中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Nvidia
Terafab
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
China’s IC designers expand AI interconnect efforts as Montage grows in DDR5 and TWSC targets CXL
Tomorrow's Headlines
2h 3min ago
Nvidia emerges as AI industry’s central bank amid cloud startup risks
Tomorrow's Headlines
2h 3min ago
Apple reportedly plans high-end HomeView with robotic arm
Tomorrow's Headlines
2h 3min ago
Rising memory costs push smartphone makers from LTPO to LTPS panels
Tomorrow's Headlines
2h 3min ago
Qiyi Technology’s Arizona fab projects drive order backlog to NT$4.476 billion
Tomorrow's Headlines
2h 3min ago
Home
Biz Focus
COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Thursday 6 August 2026
Traditional Chinese Medicine in the Era of Digital Health and Preventive Healthcare
As global healthcare systems evolve, preventive medicine and digital health technologies are becoming key drivers of medical innovation. Aging populations, rising healthcare costs, and increasing chronic diseases are accelerating the transition from treatment-oriented care toward preventive, personalized, and data-driven health management.
Tuesday 4 August 2026
SK hynix Unveils First HBF Standard Specifications with Sandisk
SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth Flash (HBF), a next-generation storage technology.
Friday 31 July 2026
Montage Announces Industry-First Trial Production of CXL 3.2 MXC
Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data center environments...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Toppan, Keio University validate quantum AI image generation
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions
AI infrastructure faces four hurdles: Power, construction, technology, funding
Full list
×
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first