Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Technology news, product launches and show highlights from the event attendees available for download (PDF).

At CES 2026, DEEPX will present a new paradigm for AI infrastructure - one designed for the physical world. As AI expands beyond data centers into robots, mobility, smart cities, factories, and intelligent devices, DEEPX positions itself at the core of this transformation with energy-efficient, real-time AI semiconductors purpose-built for Physical AI.Much like Arm reshaped the CPU industry through low-power innovation, DEEPX aims to establish a new global standard for Physical AI by delivering ultra-efficient AI accelerators. DEEPX enables intelligence to operate reliably and sustainably in real-world environments, addressing the critical constraints of power, heat, and cost.DEEPX's technology leadership has already been validated in the global market. In addition to winning two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, DEEPX-powered solutions have achieved the industry's highest recognition. Notably U.S.-based partner Sixfab received the CES Best of Innovation Award for its ALPON X5 AI Gateway, powered by DEEPX's first-generation AI chip, DX-M1. This success serves as a testament to DEEPX's solutions being more than just a component supply; they are recognized as a core engine and a game changer that elevates global partners' products to a world-class level.DEEPX will host a dedicated booth at the Las Vegas Convention Center (LVCC), North Hall – AI & Robotics Zone (#8945). The exhibit will showcase real-world deployments of AI semiconductors across robotics, drones, factory automation, retail, and intelligent infrastructure, proving that Physical AI has moved beyond concept and into commercial-scale deployment.At the booth, DEEPX will showcase performance targets for its next-generation DX-M2 AI chip, built on an advanced 2nm process. The DX-M2 is designed as a foundational infrastructure chip for the Physical AI era, solving the fundamental power and scalability limitations of data-center-centric architectures.Furthermore, DEEPX will launch its Open-Source Physical AI Alliance, formed in collaboration with leading AI software ecosystems including Baidu PaddlePaddle and Ultralytics' YOLO community. This initiative reflects DEEPX's strategy to tightly integrate hardware and software, accelerating global adoption of Physical AI through open, developer-friendly platforms."CES 2026 marks a pivotal moment for DEEPX - not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,"said Lokwon Kim, CEO of DEEPX.

The Seoul Business Agency (SBA), a small business support organization under the Seoul Metropolitan Government dedicated to revitalizing the startup ecosystem and discovering promising startups, announced that it will participate in CES 2026, the world's largest IT exhibition, by establishing and operating the Seoul Integrated Pavilion. In addition, following last year's initiative, SBA plans to host and expand the first-ever CES-based inter-country collaborative networking event, the "Global Innovation Forum," which aims to drive convergence across the global startup ecosystem.The forum is designed to provide Seoul-based startups with outstanding technological capabilities and growth potential, and a platform to engage directly with key players in the global startup ecosystem. By doing so, the event seeks to turn CES participation into tangible global business opportunities and help startups shine on the world stage. In particular, the forum is expected to attract strong interest from startups and ecosystem stakeholders seeking international expansion, as it offers a rare opportunity to experience investment, promotion, and networking in a single setting.The Global Innovation Forum was conceived as a networking platform that uses CES, the world's largest exhibition, as a bridge to enable startup ecosystems from different countries to communicate organically beyond national borders. The initiative began in 2025 under the name "Seoul Innovation Forum," when five national pavilions-Japan, the Netherlands, Switzerland, Taiwan, and the Republic of Korea (Seoul)-collaborated for the first time. As the inaugural event built on solidarity among Eureka Park-participating countries at CES, the Seoul Innovation Forum was considered particularly meaningful. It brought together key startup ecosystem players from each country to explore practical collaboration measures, earning positive evaluations as a successful first step toward enhancing competitiveness as global startups.A "national pavilion" refers to an exhibition pavilion established and operated by a national institution participating in CES.Building on this success, the event has been rebranded as the "Global Innovation Forum" starting in 2026 to provide participating startups with more stable and expanded opportunities for global collaboration. The highlight of the forum, the IR Pitching Competition, has been significantly strengthened through an enhanced judging panel. In addition to promoting technology through global media, the competition now includes rigorous business evaluations by leading global venture capital firms. Through this approach, participating companies are expected to gain opportunities for accelerated growth, expand brand awareness, and attract practical investment and market validation in a single venue.The 2026 Global Innovation Forum will be held in collaboration with startup support organizations from seven countries. The event is jointly supported by the host organization, Seoul Business Agency (SBA) of the Republic of Korea, Taiwan Tech Arena (TTA), Switzerland Global Enterprise (S-GE), Israel Economic and Trade Office, Japan External Trade Organization (JETRO), Québec Government Office of Canada, and Business France, raising expectations for a successful outcome.The forum will open with an IR pitching competition featuring startups selected by each participating country. The competition serves as a core program that draws strong attention from investors, media, and industry stakeholders, as promising startups carefully selected by national startup support organizations present their technologies and business models on the global stage. Each participating country-the Republic of Korea, Taiwan, Switzerland, Israel, Japan, Canada, and France-will showcase its leading startups before global investors and media, providing opportunities to expand international partnerships. Through this IR pitching competition, which combines media reach with the expertise of venture capital firms, participating companies are expected to achieve tangible outcomes beyond simple promotion, including market validation and investment connections.As the centerpiece of the forum, the IR pitching competition will serve as a platform for outstanding startups from seven countries, including Korea, Japan, and France, to demonstrate their value on the global stage. This platform, where national innovation capabilities converge, will act as a bridgehead for expanding international partnerships. Through an advanced evaluation process involving both media and venture capital firms, participating companies are expected to achieve meaningful results in brand recognition and capital linkage simultaneously.Award-winning companies that demonstrate innovative technologies and vision during the competition will receive prize money and trophies according to their respective award categories. The awards are divided into the Grand Award (first place), Scale-up Award (second place), and Impact Award (third place), with prize money of USD 3,000, USD 2,000, and USD 1,000, respectively.In addition, the forum will host panel discussions featuring representatives from each participating country, creating a knowledge-sharing platform to discuss the latest trends and support know-how in the global startup ecosystem. This is expected to go beyond individual company scale-up efforts and serve as an opportunity to strengthen policy alignment among countries. The networking session, where participants can interact freely, will be a key element in turning forum participation into tangible business outcomes. The teamwork among media, venture capital firms, startups, and startup support organizations is expected to open new opportunities for market entry for participating startups.Hyunwoo Kim, President and CEO of the Seoul Business Agency, presented his vision for the forum, stating that SBA aims to grow the event into a representative collaboration model that connects the global startup ecosystem into one through CES.

Mobilint, a South Korean fabless AI chipmaker, announced that it will showcase its efficient and production-ready industrial edge AI processors and their real-time demonstrations at CES 2026, to be held from January 6 through 9 at the Las Vegas Convention Center.MLX-A1, the company’s standalone edge AI box, was recently named a CES 2026 Innovation Award Honoree in the Artificial Intelligence category. The compact 1.3 kg system was recognized for its ability to run advanced AI workloads locally - including language, vision, and multimodal models - within a 70-watt, laptop-class power envelope, without relying on cloud services, servers, or GPUs. By addressing latency, power consumption, cost, and data privacy challenges, MLX-A1 enables practical AI deployment across industrial environments.Designed for flexible integration, MLX-A1 supports both retrofitting existing equipment and deploying new production lines without added infrastructure complexity, while delivering meaningful power and cost savings.MLX-A1 is powered by ARIES, Mobilint's high-efficiency AI accelerator chip, capable of delivering up to 80 TOPS of performance. ARIES entered mass production in 2024 and is now shipping globally in multiple form factors, supporting scalable deployment across industrial and commercial systems.Mobilint will also present REGULUS, its ultra-compact AI system-on-chip that won the CES 2025 Innovation Award, during the exhibition. Measuring 17 mm × 17 mm, REGULUS delivers up to 10 TOPS of AI performance at under 3 watts, enabling always-on, on-device AI in space- and power-constrained environments such as smart sensors, embedded vision systems, and low-power industrial devices.Throughout CES 2026, Mobilint will run live, application-focused demonstrations showcasing real-time video analytics, local AI assistants, and multi-model AI processing executed directly on its hardware. These demonstrations emphasize low-latency inference, stable real-time operation, and energy efficiency.In addition, Mobilint will feature joint demonstrations with global industrial platform partners including Lanner and Autonics, highlighting how its AI processors can be integrated into existing systems with minimal modification, enabling AI upgrades without full system replacement."CES 2026 gives us the opportunity to demonstrate our edge AI technologies that are ready for immediate deployment in real industrial settings," said Dongjoo Shin, CEO and CTO of Mobilint. "By combining high-performance, power-efficient AI processing technology with close collaboration with global partners, we will further accelerate AI adoption across industries and continue to strengthen our technological competitiveness in the global market."Visitors can experience Mobilint's CES Innovation Award–winning MLX-A1, REGULUS, and its latest edge AI hardware at Booth No. 9129 in the North Hall, LVCC, during CES 2026.