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Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
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Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
Monday 21 September 2026
GMIF 2026 Agenda Unveiled: Tech Giants on Lineup
On September 23, the 5th Global Memory Innovation Forum (GMIF2026) will convene at the Renaissance Shenzhen Bay Hotel...
Tuesday 25 August 2026
Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
As the power demands for AI servers and racks continue to rise, data center power architectures are moving toward higher voltages and greater power densities. Ryan Chiu, Vice President of Conquer Electronics, noted that the rapid expansion of AI infrastructure is not only reshaping server and power system designs, but also raising the bar for circuit safety and long-term reliability.
Thursday 13 August 2026
AI Memory & Storage: GMIF 2026 Hits Shenzhen Sept 22-23
The AI industry is entering a new phase centered on inference efficiency and agentic deployment...
Friday 24 July 2026
Ubiqconn lifts first-quarter revenue and expands North America and AI plans
Ubiqconn Technology, a Taiwan-based industrial computer manufacturer, said on July 21 that its consolidated revenue rose to NT$548 million in the first quarter of 2026, up 61% from the previous quarter, as project deliveries improved and shipments recovered...
Friday 24 July 2026
TEEMA unveils three-part plan for Mexico technology park to help small exporters expand
Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) on July 21 held an investment briefing in Taiwan on its Mexico science park plan, bringing together representatives from Mexico and Sonora state as it advanced a project aimed at helping Taiwanese small- and medium-sized enterprises expand overseas...
Wednesday 15 July 2026
Chunghwa Telecom accelerates next-Gen AIDC deployment to boost AI compute
The data center industry is undergoing its largest structural transformation in the past decade due to the rapid development of generative AI...
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Tuesday 23 June 2026
Clientron Partners with Parallels to Modernize Digital Workspaces in Asia
Clientron, a premier global provider of smart endpoint solutions, today announced a strategic partnership with Parallels, a global leader in cross-platform and virtualization solutions...
Thursday 18 June 2026
Nuvoton partners Qualcomm to advance tethered XR glass SoC business
Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications...