Jasper Display Corp. (JDC), a leading company in high performance liquid crystal on silicon microdisplay design and production, and the HOLOEYE Companies (HOLOEYE Photonics AG and HOLOEYE Systems, Inc)., leaders in the provisional of LCOS micro-displays configured for phase modulation and integrators of micro-display technology, recently announced the establishment of a value added reseller (VAR) agreement to serve specialty markets.JDC supplies LCOS products for consumer and professional electronic applications. JDC will supply HOLOEYE with finished, amplitude aligned JD4552 micro-displays, fully custom micro-display controller ASICs, JD2552 wafers that HOLOEYE will manufacture into phase aligned micro-displays, and development kits for both micro-displays. The JD4552 is a Full HD (1920 x 1080), completely digital micro-display with a 0.55" image array diagonal, optimized for very high speed operation in single and multi-panel display systems.Using JDC products HOLOEYE will apply its expertise to address a wide range of applications such as Head Mounted Displays (HMD), Heads-Up Displays (HUD), optical metrology, and medical imaging. HOLOEYE will utilize the new high resolution LCOS micro-displays, design for single panel color field sequential applications, in cost effective projection and Near to Eye applications. HOLOEYE has also started the development of phase modulating LCOS micro-displays based on JDC's LCOS platform for use in adaptive optics applications such as dynamic diffractive optics, digital holography and optical networking solutions.Darwin Hu, President of JDC, explained, "Our partnership with HOLOEYE Systems Inc. enables JDC to address the industrial market place through HOLOEYE's established and developing customer bases. By working with HOLOEYE Systems, we can expand the field from the products we developed for consumer electronics and offer niche markets at an attractive cost versus performance value."Marcel Rogalla, CEO of HOLOEYE Systems Inc., added, "JDC's development of high resolution backplanes with very small pixels provided a superb platform for developing phase modulating LCOS devices. Adding JDC's JD4552 LCOS micro-display system to HOLOEYE's lineup will give HSI a very high performance product with significant added capabilities. HOLOEYE and JDC are working together to develop further product offerings."About Jasper Display Corp.Jasper Display Corp., operations started in 2010, has successfully developed and brought to the marketplace a new, very high speed Full HD microdisplay and microdisplay controller, the first in a line of new LCOS products to support color-sequential single-microdisplay operated at FHD resolution. For more information about Jasper, visit the company's website at www.jasperdisplay.com.About HOLOEYE Systems, Inc., and HOLOEYE Photonics AGHOLOEYE Photonics, Berlin, Germany, develops custom micro-display solutions for projection and imaging applications in the industrial and scientific environment as well as specialized LCOS phase modulators for industrial and photonics markets.Both HOLOEYE companies are professional integrators of LCOS micro-display technologies and offers complete solutions and development services including optical, mechanical and electronic system design, prototype to high-volume manufacturing services, and supply chain management, whereby HOLOEYE Systems, Inc., targets primarily governmental markets. More information can be found at www.holoeyesystems.com and www.holoeye.com
Amacrox MOBILE 95 is a powerful charging solution, ideal for driving commuters who look to do more while in the traffic jam. Its sleek and compact design makes charge one smartphone and one laptop at the same time in your car without losing your fashion statement. With 11 exchangeable tips, MOBILE 95 is compatible to major brands of laptops in the market. The multi-charging and high compatibility with stylish design make Amacrox MOBILE 95 one of the must-have item selections.Fast Charging and Easy to UseWith 2.1A True Current USB charging, Amacrox MOBILE 95 provides speed charging to your USB devices. Amacrox MOBILE 95 is capable of charging laptop and USB device at the same time without slowing down the charging speed.Max Protection with Changeable FuseAmacrox MOBILE 95 provides max protection ( OCP,OVP,SCP) and its changeable fuse circuit breaker makes it easy to charge multiple devices at once without the fear of any power surge ruining those devices. Moreover, you can easily change the fuse when necessary in a simple and easy way. You will enjoy the safety and convenience with Amacrox MOBILE 95 Laptop Car Charger delivers, whether you are looking to charge your laptop, smartphones or other USB-powered devices.Features:Multi-Charging: Charging Laptop & USB devices at the same time.2.1A output on USB : True Current, Fast Charging Max Protection: OVP, OCP, SCP.Changeable Fuse: Safety and environmental friendly ensured.Specifications:95W Power OutputInput VoltageG12V~16Vdc USB Charging Port OutputG 2.1AOutput VoltageG19V,5VSize & WeightG120*26.5*48mm/100gPackage ContentG95W Laptop Car Charger/Laptop exchangeable tip/laptop power cord/ User GuideAmacrox MOBILE 95 Laptop Car Charger
Santa Clara, Calif., May 31 -- Jasper Display Corp. (JDC), a leading company in high performance liquid crystal on silicon microdisplay design and production, today announces the world leading 1080P(1920X1080) 0.55" LCOS microdisplay is now first released to serve diverse markets, ranging from single-panel to multi-panel projector, phase modulation applications and optical network communication.JD4552 is a high performance, full digital liquid crystal on silicon microdisplay, featuring at world first 1080P with full digital backplane for use in 1-channel to multi-channel optical systems at rear and front projection applications. With an additional 32 rows and 32 columns, it could offer a total resolution of 1952 x 1112 that allows dynamic convergence adjustment when integrated into a multi-panel projector. The digital driver supports frame rate up to 120Hz or above for HD video, and allows three to four color field rate up to 480Hz, which could meet less color break effect under color sequential drive. To achieve good light output while keeping excellent image quality, it features capabilities that enable higher native contrast ratio more than 1000:1 with controllable border grayscale, higher bit-rate to support wide color gamut with clear color fidelity, and average reflectivity reaches average 75%, leading in this filed. Compare to other competitive microdisplay, JD4552 now is reaching above industrial average yield rate to more than 70% with good quality control method. To benefit system designer at good cost/performance control, it has successfully proved its value in optical network communication, phase modulation application, diffractive optical elements to projector markets.According to a recent study by the Nielsen Company, 88% of U.S. tablet owners and 86% of smartphone owners used their device while watching TV at least once during a 30-day period. Most consumers are now wanting higher resolution video by using mobile devices. Toward this trend, JDC now are achieving the world leading 1080P with higher frame rate to provide system makers design a compact, higher resolution, portable projector, so-called premiere projector. To prove the concept, JDC provides the JD4552 evaluation kit and system development kit with 1-channel optical engine and 2-channel optical engine featuring in compact size, up to 400 lumens, LED light and high contrast ratio for our worldwide market partners to engage toward Full HD Video Sharing Devices in cost effective, lower power consumption large screen, mobility, and less environmental consuming solutions. JDC plans to serve the premiere portable projector at above HD good image quality, and believes in bringing a better video life to the world. JD4552 could provide at consumer projector market and professional market, and it is also capable to serve industrial to medical application by requested. Find more in www.jasperdisplay.com.About Jasper Display Corp.Jasper Display Corp., operations started in 2010, has successfully developed and brought to the marketplace a new, very high speed Full HD microdisplay and microdisplay controller, the first in a line of new LCOS products to support color-sequential single-microdisplay operated at FHD resolution. For more information about Jasper, visit the company's website at www.jasperdisplay.com.
MILPITAS, Calif. – June 6, 2012 – Phoenix Technologies Ltd., the global leader in UEFI firmware technology, products and tools, today announced it has signed an agreement with Intel Corporation (NASDAQ: INTC) to be its collaborative partner for BIOS. The two companies will jointly develop the new reference UEFI firmware for the Intel code base.Phoenix will provide on-site engineers who will work collaboratively with Intel across various global locations to create the reference UEFI core code firmware that will greatly improve and standardize the code base support for all future Intel client platforms. These improvements will be included in areas such as tools, re-visioning schemes and other firmware structures that will support bringing customer products to market quickly and efficiently. This jointly created reference standard for UEFI BIOS on Intel platforms will optimize an OEM's ability to meet market demands such as long battery life, instant-on and always connected for ultra-thin client products, as well as reliability, scalability and performance.Additionally Phoenix has been selected by Intel to provide engineering support for Intel's server software development platforms. This collaboration will allow Intel and Phoenix to serve their mutual customers with accelerated development time for hardware and software. This joint effort will better enable customers to achieve balance between complex bring up of multi-core chipsets and software design while achieving performance and scalability for server systems.Phoenix pioneered the commercial BIOS business and was selected by Intel as a firmware partner because of the deep technology expertise developed over 30 years of serving the market. Phoenix's firmware architecture is very organized and highly structured, making it easy to use, readable and extensible. These characteristics are in alignment with Intel's focus on highest quality engineering and technology development and will be extremely valuable as Intel continues their transition to EDK II across all platforms."Phoenix has over 200 patents in the U.S. and internationally. Greater than 75% of our patents are in core system software (BIOS) and we continue to provide innovation in this technology space. Through the collaborative creation of UEFI firmware with Intel, our mutual customers will benefit from new levels of efficiency while providing them with current and future platforms that support faster and easier modifications, and next generation product development," said Rich Geruson, Phoenix CEO. "It's an honor to work with Intel on this project, confirming our leadership role in firmware."For more information, go to http://www.phoenix.com/Phoenix continues its technology leadership in BIOS with its architecture and deep expertise in firmware development.
AMD has announced the immediate availability of the AMD FirePro W600 professional graphics card, the company's first professional graphics card to leverage AMD's Graphics Core Next architecture and 28nm production technology, for use in high-resolution, content-rich, multi-screen display wall environments. With this launch, AMD is addressing a growing need for large, dynamic screens that are easily updated with new content.System integrators and display installation builders are rapidly replacing single, low-resolution displays with the latest in HD LED, LCD and plasma technologies that can reach audiences on massive, high-resolution screens grouped together to form a single image or divided into multiple streams of information. The thinner, lighter and increasingly cost-effective nature of these technologies makes multi-screen display walls attractive to a range of companies, including those in the advertising, entertainment, operations, security, training and video-conferencing markets.The AMD FirePro W600 Professional Graphics card can support up to six high-resolution displays or projectors from a single-slot card and six mini DisplayPort connectors, while the card also equips 2GB of GDDR5 graphics memory for multimedia performance.The card also supports two HD video streams via AMD's Unified Video Decoder and features projection overlap capability to create one seamless image, with planned support for projection edge blending and image warping in the fourth quarter of 2012. Furthermore, it also features AMD's PowerTune technology to dynamically optimize power consumption during operation as well as ZeroCore Power technology to provides reduced power consumption at idle.The AMD FirePro W600 professional graphics card joins a range of products for configuring displays with two to six screens, including the ATI FirePro 2460, AMD FirePro 2270, AMD FirePro V7900 and ATI FirePro V9800.AMD FirePro W600 professional graphics cardPhoto: Company
In response to the steadily growing market for high-speed wireless transmission demand, the WiGig Alliance standard, based on the 60GHz frequency band technology, has been rapidly progressing and is actively being called on by manufacturers to work together to build products to enhance consumer user experience beyond other wireless technologies provide today.The WiGig Alliance, Taiwan's Industrial Technology Research Institute (ITRI) and the Taipei Computer Association (TCA) co-organized the first ever WiGig executive Summit during the Computex 2012. Heavyweight executives from Broadcom, Intel, Qualcomm-Atheros, Panasonic and Wilocity were invited to share WiGig strategies and trends including a stimulating panel discussion on business and market opportunities, challenges, usage models and other relevant topics.It is estimated that by 2016, WiGig will account for more than 40% of multi-band frequency chipset shipmentsWiGig Alliance Chairman, Ali Sadri, conveyed the latest progress of the standard in his keynote address. He pointed out that in the early stage of WiGig development, the market was skeptical about creating a viable and commercialized technology based on the WiGig 60 GHz technology. However, the technology is now well recognized by the industry and its ecosystem is growing rapidly such that we will soon see WiGig based products in the market alongside of the other mainstream wireless technologies.In a quote from an ABI Research report, Ali Sadri said the WiGig's 60GHz chipset is expected to ramp in 2013. Moreover, In just few years and by 2016, it could account for more than 40% of the multi-band frequency chipset shipments alongside of the legacy 2.4 Ghz and 5 GHz WiFi chipsets.WiGig chipset modules are 10 times faster than Wi-Fi and certification for the MAC-PHY is expected in the second half of 2013Compared to past failed UWB (Ultra Wideband) and WirelessHD standards, Ali Sadri pointed out that the WiGig Alliance has learned from the experiences of other standards and technologies limitations. UWB for example, has global spectrum regulation problems and was intended to compete with the legacy 802.11n technology; that made UWB unlikely to succeed. WirelessHD however was focused on HDMI cable replacement and video streaming applications. Neither of these technologies were backward compatible with legacy Wi-Fi, which does not create transparent wireless connectivity with current technology and limits the application to a single use.Ali Sadri stressed while backward compatibility with Wi-Fi is important, WiGig has different usage models beyond what the current WiFi technology provides. Some of those applications are wired replacement technologies such as HDMI and Display port, USB 3.0, SDIO and PCIe all applicable to the docking stations usage model. All these usages makes WiGig a natural extension to the Wi-Fi technology.Panasonic Tokyo R & D Center Director, Makoto Miwa, said that consumers create and use data in increasing amounts and there is no doubt about the benefits of WiGig for the fast transmission of large files. Panasonic is developing a 10mm x 10mm x 1mm delicate WiGig chipset module, which can provide speeds up to 10 times faster than Wi-Fi. It is estimated that the power consumption of this device is around 600mW and expected to launch by the second quarter of next year. Broadcom Vice President, Craig Ochikubo, and Intel GM of Wireless Connectivity Solutions, Mobile and Communications Group, Yaniv Garty, also agreed that the high WiGig transmission rate can meet consumers growing demand for large file transfers.In addition, Wilocity CEO, Tal Tamir, said his company has been established for five years, and began sampling WiGig chipsets to some customers at the beginning of this year. In the meanwhile, Wilocity is also cooperating with Qualcomm-Atheros and AzureWave on multi-band frequency solutions for wireless docking applications.Yaniv Garty also pointed out that, based on Intel research studies; the users need more than just high throughput connectivity. They are concern about better user experience. He believed that WiGig is focusing on these application areas to provide better user experience at home and office.The WiGig applications and challengesQualcomm Atheros, Senior Vice President and General Manager, Consumer Business Unit, Amir Faintuch pointed out that currently the market is moving to 5GHz 802.11ac. In this case of 60GHz, while WiGig is initially targeting PC applications, in the future it must be able to overcome power consumption and size for entry into the mobile market. That is going to be the volume market for WiGig technology.Craig Ochikubo also believes that size, cost, and power consumption are the major challenges. Yaniv Garty added that many emerging technologies failed in the past due to these factors.Tal Tamir has great confidence about WiGig's future; the speed of 5Gbps is just the beginning. He believed that WiGig's technology in the future is likely to reach 20Gbps or more. He further said that WiGig's learning curve will be in large steps, not only increasing 20%, but also performance efficiency could improve by two to five times within the next few years.Each panelist had different views of the first wave of usage application. Amir Faintuch thinks industry must be able to introduce cost-effective solutions; wireless docking station solutions for P2P and enterprises are good usage models.Craig Ochikubo shared his view that WiGig as a natural extension of Wi-Fi and there offers different usage models due to its high transmission rates. The industry should be able to provide the best design for various applications. A better wireless feature for video streaming is missing from today's market, which is where WiGig can fill in the gap.Yaniv Garty is optimistic about the application of the synchronization within the corporate environment, but he also stressed that no single wireless technology can be applied to all applications; thus businesses need to integrate different elements to develop a complete application solution. That is where the believed WiGig could play a major role at home and office usage scenarios.Makoto Miwa of Panasonic stated that consumers and the market will influence the demand. It then becomes the industry's mission to provide those solutions. He gave the example of the 2011 tsunami and earthquake in Japan, which created a huge demand for wireless communication. WiGig is the technology that can offload 3G and 4G data. It can also be the backhaul for small cell base stations.Overall, WiGig is at its inflection point of market deployment; thus application possibilities are endless. Ali Sadri said this shows that WiGig can offer solutions for multiple business opportunities. He also stressed that WiGig mission is to provide a comprehensive certification programs to enable total seamless product interoperability.Photo: Wilocity CEO, Tal Tamir, Qualcomm-Atheros Senior Vice President and General Manager, Consumer Business Unit, Amir Faintuch, Broadcom VP Craig Ochikubo, WiGig Alliance Chairman, Ali Sadri, Cheng Sheng-Ching, Executive Secretary of the Committee of Communications Industry Development of Taiwan (CoCID), Panasonic Tokyo R & D Center Director, Makoto Miwa, and Intel GM of Wireless Connectivity Solutions, Mobile and Communications Group, Yaniv Garty (from left to right.)
Beijing IRTOUCH Systems Co., Ltd., the world leading touch product provider (Shenzhen Stock Exchange - SZ 300282), attend COMPUTEX Exhibition again and brings a variety of infrared touchscreens, which provide large size touch experience for users.Following the increasing trend of multi-touch applications, IRTOUCH develops numerous infrared multi-touch screens and shows on COMPUTEX. The products can detect up to 10 points at the same time, while implement the functions like multi-people operation, multi-gestures or touch object shape recognition. IRTOUCH multi-touch products can provide perfect supports to Windows 8 Operating System, offer precision and smooth touch operation for users by performance optimization.IRTOUCH also launches ultra-thin infrared touchscreen which has the thinnest frame in the world. The product is designed to have ultra-thin and ultra-slim frame through structural innovation and highly integrated system. It simplifies assembly process for system integrators by integrated controller, simple wiring and detachable structure. Slim design brings better look for display devices and thinner frame also improves user experience.Another highlight on IRTOUCH's booth is large-size touchscreen over 50 inches. It meets the requirements of digital signage, large-size display system, large-size all-in-one touch machine and other industries, with fast response, precise touch, high reliability, free-of-maintenance, and long lifetime. As one of the manufacturers which could produce large and ultra large touchscreens, IRTOUCH could ensure the compliance and consistency of the products and reduce users' risks greatly with complete quality management system and intellectual properties.
Demand for analog ICs in the consumer market has been increasing as the world economy is recovering. In 2012, the analog IC market is estimated to have sales worth US$43.8 billion and according to market research firm Databeans that number will increase to US$60 billion by 2016. With light source, temperature, speed, and sound control technologies maturing, and with extensive adoption by the automotive electronics industry, analog ICs have seen market growth of 50% almost every year.Acquisition of Si-En adds audio amplifiers and LED driver ICs to product portfolio Developing analog IC technology is rather difficult. This coupled with electronic products having various requirements means that there still needs to be a lot of adjustments and design iterations. The entry barrier is high, and services are mainly provided by experienced IC providers. But, as the development period for electronic products is shrinking and production tends to be in small volumes of multiple devices and diversified specifications, not too many IC design firms can provide flexible and fast customized services for each customer's specific needs.Therefore, Integrated Silicon Solution, Inc. (ISSI), which has been developing SRAM and DRAM products for the automotive electronics industry for years and has successfully serviced markets in Europe, the US, China, South East Asia and Japan, acquired analog IC designer Si-En Technology in 2011. With Si-En's audio amplifier and LED driver product lines, ISSI will extend support of its new analog product area to the automotive market.Using existing resources to expand competitiveness in automotive marketISSI's Analog Product marketing director, KC Chun, said, "There are many electronic parts used during automobile manufacturing, so cutting back on the amount of suppliers will help streamline the procurement process for parts and components, and enable more comprehensive technological support from suppliers." Different from the information industry, the automotive industry gives top priority to safety and reliability, and seldom replaces suppliers of electronic components for car models that are still on the market. Therefore automakers' relationship with the supply chain is relatively long-term and closed.ISSI's IC products and business operations have already been certified by international first-tier manufacturers, and the company is a member of the Automotive Electronics Council (AEC) and Genivi Alliance. ISSI has more than 10 years of experience in the automotive market's application specifications and strict certifying processes. This would help ISSI to enter the analog area faster.Innovative packaging for audio products with 3D sound field effectsIn terms of audio amplifiers, ISSI is initially promoting application services for portable products, including tablets, notebooks, smartphones, wireless stereos, and wireless earphones. For future products, ISSI also plans to have a more diverse product line for consumer electronics, automotive, industrial and medical products, with applications for digital TVs, on-board navigation and infotainment systems, and so forth.What's worth noting is that almost all packages from wafer chip scale packaging (WCSP) currently available on the market are bare dies, which can be potentially damaged easily during testing. This increases procurement costs. Therefore, ISSI's new UTQFN (ultra thin quad flat no lead) series packages adopt a packaging technology that offers better protection to reduce the chance of damage during testing. It is particularly remarkable that the pin design of the PCB does not have to be changed when switching to a more advanced process for a smaller chip size to achieve lower production costs for customers."We believe we can provide cost-effective solutions and good support to customers." explained Chun. "ISSI has added 3D sound field technology to its mid-range and high-end audio amplifiers, which makes the sound more crisp and clear, and meets increasing requirements set by the market." The UTQFN series has low-noise capabilities, boosting Bluetooth earphone and hi-fi system makers' competitiveness without adding costs. In addition, ISSI's technical support will also help shorten both the design and production time. ISSI's solutions are the best possible choices available on the market.Comprehensive support for situational lighting, backlighting and general lightingISSI LED driver IC products are aimed at three main areas of use in the market - FxLEDTM , backlighting and general lighting. Not only does the company provide integrated solutions combining light guide plates and LED chips to decrease LED driver ICs' energy consumption, it also has simple-to-use light dimmers and I2C-based interfaces. Program designers will only need to take a few simple steps to allow LED lights to adjust the flashing and dimming frequency in line with the changes of the sound effects.Chun further pointed out, "In the past software engineers had to do real-time detection to change the flicker frequency of LED fixtures, which wasted bandwidth and added MCU code development. We now incorporate this function into the controller to more accurately time the flashing and decrease the work load of the MCU, so the system can run more efficiently." Moreover, ISSI's dimmers also have three dimmer settings to meet various market needs.In 2012, incandescent lighting fixtures will either slowly or completely be replaced by throughout the US, Japan, China, and Europe. LED lighting is expected to be entering into a new era and that it is being sought out to meet specifications and requirements set by nations all over the world. To this end, ISSI is working diligently to make better products in cooperation with partners in the industry that meet the future product requirements.Worldwide automotive business is the long-term goal for ISSIISSI has very strong business with memory product line (SRAM/SDRAM/DDR/DDR2) in the worldwide automotive market. With the experience of long-term support, quality and reliability monitor capability; ISSI will duplicate the success on analog products with those tier-1 automotive customers in the future.ISSI analog product line marketing director, KC Chun (left), and DRAM marketing manager, Sherman Hsu (right).
The IEEE Symposia on VLSI Technology & Circuits will be held in Hawaii, USA from June 12-15. Four Macronix papers have been selected for presentation at the Symposium on VLSI Technology, the most among all Taiwan-based companies. And of the 20-strong memory-related papers selected, Macronix also ranked number one among all participants. Especially, Macronix's papers cover the most advanced research topics including 3D NAND Flash, ReRAM, and phase change memory, showing the Company's comprehensive grasp of key technologies for next-generation memories.In addition, on the opening night of June 12, the VLSI Symposia will hold a Joint Rump Session on "Scaling Challenges Beyond 1xnm DRAM and NAND Flash." Macronix President Dr. Chih-Yuan Lu, who recently received the IEEE Frederik Philips Award, was invited to join the session in a discussion with global leading memory companies of Micron, Rambus, Samsung, Hynix and Toshiba on the challenges from and feasible solutions to migrating DRAM and NAND Flash to below 10nm.Since 2006, Macronix has presented its research papers every year at the VLSI Symposia. This year, the four Macronix papers to be presented during the event are: "A Highly Pitch Scalable 3D Vertical Gate (VG) NAND Flash Decoded by a Novel Self-Aligned Independently Controlled Double Gate (IDG) String Select Transistor (SSL)"; "Multi-Layer Sidewall WOx Resistive Memory Suitable for 3D ReRAM"; "A Novel Cross Point One-Resistor (0T1R) Conductive Bridge Random Access Memory (CBRAM) with Ultra Low Set/Reset Operation Current" and "A Simple New Write Scheme for Low Latency Operation of Phase Change Memory."The VLSI Symposia is seen as a window on the latest IC technology processes, and is closely related to the IC industry's future development. More than 600 papers were submitted to the VLSI Symposia this year. Of the 209 papers submitted for VLSI Technology, 79 papers have been selected for presentation, and eight of them come from Taiwan – four from Macronix, two from TSMC, one from National Chiao Tung University and one from National Nano Device Laboratories. As for VLSI Circuits, 97 papers have been selected from more than 400 submitted. Among the 15 papers selected from Taiwan, four are from MediaTek, two from TSMC, four from National Taiwan University, three from National Chiao Tung University, and two from National Tsing Hua University.Macronix has been outstanding in participating in important international academic symposia. For the annual IEDM (IEEE International Electron Devices Meeting) over the past five years, Macronix has presented five papers each year on average. In 2011, Macronix presented the most papers of all Taiwan firms. Macronix's fruitful R&D results on advanced memory products have won wide recognitions internationally. Therefore some members of Macronix's R&D team have been invited to join IEDM committees for screening papers. This year, Macronix's R&D staff was invited to serve as the committee member for the VLSI Symposia.Media Contact: Michelle ChangDeputy DirectorCorporate Communication OfficeTEL: 886-3-578-6688 ext. 71233Email: michellechang@mxic.com.twMobile: 0933-310-870
Lintes Technology Co. is pleased to announce new lower cost Thunderbolt cables today. As a dedicated supplier and manufacturer of Thunderbolt cables and connectors, Lintes has demonstrated its commitment to the technology by continuous working on reducing cost of Thunderbolt cable product. Although a great part of cost of Thunderbolt cable is in chipsets and components, Lintes is still trying to reduce cost as much as possible by yield rate improvement and efficient production. By replacing some key components with next generation products, Lintes' new Thunderbolt cables will enable lower prices to IT and consumer electronics industry.Developed by Intel, and brought to market with technical collaboration from Apple, Thunderbolt technology is a new, high-speed I/O technology designed for performance, simplicity, and flexibility. The technology enables data transfer at speeds and volume that few consumers have ever seen before. However, after the newest ultrabook with Thunderbolt port start shipment, peripheral-connection devices that take advantage of the new feature are making their way to consumers quite slowly. One of the reason that slow down the market acceptance is the price of Thunderbolt cable. One Thunderbolt cable can combine the work that has been done by multiple cables, daisy-chaining an array of devices. The technology combines data, video, and audio that allows for a single, high-speed connection of peripherals such as hard drives, RAID arrays, video-capture solutions, and network interfaces—providing up to 10Gbps of data throughput. That requires the insides of a Thunderbolt cable to be considerably more complicated than say, a simple typical USB cable. Which, in turn, made development and shipping of new Thunderbolt devices a slower, more painstaking process. But the combination of Apple and Intel is formidable and making it too important to ignore. As the technology becomes cheaper, Thunderbolt will find mass-consumer uses. By the time that happens, strong market demand will drive lower costs of key components inside Thunderbolt cables and make the cable price cheaper.In order to speed up Thunderbolt technology market growth, we understand that reliable and low-cost Thunderbolt cable product is an important factor. While we put efforts to reduce cable cost, we are also expecting more applications and vendors joining the market. When the demand grows, the key components of Thunderbolt cables can be cheaper due to quantity increasing. Although it may not be as cheap as USB cable, Lintes' goal is to reach the price that consumers are willing to pay for better performance sometime next year.
