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Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
Tactile sensing is rapidly emerging as a critical foundation for next-generation applications across consumer electronics, robotics, automation, healthcare, manufacturing, and immersive technologies such as VR/AR and telepresence. According to Exactitude Consultancy and Global Market Insights, the global tactile sensing market is projected to surpass USD 30.7 billion by 2030 and approach USD 43.9 billion by 2032.Amid this rising wave of sensory innovation, an international team at National Chin-Yi University of Technology (NCUT) in Taichung is pushing the boundaries of how machines perceive the physical world. Their breakthrough project—AI driven TOUCH System – Digitizing Touch —earned the Gold Medal in the AI Application category at the 2025 Best AI Awards hosted by Taiwan's Ministry of Economic Affairs. Their goal is ambitious to digitize touch, and in doing so, teach machines how to "feel.""Our original mission was to help the visually impaired better perceive their surroundings," says Dr. Aaron Raymond See, founder of TOUCH Lab, project lead, and associate professor at NCUT, Department of Electronic Engineering. "Most assistive technologies focus on vision or hearing. We chose to help machines understand touch—the most intuitive yet and underutilized human sense in AI today."TOUCH Lab's journey began in 2021 with early prototypes of tactile teaching aids and haptic gloves. Over time, the team developed Omnisense, a visual-tactile sensing system that mimics the integrative capabilities of human skin. It simultaneously detects pressure, temperature, texture, and shape—unlike competing technologies such as GelSight, DIGIT or TacTip, which typically focus on isolated variables."Human skin doesn't separate functions," Dr. See explains. "We wanted our sensor to work the same way—fusing multiple tactile cues into one unified system, just like the way our fingertips perceive the world."Tactile sensing, Dr. See notes, fills critical gaps left by vision and audio-based systems. In precision manufacturing, for example, engineers still rely on touch to verify metal coatings or fabric softness. "You can't tell if a blade is sharp just by looking at it. You need to feel it. That's the kind of insight tactile data provides—and it's currently missing from most machine systems."The TOUCH system is already being evaluated for diverse applications, from robotic manipulators and automated quality control to medical rehabilitation and assistive devices for people with visual impairments. The team has also partnered with National Cheng Kung University Hospital for clinical testing of wearable medical devices."We're in active discussions with Siemens and other industrial partners," Raymond shares. "After multiple technical iterations and are now in the second phase of commercialization. We're also conducting durability testing under extreme conditions—high temperatures, oily surfaces, dusty environments—to prepare the system for deployment in heavy manufacturing."Looking ahead, Dr. See says the lab's short-term priority for 2025–2027 is to refine the sensor material, making it thinner and lighter for use in medical wearables, where comfort and responsiveness are paramount. The long-term goal for 2027–2030 is to miniaturize the entire sensing module for integration into robotic arms and end-effectors that perform high-precision tasks."Our ultimate goal is to make tactile sensing a standard feature in future machines," says Dr. See. "Just like cameras and accelerometers became essential in smartphones, touch sensors will be essential in robotics."For the team, the Best AI Award provided more than just funding and exposure—it validated a vision that was once considered niche. "It motivates our students, sustains our lab, and gives us the platform to go further, " Dr. See reflects. Winning the awardwas not just about showcasing innovation, it was a test of the team's resilience and synergy. Dr. See stated that, "he students faced enormous pressure during the competition, but that's exactly the kind of environment they’ll encounter in the real world. They didn't just refine the tech, they learned how to adapt quickly and collaborate under stress."With students and researchers from electronics, computer science, mechanical engineering, and design, the team's cross-disciplinary structure enabled rapid integration and validation. "We've been an international team from the start, with collaborators across the Philippines, Taiwan, Malaysia, and Germany" Dr. See says. "Beyond sensors, we're also exploring assistive technologies such as leg rehabilitation tools. Our ultimate goal is to bring tangible improvements to elderly care and rehabilitation."While today's AI is dominated by visual and auditory systems, Dr. See believes tactile intelligence remains a largely untapped blue ocean, with transformative potential.  "Touch is the most subtle, intuitive, and instinctive of all senses," he says. "If AI can capture and replicate that, it unlocks a new dimension of value."From simulating fabric textures in e-commerce to enabling remote medical diagnostics and high-precision industrial inspections, TOUCH Lab's sensor is moving beyond the lab and into  real-world use. "We don't want this to remain an academic prototype, our vision is for machines to feel—not just calculate. And that changes everything." Dr. See concludes. TOUCH Lab won the Gold Award and NT$1,000,000 in the International Group AI Applications Category at the 2025 Best AI Awards. Now it's your chance to shine—bring your innovation to the world and apply for the 2026 Best AI Awards! With global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000. The deadline is March 16, so don't miss out. For more details, join the online orientation on February 11 and sign up today.
Tuesday 3 February 2026
Asia FinTech Alliance (AFA) Announces Leadership Election Results
The Asia FinTech Alliance (AFA) recently announced the results of its latest leadership election, conducted in full accordance with the AFA Bylaws unanimously adopted by all members in 2025.All elected members of the Executive Committee received affirmative written consent from more than two-thirds (2/3) of AFA member associations, representing at least ten Asian economies, underscoring strong collective confidence in AFA's governance framework and leadership continuity.Election ResultsJaclyn Tsai (Taiwan) was re-elected as Chairwoman of AFA for a second term.Dongpyo Hong (Korea) and Wilson Beh (Malaysia) continue their roles as Vice Chairpersons, having been elected in November 2025.Takafumi Ochiai (Japan) was elected as Treasurer, a newly established Executive Committee position that marks a key milestone in strengthening AFA's financial oversight and institutional maturity.Winston Hsiao (Taiwan) was re-elected as Secretary, ensuring continuity in AFA’s operational coordination and internal governance.Under the renewed leadership structure, the two Vice Chairpersons will jointly oversee eight Working Groups, including Bylaws, Anti-Fraud, Academy, Affiliate Members, Women in FinTech, Website, and Webinars, to drive focused execution across policy, industry development, inclusion, and knowledge exchange.Leadership Voices"I am deeply honored by the trust our members have placed in this leadership team," said Jaclyn Tsai, Chairwoman of AFA. "AFA is not just a platform - it is a network of trust. The more trust we build across borders, the more collective power we have to shape Asia's fintech future."Dongpyo Hong, Vice Chairperson, noted: "Strong governance is the foundation of meaningful regional collaboration. With clearer roles and active working groups, AFA is well positioned to move from dialogue to coordinated action."Wilson Beh, Vice Chairperson, added: "AFA's strength lies in its diversity - across markets, regulatory environments, and stages of development. This allows us to co-create solutions that truly work for Asia."Takafumi Ochiai, Treasurer, commented: "The creation of the Treasurer role reflects AFA's evolution into a more accountable and sustainable regional organization, reinforcing member trust through sound financial governance. As a member of the Executive Committee, I also look forward to contributing to AFA's broader initiatives across the region."Winston Hsiao, Secretary of AFA, emphasized execution and continuity: "Good governance is not only about structure, but about consistent implementation. As Secretary, I look forward to supporting the Executive Committee and Working Groups in translating AFA’s shared vision into concrete outcomes for our members."A Shared Vision for AsiaGuided by the principle of an alliance of associations, AFA brings together one leading fintech association from each participating economy. The Alliance currently comprises 15 member associations, representing Taiwan, Korea, Japan, Singapore, Malaysia, Hong Kong, the Philippines, Indonesia, Thailand, Mongolia, Cambodia, Vietnam, India, Nepal, and Sri Lanka.With its renewed mandate, AFA will continue to strengthen cross-border trust, regulatory dialogue, and industry collaboration, transforming diversity into collective strength and governance into long-term regional impact.AFA — We Build Trust Together, Shape Asia's Future Together.
Monday 2 February 2026
Smiths Interconnect to Showcase Next-Generation Test Solutions at DesignCon 2026
DesignCon, the United States' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26, 2026. For over three decades, this flagship Silicon Valley event has served as the essential forum for industry professionals to discover innovative solutions to the most pressing signal and power integrity challenges.As a global leader in semiconductor test sockets, Smiths Interconnect is proud to announce its participation in this prestigious conference and exhibition. We will feature a comprehensive portfolio of our star test products, highlighting solutions engineered for the next generation of technology in AI PCs, Enterprise Data Centres (EDC), automotive electronics, and the Internet of Things (IoT).Spotlight on Innovation: DaVinci Gen V High-Speed Test SocketHeadlining the display will be the DaVinci Gen V High-Speed Test Socket, Smiths Interconnect's latest flagship product. Designed to meet the extreme demands of high-performance computing and AI data centres, the DaVinci Gen V test socket delivers breakthrough high-speed signal transmission and performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications. These speeds are crucial for supporting the growing demand for massive data transfer.The solution supports BGA, LGA, and other package variants, using spring probe technology with a homogeneous alloy and gold plating to ensure better grounding. It delivers RF bandwidth greater than 84 GHz at -1 dB insertion loss, with a short signal path and a 4.90 mm test height. The impedance is tuned to match the system, providing consistent and stable contact resistance of 55 mΩ on average.The design also accommodates high co-planarity and features a tri-temp socket structure capable of operating from -55 °C to +150 °C. The same socket is suitable for manual test, bench test, and high-volume manufacturing (HVM) production test, enabling greater efficiency and consistency across test stages.In addition to high-speed test solutions, Smiths Interconnect will also showcase its high-power burn-in socket, a specialised electromechanical interface designed to temporarily connect a semiconductor device—such as a CPU, GPU, AI accelerator, or high-power discrete component—to a test board during the burn-in and stress-testing phase of manufacturing.It is designed to support next-generation devices with up to 22,000 contacts and sizes up to 150 × 150 mm, while managing power levels of up to 2000 W through integrated liquid cooling. The socket is universally compatible with advanced burn-in chamber platforms and can deliver a 500 lb applied load with a maximum closing force of 15 lb. Flexible thermal options, including passive heatsinks and heat pipes, are also available to meet different testing requirements.This burn-in socket is built for durability and thermal/electrical stability under extreme stress conditions.Attendees are invited to visit Booth 508 to experience Smiths Interconnect's cutting-edge technologies firsthand and engage with technical experts.Credit: Smiths InterconnectCredit: Smiths Interconnect
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