As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms.Against this backdrop, TEAMGROUP General Manager Gerry Chen warned that the industry could face a period of unprecedented scarcity by 2027. He described the situation as one where "even customers willing to accept higher prices may still face supply risks," potentially echoing the severe chip shortages seen during 2021–2022. Chen noted that even buyers willing to pay premium prices could face significant procurement challenges if they lack long-term strategic relationships with original chip manufacturers, leaving them highly vulnerable to supply disruptions.In response, TEAMGROUP initiated a strategic transformation in 2025, redirecting 80% of its resources from the consumer segment toward long-lifecycle, high-reliability applications. The company is now focused on mission-critical sectors, including industrial automation, enterprise infrastructure, defense, and healthcare, while also expanding into military-grade storage and high-density computing applications. Leveraging three decades of partnerships with leading global suppliers and its extensive experience in IPC design-in collaboration, TEAMGROUP has strengthened supply-chain resilience and enhanced supply assurance amid ongoing market volatility, positioning itself as a trusted enabler of secure and reliable AI infrastructure.Building supply chain resilience amid persistent memory shortageChen emphasized that the exponential growth of AI-driven demand is outpacing semiconductor capacity expansion, a process that typically requires three to three-and-a-half years to complete. As a result, supply constraints in DRAM and SSD markets are becoming a structural challenge rather than a cyclical phenomenon. In this environment, competitive advantage will increasingly depend on supply assurance, allocation capabilities, and long-term supplier relationships rather than price alone.Leveraging decades-long partnerships with leading memory manufacturers and extensive IPC expertise, TEAMGROUP has established a stable supply framework for industrial PCs and other long-lifecycle applications requiring seven to ten years of product availability. The company works closely with customers to identify alternative component sources, optimize system configurations, and mitigate demand distortion and bullwhip effects across the supply chain. These capabilities have strengthened resilience for customers in mission-critical industries such as automotive, healthcare, and defense.T-CREATE EXPERT P35S & TEAMGROUP INDUSTRIAL P250Q secure data in defense & finance. Credit:TEAMGROUPTEAMGROUP's portfolio spans commercial-grade storage solutions for general confidential data protection, as well as industrial-grade products engineered for deployment in aircraft, naval vessels, unmanned systems, and other high-reliability platforms. The company has showcased these solutions at major industry events, including Embedded World and Japan IT Week.Physical destruction technology enables one-click data destructionThe T-CREATE EXPERT P35S, recipient of the 2026 COMPUTEX Best Choice Award, exemplifies TEAMGROUP's philosophy that "physical destruction is the ultimate safeguard." According to Chen, true data security lies in the complete physical destruction of storage media rather than relying solely on software-based deletion methods.When activated, the SSD's built-in boost chip instantly releases a high-voltage current that physically breaks down the insulation layer of the NAND flash ICs, permanently destroying the storage medium within 2.4 seconds and making data recovery extremely difficult. For everyday protection, AES-256 encryption provides a first line of defense, creating a comprehensive security framework that integrates both hardware- and software-based safeguards.The design is engineered to eliminate any possibility of residual data. Its proprietary circuit architecture uses a zoned sequential-conduction mechanism, enabling high-voltage current to destroy memory chips in a controlled chain reaction. TEAMGROUP's patented "power-resume destruction" technology further ensures destruction integrity by automatically completing the process when power is restored if an interruption occurs during the destruction sequence.To prevent accidental activation, the device incorporates a two-stage fail-safe button requiring deliberate user action. The technology also supports remote activation through 4G/5G networks, radio communications, or SMS commands, allowing data destruction to be triggered from several kilometers away. This capability helps prevent sensitive information from being compromised even if a device is lost, stolen, or captured.The patented technology is currently available in two products: the T-CREATE EXPERT P35S, a portable secure storage device, and the industrial-grade TEAMGROUP INDUSTRIAL P250Q-M80 M.2 high-speed SSD, designed for classified computing environments, financial institutions, and defense applications. Together, they provide a robust cybersecurity safeguard for the defense, finance, and R&D sectors.TEAMGROUP showcases a variety of enterprise-grade SSDs at COMPUTEX. Credit: TEAMGROUPAdvanced specs pave the way for agentic AILooking ahead to the convergence of AI and physical robotics, Chen noted that technology ultimately serves human needs. As AI systems continue to collect and process vast amounts of behavioral, operational, and contextual data, demand for on-premises storage is expected to grow significantly.TEAMGROUP keeps data stable in harsh settings & inspires young teams to innovate. Credit: TEAMGROUPOne example is the emerging long-term care robotics market. These systems must not only deliver healthcare-related capabilities but also retain medical records and behavioral data over extended periods. Such requirements place stringent demands on SSD endurance, reliability, and long-term stability, underscoring the importance of local data storage. Similarly, enterprises are increasingly reluctant to move highly sensitive information—including financial data, proprietary business models, and operational intelligence—to the cloud. As a result, agentic AI systems capable of autonomous decision-making within on-premises environments are gaining strategic importance.To support next-generation AI applications, TEAMGROUP has become one of the industry's early innovators in LPCAMM2 and SOCAMM2 memory technologies. LPCAMM2 enables LPDDR memory, traditionally soldered directly onto notebook motherboards, to become modular and upgradeable, while SOCAMM2 introduces a compact, low-power architecture designed for AI servers and advanced computing platforms, offering an alternative to conventional RDIMM. Together, these technologies offer greater flexibility, serviceability, and power efficiency for future AI systems.Beyond supplying low-power memory components, TEAMGROUP has evolved into a comprehensive solution provider, helping customers maintain data integrity and system stability in demanding operating environments characterized by vibration, thermal challenges, and continuous workloads. At the same time, the company encourages its young talent to pursue bold innovation while investing in next-generation DDR6 R&D, laying the groundwork for future AI infrastructure and intelligent edge computing applications.Amid the ongoing memory supercycle, TEAMGROUP has demonstrated strategic resilience and innovation beyond the role of a traditional module manufacturer. By combining supply-chain expertise, advanced physical-level security technologies, and next-generation memory architectures, the company aims to help customers safeguard critical digital assets while preparing for the next phase of AI-driven transformation.For more information, please visit.

Clientron, a premier global provider of smart endpoint solutions, today announced a strategic partnership with Parallels, a global leader in cross-platform and virtualization solutions. Through this collaboration, Clientron will bring Parallels Workspace solutions including Parallels RAS (Remote Application Server), Parallels Browser Isolation and Parallels DaaS to organizations across Southeast Asia, offering a simple, flexible, and secure alternative for businesses looking to modernize digital workspaces and reduce IT cost and complexity.In today's hybrid work era, IT teams across Southeast Asia are increasingly burdened by "Legacy VDI Platforms" and are increasingly looking for ways to simplify digital workspace management, reduce operational overhead, and improve cost efficiency. Parallels Workspace solutions address these challenges with streamlined deployment, flexible infrastructure support, and cost-effective application and desktop delivery across hybrid and multi-cloud environments."Businesses want to stop using old and costly systems," said Vivienne Weng, Vice President at Clientron. "Parallels is a great way to reduce the work for IT teams. With Clientron's high-performance hardware, we help IT managers in Asia move away from expensive setups to a smarter and easier way to manage their workspaces.""Many organizations across Southeast Asia are currently seeking solutions to modernize their digital workspace strategies," said Asif Khan, Country Sales Manager at Parallels. "As a strong mid-market enabler, Parallels helps organizations simplify application and desktop delivery with secure, flexible solutions designed for hybrid and multi-cloud environments - backed by competitive and cost-effective pricing. Together with Clientron, we're expanding access to these modern workspace solutions across the region."Key Advantages of Clientron x Parallels:1. Cost-Effective Seamless Access: Smoothly run critical apps on Mac, Windows, or Linux platforms while cutting Total Cost of Ownership (TCO); 2. Deployment Without Complexity: Parallels Workspace Solutions can be deployed in hours with minimal specialized training; 3. Ultimate IT Flexibility: Support workloads across hybrid, multi-cloud, and on-premises environments, protecting enterprises from vendor lock-in; 4. Stronger Security: Modern encryption and login technology to keep your data safe with high-class protection while staying fast and smooth; and 5. Localized Southeast Asia Support: Dedicated focus on key Southeast Asian markets including Malaysia, Thailand, the Philippines, Taiwan, Vietnam, and Indonesia, helping customers and partners access localized expertise, deployment support, and faster regional engagement.Moving forward, Clientron will continue to expand its footprint in Asia, working closely with channel partners to promote Parallels solutions and help enterprises build 'Smart Secure Workspaces' for the future.Deliver secure apps and desktops via Parallels RAS with simple VDI and seamless remote access.Credit: Clientron

Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications. Through this collaboration, Nuvoton will combine its tethered XR Glass–optimized SoCs with Snapdragon XR platforms, and its software ecosystem to accelerate the development and deployment of tethered XR Glass applications and to support industry expansion.XR glasses are increasingly being adopted, particularly in industrial and enterprise fields, for use cases such as operational support, remote assistance, and information visualization. At the same time, achieving compact and lightweight designs, long battery life, and comfortable user experience remains a key challenge for broader market adoption.Nuvoton has been providing SoCs that balance the processing performance and low power consumption required for tethered XR Glass applications. Through this collaboration with Qualcomm Technologies, Nuvoton aims to create an environment that enables more device manufacturers and developers to more easily enter the tethered XR Glass industry.Qualcomm Technologies'newest XR platform, Snapdragon Reality Elite, combined with Nuvoton's SoC, enables a practical and scalable tethered optical see-through (OST) architecture that balances performance, power efficiency, and system flexibility. This configuration allows computing intensive XR workloads to remain on the tethered device while delivering high quality, low latency display and sensor data to lightweight glasses. Together, Snapdragon Reality Elite and Nuvoton’s SoC form a strong foundation for OEMs to accelerate time-to-market for tethered OST designs while maintaining a clear path for future system evolution.Key Collaboration AreasEvaluation of optimized tethered XR Glass configurations by combining Nuvoton's SoCs with Qualcomm Technologies' XR platforms and related technologies.Nuvoton positions its SoC as a key enabler of AI-driven tethered XR platforms. The SoC provides a scalable architecture that decouples application processors from display and sensor subsystems, including cameras and microphones.By abstracting complex interfaces, it helps device manufacturers accelerate time-to-market, reuse designs across product generations, and optimize system performance and power efficiency, particularly for smart glasses.In addition to tethered XR Glass applications, the SoC supports emerging use cases such as agentic AI experiences by simplifying system integration and enabling flexible system architectures. Within the XR ecosystem, Nuvoton works with Qualcomm Technologies, OEMs, and partners at a platform level, supporting the evolution of XR as a next-generation AI computing platform.Value Proposition and BenefitsThrough this collaboration, the adoption of Nuvoton's XR Glass SoCs is expected to deliver the following benefits:1.A comfortable user experience enabled by high-performance, low-power designs optimized for tethered XR Glass use cases. 2.Superior connectivity and access to a rich software ecosystem through compatibility with Qualcomm Technologies platforms. 3.Reduced development effort and shortened time-to-market. 4.Support for a wide range of applications, from industrial to enterprise use cases."This collaboration with Qualcomm Technologies represents an important step in expanding the applicability of our SoC solutions for tethered XR Glass and emerging AI-driven XR platforms." said Ken Su, Vice President of Cloud Security Business Group at Nuvoton Technology Corporation."By working together within the ecosystem, we aim to support our customers in bringing innovative smart glasses and next-generation devices to market more efficiently.""By working with Nuvoton to pair Snapdragon XR platforms with their optimized SoC, we aim to support lightweight optical see-through designs that balance performance, power efficiency and system flexibility. This collaboration builds toward the next phase of the XR ecosystem." Sahil Bansal, Senior Director, Product Management at Qualcomm Technologies remarked.For more information.

Ultraband Technologies, an emerging IC design startup, announced today the official signing of a Memorandum of Understanding (MOU) with NTT ADVANCED  TECHNOLOGY CORPORATION (NTT-AT), a subsidiary of Japan's NTT Group. Focusing on III-V compound semiconductor technologies, the two companies plan to establish a supply chain partnership spanning upstream epitaxial development, midstream product design and development, and downstream market expansion.Initial Focus on Power Semiconductors with Parallel RF DevelopmentThis strategic collaboration is intended to leverage the complementary technological strengths of Ultraband Technologies and NTT-AT in addressing global market opportunities in electric vehicles (EVs), automotive electronics, green energy, AI servers, and high-frequency communications, including 5G-Advanced, 6G, and satellite communications.To support concrete business execution, both parties have established a structured communication mechanism and will progressively align their technology and product roadmaps across two primary domains:1.In the field of power semiconductors, which represents the initial focus of the collaboration, NTT-AT's epitaxial material technologies in III-V compound semiconductors, including GaN, will be integrated with Ultraband's expertise in power device and chip design. The objective is to develop high-performance and reliable power management solutions for applications in new energy, AI, and industrial markets.2.In parallel, collaboration in RF semiconductors will be advanced concurrently. By combining Ultraband's design capabilities in RF ICs and Antenna-in-Module (AiM) technology with NTT-AT's III-V compound semiconductor crystal growth expertise, the two companies plan to co-develop RF components for applications such as 5G-Advanced, 6G, satellite communications, drones, and robotics.Strengthening Supply Chain Integration Through Epitaxial Structure DesignThis partnership is intended to extend beyond individual projects, with both companies working toward a long-term collaboration framework covering the full product lifecycle. Within this framework, Ultraband will leverage its capabilities in epitaxial structure design as a key technical interface to facilitate integration between the two organizations.Semiconductor chip performance has traditionally been constrained by material specifications and epitaxial growth limitations. Ultraband applies its proprietary research in device material physics and epitaxial structure design to enable precise optimization at the material level, with the aim of overcoming technical bottlenecks and enhancing overall chip performance.By integrating Ultraband's epitaxial structure design capabilities with NTT-AT's epitaxial growth expertise, the collaboration is expected to improve performance from the material foundation while ensuring alignment with subsequent product design and development stages. Looking ahead, both parties intend to leverage their respective market channels to introduce these solutions into the global supply chain, targeting mutually beneficial outcomes.Seizing Market Opportunities in High-Computing AI, Green Energy, and Advanced CommunicationsAmid the continued growth of AI data centers, digital transformation, and global net-zero initiatives, high-performance III-V compound semiconductors for power and RF applications are becoming increasingly critical. The stringent requirements of AI servers for power efficiency and thermal management, the efficiency demands of energy storage systems, and the high-frequency performance standards of next-generation communication technologies all underscore the importance of advanced semiconductor solutions.Ultraband Technologies aims to contribute to the development of next-generation AI computing, green energy systems, and advanced communication ecosystems through its technological capabilities.Going forward, Ultraband Technologies and NTT-AT will utilize their joint working group to further align epitaxial specifications and product roadmaps, with the goal of delivering reliable technologies and solutions to global customers.Click here for more information.

The global semiconductor landscape is undergoing a fundamental shift, moving from a focus on raw training power to the practical complexities of large-scale deployment. In an in-depth interview, Wallace Kou, President and CEO of Silicon Motion, detailed how the generative AI has evolved beyond its initial stages. While the market's early gaze was fixed almost exclusively on NVIDIA's GPUs, the High Bandwidth Memory (HBM), and the CoWoS advanced packaging technology, Kou argues that the industry is now entering the "Inference" era that is turning previous under-estimation about storage's importance on their head.The Shift from Training to InferenceThe turning point for this realization occurred during the NVIDIA GTC conference in March 2026. CEO Jensen Huang unveiled the Vera Rubin architecture, a move that signaled a massive spike in demand for NAND flash memory. During the initial AI boom, the industry was preoccupied with training massive models, a process that relies heavily on the lightning-fast throughput of HBM. However, as these models move into the inference phase - where they are actually used by end-users to generate content or solve problems - the access to context, historical data, and massive datasets storage become the primary bottleneck.Kou notes a dramatic shift in market sentiment. Only two years ago, storage was often an afterthought in the AI conversation; today, it is a critical scarcity. "There is currently not a single global cloud service provider or major smartphone manufacturer whose demand for DRAM and NAND is being fully satisfied," Kou observed. This supply-demand gap has triggered a financial windfall for storage module manufacturers and memory giants, with some stock prices skyrocketing up to tenfold as the market reacts to persistent shortages and rising prices.Technical Paradigm Shift: CMX and the Infrastructure of ThoughtAt the heart of this transition is a new architecture introduced by NVIDIA: the CMX Context Memory Storage platform. This architecture is designed specifically to handle the "KV Cache" (Key-Value Cache), which allows AI models to remember the context of a conversation or a complex task during the inference process.The hardware requirements for the CMX architecture are staggering in their scale and technical demands. Each individual Rubin GPU requires 16TB of dedicated storage to function effectively within this framework. At a system-level scale, a single NV72 Vera-Rubin setup can demand more than 1 Petabyte, or 1,000 Terabytes, of total storage capacity. Beyond mere capacity, the CMX architecture facilitates direct GPU access to storage, a feature that bypasses traditional latency bottlenecks and ensures that AI inference remains fluid and responsive.While this creates a massive commercial opportunity for the storage industry, it also places an unprecedented strain on NAND production. Kou emphasizes that this is not just a cloud-based phenomenon. The explosion of Edge AI - AI processed locally on devices - is further complicating the supply chain. For instance, driven by major players like Meta, the market for smart glasses is expected to reach 60 million units this year. These wearable devices require high-performance embedded storage, creating a secondary front in the war for NAND capacity.Silicon Motion's Role: Solving the QoS BottleneckAs the world's leading NAND controller maker, Silicon Motion sits at the intersection of these competing demands. The primary technical challenge in modern AI environments is maintaining Quality of Service (QoS). In a multi-tenant cloud environment, where multiple GPUs are accessing shared storage simultaneously for different inference tasks, data transfer speeds can often fluctuate or drop.To solve this, Silicon Motion has deployed its proprietary PerformaShape technology. This technology ensures that even under heavy, concurrent workloads, the transmission speed remains stable. By stabilizing these data flows, Silicon Motion has positioned itself as an "indispensable stabilizer" in the AI ecosystem.Beyond data path optimization, Silicon Motion is also extending its role into system-level infrastructure by providing enterprise-grade boot drives for leading AI GPU, TPU, and DPU platforms, ensuring system reliability and fast initialization at scale.The Crisis of Imbalance: Kou's "Capacity Persuasion" EffortsDespite the record-breaking revenues, Kou is deeply concerned about the "shadows" lurking behind this prosperity. The current memory market is suffering from a dangerous imbalance. To maximize profits and satisfy the insatiable hunger of AI cloud giants, major manufacturers like Samsung, SK Hynix, and Micron are funneling the majority of their capital expenditure (CAPEX) into HBM and DDR5 production.This strategic pivot has effectively "squeezed" the production capacity available for standard NAND flash. Kou warns that this "AI squeezing effect" could lead to a collapse in traditional sectors. Over the past eight months, Kou has embarked on a global mission, meeting with leaders at Samsung, SK Hynix, Kioxia, SanDisk, YMTC, and Micron. His message is one of "capacity persuasion": he is urging these giants to reserve a portion of their production lines for the automotive, PC, and smartphone industries."If these foundational industries break because they cannot find parts, Edge AI will have no 'soil' to grow in," Kou warned. He believes that a total focus on the high-margin AI server market could eventually backfire, destroying the broader technology ecosystem that supports AI development.A Stabilizing Strategy: From Cloud to EdgeSilicon Motion is positioning itself as the "transition enabler" for an industry in flux amid an expected 2–3 year supply shortage. As NAND manufacturers concentrate their internal resources on AI-driven initiatives, they are increasingly outsourcing non-core and mainstream projects, such as PCIe Gen5 controllers and embedded solutions. In this shift, Silicon Motion has emerged as a preferred partner to fill the resulting gap.At the same time, as rising prices weigh on demand in the PC and smartphone markets, the company is helping customers pivot toward automotive and AIoT applications, including rapidly growing segments such as smart glasses, which are seeing a surge in shipments this year.One of the most critical areas is the automotive sector, where Silicon Motion has spent a decade building a presence. While memory giants might see automotive requirements as "niche" or low volume compared to AI servers, Kou views them as essential to global stability. When major OEMs consider abandoning these specialized demands due to capacity constraints, Silicon Motion steps in to ensure the global automotive supply chain does not grind to a halt."We are not just looking for a surge in revenue; we want to fulfill our responsibility to the industry," Kou said. By providing stable controllers and storage solutions for AIoT and automotive applications, Silicon Motion is effectively repairing the cracks in a fractured global supply chain.Future Outlook: 2027 and BeyondThe current supply-demand imbalance is not a temporary glitch but a structural reality that Kou expects to persist until at least late 2027 or 2028. Several factors make it nearly impossible to add capacity quickly, for example, land acquisition is increasingly difficult. The lead time for building specialized cleanrooms and procuring critical equipment now exceeds one year.Kou predicts that while the DRAM shortage might begin to ease by the end of 2027, the relief for NAND will likely come even later. In this high-pressure environment, Silicon Motion's role as a key stabilizing force becomes increasingly important.Particularly in emerging sectors such as smart IoT and automotive applications, Silicon Motion delivers reliable controller and storage solutions, filling the vacuum left by production shifts at major manufacturers or by projects lacking sufficient engineering support.By helping global clients navigate the complexities of geopolitics and capacity wars, Silicon Motion aims to ensure that the AI revolution leads to a steady, sustainable future rather than a chaotic collapse of the broader tech industry.AI inference boom fuels supply-demand imbalance until 2027-2028, says Wallace Kou. Credit: Silicon Motion

With demand for AI edge computing continuing to grow, Retronix announced that its Sparrow Hawk AI edge computing platform has officially entered mass production and is now available to the global market. The platform is powered by the automotive-grade SoC R-Car V4H from Renesas Electronics, delivering up to 30 TOPS (Dense) AI inference performance. Sparrow Hawk is designed to support a wide range of edge AI applications, including robotics, smart manufacturing, and other intelligent edge systems.According to Retronix, Sparrow Hawk integrates high-performance AI computing capabilities with a comprehensive I/O expansion architecture, enabling diverse edge computing scenarios such as computer vision, industrial automation control, and smart device development. The platform provides a wide range of interfaces including PCIe, USB 3.0, DisplayPort, CAN-FD, AVB Ethernet, and MIPI CSI/DSI. It also features an expansion connector compatible with industry-standard accessories, allowing developers to flexibly integrate peripheral modules and accelerate AI application development and deployment."We are pleased to see the global launch of Retronix's Sparrow Hawk Edge AI Computing Platform, powered by the automotive-grade R-Car V4H SoC," said Aish Dubey, Vice President and Head of the SoC Division at Renesas Electronics. "We value our collaboration with Retronix and look forward to continuing our work together to bring more innovation to the edge AI ecosystem."Regarding product compliance, Sparrow Hawk has obtained several international certifications, including FCC, CE, UKCA, and VCCI. These certifications indicate that the product meets international standards for electromagnetic compatibility (EMC), safety regulations, and other regulatory requirements, enabling Sparrow Hawk to be legally marketed and deployed in major regions including the United States, the European Union, the United Kingdom, and Japan.Sparrow Hawk was developed with an Upstream First software strategy that helps reduce entry barriers for developers. To meet diverse application needs, it fully supports two major software distributions. The Debian BSP is primarily aimed at industrial applications, providing a familiar software installation experience, while the Yocto BSP continues the high performance and reliability DNA of the R-Car series in the automotive field. Developers can access source code, Startup Guides, and detailed technical tutorials directly through the R-Car Open Source Community GitHub page. The community has established FAQ and Q&A forums, allowing global developers to communicate with experts in real-time and accelerate the transition from prototype to production.For hardware configuration, Sparrow Hawk is available in 8GB and 16GB LPDDR5 memory versions. The Basic Kit includes the Sparrow Hawk SBC, while the Complete Kit adds a 32GB microSD card, a fan HAT and a debug serial cable for a ready-to-use development setup.The Sparrow Hawk single-board computer and development kits are now officially available through Shimafuji Electric, with broader availability planned through major electronic component distributors such as Mouser Electronics and Digi-Key Electronics. Retronix Technology will work closely with Renesas Electronics to provide comprehensive technical support for developers and customers worldwide.For more technical details, please visit: Retronix Official Website.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe Technology Symposium.This exhibition highlights the successful collaboration between GUC and VSORA, combining advanced AI architecture with leading-edge ASIC implementation and packaging technologies to deliver a high-performance, scalable inference solution for data center workloads.Enabling advanced AI inference through close collaborationJotunn8 is VSORA's flagship AI inference processor, purpose-built for inference workloads. It delivers ultra-low latency and very high throughput by addressing the memory wall bottleneck, enabling cost-efficient deployment of large-scale AI models.GUC provided comprehensive turnkey ASIC services for Jotunn8, managing the full implementation from netlist to manufacturing. The project demonstrates GUC's expertise in complex system integration, including: Advanced chiplet architecture design and integration, High-bandwidth memory integration with HBM3E PHY and controller, 2.5D die-to-die connectivity using GUC's 17.2 Gbps GLink-2.5D interconnect, Advanced packaging implementation leveraging TSMC CoWoS-S technology (3x reticle size), Implementation on TSMC's 5nm process node,Full-system co- optimization of signal, power, and thermal integrity (SI/PI/TI), Power and IR optimization to enhance overall system efficiency.This collaboration underscores GUC's capability to deliver complex AI and HPC ASICs with optimized performance, power, and scalability.Leveraging a strong ecosystem with TSMCJotunn8 also reflects the strength of GUC's long-standing collaboration with TSMC. As a key partner in TSMC Open Innovation Platform (OIP) ecosystem, GUC enables customers to efficiently adopt advanced process nodes and packaging technologies, bridging innovative architectures with leading-edge manufacturing.By leveraging TSMC's advanced CoWoS packaging and 5nm process technologies,GUC ensures high-quality silicon execution and a reliable path to production for demanding AI applications."We are proud to showcase Jotunn8 at the TSMC Europe Technology Symposium. This achievement highlights our strong collaboration with VSORA and demonstrates GUC's ability to bring complex AI processors to silicon using advanced process and packaging technologies," — said Patrick Wang, Senior Vice President and Chief Revenue Officer at GUC."Jotunn8 is designed to unlock a new level of efficiency and scalability for AI inference. Our collaboration with GUC has been key in successfully translating this architecture into a highperformance silicon solution,"— said Khaled Maalej CEO of VSORA.Driving next-generation data center AIThrough this collaboration, GUC and VSORA address the growing demand for high-performance,energy-efficient AI inference in hyperscale data centers. Jotunn8 enables new levels of throughput and latency optimization, supporting large-scale AI deployment across cloud and enterprise environments.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.

Taiwan Mobile today held a Mac launch event to announce that Mac products are now officially available. Centered around the theme "Small Bite. Big Possible.", Taiwan Mobile has integrated MacBook Neo, M5-powered MacBook Air and MacBook Pro, as well as Mac mini, becoming the first telecom operator in Taiwan to deliver a full-scale Apple ecosystem.Beyond the simultaneous launch across myfone retail stores, myfone online shop, customer service channels, enterprise divisions, and momo.com, Taiwan Mobile has introduced dedicated "Mac Experience Gateways" across 100 select myfone retail stores. These areas are supported by over 1,000 professionally trained AI Tech Consultants who provide hands-on demonstrations and personalized guidance nationwide.At the launch event, a live demonstration showcased Taiwan Mobile’s evolution from device sales to integrated experiences. The showcase highlighted both the cross-device Apple ecosystem experience and Taiwan Mobile's own advantages-5G hotspot sharing, home Wi-Fi broadband, diverse purchasing plans, and OP Tech Life services-illustrating how Taiwan Mobile delivers one-stop solutions across network, device, and content services, tailored to different user needs, empowering customers to maximize their digital productivity in the AI era.Tony Lin, Chief Consumer Business Officer at Taiwan Mobile, stated that as the "AI Inquiry Era" emerges, the challenge for consumers is no longer about choosing devices, but about how to effectively harness and integrate technology into everyday life. Through today's launch event demonstrations, Taiwan Mobile showed that retail stores are no longer just points of sale, but have evolved into integrated service hubs. myfone retail stores continue to strengthen their consultative service approach, upgrading into "Experience Gateways," where AI Tech Consultants guide users in understanding how devices connect and work together-bringing "Big Possible" to life.Tony Lin, Chief Business Officer at Taiwan Mobile, at the Mac Launch Event. Credit: Taiwan MobileLin further noted that Taiwan Mobile integrates 14 value-added services, including Apple One, streaming content, and cloud gaming. With select plans, customers will also receive a one-year free membership to the "GeForce NOW powered by Taiwan Mobile" Ultra Plan Hourly Subscription, enabling them to enjoy AAA titles on Mac and further expanding its entertainment and productivity value.Live from the Launch Event: 3 Real-Life Scenarios Across Students, Professionals, and CreatorsStudents: MacBook Neo at $0 - A Seamless Learning ExperienceThe first scenario demonstrates a student’s learning journey, from attending classes to reviewing course materials, addressing the challenge of fragmented information and inefficient organization. Through Taiwan Mobile's device plans, users can easily get started with the latest MacBook Neo and step into the Apple ecosystem. By using iPhone Air to capture whiteboard content and extract or translate key information, and iPad Air to take notes during class, students can seamlessly sync everything to MacBook Neo for further review, creating a smooth and connected workflow for capturing, organizing, and learning.After completing schoolwork, students can transition into leisure and entertainment. With GeForce NOW powered by Taiwan Mobile, there is no need to install large game files, while game progress can be saved across devices through cloud saves, enabling access to AAA titles via cloud gaming. From productive learning during the day to relaxing entertainment at night, MacBook Neo paired with Taiwan Mobile's low-latency, ultra-fast 5G and Wi-Fi delivers everything students need for a modern digital lifestyle.Professionals: Unlimited 5G Hotspot Sharing Powers Seamless Work on MacBook AirThe second scenario focuses on professionals, highlighting how to maintain efficiency amid fragmented information and the growing demand for mobile productivity. It also showcases Taiwan Mobile's NT$1,599 monthly plan with unlimited 5G hotspot sharing.With MacBook Air paired with iPhone and Apple Watch, users can stay productive anytime, anywhere. Whether reviewing reports during the commute, delivering presentations on the high-speed rail, or joining last-minute online meetings, they can rely on stable connectivity and smooth performance-turning every location into a mobile workspace.Creators: OP Tech Life and Double Play Plan Enable a Seamless Creative Workflow with Mac miniThe final scenario focuses on creators, demonstrating how OP Tech Life and Double Play Plan, which integrates mobile connectivity and home Wi-Fi, address the challenges of fragmented processes across shooting, organizing, and post-production.When shooting on the go, iPhone 17 Pro Max captures 4K video, while 5G connectivity enables real-time content transfer and processing. Back in the studio, high-speed broadband supports a smooth continuation of the creative process. With AirDrop, files can be quickly transferred and seamlessly integrated with Mac mini and other devices, allowing the entire workflow, from shooting to editing and post-production, to be completed efficiently. This empowers creators to maintain creative momentum and maximize productivity without interruption.Four New "OP Tech Life" Bundles: Elevating Mac Across All ScenariosTo further enhance the Mac experience, Taiwan Mobile's "OP Life" series introduces four curated bundles, providing users with a complete, out-of-the-box solution for various use cases.AI All-in-One Smart Laptop BundlesDesigned for the MacBook Neo, MacBook Air, and MacBook Pro, these bundles pair Mac notebooks with premium Logitech peripherals, including the Lift for Mac Ergonomic Vertical Mouse or the MX Master 4 for Mac Wireless Mouse. These combinations cater to entry-level users, advanced creators, and high-productivity professionals alike.MacBook Neo Bundle: Available for $0 with a NT$1,399 (48-month) plan.MacBook Air & MacBook Pro Bundles: Starting at $15,900 and $34,900 respectively, with NT$1,399 and NT$2,699 (48-month) plans.AI All-in-One Mini Desktop BundleFor desktop users, the Mac mini is paired with the Logitech K580 Wireless Keyboard to meet the demands of home offices and multitasking. This versatile setup is available for $0 with a NT$1,399 (48-month) plan.MacBook Neo AI All-in-One Bundle: $0 with NT$1,399 plan (48 months). Credit: Taiwan MobileOver 1,000 AI Tech Consultants Lower Barriers to Technology Use Across Four Key AreasIn addition to its multi-channel sales rollout, Taiwan Mobile has established dedicated Mac demonstration zones across 100 select myfone retail stores. Nationwide, more than 1,000 AI Tech Consultants are available to support customers. Covering four key areas across product expertise, device connectivity, customer service, and problem-solving, they help lower the barriers to cross-device usage.By integrating 5G and Wi-Fi broadband connectivity, device selection, and value-added content services, Taiwan Mobile aims to enable customers to activate and maximize the value of the Apple ecosystem from the moment they step into the store.Apply for Select Plans for a Chance to Win a Gold Coin; Online Shop Offers Additional Chances to Win MacBook Neo and iPhone 17eFrom now until May 31, 2026, customers who subscribe to, switch to, or renew eligible plans priced at NT$1,399 or above, bundle with select Mac products, and complete registration on the official website by June 2 will receive one entry for a chance to win a gold coin. Customers who subscribe to eligible plans priced at NT$1,599 or above, renew or upgrade their plans, add annual subscriptions for streaming services, or subscribe to "Double Play Plan" with 300 Mbps or higher broadband can receive up to five entries.In addition, customers who apply for designated plans or purchase Mac products via the myfone online shop will have the chance to win MacBook Neo, with an extra draw for iPhone 17e available until April 30. Renewal customers can receive up to NT$1,000 in myfone e-voucher rewards, with an additional NT$200 for social sharing. New subscriptions or number portability applications are also eligible for NT$500 in myfone e-vouchers.Bundle Mac with NT$1,399+ monthly plans by May 31 to win gold coins. Credit: Taiwan MobileSubscribe to Eligible 5G Plans to Enjoy a One-Year Free "GeForce NOW Powered by Taiwan Mobile" Ultra Plan Hourly SubscriptionGet MacBook Neo at $0 with Taiwan Mobile's NT$1,399 monthly plan. Credit: Taiwan MobileCustomers who subscribe to Mac products with designated plans can receive trade-in discounts of up to NT$32,100, along with additional savings of up to NT$5,000 for VIP renewals. MacBook Neo is available at $0 under eligible plans. Furthermore, using the "Open Possible" Co-branded Card for purchases at myfone stores earns 2% cashback, alongside up to 3.5% cashback on telecom bills. Customers will also enjoy a range of value-added services, including a two-month free trial of Apple One, NT$50 App Store billing credits, and up to four months of YouTube Premium. In addition, a 12-month free membership to "GeForce NOW powered by Taiwan Mobile" Ultra Plan Hourly Subscription and a six-month free trial of the OP Scam Buster advanced plan.Taiwan Mobile further offers exclusive benefits such as a three-month free trial of MyVideo, Business Today app, CommonWealth Magazine Digital Subscription, and WeMo PASS, along with NT$50 ride coupons for daily rental services, providing an integrated experience across entertainment, reading, and smart lifestyle services.For streaming services, Taiwan Mobile offers a variety of discounted plans, including Prime Video at NT$89/month (originally NT$169), HBO Max Standard Plan (annual subscription, monthly payment) at NT$160/month (originally NT$220), and Disney+ 24-month add-on plan at NT$199/month (originally NT$285), as well as the Taiwan Mobile exclusive Multi-Streaming Package at up to 44% off. Additionally, customers on the "Double Play Plan" 1Gbps designated plan can enjoy selected home appliances worth up to NT$10,000 at no cost, or up to 10 months free on the Multi-Streaming Package, plus a complimentary 3-month KKBOX trial-delivering a more complete digital entertainment experience.NT$100 Off for Every NT$1,000 Spent on Selected Accessories for MacTaiwan Mobile is also introducing promotions on Mac-related accessories, covering both Apple original products and selected third-party options to enhance the overall user experience. Apple accessories include Magic Mouse with USB-C, Magic Keyboard with USB-C, USB-C Digital AV Multiport Adapter, 240W USB-C Charge Cable, 40W Power Adapter, and 70W USB-C Power Adapter.Selected third-party accessories include laptop sleeves, the Momax ONELINK 8-in-1 USB-C multi-function adapter, magnetic privacy screen protectors designed for MacBook 13.6-inch and MacBook Neo, as well as magnetic aluminum stands, providing a wide range of options for different user needs.

Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology at the Partner Pavilion of the TSMC 2026 North America Technology Symposium. The platform features GUC's in-house full functional HBM4 Controller and PHY IP, integrated with a partner's HBM4 memory, and used TSMC's industry-leading CoWoS advanced packaging technology.GUC's previous-generation HBM3E PHY and Controller, deployed in customers'3nm products, have achieved speeds 15% above specification in production. JEDEC continues to drive an aggressive HBM roadmap, increasing memory throughput and capacity while further doubling the data bus width in HBM4. Comparing with HBM3E, GUC's HBM4 IP delivers 2.5x bandwidth, while improving power efficiency by 1.5x and area efficiency by 2x.In line with GUC's previous HBM, GLink, and UCIe IP solutions, the HBM4 IP integrates proteanTecs' interconnect monitoring solution to provide high visibility for PHY testing and characterizing, while enhancing in-field performance and reliability for end products.To address the growing demand for 3DIC architectures, GUC's HBM4 PHY also supports a face-upconfiguration, enabling integration with TSMC's SoIC face-to-face technology. The PHY macrointegrates TSVs for PHY's I/O signals, power, and ground connections, and also reserves TSVs forpower feedthrough to the top die, supporting the power distribution requirements of the upper logic die."We are proud to be the first company to demonstrate a 12 Gbps HBM4 IP to customers at theTSMC Symposium" said Igor Elkanovich, CTO of GUC. "Together with GUC's UCIe and GLink-3D IPs, we offer a complete 2.5D/3D IP solution for modern 3.5D system architectures, includingTSMC SoIC-X on CoWoS."For more information,please visit our website.12 Gbps Eye Diagram. Credit:Guc