中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Anthropic
Nvidia
SpaceX
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Qualcomm validates HBC memory architecture, targets AI250 samples in 1H27
Semiconductors
37min ago
EOI posts record nine-month results, readies Mexico plant for 4Q26 production
Electric Vehicles
46min ago
Home
Biz Focus
COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Tuesday 22 September 2026
Macronix Secure Memories Build Hardware Defenses for EU CRA
In the fiercely competitive European and other global markets, high-end applications such as automotive electronics, industrial control, networking equipment, and AI data centers face increasingly stringent requirements for supply chain transparency and device-identity recognition...
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
Monday 21 September 2026
GMIF 2026 Agenda Unveiled: Tech Giants on Lineup
On September 23, the 5th Global Memory Innovation Forum (GMIF2026) will convene at the Renaissance Shenzhen Bay Hotel...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
TSMC advances CoPoS packaging at Taoyuan Longtan site
Samsung HBM4E wins NVIDIA nod for AI accelerator push
US midterm elections shake-up leaves Samsung, SK Hynix facing AI data center risks, CHIPS Act opportunities
Nscale's US$35 billion IPO faces fresh uncertainty after Microsoft rejects Texas AI capacity expansion
Commentary: Marvell's Lumentum deal holds a lesson for smartphone makers on supply chain integration
TI targets next semiconductor supercycle as humanoid robots surge
Taiwan's server makers commit billions to Texas as new governor vows data center moratorium
Full list
×
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first