Elitegroup Computer Systems (ECS), a leading global provider of motherboards, mini PCs, and computing solutions, will participate in COMPUTEX 2026 from June 2 to 5, 2026, at Taipei Nangang Exhibition Center, Hall 1, Booth J1317a. Under the theme Power AI Computing, ECS will present its latest motherboards and LIVA Mini PCs, highlighting how compact and scalable PC platforms can support AI Agent workloads, Edge AI processing, smart healthcare applications, and embedded deployments.ECS will demonstrate how LIVA Mini PCs can be flexibly deployed in edge computing environments to support AI-assisted information retrieval, private knowledge base applications, healthcare data monitoring, and embedded commercial deployments. Through these demonstrations, ECS will highlight the role of LIVA Mini PCs in data processing, application execution, real-time monitoring, and vertical use cases. ECS will also showcase motherboard platforms with high-performance expansion capabilities, providing customers with a broader choice of computing foundations for AI and edge applications.Showcasing AI Agent Applications in PC EnvironmentsECS will showcase OpenClaw AI Agent applications running on an AMD desktop PC at its booth, demonstrating how AI Agent capabilities can be applied in PC-based environments. The demonstration will cover common scenarios such as system status queries, information search, and content summarization, showing how AI Agents can help users streamline daily operations and improve information processing efficiency. Through this demonstration, ECS will further present the flexibility and practical value of integrating AI Agent applications into commercial PC environments.LIVA Z11 PLUS. Credit: ECSLIVA One H810. Credit: ECSExtending Edge AI into Healthcare and Private Knowledge ApplicationsECS will showcase the LIVA Z11 PLUS mini PC in two Edge AI and data-driven scenarios: healthcare monitoring and private knowledge base applications. In the healthcare demonstration, the Z11 PLUS will support hemodialysis simulation and FHIR BOX applications, showing how a compact mini PC can serve as an edge computing node for medical data collection, real-time monitoring, and data format conversion.The knowledge base scenario will run a local database with a natural language interface, enabling users to query product and business information more intuitively. This highlights the role of mini PCs in enterprise information access, private data environments, and on-site applications where sensitive information needs to be managed locally. Powered by Intel Core Ultra processors, the LIVA Z11 PLUS provides high-speed storage, dual networking, and USB4 connectivity to support data-intensive Edge AI applications.LIVA Z15 PLUS. Credit: ECSExpanding the LIVA Lineup from AI-ready Performance to Embedded FlexibilityBeyond AI application demonstrations, ECS will present its full LIVA Mini PC lineup and next-generation platforms for commercial, edge, and embedded deployments. The new LIVA Z15 PLUS, built on the Intel Wildcat Lake platform with integrated NPU-based AI acceleration, will be a key highlight of ECS’s LIVA showcase, addressing high-performance commercial use, AI-assisted workloads, and edge computing applications.ECS will also feature the LIVA One H810, extending the LIVA One series' upgradeable socket-type design with the Intel Core Ultra LGA1851 platform. For low-power and embedded applications, the LIVA Z4F offers fanless reliability, while the LIVA Q4 combines an ultra-compact form factor with 45W USB Type-C power input for mobile, space-constrained, and flexible installation environments.

ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting the growing role of quality in scaling AI hardware.As demand for AI infrastructure accelerates, quality is shifting from a manufacturing support function to a direct driver of performance, yield and delivery readiness. While public attention often centers on AI models, ZEISS says reliable hardware execution is becoming a decisive factor in AI deployment.Behind every AI interaction are massive data centers powered by thousands of GPUs. As systems scale from chip to rack, defects in semiconductor packaging, printed circuit boards (PCB/A), cooling systems and high-speed interconnects can affect uptime, deployment speed and total cost."With compute demand surging, manufacturers face record orders, but the challenge is delivering at scale with consistent quality," said Clive Yen, Global Head of Electronics Customer Segment, ZEISS Industrial Quality Solutions. "As systems grow more complex, quality becomes critical to reliable deployment. This is why we work across Taiwan's ODM ecosystem and the full AI server value chain to enable consistent, scalable quality.""At scale, even small defects can become major bottlenecks," said Tonmoy Kundu, Global Head of Sales, ZEISS Research Microscopy Solutions. "Manufacturers need faster insight, tighter process control and trusted failure analysis to accelerate next-generation AI hardware."ZEISS says it offers one of the industry's most comprehensive quality portfolios across the AI hardware value chain, supporting customers from semiconductor packaging and PCB inspection to liquid cooling, optical connectivity and final rack integration.At the forum, ZEISS will showcase solutions for advanced high-bandwidth memory (HBM), where rising stack heights and shrinking interconnect dimensions require high-resolution, non-destructive inspection and deep defect analysis.The company will also present metrology solutions for co-packaged optics (CPO), where ultra-tight tolerances for FAU and MPO connectors are essential to maintain alignment, coupling efficiency and long-term transmission reliability in 51.2T+ networks.At the exhibition hall (Booth J1109 | TaiNEX Hall 1, Taipei), ZEISS will showcase technologies spanning wafer process control, advanced packaging, X-ray inspection, electron microscopy, light and digital microscopy, and coordinate measuring machines. Applications will focus on chip manufacturing, PCB reliability, thermal management systems, connector quality and L10-L11 rack mechanical parts assembly.COMPUTEX 2026 runs June 2-5 in Taipei, where ZEISS will position quality as a foundational enabler of the next wave of AI growth. ZEISS will speak at the official COMPUTEX 2026 Forum on June 4, 4:30 p.m. to 4:55 p.m. at TaiNEX 2, Room 701, presenting "Quality Innovation Across the AI Chip-to-Rack Stack." The session will feature Tonmoy Kundu and Clive Yen. 

SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth memory(HBM) package for next-generation HBM products.Heat management has become a critical challenge as HBM technology advances with higher stacking and faster speeds to cater to the surging demand for AI data processing.The efficient management of power density in the Die-to-Die Physical Layer (D2D PHY) - the interface connecting HBM and GPU - has emerged as a key factor defining the competitiveness of next-generation HBM.With the iHBM solution, the company has taken a structural approach to addressing the heat management issue. Existing HBM products rely on an indirect cooling method that draws heat away through the core die. In contrast, the iHBM solution places ICEs directly in the D2D PHY area where heat concentration is the highest, creating an additional 'heat dissipation path'. This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.The company's mass-production capabilities also serves as a key advantage. SK hynix's Wafer Level Packaging(WLP) process, based on its market-proven Mass Reflow Molded Underfill(MR-MUF) technology, enables stable high-volume production of iHBM-equipped chips. Furthermore, the solution offers high design compatibility with existing System-in-Package(SiP) architectures, allowing customers to adopt the new thermal technology with minimal design adjustments.Through the iHBM solution, slated for deployment in next-generation HBM products, including HBM5, SK hynix aims to increase the stability and operational efficiency of HPCs, AI data centers by meeting heat management standards required in high-density and high-bandwidth environments."iHBM is an optimal solution for thermal management, combining our memory design capabilities with advanced packaging technology," said Kangwook Lee, Senior Vice President and Head of PKG Development at SK hynix, adding "The company will cement its AI memory leadership by taking preemptive steps to offer values needed in the AI environment for its customers."

With the first phase of the European Union's Cyber Resilience Act (CRA) set to take effect imminently, German-based automated cybersecurity compliance provider ONEKEY, together with its Taiwanese local partner Trinity Technologies, notes that the CRA elevates product cybersecurity from a "one-time audit" to a "long-term governance" framework. Its review documentation and reporting processes are subject to an extremely rigorous compliance framework. To this end, ONEKEY and Trinity Technologies jointly recommend that Taiwanese ICT companies prepare early, leveraging localized professional support and automation tools to complete verification, and transform compliance pressures into market competitiveness.Cybersecurity Management Obligations Extend from Shipment to the Entire Lifecycle, Making Reporting Mechanisms a New Challenge for EnterprisesThe CRA will first implement vulnerability reporting and response mechanisms on September 11, 2026, and will take full effect on December 11, 2027. At that time, companies that have not achieved compliance will not only face substantial fines but may also see their products banned from sale in European countries. The CRA requires that all "Products with Digital Elements" (PwDE) fully incorporate cybersecurity management during planning, design, development, and maintenance, and address vulnerabilities throughout the entire product lifecycle. Consequently, most information and communications technology (ICT) supply chains—including smart home devices, connected devices, industrial control products, automotive electronics, and software solutions—are directly facing the impact of CRA regulations.Although the CRA is set to take effect in early September, a survey by ONEKEY reveals that as many as 68% of companies remain unfamiliar with the specific details of the CRA. ONEKEY notes that most manufacturers face four common misconceptions regarding the CRA regulations. First is a misjudgment of the implementation timeline, overlooking the fact that the "24-hour vulnerability reporting obligation" will take effect on September 11, 2026;second is a misunderstanding of responsibility, failing to elevate product safety to the level of "product governance"; third is a lack of compliance evidence, as a single penetration test is no longer sufficient to meet EU audits; and finally, manufacturers must be responsible for the overall safety of their products, which means the entire product supply chain must also comply with the CRA regulations.Five-Step Guide for Manufacturers to Build a Reproducible Operational Model, Starting with a Product Line InventoryJan Wendenburg, CEO of ONEKEY, stated: "We are at a turning point where global products face stringent cybersecurity requirements. With the EU's implementation of the CRA, cybersecurity is no longer a 'nice-to-have' for products, but rather a 'passport' for entering the European market. Many manufacturers possess world-class hardware engineering capabilities, but when faced with complex software supply chains, they often lack real-time, auditable transparency. ONEKEY's mission is to help clients bridge compliance gaps, guiding them from a 'good enough' approach toward full lifecycle cybersecurity governance."To transform this situation, ONEKEY leverages integrated platform technology to weave SBOM automation, vulnerability prioritization, impact assessment, and compliance guidance throughout the entire product lifecycle. This helps manufacturers establish a monitoring system ready for audits at any time, fundamentally resolving compliance challenges. Currently, ONEKEY has assisted global giants in Taiwan—including and ZyXEL—in aligning with CRA compliance requirements. Leveraging its extensive experience in CRA compliance, ONEKEY recommends that manufacturers follow these five steps to progressively achieve CRA compliance, thereby creating a repeatable compliance operating model. This transforms product "compliance" into a powerful competitive advantage, enabling them to seize the initiative in the European market. 1. Assess the product portfolio: Prioritize identifying which networking equipment, industrial computers, or IoT devices will be sold in the European market after 2026 and 2027. 2. Comprehensively establish a Software Bill of Materials (SBOM): For the aforementioned products, create an SBOM by scanning source code and binary code, ensuring it includes legacy firmware and vendor-provided firmware.3. Establish a Product Security Incident Response Team (PSIRT) process: Ensure that a dedicated team can assess the scope of impact within 24 hours of a vulnerability disclosure, fulfill reporting obligations, and proactively implement remediation.4. Implement "Shift-Left" Development: Integrate binary analysis and SBOM checks into every software development and firmware release cycle as a final pre-shipment verification.5. Turn Evidence into a Marketing Asset: Encourage the public disclosure of these automated detection results and compliance evidence to demonstrate product security as a key differentiator to European buyers.Incorporating AI Compliance Pathways Aiming for 100% Certainty into Automated TestingRegarding the application of AI in automated testing technology, ONEKEY emphasizes that while AI adoption certainly improves efficiency, it must also adhere to non-negotiable standards of determinism for cybersecurity compliance. Unlike the generative AI commonly found in the market today—which is prone to "hallucinations" or misjudgments—the AI models adopted by ONEKEY focus on the auditability and accuracy of results. Wendenburg stated, "In the realm of legal compliance, 'mostly correct' is 'wrong.' When EU auditors request proof of compliance, vendors cannot provide a result that is merely a guess generated by AI."To implement "Responsible AI," ONEKEY's technical architecture combines in-depth binary static analysis with rigorously validated deterministic algorithms. This means that every decision made by the system—whether scanning firmware, generating an SBOM, or matching against CRA regulatory requirements—is backed by clear logical reasoning and technical evidence. This approach ensures the system does not produce false regulatory determinations, preventing enterprises from falling into compliance traps due to AI false positives and even facing unnecessary legal litigation risks.Wendenburg emphasized that cybersecurity compliance requires not an AI that writes poetry, but a digital audit assistant with a high degree of "certainty." Through this rigorous technical approach, ONEKKEY assists Taiwanese companies in navigating the complex provisions of the CRA to produce legally valid compliance evidence that withstands official EU verification, reducing the error rate in regulatory judgments to near zero and fundamentally protecting the company's market reputation and operational rights.Trinity Technologies Strengthens Localized Technical Support to Help Manufacturers Become Trusted Security Partners in the EUChen Zhaoren, founder of ONEKEY's Taiwanese partner Trinity  Technologies, pointed out that as a global hub for the ICT industry , time has become the most pressing cost factor for enterprises in Taiwan as the EU's CRA regulations are set to take effect. He observed that while Taiwanese contract manufacturers have traditionally relied on "fast delivery" and "value for money" as their core competitive advantages, future market dynamics will shift toward "Secure by Design" and "supply chain transparency." Currently, EU brands have begun formally shifting the responsibility for providing Software Bill of Materials (SBOM), vulnerability reporting obligations, and up to five years of security maintenance to their Taiwanese supply chain partners. This means that Taiwanese manufacturers can no longer remain on the sidelines of this compliance wave.To help enterprises navigate these stringent regulatory hurdles, Trinity  Technologies is committed to localizing world-class tools like ONEKEY to assist Taiwanese companies in reshaping their R&D and quality assurance management processes. Through comprehensive protection technologies that integrate source code and binary firmware, Trinity  Technologies helps manufacturers establish automated compliance evidence chains and vulnerability response mechanisms without sacrificing cost-effectiveness. This not only accelerates clients' procurement review processes but also helps Taiwanese manufacturers transition from mere hardware suppliers to "security strategic partners" trusted long-term by the EU market, enabling them to withstand low-cost competitors in a regulation-driven competitive environment.Smart Compliance Wizard and Fast Start Program  Helping Enterprises Simplify Processes and Accurately Identify GapsTo help clients quickly grasp, organize, and implement the CRA regulations, ONEKEY has launched the "CRA Fast Start" acceleration program—specifically designed for equipment, machine, and system manufacturers—to assist companies unsure where to begin. Through automated software, the program addresses three key areas—readiness assessment, systematic vulnerability management, and 24/7 continuous monitoring—to guide companies step-by-step in identifying gaps in their existing processes and precisely pinpointing discrepancies with compliance standards.Additionally, ONEKKEY actively participates in the EU-funded Digital Europe program "CRA Compliance Wizard" and has integrated it into its products to provide automated guided workflows. Customers need only upload firmware binary files; the system automatically analyzes vulnerabilities and compares them against regulatory requirements, guiding enterprises through technical and organizational questions to generate a CRA-compliant "Statement of Compliance" and audit trail with a single click. This streamlines the previously cumbersome process of manually creating documents—which required significant legal and engineering resources—transforming it into an intelligent software tool that simplifies regulatory compliance in daily operations.If addressing EU CRA regulations is likened to a military campaign, "CRA Fast Start" serves as a "training and advisory program" that helps enterprises inventory their resources, formulate strategies, and build a defense system; meanwhile, the "Compliance Wizard" is the "intelligent detection weapon" used by R&D and QA personnel in actual operations to scan for product vulnerabilities, accurately answer regulatory questions, and generate certificates of compliance. The two complement each other, not only simplifying complex processes but also helping manufacturers transform compliance costs into a strategic advantage for entering the European market.Actively Preparing for the Phase 1 Deadline: Turning Compliance Pressure into a Strategic Advantage for Entering EuropeAs the September 11 deadline for the first phase of vulnerability reporting obligations draws near, Taiwanese ICT manufacturers can no longer afford to sit on the sidelines. The entry into force of the CRA not only signifies a comprehensive raising of the EU's product cybersecurity standards but also marks a survival-of-the-fittest test of supply chain resilience. Faced with extremely complex review documents and the stringent 24-hour reporting deadline, traditional manual response models can no longer meet compliance requirements. If manufacturers fail to promptly establish an automated vulnerability management and continuous monitoring system, they not only face the legal risk of product withdrawal from the market but may also lose their competitive edge as EU brands reshape their supply chains.Amid this tidal wave of compliance, the first step in proactive preparation lies in implementing a "product safety incident response team," "shifting security left," and "supply chain transparency." Through ONEKEY's automated compliance tools and Trinity Technologies' localized professional support, enterprises can start by inventorying their product lines to rapidly build highly reliable SBOMs and technical evidence chains. This transformation effort should not be viewed as a burdensome "compliance tax", but rather as a "market passport" for building international trust and countering low-cost competition. By taking action now and leveraging automation to bridge process gaps, companies can confidently turn regulatory challenges into a powerful moat for deepening their presence in the European market when the new regulations take effect in 2026.ONEKEY and Trinity Technologies meet to discuss CRA compliance solutions. Credit: DIGITIMESONEKEY CEO Jan Wendenburg explains CRA regulations and strategies for Taiwanese ICT companies. Credit: DIGITIMES

iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical AI platforms. At COMPUTEX 2026 (June 2–5), iCatch will showcase its latest PAISB solutions at Booth #R0826, Nangang Exhibition Center Hall 2, 4F.As Physical AI systems rapidly evolve, developers are increasingly challenged by the complexity of multi-sensor synchronization, high-bandwidth data ingest, and image quality tuning, which often diverts resources away from core AI development. iCatch's PAISB platform directly addresses this challenge by introducing a hardware-accelerated, HSB-aligned imaging pipeline that enables deterministic, low-latency data transfer into NVIDIA GPU platforms. By offloading sensor ingest, synchronization, and imaging processing into a dedicated ASIC, PAISB allows developers to focus on AI model innovation and system-level applications, positioning iCatch as a key enabler within the NVIDIA Holoscan ecosystem for next-generation robotics, autonomous systems, and Physical AI deployments.At COMPUTEX 2026, iCatch will demonstrate two key PAISB platforms that highlight this capability. The PAISB-E1 (1GbE) can run stereo vision applications on NVIDIA platforms, designed for smart actuators and dexterous robotic manipulation requiring precise depth perception and real-time responsiveness. In parallel, the PAISB-E10 Proto-ES (10GbE) will showcase Tele/Wide imaging with EIS on NVIDIA platforms, targeting humanoid robot edge platforms and robotic factory simulation server environments. These demonstrations illustrate how PAISB enables time-aligned, high-bandwidth multi-sensor streaming while simplifying system integration."PAISB represents a key milestone in iCatch's Physical AI platform strategy," said Weber Hsu, President of iCatch Technology. "As the first HSB-aligned Imaging ASIC, PAISB enables AI developers to focus on model innovation by abstracting sensor-level complexity. We are committed to building the sensor infrastructure layer that accelerates Physical AI deployment across robotics and autonomous systems."iCatch invites industry partners and developers to visit the booth at COMPUTEX 2026 to experience live PAISB demonstrations and explore collaboration opportunities. Learn more about PAISB and Schedule a meeting or request information.

Founded in 1986, PANJIT Group is approaching a major milestone: its 40th anniversary. In an exclusive interview, founder and Group President Jason Fang reflected on the company's entrepreneurial journey, which began shortly after completing his military service, when he launched a red-brick manufacturing business specializing in tunnel kiln technology that later became the largest brick factory in southern Taiwan.Looking back on those early years, Jason Fang believes entrepreneurship is built on respecting professional expertise, building the right values within an organization, and fulfilling corporate social responsibility. These principles laid the foundation for PANJIT's evolution into a leading Integrated Device Manufacturer (IDM) in the power semiconductor industry, with capabilities spanning wafer fabrication, packaging, and testing.Like any enduring enterprise, PANJIT's journey came with its share of challenges. Along the way, a key source of the company's strength has been the close partnership between Jason Fang and his brother, Chairman & CEO Jeff Fang. With complementary leadership styles and strong execution capabilities, the two brothers have worked side by side for four decades, guiding PANJIT through every stage of its growth.Turning the Vision of "Power Semiconductors as the Backbone of Industry" into RealityPANJIT was founded during Taiwan's rapid industrial transformation in the 1980s, when the economy was shifting from traditional manufacturing toward a rapidly growing technology sector. Recognizing the long-term potential of foundational electronic components, Jason Fang chose to enter the power semiconductor industry despite having little prior experience in the field.He believed that every electronic device ultimately depends on efficient power components, viewing power semiconductors as the backbone of modern electronics. The vision, that power semiconductors would become the backbone of the modern electronics industry, became the driving philosophy behind PANJIT's development. Through the collective efforts of Jeff Fang and the entire PANJIT team, has steadily become reality over the past forty years.In its early days, PANJIT entered the market through packaging technologies for fundamental components such as power diodes. Technical support initially came through a Korean supply chain connected to Fairchild Semiconductor, allowing the company to begin as an OEM supplier serving the European home appliance market.Through close collaboration with customers, PANJIT gradually established its quality systems, manufacturing foundation, and domestic supply chain ecosystem, strengthening its operational capabilities and building a solid foothold in the market.Three Key Milestones Behind PANJIT's Rise in Automotive and Data Center Power SemiconductorsThe first came during the Y2K era around 2000, when rapid growth in ICT products and compact consumer electronics accelerated the industry's shift from through-hole components to surface-mount devices (SMD). Recognizing this trend early, PANJIT imported advanced equipment from Switzerland and quickly expanded into the SMD segment, capturing its first major growth opportunity.The second milestone came during the COVID-19 pandemic in 2020. Surging demand for notebooks and electronic devices placed heavy pressure on semiconductor supply chains, making capacity expansion a top industry priority. PANJIT accelerated expansion at its Xuzhou manufacturing base while restructuring its solar panel business to refocus resources on core semiconductor operations. As Jason Fang described it, the company chose to "rise again from where it once faced setbacks."The third turning point emerged from tightening global automotive semiconductor supply chains beginning in 2024, often referred to by the media as the "Nexperia supply disruption." During this period, PANJIT successfully transitioned from a secondary supplier to a primary sourcing partner for many customers. By providing stable supply, competitive pricing, and strong manufacturing support, the company rapidly expanded its automotive power semiconductor business, with automotive applications accounting for approximately 40% of revenue, while further advancing into AI data center and medium- to high-voltage DC power solutions.Expanding the PANJIT Brand in the Global MarketPANJIT's expanding presence in the global automotive supply chain began taking shape as early as 2018, when increasing numbers of Tier 1 automotive customers approached the company in search of additional sourcing partners. This opportunity also highlighted the need to further strengthen product quality and manufacturing systems.While PANJIT's earlier business focused primarily on consumer electronics, automotive applications required a much higher level of reliability and quality assurance. To meet these standards, PANJIT worked with a German team in Europe to establish automotive-grade quality and manufacturing systems, rebuilding its quality management framework over two years.Beginning in 2020, PANJIT significantly increased investment in automotive and high-performance power semiconductor technologies. Through its R&D teams, the company expanded product lines compatible with leading European solutions while investing approximately USD 300 million between 2020 and 2023 to strengthen its competitiveness in the automotive market.By 2024, PANJIT had further expanded its third-generation semiconductor portfolio to include silicon carbide (SiC) products, addressing growing demand from AI data centers and next-generation infrastructure applications. With a strong focus on automotive and AI-related medium- and high-voltage DC power solutions, the PANJIT brand has steadily gained recognition in the global market.At the same time, PANJIT continued expanding its global manufacturing footprint while strengthening Taiwan as its core R&D and advanced packaging hub through manufacturing sites in Kaohsiung. To enhance supply chain flexibility amid evolving geopolitical conditions, the company launched a new packaging production line in the Philippines in 2023. In 2025, PANJIT further expanded its global operations by acquiring a 95% stake in TOREX Vietnam Semiconductor Co., Ltd., including its manufacturing facility. These expansions further strengthened production flexibility, regional capacity allocation, and diversified sourcing options for customers worldwide.PANJIT Advancing into New Frontiers to Power the FutureBuilt upon four decades of steady development, PANJIT is now preparing for its next phase by expanding its international product portfolio, advancing technology capabilities, and cultivating global talent resources to further elevate the PANJIT brand worldwide.Looking ahead, Jason Fang identified three key strategic markets for the company's future development: continued expansion across Europe and the United States, deeper operations within China's increasingly self-sufficient semiconductor ecosystem, and broader opportunities in Japan through collaboration with customers, suppliers, and industry partners.Beyond business expansion, Jason and Jeff Fang also hope to build long-term partnerships with organizations that share similar values while supporting the revitalization and future growth of Japanese industry through collaboration and mutual success.Guided by its vision to "Power the Future," PANJIT continues to expand its global brand presence across the Americas, China, and Japan as the company moves confidently toward its next forty years of growth and innovation.PANJIT Group executives and guests from around the world celebrated its 40th anniversary. Credit: PANJIT

As Large Language Model (LLM) reasoning capabilities continue to evolve, AI Agents have officially surpassed passive "Copilots" to become the core of global digital transformation. These agents are now capable of autonomous planning, multi-step execution, and real-time strategic adjustments, marking a shift in how organisations approach digital transformation. According to MarketsandMarkets' "AI Agents Market Report (2025–2030)," the global AI Agent market is projected to experience explosive growth over the next five years, reflecting widespread enterprise adoption.At AI Expo Taiwan 2026, this shift was a central theme across the event, with multiple organisations highlighting agent-based architectures. HCLTech was among those presenting its perspective under the theme "Are You Agent-Native Yet?". The company showcased a suite of solutions tailored for semiconductor manufacturing and financial services aimed at helping enterprises operationalise AI agents and integrate them into core business processes.Commenting on the evolving AI landscape, Terry Tai, Country Leader of HCLTech Taiwan, noted that "under the traditional Copilot model, humans act as coordinators, giving specific instructions via chat interfaces for AI to execute. In the AI Agent era, however, these agents take a high-level objective, autonomously plan, orchestrate tools, and iteratively complete tasks. Humans have transitioned from coordinators to supervisors and are no longer bogged down by tedious intermediate steps.""The real shift comes down to reasoning capability," said Alan Flower, Executive Vice President and Global Head of Cloud and AI Labs at HCLTech. "It's what allows the latest Frontier models to work through complex intermediate steps, with agentic frameworks enabling shared knowledge across the new multi-model, multi-agent solution domain.As organisations move to AI-Native approaches, it's becoming clear that this isn't just a technology change, it's a cultural transformation as organizations re-engineer their core value streams to be augmented and delivered by agentic AI. You need to think about the responsibilities you are prepared to delegate to AI, retain human-in-the-loop, or allow fully autonomous human-on-the-loop approaches. You need to reskill and train your workforce; teach them to assemble teams of AI agents to whom they will delegate work. For example, software engineers now need to describe software, and delegate the coding to agents, not write all of it themselves."Solving Smart Manufacturing Pain Points: HCLTech Kinetic AI.InspectTaiwan's semiconductor and high-tech industries lead the world, yet traditional facility inspections still struggle with high labor costs and significant safety risks. For instance, in a semiconductor wafer fab, engineers can spend considerable time merely complying with gowning and entry protocols before addressing a single device malfunction. These logistical delays represent a significant, yet often overlooked, hidden cost for high-tech manufacturers.HCLTech featured Kinetic AI.Inspect at the expo, a solution specifically designed to address these pain points. HCLTech builds "Hybrid Inspection Fleets" using quadrupeds (robot dogs) and drones, integrated with 3D reality capture and real-time AI analysis. This solution, already deployed by a leading global aircraft manufacturer, has delivered significant results: reducing unplanned downtime by 30%, increasing inspection frequency by 30x, and boosting post-processing productivity by up to 95%.Flower pointed out that with Kinetic AI.Inspect, if a robot dog detects an anomaly, it doesn't just sound an alarm; it can autonomously trigger an ERP system check for spare parts. If no stock is found, it automatically generates a Purchase Order (PO) to initiate the repair process. This Agent-Native flexibility is something traditional, stationary IoT sensors cannot achieve.Tai added that these applications extend across all manufacturing sectors, including steel, petrochemicals, and offshore wind power, where reducing on-site human risk is critical. Many Taiwanese firms expressed strong interest at the event and are currently planning Proof of Concepts (PoC).Implementing Agentic SDLC with HCLTech AI ForceBeyond manufacturing, HCLTech introduced the AI Force platform for the software-heavy tech sector. This platform supports the full Agentic SDLC (Software Development Life Cycle), covering automated requirement documentation, API specification architecture, and code refactoring. Internal benchmarks show a 30% increase in development speed, a 45% boost in testing efficiency, and a 60% acceleration in legacy application modernization. As a TSMC Design Center Alliance (DCA) partner, HCLTech also applies AI to semiconductor R&D, automating specification interpretation and test plan generation to maximize engineering throughput."When you look at the B2B Accounts Payable landscape, the scale is enormous - in Taiwan alone it's worth around USD 215 billion annually. Yet much of it still runs on manual processes, with global Straight-Through Processing rates sitting at just 32.6%," said Tai."What we're seeing is a shift. By applying specialised agents to tasks like data extraction and duplicate payment detection, it's possible to move beyond those constraints. In some cases, STP rates are rising above 80%, invoice processing costs are dropping by more than 60%, and duplicate payments are falling to under 1%."With over 200,000 employees globally, HCLTech operates innovation labs in the US, UK, Germany, India, and Singapore. In late 2025, HCLTech partnered with NVIDIA to launch an AI Lab focused on scaling Physical AI and cognitive robotics for industrial use. By assessing technical maturity and data readiness, HCLTech continues to help enterprises explore and incubate new technology use cases as their primary AI transformation partner.To find out more, please visit HCLTech.HCLTech at AI Expo Taiwan 2026. Credit: HCLTech

National Yang Ming Chiao Tung University (NYCU) successfully hosted the 2026 Global Consortium for Innovation and Engineering in Medicine (GCIEM) Global Summit. This international academic exchange highlighted that the cross-disciplinary integration of medicine and engineering has entered a stage of systematic development. Dr. Albert C. Yang, Chairman of the Department of Medicine and Director of the Center for Digital Medicine and Smart Healthcare at NYCU, pointed out that Taiwan is progressively stepping outside traditional medical education frameworks to cultivate interdisciplinary talent bridging engineering and healthcare. The summit served as a crucial opportunity to showcase the results of these long-term investments to a global audience.ASUS showcased its smart healthcare strategic layoutroadmap at the summit. Joe Hsieh, Chief Operating Officer of ASUS, stated that in addition to its talent pool, Taiwan possesses key foundational advantages such as comprehensive medical data, industry agility, and system integration capabilities. While these factors have accelerated the real-world deployment of related applications, ASUS remains committed to further elevating Taiwan's global visibility through ongoing industry-academia collaborations and continuous international platform connections.GCIEM Strengthens International Ties; ASUS Showcases Smart Healthcare SolutionsThe inception of GCIEM traces back to post-pandemic international exchanges. In 2022, an NYCU delegation visited the University of Illinois Urbana-Champaign (UIUC) and observed that certain academic and research institutions had already integrated engineering into medical education. This catalyzed the joint efforts to establish GCIEM and its annual summit mechanism. Following the inaugural summit in the U.S., Taiwan was selected to host the second edition. Dr. Yang believes that hosting the summit in Taiwan allowed the international community to witness Taiwan’s departure from traditional medical education, systematically demonstrating its achievements in med-tech integration while strengthening global ties.As a global leader in smart healthcare, ASUS participated in GCIEM 2026. At the summit, the company aimed not only to demonstrate its technical expertise but also to validate Taiwan's integration capabilities in engineering medicine. Joe Hsieh noted that ASUS has long been strategically positioned in medical applications. Its technological focus has evolved from early physiological data collection via the ASUS VivoWatch smart health watch and medical imaging utilizing the ASUS Handheld Ultrasound, to advanced AI applications. Progressing from sensor technology and medical image processing to model-driven AI, ASUS is now advancing toward No-Code AI platforms and Agentic AI, showcasing the evolution of medical technology from assistive tools to intelligent decision-making systems.NYCU and ASUS have collaborated extensively in recent years to integrate smart healthcare systems. A prime example is the clinical application of the ASUS VivoWatch smart health watch, which collects physiological signals to assess risks related to sleep, stress, and sleep apnea. Additionally, the introduction of Ambient AI-powered voice recognition technology has significantly enhanced clinical documentation efficiency and optimized medical workflows. Reflecting on these collaborative experiences, Dr. Yang asserted that Taiwan’s smart healthcare capabilities, in terms of both clinical techniques and medical quality, are on par with those of other advanced nations. He believes that international platforms like GCIEM will continue to expand Taiwan's global visibility, systematically presenting its achievements and advantages in the smart healthcare sector.NYCU Highlights Physician-Engineer Program to Deepen MedTech IntegrationDr. Yang further pointed out that the integration of medicine and engineering has progressed from the application layer to the talent cultivation system. To address this, NYCU has implemented a six-year Physician-Engineer Program within its Department of Medicine. The program equips medical students with a solid foundation in electrical engineering and computer science, fostering the cross-disciplinary expertise needed to drive medical innovation and bolster Taiwan's talent advantage in both fields. Joe Hsieh added that beyond talent, Taiwan possesses critical competitive advantages, including comprehensive medical data, industry speed, and exceptional system integration capabilities. [1] Joe Hsieh stated that in addition to talent, Taiwan possesses key competitive advantages such as data, speed, and system integration capabilities.He noted that Taiwan's highly concentrated industrial supply chain enables rapid technical integration and product deployment, while its long-accumulated data provides ideal conditions for AI model training.[2] Regarding medical data, Taiwan's long-accumulated data foundation provides optimal conditions for AI applications. Furthermore, the high concentration of Taiwan’s industrial supply chain enables rapid technical integration and product deployment, ensuring extraordinary industrial responsiveness. In terms of system integration, the capability to transform systems into total solutions remains a core advantage of Taiwan's MedTech ecosystem.Addressing collaborations with academic and research institutions, Joe Hsieh pointed out that as AI enters a phase of high specialization, healthcare is a field with significant barriers to entry. This requires deep, tripartite collaboration between enterprises, academia, and medical institutions to effectively bridge technology with clinical needs. He stated that Taiwan's unique geographical and industrial concentration accelerates the verification and deployment of medical research findings. ASUS has currently deployed hundreds of engineers to develop medical AI, utilizing industry-academia-research collaborations to streamline the path to bringing efficient and high-impact results to real-world clinical applications.AI Enters Clinical Decision-Making; Trust Remains the Key to Healthcare SystemsJoe Hsieh further noted that AI's role in the medical field is rapidly transforming. Medical AI has progressed from the early AI 1.0, which focused on image recognition, to AI 2.0, capable of integrating multimodal data. Moving forward, it will transition into Agentic AI featuring task execution and proactive collaboration capabilities, gradually entering the core of medical workflows.Dr. Yang emphasized that AI's clinical positioning is not to replace physicians, but rather to serve as a support system for preliminary screening and alerts. In areas such as image interpretation, endoscopy, and critical care decision-making, AI assists in improving efficiency and reducing the risk of human omission.As AI evolves from assisting in interpretation to participating in workflows, the depth of its application increases. However, the high requirements for accuracy and accountability in healthcare make trust a critical factor for adoption. Joe Hsieh pointed out that due to the inherent uncertainty in AI judgments, reliability must be enhanced through foundational computing power, trustworthy models, and multi-model cross-validation mechanisms.The question of whether Taiwan can transition from a technology adopter to a standard-setter against the backdrop of rapid medical AI development has become a key focus for both the medical and tech industries. Dr. Yang mentioned that standards are not formed through a top-down approach; instead, they emerge from applications recognized by frontline medical staff. These practical experiences are gradually refined and accumulated, eventually transforming into followable guidelines. Joe Hsieh added that the core of standardization lies in verifiability. Establishing consistent workflows through multi-model cross-validation to drive the standardization of decision-making mechanisms will be an essential foundation for developing medical Agentic AI. Throughout this process, Sovereign AI serves as the critical foundation for ensuring data and model autonomy. By leveraging its existing advantages in medical data to build sovereign models and application ecosystems, Taiwan has the opportunity to secure a stronger voice and greater strategic influence in the global development of medical AI.Refocusing on the Patient-Physician Relationship in the Era of AI WorkflowsRegarding the future development of smart healthcare in Taiwan, Dr. Yang suggested starting by enhancing patient-physician interactions. He cited the concept of a "computerless clinic," powered by Ambient Clinical Intelligence (ACI), as a prime example. In this scenario, wearable sensors and Ambient AI systems collect and analyze patient physiological data in real time, while automatically generating electronic health records (EHRs), ordering tests, and entering data into backend systems. This innovation ultimately frees the consultation process from the distractions of manual computer operations.Joe Hsieh concurred, adding from the perspective of real-world deployment that multiple Agentic AI systems featuring voice recognition, image analysis, and sensory capabilities could operate synergistically in the future. This collaborative approach establishes a digital assistant architecture with a clear division of labor. Combined with wearable devices and smart glasses, technology can be integrated seamlessly and invisibly into medical workflows to provide real-time information. This ultimately allows physicians to focus entirely on clinical judgments and patient interactions, thereby elevating overall efficiency and quality of care.Dr. Yang concluded by pointing out that hosting GCIEM 2026 has allowed Taiwan to transition its role in med-tech integration from a mere participant to an active practitioner. As AI advances from a supportive tool to decision-making and execution, the competitive focus within the healthcare industry is shifting from singular technical capabilities to system integration and the establishment of trust mechanisms. The collaboration between ASUS and NYCU demonstrates the pathway from talent cultivation and data accumulation to real-world deployment, gradually forming a replicable and scalable development trajectory. With cross-disciplinary capabilities serving as a solid foundation, Taiwan is poised not only to participate in this smart healthcare transformation but also to define its future direction.

iCatch Technology announced that its 360-degree vision-based obstacle avoidance system has been successfully integrated into Avilon Intelligence's drone platform. Through four camera modules, multi-view image perception, real-time AI vision processing, and flight-control coordination, the system enhances autonomous flight safety, stability, and intelligence in complex environments.Compared with traditional single-direction or partial obstacle avoidance architectures, iCatch Technology's 360-degree vision-based obstacle avoidance system uses four camera modules to build a more comprehensive surrounding perception capability. This allows drones to simultaneously understand environmental information from multiple directions, including front, rear, left, and right, effectively reducing collision risks while improving flight stability and mission success rates.The integration between iCatch Technology and Avilon Intelligence demonstrates the practical application value of the 360-degree vision-based obstacle avoidance system on a real drone platform. By combining the 360-degree module system, image input, real-time computing, and flight-control coordination, drones can move beyond simply "seeing the environment" toward "understanding the environment and actively avoiding obstacles," making intelligent flight a truly deployable system capability.Weber Hsu, General Manager of iCatch Technology, stated: "360-degree vision-based obstacle avoidance is not only an upgrade in obstacle avoidance capability, but also an important foundation for drone platforms moving toward advanced autonomy. Through a comprehensive visual perception architecture and modular integration capability, we aim to help customers shorten development cycles, lower integration barriers, and enable more drone platforms to complete integration faster and truly take flight."Dafeng Huang, Chief Technology Officer of Avilon Intelligence, stated: "Our collaboration with iCatch Technology is not merely the adoption of a single module, but an important milestone in integrating visual perception capabilities with drone platforms. Based on Avilon Intelligence's existing autonomous flight controller and Visual SLAM architecture, the system further combines iCatch Technology's panoramic imaging and depth perception capabilities. In indoor environments without GPS, it can improve positioning accuracy and obstacle avoidance response. In outdoor scenarios where GPS signals are interfered with or obstructed, real-time image capture and environmental recognition can also support navigation decisions, further enhancing flight stability and mission reliability. This provides more resilient technical support for drone applications in highly complex environments."Through this successful integration with Avilon Intelligence's drone platform, iCatch Technology once again demonstrates its technical strengths in AI vision SoCs, image sensing integration, and drone application system development. Looking ahead, iCatch Technology will continue to promote a modular sales model, helping drone manufacturers avoid the complex process of redeveloping hardware. From assembly and integration to deployment, the solution enables products to take flight faster and business opportunities to be realized sooner. iCatch Technology will also continue working with partners to promote safer, smarter, and more practical drone solutions, redefining the core value of next-generation intelligent flight. 

Montreal-based AON3D is setting a new standard through its mastery of high-performance materials and precision 3D printing technology.Co-founded in 2015 by Andrew Walker, Randeep Singh, and Kevin Han - who started the company in his family's basement - AON3D has evolved into a global leader in high-performance additive manufacturing.With an eye on the Taiwan market at COMPUTEX 2026, Han and his team are ready to bridge the gap between complex aerospace technology and the agile SME ecosystem.The Materials Engineer's VisionKevin Han's journey began at McGill University with a background in materials engineering. After operating as a service bureau, Han recognized a gap in the market for machines capable of handling specialized materials. Through multiple product iterations, AON3D today offers it's Hylo High-Temperature 3D Printer, along with Basis, it's advanced physics simulation software for additive manufacturing. Hylo and Basis: AI-Infused and Physics-BasedAON3D's product suite offers an AI-infused manufacturing solution that reduces the trial and error usually experienced in additive manufacturing processes. "What we do is actually model out at the physics level what's going to happen as you run the print job," says Han. "Our technology creates a digital twin of the print, meaning we can use simulation to identify process irregularities that lead to hidden defects, instead of in post-production."Within the Basis platform, simulated data and real data are also compared to offer automatic optimizations. The Power of "Open Materials"AON3D's primary competitive advantage is its "Open Materials" philosophy. Unlike competitors that "lock" users into proprietary, expensive filament spools - much like the cartridges on a paper-based printer - AON3D's platform is supply-agnostic. "We support the full gamut of industrial polymers, but many customers are most interested by high-performance varieties like PEEK, PEKK, and PEI (Ultem)," Han explains. "This includes their carbon and glass-fibre variants, where strength and lightweighting benefits most appeal to demanding industries like aerospace and defense." From NASA to the Factory FloorAON3D's credentials extend to outer space. The company has worked with the Canadian Space Agency (CSA) to print components for the International Space Station, and their parts were aboard the Artemis 1 mission.Closer to home, AON3D's solutions are used by customers like Boeing, Lockheed Martin, Northrup Grumman, and more in aerospace, while also offering benefits to automotive, energy, and general manufacturing. One automotive customer saw full payback under 2 months for their first Hylo purchase, and is eagerly awaiting more. Leveraging Taiwan's EcosystemAt COMPUTEX 2026, AON3D aims to connect with Taiwan's semiconductor packaging and testing sectors. Beyond chips, they see massive potential in Taiwan's drone industry and medical prosthesis field. Hylo's ability to "light-weight" components makes it ideal for rapid drone iteration.  "We want to bring capabilities to a group that didn't have them before," Han concludes. AON3D isn't just selling a printer; they are offering a gateway to the next generation of industrial manufacturing.