As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law...

NewPower Worldwide, one of the electronics industry's fastest-growing distributors, today announced it has expanded its committed credit facility to $750 million, further enhancing its ability to invest in inventory, support customer growth, and capitalize on opportunities across the global supply chain.

Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined Failure Analysis for Advanced Packaging," Tescan will present a correlative workflow that connects defect localization, rapid access to regions of interest (ROIs), site-specific sample preparation, and nanoscale characterization.