As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

VIA Labs, Inc. (VLI), a leading supplier of USB4, DisplayPort, SuperSpeed USB, and USB Power Delivery Controllers, today announced the launch of its first MST Hub VL610 at Computex 2026. Following the market success of the VL605 USB-C to HDMI 2.1 signal converter, VL610 is a new-generation chipset designed to address the growing demand for multi-display expansion. Supporting up to three high-resolution displays simultaneously, it sets a new benchmark for USB-C docking solutions. Attendees can learn more about VLI's products during Computex 2026 at Booth N0614 in Hall 1, Taipei Nangang Exhibition Center.The VIA Labs VL610 is a highly integrated DP 2.1 HBR3 Multi-Stream Transport (MST) hub designed for USB-C docking stations and high-end video adapter applications. Compared to its predecessor VL605, which supports a single HDMI 2.1 output, VL610 significantly enhances display performance. VL610 series includes two SKUs: VL610 supports three video outputs, while VL610D supports two video outputs, addressing different docking design needs. Its flexible architecture includes one fixed HDMI 2.1 FRL transmitter, one configurable port supporting DP++ or HDMI 2.1 FRL, and a third configurable port supporting DP++ or HDMI TMDS (VL610 only). VL610 supports a single display up to 8K60Hz or 4K240Hz, and up to three displays at 4K60Hz or QHD144Hz. It also enables up to six independent audio and video streams, with a single DP output supporting up to four MST streams. Full support for color formats and audio ensures a high-quality multimedia experience.In terms of advanced display technologies, VL610 integrates a DSC 1.2a decoder, supporting decompression to HDMI output or direct pass-through to compatible displays. It also supports cross-platform Variable Refresh Rate (VRR), delivering smooth visuals for high-end gaming and professional imaging applications. VL610 also integrates ECDSA-256 asymmetric authentication, enabling secure firmware updates and protection against malicious firmware attacks.VL610 also features a unique Logo Bitmap display capability with event-triggered graphics. It can display brand logos, warning messages, or guidance screens in scenarios such as host disconnection, USB-C port anomalies, or link errors, helping users quickly identify and resolve issues. This feature enables brands to proactively communicate with users during idle or fault conditions, enhancing both brand visibility and user experience."VL610 represents a key milestone in VLI's multi-display signal conversion technology. Evolving from the single HDMI 2.1 output of VL605 to the triple-stream architecture of VL610, we have translated customer needs into product innovation. VL610 is positioned to become the core chipset for next-generation high-end USB-C docking stations, further strengthening VLI's leadership in USB-C display interface solutions.", said Wayne Chang, Director of PM at VIA Labs.

With demand for AI edge computing continuing to grow, Retronix announced that its Sparrow Hawk AI edge computing platform has officially entered mass production and is now available to the global market. The platform is powered by the automotive-grade SoC R-Car V4H from Renesas Electronics, delivering up to 30 TOPS (Dense) AI inference performance. Sparrow Hawk is designed to support a wide range of edge AI applications, including robotics, smart manufacturing, and other intelligent edge systems.According to Retronix, Sparrow Hawk integrates high-performance AI computing capabilities with a comprehensive I/O expansion architecture, enabling diverse edge computing scenarios such as computer vision, industrial automation control, and smart device development. The platform provides a wide range of interfaces including PCIe, USB 3.0, DisplayPort, CAN-FD, AVB Ethernet, and MIPI CSI/DSI. It also features an expansion connector compatible with industry-standard accessories, allowing developers to flexibly integrate peripheral modules and accelerate AI application development and deployment."We are pleased to see the global launch of Retronix's Sparrow Hawk Edge AI Computing Platform, powered by the automotive-grade R-Car V4H SoC," said Aish Dubey, Vice President and Head of the SoC Division at Renesas Electronics. "We value our collaboration with Retronix and look forward to continuing our work together to bring more innovation to the edge AI ecosystem."Regarding product compliance, Sparrow Hawk has obtained several international certifications, including FCC, CE, UKCA, and VCCI. These certifications indicate that the product meets international standards for electromagnetic compatibility (EMC), safety regulations, and other regulatory requirements, enabling Sparrow Hawk to be legally marketed and deployed in major regions including the United States, the European Union, the United Kingdom, and Japan.Sparrow Hawk was developed with an Upstream First software strategy that helps reduce entry barriers for developers. To meet diverse application needs, it fully supports two major software distributions. The Debian BSP is primarily aimed at industrial applications, providing a familiar software installation experience, while the Yocto BSP continues the high performance and reliability DNA of the R-Car series in the automotive field. Developers can access source code, Startup Guides, and detailed technical tutorials directly through the R-Car Open Source Community GitHub page. The community has established FAQ and Q&A forums, allowing global developers to communicate with experts in real-time and accelerate the transition from prototype to production.For hardware configuration, Sparrow Hawk is available in 8GB and 16GB LPDDR5 memory versions. The Basic Kit includes the Sparrow Hawk SBC, while the Complete Kit adds a 32GB microSD card, a fan HAT and a debug serial cable for a ready-to-use development setup.The Sparrow Hawk single-board computer and development kits are now officially available through Shimafuji Electric, with broader availability planned through major electronic component distributors such as Mouser Electronics and Digi-Key Electronics. Retronix Technology will work closely with Renesas Electronics to provide comprehensive technical support for developers and customers worldwide.For more technical details, please visit: Retronix Official Website.

ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting the growing role of quality in scaling AI hardware.As demand for AI infrastructure accelerates, quality is shifting from a manufacturing support function to a direct driver of performance, yield and delivery readiness. While public attention often centers on AI models, ZEISS says reliable hardware execution is becoming a decisive factor in AI deployment.Behind every AI interaction are massive data centers powered by thousands of GPUs. As systems scale from chip to rack, defects in semiconductor packaging, printed circuit boards (PCB/A), cooling systems and high-speed interconnects can affect uptime, deployment speed and total cost."With compute demand surging, manufacturers face record orders, but the challenge is delivering at scale with consistent quality," said Clive Yen, Global Head of Electronics Customer Segment, ZEISS Industrial Quality Solutions. "As systems grow more complex, quality becomes critical to reliable deployment. This is why we work across Taiwan's ODM ecosystem and the full AI server value chain to enable consistent, scalable quality.""At scale, even small defects can become major bottlenecks," said Tonmoy Kundu, Global Head of Sales, ZEISS Research Microscopy Solutions. "Manufacturers need faster insight, tighter process control and trusted failure analysis to accelerate next-generation AI hardware."ZEISS says it offers one of the industry's most comprehensive quality portfolios across the AI hardware value chain, supporting customers from semiconductor packaging and PCB inspection to liquid cooling, optical connectivity and final rack integration.At the forum, ZEISS will showcase solutions for advanced high-bandwidth memory (HBM), where rising stack heights and shrinking interconnect dimensions require high-resolution, non-destructive inspection and deep defect analysis.The company will also present metrology solutions for co-packaged optics (CPO), where ultra-tight tolerances for FAU and MPO connectors are essential to maintain alignment, coupling efficiency and long-term transmission reliability in 51.2T+ networks.At the exhibition hall (Booth J1109 | TaiNEX Hall 1, Taipei), ZEISS will showcase technologies spanning wafer process control, advanced packaging, X-ray inspection, electron microscopy, light and digital microscopy, and coordinate measuring machines. Applications will focus on chip manufacturing, PCB reliability, thermal management systems, connector quality and L10-L11 rack mechanical parts assembly.COMPUTEX 2026 runs June 2-5 in Taipei, where ZEISS will position quality as a foundational enabler of the next wave of AI growth. ZEISS will speak at the official COMPUTEX 2026 Forum on June 4, 4:30 p.m. to 4:55 p.m. at TaiNEX 2, Room 701, presenting "Quality Innovation Across the AI Chip-to-Rack Stack." The session will feature Tonmoy Kundu and Clive Yen.