LB Semicon is planning to offer fan-out wafer-level package (FOWLP) service next year at the earliest. The company completed the development of relevant technologies earlier this year and has been testing them with an analog chip customer since the first quarter. LB Semicon will likely offer FOWLP for RF and power management ICs.

STAr Technologies, a leading supplier of semiconductor reliability test systems, today announces the sale of Accel-RF HTOL Burn-In test systems to top semiconductor foundries in Taiwan. Accel-RF Instruments Corp., a STAr Technologies Group company, located in San Diego, U.S.A. and specializing in turn-key RF reliability and performance characterization test solutions for compound semiconductors, provides this HTOL burn-in reliability test solution.

Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix's first available HBM3 samples. The platform was demonstrated at the Partner Pavilion of the TSMC 2022 North America Technology Symposium; it contained an HBM3 Controller, a PHY, GLink-2.5D die-to-die interface, and a 112G SerDes. The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies.

DIGITIMES Research report shows that Taiwan's ICT industry development has shifted from focusing on hardware to hardware/software integration models. The industry is combining big data analysis and AI applications in public IoT to facilitate the development of smart city management. Tools such as IoT, AI, cloud computing, and communications technologies are efficiently integrated with urban infrastructure to ultimately produce economic benefits and improve quality of life.

Quectel Wireless Solutions, a global IoT solutions provider, is continuing to build on the successful EMEA roll-out of its Connectivity-as-a-Service (CaaS) and is now launching global connectivity sales in the Asia Pacific region. This new launch complements Quectel's heritage of providing innovative modules and antennas to support cellular applications and allows customers to simplify their edge-based deployments by purchasing SIM cards and connectivity management alongside modules, antennas and design services. Adding connectivity broadens the company's portfolio and helps its customers to simplify the journey of designing, building, connecting and commercializing their IoT offerings.

As countries continue to lift lockdowns, people's lives and business activities will soon recover while the world enters an era of coexistence with the virus, or so-called the "New Normal." DataVan (3521.TWO) adopted it as the theme at COMPUTEX this year to showcase a series of smart retail solutions aimed at supporting retail businesses to rapidly adapt to post-pandemic consumer behaviors and grasp market opportunities.

ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products, today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5) solid state drives (SSD) utilizing the SATA III interface. They include the ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs. All three SSDs are designed to be energy efficient, feature high capacities, and are well suited for high-load industrial systems relating to industrial computing, embedded devices, automation, networking, transportation, and other fields.

With the deep integration of the new generation of information technology and manufacturing industry, and the digital transformation and upgrading, digitalization is currently intensively filling every link of production and manufacturing. Under this background, ZNT, the industrial automation integration platform solution supplier, continues to move forward to the industry's cutting-edge with a variety of cutting-edge Application Benchmark products. In this CEO interview, ZNT shared the development experience, opportunities and challenges of ZNT digital empowerment, as well as its vision and planning for the whole industry.

United Microelectronics Corporation (UMC) announced today that the Science Based Targets initiative (SBTi) has approved its emissions reduction targets, making the Company the first semiconductor foundry globally to obtain SBTi validation of climate goals. This marks a critical step in UMC's roadmap to achieve net zero emissions by 2050.

Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has hired Mike Slater as its new vice president of global business development. In his new role, Slater will oversee the company's worldwide customer and supplier development strategy.