announces world's fastest DDR5-6600 CL36 Trident Z5 memory kitsThe screenshot shows a G.SKILL memory kit validated with the use of high performance Samsung DDR5 ICs
Thursday 21 October 2021
FSP energy storage system applications in smart city
The world and our environment are undergoing a wave of smart transformation, which includes energy supply and is a hot topic in the public consciousness. Designs for energy storage and the power grid have also become a newfound product focus for power supply manufacturers and system integrators.As an established player in the power supply industry, FSP is targeting the field and matter of energy storage. It's doing so by launching high-quality, highly integrated, and highly reliable total solutions that are experiencing numerous cases of successful market adoption in recent years.Green Energy TrendsGreenhouse gas emissions fell in 2020 due to the Covid-19 pandemic disrupting economic activity, travel, and trade. This type of result could be the motivation companies and the public need to ramp up the production of clean energy technologies. By implementing renewable energy sources, local governments and consumers can substantially reduce the carbon footprint and directly impact global warming and climate change. Green energy provides the world with many benefits such as conserving fossil fuels, slowing and reversing climate change, saving lives, reducing severe weather, minimizing fuel dependency, and creating economic and job development opportunities.Some trends to be aware of are that green hydrogen is likely to grow, renewable energy production will rebound, and new innovative solutions such as within energy storage systems will push green efforts forward. You'll likely also start to see traditional energy companies even getting on board. Corporate giants alike will begin to spell out their green energy plans and there will be a transformation happening that will get everyone involved and working toward a common goal. Eco-friendly is now the expectation instead of a fad. Not just a few, but multiple renewable energy sources will proliferate. Some of these that you may see but are not limited to are hydropower, wind energy, solar energy, bio-power, and geothermal energy. Now the only question to stop and ask is if renewable energy can save the world and create a better place for us all to live.FSP's VisionFSP is where power never ends. Nature's backlash is quickly approaching with climate change and energy depletion. FSP accepts environmental protection as a significant responsibility. The new energy industry is a passion and with power storage products, they're working hard for all life on Earth.Green energy systems achieve the most effective conversion, storage, and usage of solar energy to keep power alive. Together with a solid R&D design team, advanced mechanical designs, and thermal management capabilities they can make this all possible. Nature creates energy but FSP creates new energy. Through these developments and innovations, FPS is making the vision of smart power a reality. FSP's comprehensive product line has superior digitization, communication, modularity, and reliability, promising to be the solution to provide stable power for smart cities in the 5G era and ensure uninterrupted uptime.Solutions & ProductsFSP provides clean and reliable electricity through their Renewable Energy Storage and Management Solutions for better energy and future. In the field of energy storage, governments and corporations around the world in recent years are switching largely to new energy policies that favor a higher percentage of green power to curb further climate change. But due to the sporadic nature of renewable energy, governments, corporations, and home will all need to have energy storage devices in their grids to ensure a stable supply of power. As one of the top ten largest ac dc power supply manufacturers in the world, FSP has also extended its reach to this field.Energy storage devices can loosely be divided into three types: small, medium, and large. Small energy storage devices are generally mobile or portable energy storage sources, serving primarily as a backup to the main system because of their lesser size. Medium energy storage solutions mostly target home and corporations to ensure power stability and help with regulating power costs. Finally, large energy storage solutions are typically part of the local power grid, used for modulating power stability over a region. FSP's energy storage solutions are centered on small to medium size scenarios, such as the Emergy3K+, Ion mate, and other medium-sized energy storage solutions for commercial or family and household installations.Within the smart city, FSP is working on building an energy management system and has visions for a green public electricity microgrid. All of these solutions and innovations will require having the right energy storage system in place within a smart city. There are also elements such as a data collection unit, smart meter, and smart EV charging integrated system. For all of these pieces to come together and function properly they'll need to be powered up by an energy storage system that can handle all of the force and power needed to run the smart city.Looking to the FutureLooking forward, FSP wants to continue to discover potential clients from the commercial and home power grid market by focusing on three primary goals. The first is to develop distributed energy storage products up to 10kW capacity. The second is to create a hardware-software-integrated energy management system. The third is to find more suppliers of lithium iron phosphate batteries to alleviate the relevant supply chain instability issues.The clean energy industry continues to gain support and, therefore, it'll become more and more accessible. If you're ready to introduce renewable energy sources into your energy system then we encourage you to get in touch with us at FSP today to learn more and have your questions answered.FSP energy storage system applications in smart city
Thursday 21 October 2021
Cutting-edge POS system with slim edge bezel - Clientron unveils PT2700
There are plenty of features when it comes to choosing a POS system, and stylish might be the key decision to purchase a POS system considering that all the hardware looks the same. Clientron unveils the latest POS system-PT2700 with a slim edge bezel and bezel-free touch display to shine the overall fanless design. Most importantly, PT2700 supports portrait screen mode which enhances the ability to transform a POS system into a self-service Kiosk. This is especially crucial under the circumstances of COVID-19 to reduce as much as possible human interaction in every customer-related premises.Outstanding specs and innovative mechanical designIf you are hardcore for technical specifications, PT2700 will not let you down as it is equipped with Intel 8th Whiskey Lake Core i Processor which is among the higher level of POS system. With the exquisite mechanical design, PT2700 is capable of handling the easy access dual M.2 SSD storage slot that is simple to replace or insert M.2 SSD in the terminal. In terms of flash memory, PT2700 is built with dual DRAM that maximizes the memory to 64GB which is suitable for those who need to run multiple programs simultaneously.Rich I/O interface with TYPE C supportedFor better compatibility, PT2700 is embedded with dual TYPE C ports, and one of them is able to support DP output. Therefore, it is possible to expand three screens to display at the same time which allows you to do several tasks with multi-screen for enhancing the ability to provide better service. Furthermore, with TYPE C integrated into PT2700, it upgrades the speed of data transmission and increases the efficiency of charging devices while needed.Full coverage of wireless connectionsWith 4G LTE mini-SIM and WiFi connection supported, PT2700 truly enhanced the mobility of the POS system and it could easily choose WiFi or 4G network for a better wireless connection and coverage. Now, you can do business everywhere and even start planning on a pop-up shop to promote your brand and enlarge your revenue with PT2700 in hand.Main features of PT2700*Slim edge bezel and portrait mode supported*Solid aluminum die-casting rear cover with fanless design*Power-efficient Intel Whiskey Lake Core i Processor*Easy access M.2 SSD for installation and maintenance*Expand to 64GB memory with dual DRAM*Embedded dual Type C input (one supports DP output)*Integrated 4G mini-SIM and WiFi connection. Optional VFD & 9.7" or 15.6" attached customer display*Optional MSR, iButton, fingerprint, 2D scanner and RFIDIf you are looking for a stylish POS system with high value and reasonable price, Clientron's latest POS system-PT2700 will be the smart choice for you and your business.More product information: https://www.clientron.com/en/goods.php?act=view&no=76Clientron is thrilled to announce its latest POS system-PT2700 that is ready to launch in the market.
Monday 18 October 2021
JPC seizes new energy vehicles and energy storage business opportunities with customization and one-stop service
According to the predictions of a professional institution, the total sales of electric vehicles in 2025 will exceed 14 million units. By the year 2040, the global sales of electric vehicles will exceed traditional combustion vehicles. At that time, the world will need around 290 million charging stations. Therefore, without a doubt, new generation energy vehicles and energy storage technology will undergo massive developments in the future. Furthermore, the new applications and developments of new energy vehicles and energy storage equipment will create new business opportunities for various industries, with connectors and wire harness industries being some of the industries to benefit from.JPC has long been cultivating the automotive industry. Besides performing well in the traditional areas of ADAS and infotainment, JPC is able to provide one-stop service for the high voltage wire harnesses needed by new energy vehicles and high voltage connectors for both ends of the wire harnesses. JPC's industry layout is vastly superior to normal cable houses, creating a unique advantage rarely seen in the industry. Therefore, in the major electric vehicle markets of China, Europe, North America or Japan, JPC is winning the affirmation of more and more landmark customers.The ability to provide voltage connectors and automotive wire harnesses is rare in the industry.In the future, as the global electric vehicle market continues to expand, the construction of charging stations is being driven by the subsidies provided by various governments. This represents an optimistic future for the new energy market, and for companies that were not tier 1 suppliers of large automobile manufacturers such as JPC, this represents great coming opportunities.This is mainly because of JPC's more than 25 years of experience in designing, developing and manufacturing connectors and wire harness products. JPC has not only established solid and professional vertical integration capabilities, product design, innovative research, development capabilities, mechanism simulation/electric circuit design and analysis, it also possesses complete supply capabilities for high voltage/high current products in key components, such as series battery modules in electric vehicles, PDU, MCU and on-board chargers. Moreover, JPC has 4 major business divisions internally. Besides automotive and new energy departments, the divisions also cover IoT, industrial and high frequency industries. Therefore, when a customer has other needs, JPC is able to provide its full support. These advantages provide great incentives for partnership to medium to large manufacturers with established foundations or start-ups that are ready to soar.Presently, JPC has established three major solutions related to new energy and energy storage systems. The first supports high voltage and high current, including 200A, 300A and 60A, connectors. The connectors are not only applicable for electric vehicles and can also be used for new energy storage cabinets. JPC has conducted complete reliability testing for the related products. The second solution includes the FAKRA and HSD series wire harnesses used in the ADAS or infotainment field. Next is customized automotive wire harnesses, which is different to normal wire harness terminals due its ability to withstand high temperature environments.For the high voltage and high current connector or automotive waterproof wire harness solutions mentioned above, the barrier to entry is rather high. Therefore, companies focused on the global connector and wire harness industries are quite common. However, companies that can supply these niche products together are relatively rare, creating an unique advantage for JPC's one-stop service.By combining the strengths of its strategic partners, JPC provides the most complete solutions.It is also worth mentioning that JPC is also involved in an older industry, which is flat cables. When the market headed towards a price war, which formed a red ocean, forcing JPC to be silent for a period of time. However, with the rise of new energy vehicles, JPC saw major opportunities. Because electric vehicles require flat cables that support a wide temperature range (-40 degrees C to 125 degress C) for image transmission, which is the strength of JPC, the company decided to reenter the market and actively expand its flat cable supply.Due to the rarity of companies that are able to supply flat cables and high voltage wire harnesses for battery management systems (BMS) together, it created a unique niche for JPC, which attracted some well-known electric vehicle manufacturers.On the other hand, JPC knows that in the future, there will not be a single company that can fully satisfy all market needs. Therefore, JPC does not only provide one-stop service for connectors and wire harnesses. It also integrates the capabilities of Coretronic, FSP, ADLINK, Chenbro and other strategic partners to create the most complete solutions for customers.Returning to issues related to new generation energy vehicles and energy storage related technologies, JPC has accumulated more and more landmark cases. For example, electric vehicles have always favored the connectors of a certain international brand, allowing the connector to dominate the market. A electric small truck manufacturer in China was supposed to use the connector and commissioned JPC to process the wire harnesses. However, due to the structure of the vehicle, the connector had to be customized but the manufacturer refused the request. At this time, the electric truck manufacturer turned to JPC for help. JPC was able to create stands and mechanisms compatible with the well-known connector and integrated customized high voltage connectors. JPC was able to solve the electric truck manufacturer's problem and it became a success story in the industry.Additionally, an electric container truck company felt that due to the long length of the vehicle (the cabin plus the trailer) and the need to travel between the customer and port non-stop, the vehicles need constant charging. However, when charging, the cabin and trailer has to be separated, creating a mess of cables that could pose a threat to safety on the work site. Therefore, JPC was commissioned to design a solution. JPC developed a mechanical wire storage reel which uses the spring controlling the turbine to turn the cable reel. It successfully implements electric storage. The ingenuity of the solution highlights the thought and technology JPC invests in its customized connectors and wire harnesses.JPC, enabling next-generation electric vehicle connectivityPhoto: Company
Friday 15 October 2021
ADLINK assists in implementation of smart transportation, providing complete solutions with software and hardware
Self-driving cars have been listed as an important focus for development by global car and technology companies. The successful development of the technologies will not only depend on the sensor and recognition technologies for the vehicles, it will also require digitized systems in the surrounding environments on the road. ADLINK has been working in this area for many years. Henry Hu, Global Business Development Director, Networking Communication and Public Sector Business Unit, ADLINK, stated that besides the high quality and high performance edge computing hardware understood by the industry, the software technology has also been completed in recent years. Through the integration of hardware and software, ADLINK can provide complete solutions for system integration companies and end users.In terms of self-driving cars, the image that most people have in their minds is of a car driving down the road with no one in the driver's seat. The car will set the route according to the passengers' instructions and avoid other cars and pedestrians on the road, safely taking the passengers to their destination. Henry Hu pointed out that this is the ultimate goal of self-driving cars. By looking at the development trends in society and industry, the goal will not be achieved at once, but will be completed through the gradual implementation of technology and infrastructure.He used autonomous rail rapid transit (ART) as an example. In the past, rail transport has involved the laying of tracks on the road, allowing trains to travel in a semi-enclosed space. In recent years, ART has been implemented on normal roads. Magnetic tracks are installed underneath the road surface. Vehicles only need ADAS driver assist systems, which include forward crash warning (FCW) and lane deviation warning (LDW), 2 matured technologies, to travel on the lane. At present, smart tracks have been officially launched in Hunan, China. Taiwan is currently promoting the technology and the Ministry of Transportation and Communications is formulating a budget. The industrial, governmental, academic and research capabilities of Taiwan will be invested to develop the technology. ADLINK will also actively contribute to the effort.Henry Hu stated that smart tracks are a representative application of smart transportation. The system requires the integration of cloud, edge computing and internet connected equipment. The hardware capabilities of ADLINK are well-known in the industry, and the industrial computers released by ADLINK have been widely implemented in various transportation areas. In recent years, the company has strengthened its software layout, with the merger of the UK software company, PrismTech, in 2015 as one of its strategies. The core technology of PrismTech is data distribution service (DDS). The technology was mainly applied to military manufacturing systems, and has now been extended to industrial IoT. The peer-to-peer real time data transmission of DDS is very suitable for automotive IoT. Furthermore, in order to accelerate industry development, ADLINK has not only published the source code of the technology, it has also promoted the use of the software in open-source robotics operating system (ROS) and open-source self-driving technology of the Autoware Foundation (AWF). Currently, Jim Liu, CEO of ADLINK, is one of the 5 directors of AWF, which is assisting in the development of self-driving cars.The complete industry layout of its software combined with the advantages of existing hardware, and with the ecosystem created in recent years, has allowed ADLINK to provide the most complete industry solutions. Using traffic cameras as an example, Henry Hu said that in the past, cameras at intersections were mainly for catching speeding vehicles. In recent years, the law enforcement application of the technology has been expanded and more functions have been implemented. ART mentioned above is one such function. Currently, the self-driving bus service implemented by the Ministry of Transportation and Communications and Hsinchu County Government on the roads surrounding the Zhubei high speed rail area, uses the ADLINK solution. In this solution, ADLINK partners has integrated LIDAR, radar, cameras, and communication modules into the smart intersection system. The various equipment of the system can share intersection data through sensor and IoT technology, creating a smart traffic system with comprehensive functions. For ADLINK, creating a complete smart transportation system with eco-system partners is focused on establishing a comprehensive structure that can allow self-driving cars to safely travel with the C-V2Xd framework.Henry Hu stated that Taiwan has been devoted to the development of self-driving cars in recent years. Taiwan is currently one of the leaders in technology and in terms of industry capabilities, Taiwan companies show great promise. ADLINK has been invested in self-driving cars for a long time. Besides providing integrated self-driving system development kits (G-AD-KIT) to help developers and academic institutions invest in applications for minimal R&D and labor costs, the company has also accumulated extensive system construction experience through partnerships with various global companies. In the future, ADLINK will continue to use its products and experience to cultivate domestic companies and transform smart transportation into an important industry for Taiwan.Learn more about ADLINK's Autonomous Vehicle SolutionsHenry Hu, Global Business Development Director, Networking Communication and Public Sector Business Unit, ADLINKPhoto: Company