Lanner Electronics has launched the LEC-7100, a fanless industrial computer powered by the new dual core Intel Atom D510 processor at 1.66GHz. The LEC-7100 is designed to be easily deployable for a variety of industrial and commercial applications, according to the company."We're very excited about the new dual-core Intel Atom processor and the advantages it brings to our fanless computers," said Spencer Chou, product planner, Embedded Business Group, Lanner. "The LEC-7100 is a versatile network-ready computer with all the interfaces needed for a wide variety of end-use applications, and with the new D510 processor, we've developed a powerful solution that improves on all aspects of the fanless design, including performance, stability, power consumption and price."The LEC-7100 includes multiple audio and video interfaces, two Gigabit LAN network ports, and two storage interfaces – Compact Flash Type I/II and SATA HDD. Another feature in the LEC-7100 is the ability to communicate wirelessly via a 3G/GPS module and Wi-Fi ready hardware, Lanner highlighted.Additionally, the LEC-7100 features both VGA and DVI-D video ports, delivering increased flexibility for dual-display applications such as digital signage, point of sales, kiosk and jackpot displays, the company said.The LEC-7100 embedded computer's fanless design makes it suitable for video applications such as digital signs, outdoor advertising and kiosk systems. Lanner claims the dual-core Atom CPU provides outstanding performance with very low power consumption and minimal cooling requirements, resulting in improved stability and longevity and providing a higher return on investment.Lanner Luge LEC-7100Photo: Company

Micro-Star International (MSI) is showcasing the latest members of MSI G-series notebooks, the GX640, GX740 and GT660, at CeBIT 2010.The GX640 and GX740 boast Intel Core i5 processors with AMD's ATI Radeon HD 5870 and HD 5850 discrete graphics cards, respectively. Both notebooks feature 1GB GDDR5 VRAM on the graphics cards and SRS Premium Sound for audio output.The GX740 adopts a 17-inch LCD panel, and the GX640 a 15.4-inch. Both notebooks feature MSI's ECO Engine Power Saving Technology as well as Cinema Pro Technology for enhanced performance.The GX640 and GX740 are covered by an aluminum magnesium alloy chassis and have a keyboard designed specifically for gamers.The GT660 gaming notebook has an Intel Core i7 processor with Nvidia GeForce GTX 285M (1GB GDDR3 memory) discrete graphics card. MSI GX640 notebook specifications Item Detail OS Windows 7 Home Premium CPU Intel Core i5 processor Chipset Intel HM55 Graphics ATI Radeon HD 5850 with 1GB GDDR5 VRAM Memory DDR3 memory supports up to 8GB Display 15.4-inch TFT LCD HDD 2.5-inch 320/500/640GB SATA Source: Company, compiled by Digitimes, March 2010 MSI GX740 notebook specifications Item Detail OS Windows 7 Home Premium CPU Intel Core i5 processor Chipset Intel HM55 Graphics ATI Radeon HD5870 with 1GB GDDR5 VRAM Memory DDR3 memory supports up to 8GB Display 17-inch TFT LCD HDD 2.5-inch 320/500/640GB SATA Source: Company, compiled by Digitimes, March 2010MSI GT660 gaming notebookPhoto: Company

Gigabyte Technology is is set to launch its latest AMD AM3 Socket GA-890GPA-UD3H motherboard, the first featuring the AMD 890GX chipset paired with the new SB850 southbridge.In addition to supporting upcoming six-core AMD CPUs and the new ATI Radeon HD 4290 IGP, the Gigabyte GA-890GPA-UD3H offers native support for SATA 6Gbps for up to six devices with the ability to configure RAID 0, 1, 5 and 10 for maximum data performance or enhanced data backup, the company highlighted.The NEC USB 3.0 controller which is becoming a key value-added feature of Gigabyte's lineup for 2010 appears again offering high-speed data transfer rates for external devices and storage, and 3x USB Power Boost, which allows power-hungry peripherals to be used with a single USB port, without the need for an extra power supply.The Gigabyte GA-890GPA-UD3H's HD 4290 IGP supports DirectX 10.1 and 128M DDR3 sideport memory, and scores up to 18% higher than the previous generation AMD 790GX chipset in certain benchmarks, according to Gigabyte. In addition, the motherboard includes two PCI Express 2.0 x16 slots, allowing users to run ATI CrossfireX or Hybrid CrossfireX configurations depending on their gaming, productivity and power efficiency needs.The GA-890GPA-UD3H is expected to launch at CeBIT 2010 which runs from March 2-6.Gigabyte GA-890GPA-UD3HPhoto: Company

Micro-Star International (MSI) has launched the 890GXM-G65, a motherboard using AMD's 890GX chipset, for the home theater PC segment.The motherboard supports the latest AMD Phenom II processors, while its integrated graphics chip supports DirectX 10.1 and UVD 2.0 to enhance high-definition audio and video effects.The motherboard includes MSI's OC Genie Lite technology for overclocking, while adopts military class component for stability, MSI said.The motherboard also features native support of SATA 6Gb/s and USB 3.0, MSI noted.MSI 890GXM-G65 motherboardPhoto: Company

AMD has introduced the ATI Radeon HD 5830 graphics card, bringing gamers the latest features from AMD and performance of the ATI Radeon HD 5800-series at a lower price than US$250.With the introduction of the ATI Radeon HD 5830, gamers have another choice in graphics hardware, with full support for DirectX 11 gaming, ATI Eyefinity technology, and ATI Stream capabilities.MSI has released its R5830 Twin Frozr II graphics card which features 1120 stream processors and 1GB GDDR5 memory.The card also includes MSI's exclusive Twin Frozr II Thermal design and Afterburner overclocking software. The card is built by military class components for stability, MSI also claimed.MSI R5830 Twin Frozr II graphics cardPhoto: Company

SANTA CLARA, Calif., - February 8, 2010 - OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced the introduction of the world's first 1.1-micron backside illumination (BSI) pixel. The new OmniBSI-2 pixel architecture represents a major milestone in digital imaging technology, and enables new imaging solutions with superior image quality and low-light sensitivity. The architecture also extends OmniVision's pixel roadmap to submicron levels, and serves as a key enabler in the continuous miniaturization of digital imaging technology."OmniBSI-2 drives the development of higher resolution image sensor solutions with an aggressive form factor and lower z-height for ultra-thin products," said Bruce Weyer, vice president of worldwide marketing at OmniVision. "OmniBSI-2 advances the digital imaging market by enabling improved image quality and enhanced low-light performance that dramatically improves the user experience in videobased applications. OmniBSI-2 technology can also be applied to larger pixel designs to achieve performance advantages that exceed current BSI and FSI imaging sensors."OmniBSI-2 is OmniVision's second-generation BSI technology, and is the first pixel built on a 300mm copper process at 65nm design rules developed in cooperation with strategic manufacturing partner, Taiwan Semiconductor Manufacturing Company (TSMC). By combining custom 65nm design rules and new manufacturing process modules, the 1.1-micron OmniBSI-2 pixel achieves industryleading low-light sensitivity as well as significantly improved dark current and full-well capacity. OmniBSI-2's custom pixel design rules also enable better pixel layout, better isolation, and significantly reduced crosstalk. Each of these advances represents a substantial improvement over the first generation OmniBSI technology resulting in better image quality, enhanced color reproduction and improved camera performance."By comparison, the new 1.1-micron OmniBSI-2 pixel not only outperforms our current 1.75-micron FSI architecture, but it also equals the performance of our industry-leading 1.4-micron BSI pixel that is currently in mass production," commented Howard Rhodes, vice president of process engineering at OmniVision. "Migrating to 1.1-micron BSI pixel architecture required moving production to TSMC's state-of-the-art 300-mm copper process, which enabled substantially improved design rules and more advanced process tools, resulting in tighter process control and improved defect density. Key to our success was the joint development by the OmniVision and TSMC R&D teams of multiple new process modules that substantially improved opto-electronic performance. We also leveraged our close partnership with joint venture partner VisEra Technologies to establish a 300-mm color filter fabrication capability.""OmniVision and TSMC have been long standing partners in CMOS Image Sensor development. Our engineering teams collaboratively push the boundaries of digital imaging, making them an excellent development and manufacturing partners," said Sajiv Dalal, vice president, business management at TSMC North America. "OmniVision's product migration to 300-mm manufacturing will give it a clear competitive edge and we stand committed to continuously drive improved efficiencies to help widen the gap."TSMC provides the foundry segment's leading CIS technology with the largest CIS production capacity. In 2009, TSMC supported a total capacity of approximately ten million eight-inch equivalent wafers, a six percent increase over its 2008 production capacity."TSMC has been a valuable partner in making the transition to this advanced process node," added Rhodes. "Their experience and expertise in 300mm processing at the advanced technology nodes and ability to continue enhancing the sensor performance have been invaluable in ramping this new pixel technology so quickly and seamlessly."

Santa Clara (Feb 11, 2010) Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced the newest addition to the ARMADA family of application processors - the Marvell ARMADA 618 for next generation HD-capable smartphones. Characteristic of the ARMADA family of application processors, the ARMADA 618 offers a CPU core with PC-class performance, integrated 1080p full-HD encode and decode, and exceptional 3D graphics - delivering a highly scalable and power optimized platform that is designed to fuel high-end applications, rich multimedia and gaming experience in a lightweight form factor with very low power requirements."Featuring a gigahertz CPU, 1080p full-HD video, 3D graphics, the industry's fastest LP-DDR, and optimized power for longer battery life, Marvell's ARMADA 618 application processor represents a dramatic leap forward in high-end, multimedia smartphones," said Ms. Weili Dai, Marvell's Co-founder and Vice President and General Manager of Marvell Semiconductor's Consumer and Computing Business Unit. "Importantly, the ARMADA 600 series of application processors gives our customers a common platform solution to build multiple products and formats for the always-on consumer--scaling from smartphones to eReaders to tablets without compromising either the multimedia performance or the battery life."The ARMADA 618 is based on a Marvell-designed ARM v7 compatible CPU offering gigahertz-class performance in a 12mm x 12mm package. It offers the flexibility to use LP-DDR1 or LP-DDR2 memory up to 533 MHz, a highly flexible display controller capable of four simultaneous displays at up to 2K x 2K resolution, and a highly robust security subsystem that includes a secure execution processor. In addition, it features a powerful 3D graphics engine that supports DirectX, Open GL ES 2.0, and Open VG 1.1, rendering up to 45 million triangles per second with a complete floating point pipeline and unified vertex and fragment/pixel shading, generating contrast-rich scenes with high-definition resolution and color. ARMADA 618 supports Linux, Android, Windows Mobile, and full Adobe Flash.Availability The ARMADA 618 will be demonstrated at the Marvell Booth (Courtyard 18) at Mobile World Congress (MWC) in Barcelona, Spain next week. The ARMADA 618 is currently sampling to early customers.

Lanner Electronics has announced the FW-8910, a new 2U rackmount dual-CPU appliance built around two Intel Xeon C5500 processors and supporting up to 40 Gigabit Ethernet ports.The Lanner FW-8910 targets the performance segment of the network security, NAC, WAN Acceleration and ADC markets, and offers the features of Intel's new C5500 processor, such as integrated memory controller, integrated PCI Express 2.0 controller and Quick Path Interconnect (QPI) technology."As a member of the Intel Embedded Alliance, Lanner strives to lead the industry in developing the most advanced hardware platforms on the latest Intel technologies such as the Intel Xeon processor C5500-series and Intel 3420 chipset," said Jesse Chiang, Product Planner, Lanner Network Communications. "Network security and acceleration solutions demand the highest levels of performance for enterprise-class networks, and performance is what the Lanner FW-8910 delivers.""The new Xeon C5500-series feature multi-core and multi-threaded processing, allowing for vast improvements in network packet processing efficiency," said Frank Schapfel, director of marketing, Intel Performance Products Division. "Directly connecting GbE and 10GbE MACs to the integrated PCI Express controller allows network appliance manufacturers such as Lanner, to easily add sophisticated network connectivity."A 2U rack mount platform, the FW-8910 includes up to five customized Ethernet modules for a combination of up to 40 LAN ports combining GbE copper, fiber and bypass port options. Furthermore, the FW-8910 supports multiple 10Gbps cards, either fiber or 10G Base-T copper, Lanner highlighted. Twelve DIMM sockets support up to 96GB DDR3 memory, and four 2.5-inch hard drives allow for RAID based data protection. High availability features include optional RAID, swappable system fans and redundant 500W power supplies, Lanner added. An optional on-board Cavium Nitrox CN1620 security processor offloads high-level security commands to dramatically increase total system throughput.Lanner's modular design allows for easy replacement of front-facing network port modules, hot-swappable hard drives, rear-accessible fan assemblies and power supply units, the company pointed out.Lanner will be displaying the FW-8910 at the RSA conference, taking place from March 1 - 4, at the Moscone Center in San Francisco, California, and the product will be available for sampling later in first-quarter 2010.Lanner FW-8910 enterprise-class network appliancePhoto: Company

RF semiconductor company Elonics and Taiwan-based networking IC design house Realtek Semiconductor have collaborated to create a multi-standard DVB-T, DAB/DAB+ and FM TV and Radio reference design. The platform can be adopted by manufacturers as an external USB dongle or internal USB Minicard.The reference design is able to receive both digital TV and radio. The same hardware is used to receive all standards by seamlessly reconfiguring the personality of the devices using the supplied software drivers. The device operates in both VHF and L band frequencies. It has low power consumption (around 650mW fully active) and the ultra low component count creates low production costs, the companies highlighted."With high sensitivity performance (-98dBm QPSK, C/R 1/2, DVB-T, 8MHz), the design is proven to work even in the weakest signal environments," said Julian Hayes, Elonics VP of sales and marketing.The production-ready TV and radio USB design contains Elonics E4000 CMOS RF tuner that uses DigitalTune technology to enable high performance and multi-standard capabilities. The companion Realtek RTL2832U is a digital TV and radio USB 2.0 demodulator with DVB-T and FM/DAB/DAB+ reception ability.The reference design surpasses Nordig 2.0, D-Book 5.0 and ETSI 300-744 requirements and can be used for PCs of any size (including notebooks and netbooks). It is available in a number of different form factors and feature options. The USB dongle comes in a number of different sizes from 31mm×18mm including USB connector.

AzureWave Technologies, Inc., a global leading wireless solution provider, has rolled out a complete product line of 11n and Bluetooth 3.0 + High Speed (HS) wireless module IC for mobile devices, such as smartphones, mobile gaming devices, e-book readers and portable media players (PMPs), all of which require high bandwidth and efficient power management. AzureWave will showcase the latest 11n + Bluetooth 3.0 technology at MWC in Hall 2, Booth #2C09.What makes AzureWave's wireless module IC outstanding is its small footprint, cutting edge wireless performance, flexible power management and diverse OS support for multitasking smartphones and mobile devices. The coexistence of Wi-Fi and Bluetooth in one module guarantees seamless and smooth data transfer. Combined with the latest Bluetooth 3.0 technology + HS, the wireless Module IC enables a wide variety of mobile devices to quickly and easily transfer rich media contents. In addition, it facilitates high speed synchronization with other BT 3.0 + HS enabled devices.According to ABI Research, 802.11n is making its official debut in higher-end smartphones in 2010 and will have at least 87 percent bundle rate by 2014. The quick growth of 802.11n is triggered by consumers' demand for higher bandwidth to transfer big data across different devices and download advanced applications via network. Especially the increasing demand to easily and quickly connect consumers' different devices and share information is far larger than ever, an easy peer to peer connection such as Wi-Fi Direct and Bluetooth 3.0 + HS featured in AzureWave's wireless modules will help consumers' dream come true.Consumers are looking for smartphones with more powerful processors, better battery life, richer web experience and multitasking capabilities. As a result, combo solutions are growing in popularity among mobile gaming and portable CE to allow consumers to benefit from the outstanding wireless experience. AzureWave will launch the latest 11n high speed solutions in the upcoming MWC at booth #2C09 during February 15-18.