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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Friday 24 July 2026
Corning Scores Key ITC Win in Display Glass IP Defense Against Irico
Corning's long-running intellectual property (IP) dispute with China-based IRICO has entered a new phase after the U.S. International Trade Commission (ITC) issued what Corning views as a fair and critical Initial Determination in the company's trade secret case.
Friday 24 July 2026
TEEMA unveils three-part plan for Mexico technology park to help small exporters expand
Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) on July 21 held an investment briefing in Taiwan on its Mexico science park plan, bringing together representatives from Mexico and Sonora state as it advanced a project aimed at helping Taiwanese small- and medium-sized enterprises expand overseas...
Tuesday 21 July 2026
Driving Global Intelligence: Best AI Awards 2026 Wraps Up
The Ministry of Economic Affairs officialized the successful conclusion of the second annual Best AI Awards, held at the Taipei Nangang Exhibition Center Hall 2...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Japan bets on physical AI as Murata, AWS, Hitachi showcase self-learning robots at CEATEC 2026
Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
Analysis: Intel CEO Lip-Bu Tan's power of humility — how one phone call helped reshape the chip giant's comeback
China's 90%-localized EUV light source debuts at 15W, exposing the gap to commercial chipmaking
Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking
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