As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As graduation season arrives, Taiwan's semiconductor industry once again enters its annual competition for talent. Driven by declining birth rates and surging demand for computing power fueled by the artificial intelligence (AI) boom, semiconductor companies have continued to expand their hiring efforts year after year...

Discussion around advances in AI will often focus on model performance, chip launches, and compute scale. In practice, however, progress increasingly depends on something more fundamental: the ability to build faster, more reliable infrastructure for moving, processing, and managing data.

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly. Thermal management has therefore become a critical factor affecting performance, reliability, and system design...