DATOTEK INTERNATIONAL CO., LTD., a Taiwan-based memory and storage manufacturer, showcased its latest AI-powered sustainable storage solutions and AI infrastructure technologies at COMPUTEX 2026 in Taipei under the exhibition theme "AI Together." The company presented a comprehensive portfolio of AI storage, edge AI computing, PCIe Gen5 SSD thermal management, USB4 portable SSDs, and next-generation memory products designed for both enterprise and consumer markets

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Montreal-based AON3D is setting a new standard through its mastery of high-performance materials and precision 3D printing technology.Co-founded in 2015 by Andrew Walker, Randeep Singh, and Kevin Han - who started the company in his family's basement - AON3D has evolved into a global leader in high-performance additive manufacturing.With an eye on the Taiwan market at COMPUTEX 2026, Han and his team are ready to bridge the gap between complex aerospace technology and the agile SME ecosystem.The Materials Engineer's VisionKevin Han's journey began at McGill University with a background in materials engineering. After operating as a service bureau, Han recognized a gap in the market for machines capable of handling specialized materials. Through multiple product iterations, AON3D today offers it's Hylo High-Temperature 3D Printer, along with Basis, it's advanced physics simulation software for additive manufacturing. Hylo and Basis: AI-Infused and Physics-BasedAON3D's product suite offers an AI-infused manufacturing solution that reduces the trial and error usually experienced in additive manufacturing processes. "What we do is actually model out at the physics level what's going to happen as you run the print job," says Han. "Our technology creates a digital twin of the print, meaning we can use simulation to identify process irregularities that lead to hidden defects, instead of in post-production."Within the Basis platform, simulated data and real data are also compared to offer automatic optimizations. The Power of "Open Materials"AON3D's primary competitive advantage is its "Open Materials" philosophy. Unlike competitors that "lock" users into proprietary, expensive filament spools - much like the cartridges on a paper-based printer - AON3D's platform is supply-agnostic. "We support the full gamut of industrial polymers, but many customers are most interested by high-performance varieties like PEEK, PEKK, and PEI (Ultem)," Han explains. "This includes their carbon and glass-fibre variants, where strength and lightweighting benefits most appeal to demanding industries like aerospace and defense." From NASA to the Factory FloorAON3D's credentials extend to outer space. The company has worked with the Canadian Space Agency (CSA) to print components for the International Space Station, and their parts were aboard the Artemis 1 mission.Closer to home, AON3D's solutions are used by customers like Boeing, Lockheed Martin, Northrup Grumman, and more in aerospace, while also offering benefits to automotive, energy, and general manufacturing. One automotive customer saw full payback under 2 months for their first Hylo purchase, and is eagerly awaiting more. Leveraging Taiwan's EcosystemAt COMPUTEX 2026, AON3D aims to connect with Taiwan's semiconductor packaging and testing sectors. Beyond chips, they see massive potential in Taiwan's drone industry and medical prosthesis field. Hylo's ability to "light-weight" components makes it ideal for rapid drone iteration.  "We want to bring capabilities to a group that didn't have them before," Han concludes. AON3D isn't just selling a printer; they are offering a gateway to the next generation of industrial manufacturing.

Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly modular platform is a dedicated solution for Back End Process and Advanced Packaging Inspection, ranging from patterning to wafer saw, and is engineered to set new benchmarks in wafer inspection and micro-measurement metrology.The AI-powered Wafer Metrology and Inspection Platform, TR7950Q SII, is built on a high-stability granite platform and the system supports 6" to 12" wafers. The platform features robust Automated Visual Inspection (AVI) for high-speed detection of surface defects, including particles, scratches, chipping, contamination, and foreign materials.The optional Short-Wave Infrared (SWIR) module allows the system to penetrate silicon to detect hidden inner cracks and subsurface defects invisible to standard sensors. For high-detail requirements, the platform offers 0.5 µm or 1 µm high-resolution imaging via the 3D DFF (Depth from Focus) module.The TR7950Q SII provides high-precision metrology for wafer thickness, top-side warpage, and complex surface topography, alongside high-speed sensing for Through-Silicon Via (TSV) depth, trench dimensions, thin film, and Chiplet metrology. Please visit the link to learn more about the TR7950Q SII.Credit: TRI

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.