At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Linxens, a global leader in component-based solutions for authentication and traceability, and Dracula Technologies, a pioneer in ambient light energy harvesting, have announced a strategic collaboration to develop next-generation autonomous IoT solutions for traceability and smart labelling applications. This collaboration paves the way for smarter and more sustainable connected devices

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As digitalization penetrates every industry-whether in cloud computing, telecommunications infrastructure, automotive electronics, or IoT devices-the security of hardware platforms is no longer an isolated concern of a single sector, but a common challenge faced by all critical infrastructures. In the past, the focus of cybersecurity was largely placed on software.However, as attack methods continue to evolve-from supply chain infiltration and firmware tampering to chip-level exploits-the security and resilience of hardware have come to be recognized as a fundamental cornerstone of modern security architectures. At the heart of this shift, Secure Flash Memory is increasingly emerging as the critical enabler across diverse application domains.Evolution of International Standards: Hardware and Firmware Security FrameworksIn recent years, international standards and certification frameworks for hardware and firmware security have gradually formed a tightly interwoven network. Among them, the NIST SP 800-193 Platform Firmware Resiliency (PFR) Guidelines established by the U.S. National Institute of Standards and Technology clearly define three core capabilities: detection, protection, and recovery.These requirements mandate that platforms be capable of identifying anomalies, blocking unauthorized updates, and securely restoring firmware when necessary. Initially widely adopted in servers and networking equipment, SP 800-193 is now regarded as a cornerstone for defending against firmware-level attacks.However, relying on a single framework alone is insufficient to address the diversity of application scenarios. To provide a more flexible and scalable approach that covers varying product types and market demands, the Security Evaluation Standard for IoT Platforms (SESIP) was introduced. Designed specifically for IoT and embedded platforms, SESIP emphasizes a modular approach to security evaluation.By decomposing security functionalities into reusable security claims, SESIP not only improves certification efficiency but also allows manufacturers to reuse existing security assets across product lines, avoiding the need to start from scratch for each market-specific requirement. This flexibility has made SESIP a critical tool in today's rapidly expanding landscape of IoT and smart devices.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.The Convergence of Industry Standards: Common Criteria, FIPS 140-3, and ISO/SAE 21434At the same time, other international security frameworks continue to exert their influence. Common Criteria (ISO/IEC 15408) remains one of the most widely recognized global security evaluation systems, providing stringent assurances for smart cards and critical infrastructure devices. FIPS 140-3, mandated by the U.S. government, sets clear requirements for the security of cryptographic modules, covering encryption, key management, and physical protections, and has been broadly adopted in finance, government, and cloud services.Additionally, ISO/SAE 21434, originally designed for the automotive sector, introduces a risk-based approach to cybersecurity lifecycle management. While its initial focus was on automotive electronics, its methodology is increasingly being extended to other safety-critical domains, highlighting the growing convergence of cross-industry security standards.Though these standards originate from different perspectives, they share a common foundation: ensuring the establishment of a Root of Trust, safeguarding firmware and cryptographic keys against tampering, and enabling systems to recover quickly after an attack.This is precisely where secure flash memory demonstrates its value. The latest generation of secure flash memory devices typically integrate multiple security mechanisms, such as secure boot support, immutable key storage, hardware-based authentication, and cryptographic accelerators.These features allow secure flash memory not only to meet the firmware integrity requirements of NIST SP 800-193 but also to align with the cryptographic module protections defined in FIPS 140-3 and to complement the modular security claims of SESIP. In other words, secure flash memory is not just a solution for one certification, but rather a bridge across multiple international standards.Practical Applications: Secure Flash Memory in Different Industry SegmentsFor example, in the server domain, secure flash memory ensures that both BIOS and BMC firmware are verified during startup, blocking any unauthorized modifications in real time-a direct embodiment of PFR principles. In IoT devices, the same memory can be evaluated through SESIP, modularizing secure updates and key management, thereby enabling shared security foundations across different product lines.In financial services or cloud platforms, the built-in cryptographic engines of secure flash memory directly support the requirements of FIPS 140-3, providing a trusted environment for key storage. In automotive electronics, these memories can be incorporated into the threat modeling and risk management frameworks outlined in ISO/SAE 21434, supporting end-to-end lifecycle security management.Secure Flash Memory as the Engine of Cross-Industry Digital TrustIt can therefore be said that the role of secure flash memory has moved far beyond being a mere data storage component; it has become the tangible foundation of a system’s Root of Trust. It is the essential vehicle through which security standards are realized and the shared language that enables cross-industry collaboration. As industries worldwide continue to raise the bar for cybersecurity, the ability to effectively integrate and align with multiple international standards will determine whether products can successfully enter the market and earn end-user trust.Looking ahead, as supply chain security challenges intensify—from manufacturing to system integration to end applications—the demand for security will only continue to grow. With its unique ability to span across multiple standards, secure flash memory is poised to remain the cornerstone of digital trust in industry. It is not merely a technological option, but a strategic necessity for companies seeking to maintain competitiveness and compliance in the global marketplace.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading enterprises, technical experts and industry leaders across the memory sector to explore pathways for technological evolution and emerging opportunities driven by AI. Kevin Yoon, VP and CTO of Memory Division from Samsung Electronics, delivered a keynote titled "Architecting Al Advancement: The Future of Memory and Storage", unveiling a series of cutting-edge solutions and providing a glimpse into the challenges and innovation directions of memory technologies.Kevin Yoon, VP and CTO of Memory Division from Samsung Electronics. Credit:GMIFMemory is Embracing an Architecture Reconfiguration with the Advent of Agentic AI EraAccording to the address by Kevin Yoon, AI is evolving from Generative AI to Agentic AI and will progress toward Physical AI. The memory industry is now officially transitioning into the Agentic AI era. Characterized by independent inference and decision-making capabilities, the Agentic AI is demanded to maintain multiple states over time built on top of generative AI and invoke external tools without noticeable latency. This shift is fueling explosive growth in global data and computing workloads."The inference of Agentic AI requires longer periods to achieve optimal outcomes, resulting in surging needs of memory capacity," Kevin Yoon underlined, data centers are transitioning into data-intensive computing mode in a fast manner. Therefore, memory technologies goes beyond a backend underpinning to become the determinant of AI system efficiency and scalability. Legacy storage architectures are faced by exponential bandwidth demands, power consumption nearing physical limits, and increasing latency constraints, so the memory hierarchy must be restructured to meet the needs of next-generation intelligent infrastructure.Dual-Track Advances in Memory: Samsung Mass Produces GDDR7 and Leads the CXL EcosystemRegarding high-bandwidth needs of AI servers, Kevin Yoon announced its major breakthroughs. Its first-ever 24Gb GDDR7 in mass production establishes deep collaborations with leading GPU partners. Engineered with leading-edge process and optimized IC architecture, it delivers transfer rate up to 42.5Gbps, a 30% enhancement in energy efficiency compared to last-gen products, making it stand out in AI training and graphics rendering.Compute Express Link (CXL) stands as a promising solution to address the capacity limit of DRAM. Samsung, the first to debut CXL products, has already mass-produced CXL 2.0 products benefited by its technology and ecosystem development since 2021. Kevin Yoon noted that as the industry moves into the CXL 3.0 era, Samsung is developing devices that support real-time memory sharing across multiple servers. A CMM-D solution with CXL 3.1 and PCIe Gen 6.0 compatibility is scheduled for launch next year, with plans to add full-feature support such as near-memory processing to further improve flexibility and scalability in data centers.All-Around Innovation: Advancing Performance, Density and Thermal ManagementIn memory sector, Kevin Yoon introduced Samsung's technology layout and product roadmap in terms of three major indicators: high performance, high density and thermal control. On the performance front, Samsung is tackling the challenges posed by interface upgrades to PCIe through coordinated design across NAND and controllers and is planning to launch its PCIe Gen6 SSD PM1763 in early 2026. This brand-new versions is expected to offer doubled performance under the power consumption limit of 25W and a 1.6-fold energy efficiency improvement, making it ideally suited to GPU-intensive AI computing scenarios.With respect to high-density storage, Samsung is clearly ahead of the pack. It launched a 128TB U.2 SSD in 2025 and plans to roll out 1T-thickness EDSFF products between 2026 and 2027, pushing capacities to 256TB on Gen5 and 512TB on Gen6. These leaps are powered by Samsung's advanced 32-layer stacked packaging and the slim form factor of EDSFF, enabling higher density and better energy efficiency in limited space.To address the thermal challenges of high-performance storage, Kevin Yoon explained that Samsung is pivoting from traditional air cooling to direct liquid cooling technologies. By reducing the thickness of its E1.S 8TB SSDs from 15T to 9.5T and minimizing thermal resistance between cold plates and enclosures, this will ensure system stability under full-load conditions for next-generation storage products.New Product Category: Memory Class Storage Ushers in a Low-Latency EraTo support the rapid-access needs of AI inference on small data blocks, Samsung introduced a new category called Memory Class Storage (MCS), designed to close the performance gap between storage and compute. A key use case is GPU Initiated Direct Storage (GIDS), where data moves directly between storage and the GPU, dramatically cutting system latency.The company is now developing seventh-generation Z-NAND, the key medium behind MCS. Its third-generation product, tailored for GIDS, is expected to deliver throughput well above current industry benchmarks while maintaining ultra-high performance and peak energy efficiency. "Memory Class Storage will reset expectations for AI inference speed and underpin real-time intelligent applications," Kevin Yoon emphasized.In closing, Kevin Yoon stated that through full-stack innovation in memory and storage, Samsung not only aims to solve AI-era data management challenges but also unlock the full potential of AI technologies. Moving forward, Samsung will continue to push technical boundaries and work with global partners to build an open storage ecosystem and co-create an intelligent future empowered by AI.Honored for Excellence: Outstanding Storage Technology Leadership AwardThe GMIF2025 Innovation Summit, in addition to in-depth discussions of technological evolution and ecosystem collaboration in the AI era, also announced an award list that highlighted outstanding enterprises, innovative technologies, and exemplary solutions that have emerged in the storage field over the past year. As an industry leader, Samsung Semiconductor has continued to make major strides in both DRAM and NAND technologies and was honored with the "Outstanding Storage Technology Leadership Award."Samsung Semiconductor honored with Outstanding Storage Technology Leadership Award. Credit:GMIFThe judging committee noted that as AI fuels surging demand for high-bandwidth, energy-efficient storage, Samsung has moved fastest in bringing advanced technologies like HBM, DDR5, LPDDR5X and high-stack 3D NAND into large-scale production and real-world use. These innovations have helped accelerate large-model training, data-center upgrades and next-generation smart devices, giving global customers a much stronger technology backbone.The award also reflects Samsung Semiconductor's long-term investment in R&D and its role in continuously pushing the limits of storage performance and enabling digital transformation worldwide. The company reaffirmed that it will keep driving memory innovation, deliver cutting-edge solutions across the ecosystem and help advance AI adoption globally.GMIF2025 brought together top industry leaders and the keynote by Kevin Yoon offered a clear view of where storage technology is heading in the AI era. From agentic AI and breakthroughs in GDDR7 and CXL to progress in high-density storage and thermal design, Samsung is clearly at the forefront. Its introduction of Memory Class Storage adds an entirely new approach to AI inference. Moving forward, Samsung will continue working with partners around the world to unlock the next wave of storage possibilities and power an AI-driven intelligent future.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) was successfully concluded recently in Shenzhen. Under the theme "AI Applications, Innovation Empowered", the GMIF2025 of the year brought together leading representatives across the global memory industry chain to engage in in-depth discussions on compute-storage convergence, AI deployment, and ecosystem collaboration, exploring pathways for storage technology innovations and ecosystem development in the AI era.Wallace C. Kou, President and CEO of Silicon Motion. Credit:GMIFWallace C. Kou, President and CEO of Silicon Motion Technology Corporation, was invited to deliver a keynote speech titled "From Cloud to Edge: Silicon Motion's Controller Technologies Accelerate AI Application Innovation." Wallace offered an in-depth analysis of the transformation of storage architectures in the AI era and showcased Silicon Motion's latest breakthroughs and product roadmap in controllers under AI.In his keynote, Wallace highlighted that as AI shifts from training to inference, data volumes are surging from PB to ZB levels. Traditional storage architectures are increasingly inadequate for the stringent needs of AI, particularly in high throughput, low latency, and energy efficiency. AI applications are pushing the memory industry evolving from "tiered storage" to "compute-storage convergence" and even "in-memory computing", making storage no longer merely a "warehouse for data" but a critical part of the AI computing pipeline."The rapid development of AI has made storage an indispensable core element in the entire value chain," said Wallace, "From cloud data centers to edge devices, AI inference will become the dominant trend after 2026. With leading controller technologies, Silicon Motion is building a full-stack storage solution that spans cloud, edge, and endpoints."Data Centers: The PCIe Gen5 SSD controller SM8366 supports sequential read/write speeds of 14GB/s and 3.5M IOPS random reads/writes. Equipped with Silicon Motion's in-house LDPC error-correcting algorithm, it ensures high reliability for high-capacity QLC SSDs.Edge & AI PCs: The PCIe Gen5 SM2508 series is in mass production with over 50% global market share. It supports the SCA interface and low-power design, making it ideal for AI PCs, all-in-one systems, and edge servers.Automotive & Embedded: The Ferri-SSD, Ferri-UFS, and Ferri-eMMC product families are purpose-built for harsh operating environments. Certified to the AEC-Q100 standard, this product lineup features wide-temperature tolerance, high reliability, and superior data integrity to meet storage needs in autonomous driving systems.Ecosystem Synergy: A Call for Industry CollaborationWallace emphasized that the future of AI storage requires deeper industry collaboration and urged stakeholders across the value chain to join forces to address the potential storage chip shortages forecasted for 2026. He noted that demand will surge due to the rise of AI inference devices, the popularization of TB-level storage in smartphones, and explosive growth in IoT terminals, while production capacity remains insufficient.Despite global uncertainties tied to geopolitics and tariffs, the structural demand for storage driven by AI remains unchanged. Wallace predicted 2026 will mark an inflection point for AI inference and edge AI, and Silicon Motion is well-positioned to seize this new growth cycle."From GPU Direct Storage to DPU architectures, from cloud to edge, no single company can achieve product innovation alone," Wallace said. "Silicon Motion will continue deep collaboration with NVIDIA, cloud service providers, and OEM/ODM partners to jointly build a thriving AI storage ecosystem."Award Recognition: "Outstanding Controller Technology Innovation Award"At its booth, Silicon Motion also showcased its latest-generation products, including SM2508, SM2504XT, SM2708, SM2324, SM2264XT-AT, and SM2268XT2-AT, as well as cutting-edge technology platforms such as MonTitan, FDP (Flexible Data Placement), PerformaShape, Ferri-SSD, Ferri-UFS, and Ferri-eMMC. SMI highlighted the value these solutions deliver to downstream device development, technological innovation, and industry applications.At its booth, Silicon Motion also showcased its latest-generation products. Credit:GMIFIt's worth noting that GMIF2025 had recognized the outstanding enterprises, innovative technologies, state-of-the-art solutions in the storage and memory sector over the past year, and the award list was concurrently released.Silicon Motion received the "Outstanding Controller Technology Innovation Award" in recognition of its leadership and innovation in controller technologies.According to the judging panel, Silicon Motion has demonstrated forward-looking technical deployment by being among the first to launch high-performance PCIe Gen5 SSD controllers. The company has also achieved continuous breakthroughs in key areas such as low-power architecture, firmware algorithm optimization, and AI acceleration solutions, significantly enhancing the performance, efficiency, and reliability of memory products. Its innovative solutions are widely deployed in PCs, portable devices, and enterprise markets, providing strong technical support for global ecosystem partners.Silicon Motion stated that the award reflects high recognition of the company's long-term R&D commitment and innovation strength. Looking ahead, the company will continue to explore frontier technologies and expand the boundaries of storage with more advanced and reliable controller products to empower the digital era.SMI Honored with"Outstanding Controller Technology Innovation Award". Credit:GMIFFrom cloud to edge, AI is reshaping the value map of storage and memory and remodeling the innovation dimensions of controllers. The insights shared by Wallace at GMIF2025 were beyond a technological vision and more of an open invitation to industry co-creation. As the world races into the Zettabyte era, industry progress will be collective-or not at all.Silicon Motion's achievements are demonstrated through the extreme performance of PCIe Gen6, large-scale deployment of Gen5, and stringent automotive-grade reliability, proving that controllers can act as the "invisible engine" driving leaps in AI computing power. Being honored with the "Outstanding Controller Technology Innovation Award" makes that dedication visible to the industry and trusted by partners. The storage landscape in 2026 will be a battleground of demand and supply, but only synergy across chips, systems, cloud, edge, and devices can turn scarcity into shared opportunity.By refining controllers into the key that unlocks innovation and scale, performance and efficiency, present and future, Silicon Motion is ready for the next leap-together with its ecosystem partners-to open the next door of AI storage and memory, where every byte of throughput becomes a step forward for intelligent computing.