DATOTEK INTERNATIONAL CO., LTD., a Taiwan-based memory and storage manufacturer, showcased its latest AI-powered sustainable storage solutions and AI infrastructure technologies at COMPUTEX 2026 in Taipei under the exhibition theme "AI Together." The company presented a comprehensive portfolio of AI storage, edge AI computing, PCIe Gen5 SSD thermal management, USB4 portable SSDs, and next-generation memory products designed for both enterprise and consumer markets

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

The "Mini SSD Strategic Seminar" convened recently to strengthen collaboration and accelerate ecosystem development following the successful "Mini SSD Ecosystem Application Seminar" held in Shenzhen on January 26.Leading companies across the industry chain, including Intel, BIWIN, Longcheer, BYD Electronics, Luxshare, Emdoor, Weibu, JWIPC, CYX Industrial, MINISFORUM, Decenta, and SIXUNITED, reached a strategic consensus to jointly build the Mini SSD industry ecosystem, marking a significant step toward large-scale adoption of this emerging storage form factor.As the first batch of core builders of the Mini SSD ecosystem, the initial partners will gain early access to patent licensing benefits, as well as the synergies created through ecosystem collaboration. This milestone signals that Mini SSD is evolving from a standalone product innovation into a collaborative, win-win industry ecosystem.Global Recognition: International Awards Validate Mini SSD's Innovation and Commercial PotentialSince its market debut, Mini SSD has rapidly gained recognition on the global stage, earning multiple prestigious international awards that highlight its technological innovation, design excellence, and industry impact.International Awards Validate Mini SSD's Innovation and Commercial Potential. Credit:BIWINTIME Best Inventions of 2025Founded in 1923, TIME Magazine is one of the world's most respected media institutions. Its annual Best Inventions list is widely regarded as a global benchmark for breakthrough innovation. Selected from thousands of nominations worldwide by TIME's editorial experts, the award recognizes inventions that demonstrate outstanding innovation, practical value, influence, and future potential.Edison Awards (Finalist)Named after legendary inventor Thomas Edison, the Edison Awards are often referred to as the "Oscars of Innovation." Judged by more than 3,000 global academics, industry leaders, and technology experts, the awards evaluate candidates across four dimensions: concept, value, impact, and achievement. Mini SSD's recognition as a finalist highlights its world-class standing in technology innovation, market potential, and societal impact.CES TWICE Picks AwardsAt CES 2026, widely known as the world's premier technology showcase, Mini SSD stood out among over 4,000 exhibitors and tens of thousands of products to win the TWICE Picks Awards, presented by leading U.S. consumer electronics publication TWICE. The award honors products demonstrating breakthrough innovation, exceptional quality, and strong market potential, and is widely regarded as a mark of excellence in consumer technology.Embedded World "Best-in-Show"The Best-in-Show Award at Embedded World is one of the most respected honors in the embedded systems industry. Evaluated by professional engineers and industry experts, the award recognizes products that excel in performance, reliability, and real-world application value. The recognition underscores Mini SSD's strong potential across embedded and edge computing environments.MWC "Best in Show"At MWC 2026, Mini SSD also received the "Best in Show Award", jointly selected by leading global technology media including TechRadar, Tom's Guide, Android Central, and T3. The recognition highlights Mini SSD's achievements in technological innovation and user experience, further reinforcing its global industry recognition.Mini SSD Receives Multiple Global Industry Awards. Credit:BIWINToday, Mini SSD has rapidly progressed into commercial deployment, gaining adoption among leading device brands. OneXPlayer, GPD, and Waterworld have already integrated Mini SSD into flagship devices including handheld gaming consoles, AI PCs, and smart albums. Early partners report that the adoption of Mini SSD has enhanced user experience while driving measurable market growth and positive brand perception.From global awards to real-world product adoption, Mini SSD is steadily advancing from technology validation to commercial success.Industry Collaboration: Partners Outline the Future of the Mini SSD EcosystemDuring the seminar, industry participants engaged in in-depth discussions around standardization, ecosystem governance, and application deployment, jointly outlining the strategic roadmap for the Mini SSD ecosystem.Industry Collaboration: Partners Outline the Future of the Mini SSD Ecosystem. Credit:BIWINShared Value and Ecosystem GovernanceParticipants agreed on the need to establish a shared-benefit mechanism to accelerate ecosystem development. Plans include forming a dedicated IP management company and governance framework, with clear policies for incentive structures, licensing models, and revenue distribution, ensuring that ecosystem partners share both the value and growth opportunities generated by the technologyDesign-In and Technical CollaborationLeading partners including Longcheer, Emdoor, MINISFORUM, and GMKtec announced plans to initiate design-in programs for upcoming flagship products such as ultra-thin laptops and Mini PCs. Through joint development, design validation, and system optimization, the industry aims to establish a collaborative innovation model across the entire supply chain.Market Expansion and Application StrategyThe seminar also outlined a value-driven market strategy. For PC platforms, participants discussed the possibility of pre-loading popular games and AI models on Mini SSD, creating new value-added distribution channels that enable hardware vendors to unlock additional revenue opportunities.Moving forward, ecosystem partners will work together to accelerate Mini SSD adoption across handheld gaming devices, AI PCs, robotics platforms, and other emerging edge-AI applications.Enabling Edge AI: Mini SSD Unlocks New Possibilities for Next-Generation DevicesWith its ultra-compact footprint (approximately half the size of a coin), PCIe Gen4 flagship-level performance, LGA packaging for enhanced shock resistance, and SIM-card-style expandability, Mini SSD provides a flexible, high-performance storage solution for next-generation intelligent devices.IMini SSD Unlocks New Possibilities for Next-Generation Devices. Credit:BIWINUltra-Thin LaptopsWeighing just 1 gram and offering 40% smaller volume compared with traditional M.2 2230 SSDs, Mini SSD frees valuable internal space within ultra-thin devices, enabling manufacturers to integrate additional components. Its user-replaceable expansion design also allows users to scale storage capacity as AI PCs increasingly require large datasets for local AI model deployment.Intelligent RoboticsFor robotics operating in high-vibration and complex environments, Mini SSD delivers high-speed read/write performance and strong shock resistance, ensuring stable access to vision and environmental data. Its modular architecture enables flexible storage expansion across the robot’s lifecycle, supporting continuous data accumulation for lifelong learning and system evolution.DronesMini SSD’s shock resistance and wide temperature tolerance ensure reliable performance during high-speed flight, rapid maneuvering, and extreme temperature variations. With capacities up to 2TB, it supports stable recording of 4K and 8K aerial video, providing creators with greater storage capacity for professional content capture.Handheld Gaming DevicesIn high-performance handheld gaming consoles from brands such as GPD and OneXPlayer, Mini SSD delivers console-class loading speeds within a footprint only slightly larger than a TF card. With random read performance up to 850K IOPS, it enables near-instant loading for large 3D games, while meeting the strict space constraints of compact gaming devices.Building the Mini SSD Ecosystem Together for the FutureThe Mini SSD Strategic Seminar marked the formal establishment of the Mini SSD ecosystem on the basis of in-depth technical exchange. With a clear roadmap spanning shared-value mechanisms, unified standards, and Design-in collaboration, industry partners are now aligned around accelerating large-scale adoption.Backed by Shenzhen's market accumulation and fast response of the industry chain, BIWIN will continue working closely with ecosystem partners to develop technical standards, expand application scenarios, and build a thriving Mini SSD industry platform.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing.SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology - the core infrastructure of the AI era.Under the theme 'Spotlight on AI Memory,' SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.The NVIDIA Collaboration Zone, located at the entrance, is the centerpiece of the exhibition, highlighting the synergy between SK hynix and NVIDIA. The company will display the memory configuration mounted on GPU-based AI accelerators through physical models and actual hardware, focusing on the actual application of SK hynix's memory products such as HBM4, HBM3E, and SOCAMM2 designed for NVIDIA AI platforms.Notably, the company will showcase a liquid-cooled eSSD developed in collaboration with NVIDIA, along with an NVIDIA DGX Spark, desktop AI supercomputer equipped with SK hynix's LPDDR5X.In the Product Portfolio Zone, visitors can view a comprehensive lineup of memory products engineered for the AI era. This includes the infrastructure-essential HBM4 and HBM3E, as well as high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and Automotive Solutions.An interactive environment allows visitors to use joysticks to select products and view specific features and use cases on-screen, enabling them to explore and understand the technology at their own pace.The Event Zone offers a hands-on experience with an 'HBM 16-High Stacking Game.' By virtually stacking memory chips, participants can gain insight into the TSV (Through Silicon Via) process and high-stack packaging technology, fostering a deeper understanding of how high-performance AI semiconductors are manufactured.Throughout GTC 2026, SK hynix plans to explore future collaboration strategies aligned with current global AI trends. Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, will meet with global tech giants to share insights on AI evolution and infrastructure shifts while discussing long-term strategic partnerships.The company will also host technical sessions to discuss the future of AI-driven manufacturing and the pivotal role of memory technology in achieving high-performance AI.SK hynix highlighted that as AI technology evolves, memory is transcending its role as a mere component to become a core element that determines the architecture and performance of the entire AI infrastructure. By applying its memory expertise across the entire AI spectrum - from data centers to on-device applications - the company aims to shape the future of AI alongside its global partners.HBM-GPU model shows SK hynix and NVIDIA AI collaboration. Credit: SK hynixSOCAMM2 and HBM4 on NVIDIA Vera Rubin Superchip. Credit: SK hynix

As global AI computing platforms continue to evolve toward higher density, increased power demands, and rack-scale integration, Chenbro unveiled its latest AI server chassis solutions at NVIDIA GTC 2026. The showcase features the NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72 systems, along with a comprehensive product portfolio based on NVIDIA MGX architecture, demonstrating Chenbros integrated capabilities spanning system design, thermal optimization, and rack-level deployment.Building on its close integrations with the NVIDIA ecosystem, Chenbro presented multiple server chassis solutions designed in alignment with NVIDIA reference architectures and the NVIDIA MGX architecture. These solutions address high-density computing, liquid cooling technologies, and enterprise-grade deployment requirements, enabling cloud service providers(CSPs) and enterprise data centers to accelerate AI infrastructure deployment.NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72- A New Standard for High-Density AI ComputingAs next-generation AI training and inference workloads continue to scale rapidly, data centers face increasing demands for space efficiency and advanced thermal design. At NVIDIA GTC 2026, Chenbro highlights the NVIDIA MGX 1U Compute Tray for Vera Rubin NVL72, engineered with optimized mechanical design and airflow management to deliver high-density computing within a 1U footprint. The solution is tailored for large-scale model training and high-performance inference applications.Chenbro also showcases:NVIDIA MGX 1U for NVIDIA GB200 NVL4, supporting high-performance inference and flexible deployment.NVIDIA MGX 2U Vera Server Chassis, offering enhanced scalability and enterprise-level integration options.Together, these solutions demonstrate Chenbro's system integration expertise under the NVIDIA MGX architecture framework.NVIDIA MGX Rack- Advancing from System Integration to Rack-Scale DeploymentAs AI infrastructure expands from individual systems to rack-scale environments, Chenbro highlights its integration capabilities based on NVIDIA MGX architecture. The company leverages its strengths in mechanical design and mass production to support the deployment of high-density AI computing environments in modern data centers.By closely aligning with NVIDIA reference architectures and the broader NVIDIA MGX ecosystem, Chenbro enables customers to extend from system-level builds to rack-level integration, accelerating scalable AI infrastructure deployment.NVIDIA MGX 6U Liquid-Cooled Server Chassis- Liquid Cooling for High-Power AI PlatformsIn response to power consumption and energy efficiency requirements for AI platforms, Chenbro presents the NVIDIA MGX 6U Liquid-Cooled Server Chassis. Designed to support high-power liquid-cooled deployment architectures, the solution enhances thermal efficiency and improves data center power usage effectiveness (PUE) through optimized mechanical and fluid management design, ensuring stable operations for next-generation AI data centers.Additional showcased solutions include:NVIDIA MGX 4U Air-Cooled Server Chassis and NVIDIA MGX 2U Short-Depth Server Chassis.These offerings provide flexible deployment options for enterprise server rooms and diverse application scenarios.Strengthening Global Footprint and AI Infrastructure CapabilitiesChenbro CEO Corona Chen stated that as AI applications continue to expand, market demand for high-density computing, liquid cooling, and rack-scale integration capabilities is rapidly increasing. Chenbro will continue deepening its collaboration within the ecosystem, strengthening its integrated R&D and manufacturing capabilities to help customers accelerate the adoption of next-generation AI platforms.                                                      With its global manufacturing footprint and localized service capabilities, Chenbro is committed to supporting diverse deployment needs across AI, HPC, and data center applications—driving sustained operational growth and industry competitiveness.At GTC 2026, Chenbro not only presents its product portfolio but is supporting NVIDIA AI platforms from system integration and thermal optimization to rack-scale deployment, enabling scalable AI infrastructure development worldwide.Chenbro supports diverse AI, HPC, and data center deployment needs. Credit: Chenbro