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REALTIME NEWS
Why are China EVs barriers on US market untouched during Trump-Xi talks
Tomorrow's Headlines
6h 1min ago
China car market weakens as Taiwanese suppliers brace for inventory clearance in 2H26
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TSMC reportedly evaluates Texas for a second US manufacturing hub
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Analysis: What are the risks facing China DRAM capacity amid a tightening market
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Mighty Hornet IV drone nears mass production as Taiwan and U.S. sites are readied
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Friday 26 June 2026
AI in Sync: Graser TECHTALKS 2026 Highlights Electronic Design Paradigm
The megatrend in electronic design today is end-to-end collaboration across ICs, packaging, PCBs, systems, data centers, and physical applications, with rapidly evolving artificial intelligence playing an increasingly critical role.
Thursday 25 June 2026
Suntek and Teledyne FLIR Lead Taiwan's Thermal Imaging Revolution
In the past, due to high equipment costs and bulky sizes, thermal imaging technology was predominantly confined to specialized fields such as security surveillance, firefighting and rescue, military defense, and high-end industrial inspection...
Wednesday 24 June 2026
Bridging potential: how AI training empowers international talents in Taiwan's semiconductor industry.
The integration of artificial intelligence into the semiconductor industry is no longer merely a competitive advantage - it has become a core driver of modern engineering.
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Musk's Memphis move puts xAI at the center of his empire
SK Hynix touts up to 5.15x inference gains with custom HBM
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
GlobalFoundries eyes GaN expansion to challenge TSMC in AI
AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform
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