Light, thin, non-glare and warm white – Orbeos is the first OLED light source from Osram Opto Semiconductors for premium quality functional lighting. The new energy-efficient surface-emitting panel is especially suited to applications in the premium segment such as architecture, hotels and catering, offices, private homes and shops.
Asustek Computer has launched Ion-based netbooks, nettops and all-in-one PCs including the Eee Box PC EB1501 and EB1012, Eee PC 1201N, and Eee Top PC ET2002 in Taiwan.
San Jose, CA, November 10, 2009 - Aptina announced today the launch of the MT9F001 camera image sensor, the latest addition to its extensive portfolio of high performance image sensor solutions...
Eindhoven, Netherlands - NXP Semiconductors today announced the launch of GreenChip TEA1733(L) - a low-cost IC that increases energy efficiency and standby performance of power supplies under 75W...
Qualcomm and Lenovo Group have announced that Lenovo will incorporate Qualcomm's new Gobi2000 technology into upcoming ThinkPad notebooks in the X, T and W Series beginning in 2010 to enable global 3G connectivity...
Hynix Semiconductor has announced Intel validation of 2Gb DDR3 DRAM chips using 40nm-class process technology. The chipmaker said it has begun mass producing the new chips, and expects the validation of RDIMMs to also be completed within before year's end.
Transcend Information has teamed up with Internet information search and management firm eSobi to offer its 4GB JetFlash V33-series USB flash drives with eSobi software in the Taiwan market, according to the company.
AMD has announced the ATI Radeon HD 5970, a new ultra high-end model joining its list of Radeon HD 5000 series graphics card to fully support Microsoft DirectX 11 technology and ATI Eyefinity multi-display technology.
Toshiba has announced development of a high-resolution photo-sensitive film (photoresist) essential for future application of extreme ultraviolet (EUV) lithography in semiconductor fabrication, and proved its viability with 20nm-scale generation process technology. The breakthrough will be announced on November 19.
SAN DIEGO – November 12, 2009 – Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today announced that it is sampling a new smartphone chipset family that breaks new ground in mobile performance in the mainstream smartphone tier...
