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Wednesday 17 December 2025
ASRock Industrial Presents Certified Edge Security and FDO Deployment at FIDO Taipei Seminar
Taipei, Taiwan (December 2, 2025) – ASRock Industrial made its mark at FIDO Taipei Seminar, presenting a keynote on Secure Device integration with FIDO Device Onboard (FDO) deployment technology, demonstrating how automated, trusted, and scalable onboarding is transforming industrial edge AI. As the first industrial computer company in Taiwan to achieve FIDO Device Onboard (FDO) certification, ASRock Industrial continues to raise the bar for industrial cybersecurity. Backed by IEC 62443-4-1 and IEC 62443-4-2 certifications, the company delivers a security architecture that spans from product design and manufacturing to deployment, building an unbroken chain of trust at every layer.With its newly introduced Ai FDO solution, ASRock Industrial empowers enterprises to automate device onboarding and configuration from factory to field, reducing risk, accelerating deployment, and enhancing operational resilience. By merging secure device, verifiable trust, and zero-touch deployment, the company continues to push the boundaries of what's possible at the industrial edge, anchored by its leading industrial cybersecurity platform and in collaboration with ecosystem partners, driving transformation across smart manufacturing, smart retail, smart cities, and other critical infrastructure industries.Security Engineered into Every Layer – Secure Device + FDO DeploymentBuilt on the foundation of the FDO trust chain, ASRock Industrial strengthens security across every layer – from secure device to secure deployment, establishing a comprehensive secure edge AI platform that sets a new industrial cybersecurity standard for critical infrastructure.Secure Device: ASRock Industrial's Secure Device architecture delivers multi-layered, industrial-grade protection built on a hardware-rooted and boot-time chain of trust. Leveraging TPM, Secure Boot, and other trusted technologies, it protects data from boot to runtime through defense-in-depth. The architecture reinforces virtualization and I/O isolation, strengthens memory and code safeguards during runtime, and incorporates accelerated cryptography to secure stored data.It also provides a verifiable security baseline for automated deployment and remote management. Fully aligned with the FDO onboarding stages (TO0, TO1, TO2), it verifies device identity, keys, and configuration integrity, reducing tampering risks and establishing trusted readiness for the intelligent edge.  Secure Deployment: Taking trust beyond the device, ASRock Industrial advances security by integrating its Secure Device design with FDO deployment through the Ai FDO solution, developed in accordance with the FIDO Alliance standard. Upon first boot, devices can automatically connect to designated servers to complete authentication, registration, and deployment - shortening time-to-deploy and minimizing manual intervention and human errors. Supporting bare-metal FDO onboarding, Ai FDO combines cryptographic validation and anti-tampering mechanisms to ensure consistent and scalable secure deployment across both cloud and private environments.Certified for Global Standards, Driving FDO Adoption Across the Industrial EdgeASRock Industrial’s secure hardware platform is certified under multiple international standards, including IEC 62443-4-1 (Secure Product Development Lifecycle Requirements) and IEC 62443-4-2 (Technical Security Requirements for IACS Components). Every stage - from design and development to testing - undergoes rigorous risk assessment and security validation to ensure compliance and resilience.As the first industrial computer company in Taiwan to achieve FDO certification, ASRock Industrial strengthens its leadership in trusted and verifiable edge AI platforms. Beyond product certifications, the company continues to enhance secure applications, supply chain transparency, and incident response capabilities - establishing multiple-layer defenses across device, deployment, and operations.At the FIDO Taipei Seminar, ASRock Industrial showcased its integrated Secure Device and FDO deployment solution that accelerates secure onboarding, reduces cyber risks, and ensures deployment consistency. James Lee, Chairman of ASRock Industrial, stated: "Industrial cybersecurity is the new baseline for intelligent edge computing. With field-proven expertise in secure edge AI, ASRock Industrial unifies secure device with FDO-driven deployment, aligned with international standards. Through zero-touch onboarding and a verifiable chain of trust, every device is protected from the first connection and runs reliably at scale - enabling enterprises to deploy faster, operate safely, and expand edge AI with confidence."For more information on ASRock Industrial's secure device and FDO deployment solutions, visit our Website or contact us via Product Inquiry.
Tuesday 16 December 2025
Japan's $65 Billion Bet: Inside the Government's Semiconductor Revival Plan
In 1988, Japanese firms controlled 51% of worldwide chip sales, dominating memory production and manufacturing equipment. Fast forward to 2019, and that share had steadily declined to 10%, a stunning reversal that left the country dependent on foreign suppliers for critical technology.Fusion Worldwide: Japan's $65 Billion Bet: Inside the Government's Semiconductor Revival Plan.Credit: Fusion WorldwideBut 2025 marks a turning point. Armed with unprecedented government investment and strategic partnerships with global tech giants, Japan is mounting an ambitious comeback that could reshape the semiconductor landscape.The Decline: What Happened to Japan's Chip Dominance?The 1986 U.S.-Japan Semiconductor Agreement created challenges. Under pressure from Washington, Tokyo agreed to minimum chip prices and doubled foreign market access from 10% to 20%. These concessions immediately eroded Japanese competitiveness, allowing American, South Korean, and Taiwanese companies to capture market share.Meanwhile, Japan's economy entered the "Lost Decades" after 1990. Corporate investment dried up just as the industry shifted toward a specialized "fabless" model, where design and manufacturing separated. While TSMC pioneered contract manufacturing in Taiwan and Samsung built massive fabs in South Korea, Japanese firms clung to outdated integrated models, trying to do everything in-house.By the 2000s, legendary Japanese chipmakers like NEC, Hitachi, and Toshiba had consolidated and exited.The $65 Billion Comeback StrategyJapan's revival plan centers on massive government intervention. Between 2021 and 2025, Tokyo has allocated approximately $65 billion in semiconductor subsidies, representing a larger share of GDP than America's CHIPS Act.This funding targets three strategic pillars:1. Attracting Foreign Fabs: TSMC's Kumamoto facility, which began operations in 2024, received $8 billion in Japanese subsidies. The plant produces 12-28nm chips for automotive and consumer electronics, with a second fab targeting advanced 6-7nm production by 2027.2. Building Domestic Champions: Rapidus Corporation, backed by Toyota, Sony, and SoftBank, represents Japan's boldest bet. Partnering with IBM, Rapidus aims to mass-produce cutting-edge 2nm chips by 2027 at its Hokkaido facility, a feat only TSMC and Samsung have achieved. The government has committed $12 billion to this project alone.3. Strengthening Equipment Makers: Tokyo Electron, the world's third-largest semiconductor equipment manufacturer, continues receiving R&D support to maintain Japan's edge in critical manufacturing tools.The strategy also includes workforce development, infrastructure upgrades in semiconductor hubs like Kyushu and Hokkaido, and participation in the "Chip 4" alliance with the U.S., South Korea, and Taiwan.Why This Matters GloballyJapan's semiconductor resurgence isn't just about national pride, it addresses critical vulnerabilities in the global supply chain.The 2020-2023 chip shortage exposed dangerous dependencies. When Taiwan made chips became scarce, Japanese automakers like Toyota lost production of 500,000 vehicles. With 75% of advanced chips manufactured in Taiwan, just 100 miles from mainland China, geopolitical tensions threaten the entire tech ecosystem.Japan's revival offers geographic diversification. Its partnerships with TSMC, IBM, and American firms like Micron (which received $3.6 billion for Hiroshima expansion) create alternative production nodes outside the Taiwan Strait flashpoint.Moreover, Japan retains formidable strengths. Companies like Sony control 50% of the global image sensor market, while Japanese firms dominate semiconductor materials—holding 88% of the coater/developer market and 53% of silicon wafers.The Road AheadJapan isn't just catching up, it's positioning for next-generation leadership. Rapidus's 2nm technology, if successful, will power AI computing and autonomous vehicles. TSMC's expanding Kumamoto operations are already attracting 44 supplier companies, creating a self-reinforcing ecosystem.The critical test comes in 2027, when Rapidus targets mass production. Success would prove Japan can compete at the cutting edge. Failure would raise questions about whether even $65 billion can overcome decades of decline.One thing is certain, Japan is back in the semiconductor race, and this time, it's playing for keeps.(Article Sponsored by Olivia Seohyun Ju, Vice President of Sales, Korea/Japan, Fusion Worldwide)
Tuesday 16 December 2025
Dimerco leverages Asia logistics expertise to navigate complex 2026 freight market
Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity.Air cargo shipment reflects growing Asia-to-US/EU demand.Credit: Dimerco"In 2026, the overall market outlook will be cautiously optimistic," said Catherine Chien, Chairwoman of Dimerco Express Group. "Ocean freight will not be driven by a sudden surge in demand, but rather by capacity imbalances and regional differences. At the same time, demand for high-tech, AI-related, and e-commerce shipments continues to drive growth in air freight from the Asia-Pacific region to North America and Europe. Our role is to integrate our ocean and air freight, contract logistics, and brokage and compliance resources to help customers build supply chains that are both secure and resilient."Freight market outlook: capacity is back, but complexity is higherOn the ocean side, new vessel deliveries and relatively stable bunker prices are being offset by structural bottlenecks. Major European hubs continue to face congestion, while Red Sea and Suez diversions still disrupt rotations and tie up ships and equipment.Regional tariff and carbon schemes are fragmenting cost structures. As a result, some Asia–Europe services have seen rates rebound from unsustainably low levels, even as several Transpacific lanes face softer demand and continued rate pressure. Global schedule reliability has recovered to around 65 percent but remains below pre-pandemic levels; for many shippers, booking at least three weeks in advance on key trades has become standard risk management. Overall, the 2026 ocean freight market is not defined by a demand boom, but by capacity often being in the wrong places and by strong regional differences.Airfreight tells a different story. Demand is driven by AI servers and semiconductor equipment, communications and electronic components, and resilient cross-border ecommerce. "Taiwan+, China+" manufacturing strategies are shifting production toward Southeast Asia and India, driving strong growth in air volumes from these origins-as well as from Taiwan-into North America and Europe. Following changes to US de minimis rules, some direct China–US e-commerce flows have decreased, but more cargo is now routed via alternative hubs and forward-stocking models, making trade lanes more diversified. Shippers that can flex between multiple lanes, multiple modes and multiple origin countries will be better positioned than those relying on a single country or mode.China+, Taiwan+ and tariffs: four logistics pain pointsManufacturers extending production from China into Southeast Asia, India or Mexico typically face four major challenges: Inadequate capacity at critical times, as port congestion, diversions and blank sailings reduce effective ocean supply even when the global fleet is large; Difficulty choosing a second warehouse or hub outside China that truly optimizes total landed cost-combining transport, duties, inventory and lead time with available government incentive schemes at each location; Limited knowledge of local regulations, customs requirements and tradecompliance rules; and Lack of practical experience managing complex factory relocations involving used machinery and oversized equipment.Dimerco's solutions: from capacity to complianceTo close capacity and lead-time gaps as more freight shifts from Southeast Asia to North America and Europe, Dimerco combines multi-modal options with consolidation through selected Asia gateways. This approach helps secure uplift for high-value cargo when local air capacity is tight, while preserving flexibility on routing and transit time.For manufacturers searching for a "second hub" outside China, Dimerco applies a structured assessment tool to compare locations across Southeast Asia. The analysis covers service levels, duties and taxes, regulatory and investment environment (including incentive schemes), transport infrastructure and labor. Using this framework, Dimerco has helped global customers select and launch warehouse hubs in markets such as Singapore, Malaysia, Thailand and Vietnam, enabling more flexible inventory deployment between China and secondary locations and giving shippers more routing options as conditions change.Dimerco also supports complex factory and line relocations. In one case, a data-center and IT equipment manufacturer planned to move a production site from Singapore to Malaysia in 48 weeks; Dimerco completed the relocation in just 36 weeks by coordinating government liaison, customs-compliance advisory for used machinery and heavy-lift transport using a combination of low-bed and open trucks.With more than 45 years of operational experience in Southeast Asia, Dimerco helps foreign manufacturers navigate customs and regulatory environments through FTZ and bonded warehouses across Mainland China, Hong Kong, Taiwan, India, Southeast Asia, Mexico and the US. Dimerco's Expand to India Advisory Service allows customers to implement phased "Test – Trade – Manufacture" models, utilize FTZ and bonded policies to optimize duties and inventory placement, and reduce compliance risks in multi-country, multi-node supply chains.Building for AI-driven growth in 2026Dimerco's differentiation is centered on three areas: deep Asia presence, with around 130 owned offices across the region; a focus on high-value, time-critical freight in sectors such as semiconductors, electronics and aerospace; and consistent systems and quality, enabled by a secure, cloud-based global operating platform that connects air, ocean, customs, warehousing and distribution services."For our customers, 2026 is not about whether they will grow, but about how to grow safely under new tariff, compliance and capacity constraints," added Catherine Chien."By combining flexible multi-modal options-such as switching from sea to air for urgent shipments, or from air to sea for cost-sensitive cargo with controlled lead times-with strategic charter flight services, deep Asia expertise, integrated warehousing solutions and strong compliance advisory, Dimerco is ready to help customers turn AI, Taiwan+, China+ from buzzwords into real, executable opportunities."Catherine Chien, Dimerco Chairwoman.Credit: Dimerco