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    Sumitomo Electric raises InP substrate capacity target to 4.5 times 2024 levels by FY2029
    4min ago
    Micron dismisses 4F-squared DRAM as CXMT presses ahead — why Samsung, SK Hynix remain divided
    4min ago
    Nvidia strengthens South Korea ties at AI Day Seoul
    10min ago
    Apple's record holiday sales outlook faces costly test from memory inflation, AI spending
    12min ago
    AI spending surge puts tech giants’ cash flow under scrutiny
    19min ago
    China’s solar overcapacity persists as four majors remain loss-making in 3Q26
    Nov 2, 18:42
    Empyrean Technology to acquire Qizhi Technology for AI and 3DIC expansion
    Nov 2, 18:42
    AI supply chain expansion persists despite concerns over a downturn
    Nov 2, 18:42
    Weak smartphone sales weigh on SoC shipments
    Nov 2, 18:42
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    COMPUTEX
    Thursday 2 July 2026
    TEAMGROUP Showcases self-destruct SSD amid AI memory boom
    As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
    Thursday 11 June 2026
    Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
    Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
    Monday 19 May 2025
    COMPUTEX's Special Issue
    Technology news, product launches and show highlights from the event attendees available for download (PDF).
    LATEST STORIES
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
    Monday 21 September 2026
    GMIF 2026 Agenda Unveiled: Tech Giants on Lineup
    On September 23, the 5th Global Memory Innovation Forum (GMIF2026) will convene at the Renaissance Shenzhen Bay Hotel...
    Monday 21 September 2026
    Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026
    Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing, with a particular focus on its latest Tecnoflon FFKM innovations, at SEMICON Taiwan 2026.
    VIDEOS
    SEMICON Exclusive Interview｜Powering the AI Era: The Role of Advanced Materials
    SEMICON Exclusive Interview｜Enabling Mass Production of Silicon Photonics & CPO for AI
    SEMICON Exclusive Interview｜Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
    Straight from SEMICON 2026｜ZEISS, Henkel, Tescan, and camLine
    Straight from SEMICON 2026｜PBA Systems, Rigaku, and ABB
    COMPUTEX Exclusive｜PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
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    MULTIMEDIA
    K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue