As the demand for high-performance power semiconductors continues to escalate across automotive and industrial sectors, Henkel is addressing one of the industry's most pressing challenges: thermal management in next-generation power devices.Henkel will host a technical webinar introducing its patented Polymerization-Induced Phase Separation technology platform-an advanced solution engineered to meet the evolving requirements of power device performance, reliability, and cost-efficiency.Thermal Control as a Critical EnablerWith rising operational temperatures directly impacting device reliability and efficiency, effective heat dissipation has become essential. The industry's transition to bare copper (Cu) designs-driven by cost and reliability considerations-further underscores the need for die attach materials that combine high thermal conductivity with Cu compatibility.Henkel's innovative technology enables die attach formulations that could meet automotive Grade 0 thermal cycling and MSL1 reliability standards; provide high bulk thermal conductivity for metallized or bare silicon die; ensure compatibility with a wide range of die finish and lead frame combinations, including bare copper; deliver improved RDS(on) performance compared to conventional die attach materials; support copper wire bonding processes. This event marks the first installment in Henkel's Power Device Webinar Series, designed to provide engineers, designers, and industry stakeholders with insights into materials innovations that address the increasing demands of power semiconductor applications.To particiapting in this webinar titled :"What's Powering the Next-Gen Power Device Performance" on 2025/11/28 10:00-10:45 am (Singaporean Time GMT+8), please register, click here to register.Participants will gain exclusive access to Henkel's technical experts and learn how this proprietary platform is setting new benchmarks in thermal performance and reliability for power devices.

When you walk the halls of the TPCA Show Taipei 2025, one theme is impossible to miss: AI is no longer the future-it's the engine driving the next great wave of electronics manufacturing. From cloud data centers to handheld devices, Artificial Intelligence is reshaping how the world processes information. And behind every AI-driven device is an intricate network of high-performance PCBs, advanced substrates, and precision manufacturing technologies.Reporter Gary with the MKS-Atotech leadership team, including the CEO. Credit: MKS-AtotechAt the center of this transformation stands MKS Instruments, whose strategic brands Atotech and ESI are powering the next chapter of Asia's semiconductor and advanced electronics industries.The New Frontier: AI and the Rise of Advanced PackagingAI's explosive growth has created a new set of demands: faster computing, higher data throughput, and unprecedented integration of components. The era of simple, monolithic chips is long gone. Today's AI processors rely on heterogeneous integration, where multiple chiplets are packaged together on complex organic substrates."It's a materials revolution," explains Dave Henry, Executive Vice President Global Strategic Marketing and GM, Materials Solutions Division. "Our technologies touch more than 70% of the critical steps in PCB and substrate manufacturing-and over 85% of semiconductor front-end processes. MKS is deeply embedded in the future of electronics."This new generation of packaging requires ultra-fine features, tighter interconnects, advanced metallization, and laser-drilled structures at microscopic scale. The PCB industry-particularly in Taiwan-is experiencing a surge in demand, driven by applications in AI, HPC, satellite communications, automotive electronics, and beyond.Inside the MKS Booth: Where Chemistry Meets Systems Technology: From Via Drilling Lasers to horizontal and vertical chemical process equipmentOne of the busiest destinations at TPCA 2025 was the MKS booth, where crowds gathered to explore a unique, fully integrated portfolio: lasers, chemistry, plating systems, motion control, optics, software, and more.MKS is one of the few companies in the world capable of delivering this level of end-to-end process integration. Its Atotech and ESI brands showcased side-by-side how laser drilling, surface treatment chemistry, plating systems, and advanced software work together to Optimize the InterconnectSM—a strategic approach to enabling next-generation electronics.This unified offering is more than convenient-it's transformational"AI chips require high-speed interconnects, smaller geometries, and new substrate materials," says Harald Ahnert, Vice President and GM of Chemistry. "Our solutions bring together decades of expertise to help customers manufacture these advanced products at scale."Spotlight on Innovation: The Technologies Everyone Was Talking AboutA walk through the MKS booth was a look into the future of electronics manufacturing, with several standout technologies drawing sustained attention from visitors.One major area of focus was breakthrough chemistry for advanced substrates. MKS highlighted InPro Pulse TGV, designed for high-aspect-ratio through-glass vias, alongside Cuprapulse IN, a reverse-pulse plating solution developed for HDI and package substrates. For reliable final finishing, the company showcased Aurotech G-Bond 3, Stannatech 2100, and PD Core, complemented by EcoFlash S300U, Bondfilm EX, and Novabond PX-S2, which support high-speed, low-loss signal integrity. Taken together, these chemistry solutions cover a broad spectrum of manufacturing needs, from SAP and SLP production to ultra-fine line formation down to 2/2 μm.Another highlight was the portfolio of next-generation equipment systems. G-Plate was presented as a solution for high-volume PTH processing with capability below 5/5 μm, while vPlate offered continuous vertical plating with industry-leading uniformity. Uniplate platforms were positioned as robust systems for mass production of HDI PCBs, and the PLB Line was specifically engineered to meet the demanding requirements of AI server boards. Combined, these systems form a core platform for the future of PCB and substrate fabrication.The ESI brand further elevated the booth with cutting-edge laser systems. Capstone was featured for high-throughput UV flex drilling, Geode A demonstrated precision CO？ processing of ABF laminates, and Geode G2 showcased ultra-fast via drilling for HDI and mSAP applications. "The industry is facing growing complexity: more I/O, more drilling, more layers," says Michael Stubelt, VP and GM of Equipment Solutions. "Our laser systems give manufacturers the flexibility and productivity advantage they need."Why Glass Substrates Are the Next Big ThingOne of the most talked-about highlights at the show was a striking, panel-scale processed glass substrate sample on display at the MKS booth. Glass, once considered exotic, is fast gaining traction as the next major substrate material in heterogeneous integration.MKS is developing complete process flows for glass—including surface preparation, seed-layer formation, metallization, and via filling—combining Atotech chemistry with ESI's high-speed laser drilling. This collaboration reflects a broader theme: MKS doesn't just deliver tools; it builds ecosystems.Scaling Up: New Investments Across Southeast AsiaWhile the spotlight was on technology, MKS also shared details of its expanding regional footprint. "Competition in APAC and Greater China is intense," says George Yang, VP and GM for MKS Greater China. "Our strategy is to be local—local manufacturing, local tech support, local expertise." Today, MKS operates 14 manufacturing sites across the APAC region and is investing aggressively in Southeast Asia.One of the major new investments is a Super Center for wafer fabrication equipment in Penang, Malaysia, which has been under construction since 2024. In Samut Prakan, Thailand, the company has recently opened a Tech Center and manufacturing site dedicated to PCB and substrate development, further strengthening its presence in advanced electronics manufacturing.MKS is also moving ahead with a flagship expansion in Thailand. In May 2025, the company broke ground on a new Atotech chemical manufacturing facility and Tech Center near Bangkok, representing an investment of more than US$40 million. The site is designed for an annual capacity of 18,500 tons and is scheduled to begin operations in the second half of 2027. As Thailand rapidly emerges as a major PCB manufacturing hub and attracts investments from China, Korea, Taiwan, and Japan, MKS aims to be a pillar in this fast-growing ecosystem.The Road Ahead: Enabling the Electronics of TomorrowFrom semiconductors and substrates to optical systems and laser drilling, MKS Instruments touches nearly every step in the electronics manufacturing chain. Its integrated approach—rooted in deep expertise across materials science and precision engineering—provides customers with the tools needed to build faster, more compact, more efficient AI hardware."MKS is proud to contribute to the industry's move toward advanced and eco-friendly manufacturing," says Wayne Cole, Senior Vice President of Global Sales and Service. "Our mission is to help customers stay competitive in a world that is evolving faster than ever."With major investments across Southeast Asia, a powerful portfolio of technologies, and a unified vision MKS is not just participating in the AI revolution-it is helping to build the foundation on which the future of electronics is being created.MKS is enabling the shift from transistor scaling to advanced integration - merging logic, memory, and photonics. The company's APAC Tech Centers act as co-innovation hubs for customers, encompassing: supporting R&D, process training, and sub-5/5 µm SAP prototyping.These centers are not just service nodes - they're bridges between customer vision and manufacturing reality.MKS has a proud history of innovations and inventions that have shaped the evolution of the key industries we serve. As a global leader in providing equipment, processes, and production solutions that power the most advanced electronic devices, our expansion in Asia reflects our commitment to supporting the growth of the semiconductor, PCB, and package substrate markets in this region. We are excited to be a key player in the future of technology and look forward to continuing to invest in Asia's bright future.  Reporter Gary interviewed the MKS-Atotech leadership team at TPCA Show 2025. Credit: MKS-Atotech

As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid escalating design complexity.Emerging architectures built around UCIe-based chiplets, PCI Express 7.0 and CXL 3.1 interconnects, and 2.5D/3D memory-integrated packaging have made integration-not computation-the new bottleneck.Progate Group Corporation (PGC, TPEx: 8227), a member of TSMC DCA, leverages its long-term partnership with Synopsys to solve that bottleneck.Through a unified ASIC turnkey flow, PGC enables innovators to design, verify, and manufacture advanced-node SoCs and chiplet-based accelerators for cloud and AI applications with greater efficiency and lower risk.PGC integrates the latest generation of Synopsys Interface IP, spanning high-speed interconnects, memory, and networking subsystems critical to modern cloud and AI processors.The portfolio includes UCIe 40G Die-to-Die, CXL 3.x, and PCI Express 7.0 controllers that enable seamless chiplet-based compute integration for next-generation server processors.It also incorporates HBM4 and DDR5 Gen2 memory subsystems optimized for multi-stack 2.5D and 3D integration, as well as 224G Ultra Ethernet PHY solutions designed for high-throughput data-center networking.Validated across TSMC 3nm to 2nm process nodes, these silicon-proven IPs address the cloud industry's most demanding bandwidth and power-efficiency challenges while maintaining full compatibility with Synopsys EDA and PDK environments.Through its TSMC Design Center Alliance (DCA) membership, PGC provides a verified turnkey service covering RTL design, APR layout, wafer fabrication, 2.5D/3D packaging, and final test coordination.By integrating Synopsys EDA tools (Design Compiler, Fusion Compiler, ICC2, PrimeTime) and complete IP deliverables (Lib, LEF, GDS, and testbench models), PGC helps customers accelerate RTL-to-signoff cycles through pre-verified IP subsystems, SIPI (signal and power integrity) analysis, and IP hardening support-as described in Synopsys' IP Accelerated methodology.This unified approach reduces integration risk, minimiclozes manual iteration, and ensures design closure consistency across advanced-node ASIC projects."Cloud and AI systems are evolving into distributed compute platforms built on multiple dies and protocol layers," said Fred Lai, CEO of PGC."By aligning Synopsys' IP Accelerated methodology with TSMC's leading-edge processes, PGC helps customers scale performance while maintaining design predictability and manufacturing reliability."Unlike large turnkey providers that concentrate solely on a handful of mega-scale clients, PGC combines advanced-node design capability with engineering agility, making it a trusted partner for both hyperscalers and rapidly growing AI startups.Beyond simplifying multi-vendor coordination, the company maintains unified technical accountability across design, IP integration, and manufacturing, ensuring that every stage of development proceeds seamlessly.PGC's engineers perform SIPI co-optimization using Synopsys EDA and PDK models to guarantee signal and power stability, while TSMC-certified signoff flows deliver predictable yield and reliability.Supported by cross-regional teams in Taiwan, Japan, China, and the United States, PGC provides rapid collaboration and execution across the entire ASIC turnkey cycle.PGC's ecosystem extends from design integration to manufacturing, combining TSMC's advanced-node foundry services, Synopsys' comprehensive IP portfolio, and partnerships with leading OSAT partners for 2.5D/3D packaging enablement.Together, this network provides a complete foundation for high-bandwidth, energy-efficient ASIC innovation across AI, HPC, and cloud computing markets.

Robust computational capabilities are fueling the rapid evolution of artificial intelligence (AI) applications. The rise of large language models (LLMs) such as ChatGPT-5 has triggered a surge in global data center investments, accelerating the expansion of Taiwan's semiconductor and server industries. Today, the production, assembly, and outsourcing of AI servers have become key benchmarks for industry and technology leaders aiming to lead in global AI innovation. As high-density CPU and GPU architectures continue to advance, the demand for next-generation cooling technologies has intensified dramatically.In an exclusive interview on "Thermal Solutions Powering the AI Era" with host Ashley Chu on IC Radio Broadcasting, Ricky Yu, Deputy Manager at T-Global Technology, and Director Chris Chuang discussed how rapid advancements in AI-integrated electronic devices are reshaping thermal design. They emphasized that thermal management-critical for improving heat dissipation efficiency-has emerged as one of the most pressing engineering challenges in the AI era. Currently, the industry is witnessing a significant transition from traditional air-cooling approaches to liquid-cooling systems in the design of thermal modules for advanced processors.The thermal design power (TDP) of processor cooling modules initially started at around 800 W and rose to 1,200 W by 2024, following updated thermal specifications. Today, TDP levels have reached 2,300 W, marking a steep upward trend. The cooling module market is thriving, and Chuang predicts that specifications may soon exceed 5,000 W, and could potentially approach 10,000 W in the near future - an unprecedented leap in thermal design requirements.Currently, three primary cooling methods dominate thermal management: air cooling, liquid cooling, and immersion cooling. Among these, air and liquid cooling remain the mainstream technologies, utilizing a variety of materials to absorb and dissipate heat efficiently.Immersion cooling, on the other hand, represents a promising frontier in heat dissipation. This approach submerges entire servers in electrically insulating fluids to achieve maximum thermal efficiency. While it delivers superior performance, its high cost and complex system integration continue to pose challenges, and the technology remains under active development and validation.As AI computing power continues its exponential growth, the demand for high-performance, reliable, and sustainable thermal solutions will only intensify. Companies like T-Global Technology are at the forefront of this transformation-bridging the gap between innovation and practicality, and empowering the world’s transition into the high-efficiency, high-density era of intelligent computing.PCM Development Exacerbates Heat Dissipation Challenges in AI EraYu notes that only a handful of technology giants - particularly those engaged in large language model (LLM) training - exhibit such extraordinary energy consumption in the development of advanced AI technologies. In contrast, small and medium-sized enterprises, as well as general consumers, tend to prioritize thermal solutions that balance performance and cost for their specific applications. Recognizing this market need, T-Global Technology is actively expanding its presence in this growing segment.To meet evolving thermal challenges, T-Global continues to invest in cutting-edge materials and technologies for product research and development. These include liquid metal, metal heat sinks, aluminum silicon carbide (AlSiC), and indium sheets - materials engineered to enhance heat dissipation and conductivity. The company is also advancing the design and manufacturing of solid-state heat sinks, metal modules, and cooling fans, ensuring customers receive more comprehensive and efficient thermal solutions across diverse applications.In recent years, T-Global has also integrated phase-change materials (PCMs) into new product lines. These materials, initially solid and easy to assemble, transition to a liquid state when exposed to heat, enabling efficient heat absorption and transfer. This liquid-metal-based cooling approach, already adopted in high-end gaming PCs and consoles, has emerged as a new technological highlight in advanced thermal design.To address the common issues of material overflow and cost associated with liquid metal, T-Global has developed an innovative containment design that effectively prevents leakage and corrosion - two factors that could otherwise compromise system stability and longevity. This advancement underscores the company's ongoing commitment to developing safer, more reliable, and performance-driven thermal technologies for the AI generation.Actively Enhance Global Synchronous Service Operations and Customer CollaborationIn parallel with the advancement of emerging technologies, Ricky Yu analyzed real-world customer use cases to identify their most pressing challenges. One key issue arises when clients face space constraints in computer rooms or data centers. To accommodate greater cooling demands, they often seek to upgrade thermal performance using existing equipment and infrastructure, rather than complete system overhauls.For instance, when power consumption requirements rise from 200W to 500W and even 1,000W, customers look for solutions that enhance cooling efficiency without disrupting the surrounding environment. This shift has redefined T-Global's role - transforming the company from a traditional supplier of complete cooling modules into a consultative partner that collaborates closely with clients to develop tailored, high-efficiency solutions.Global Expansion and Manufacturing ExcellenceTo meet growing international demand and the globalization of supply chains, T-Global Technology has intensified its manufacturing and operational investments. The company has established a network of zero-time consultants in China, Japan, and other overseas markets, ensuring 24/7, 365-day global support and synchronized operations.At the same time, T-Global continues to expand its overseas manufacturing base in Vietnam while scaling up production capabilities at its Taiwan headquarters. By leveraging its vertically integrated strengths in research, design, and manufacturing, T-Global is well-positioned to seize the opportunities emerging from the AI era's rapid growth - delivering agile, high-performance, and globally supported thermal solutions to customers worldwide.

Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic partnership to integrate CPO into GUC's advanced ASIC design services.This collaboration paves the way for high-bandwidth, low-latency, power-efficient optical interconnects in next-generation AI, HPC and networking applications where electrical signaling is reaching its limits. By integrating Ayar Labs'TeraPH optical engines into GUC's advanced packaging and ASIC workflow, the companies are exploring critical areas to enable future CPO deployment."The CPO revolution is at our doorstep. Integrating Ayar Labs'optical engines into our advanced packaging flows is a critical step," said Igor Elkanovich, CTO of GUC. "Our new joint design allows us to address the challenges of CPO integration - architectural, power and signal integrity, mechanical and thermal - ensuring our future customers have access to a robust, high-bandwidth and power-efficient solution."The new XPU multi-chip package (MCP) design replaces traditional electrical interconnects with Ayar Labs'optical engines attached directly to the MCP organic substrate. This architecture enables more than 100 Tbps full-duplex optical interface from the XPU package, more than an order of magnitude improvement over current XPUs.UCIe-S (64 Gbps) provides bandwidth between the optical engines and I/O chiplets over the MCP substrate, while UCIe-A (64 Gbps) is used for communication between the I/O chiplet to the main AI die over local silicon interconnect (LSI) bridges. The design also addresses signal and power integrity challenges associated with the large-scale package. Thermal optimization is done at the XPU MCP level, and a new stiffener design incorporates optical engines' requirements and enables detachable fiber connections while meeting mechanical stress and warpage requirements."The future of AI and data center scale-up will not be possible without optics to overcome the electrical I/O bottleneck," said Vladimir Stojanovic, CTO and co-founder of Ayar Labs. "Working with GUC on advanced packaging and silicon technologies is an important step in demonstrating how our optical engines can accelerate the implementation of co-packaged optics for hyperscalers and AI scale-up."GUC will share more about these technology advancements during a presentation titled "Advanced Packaging Technologies for Modular and Powerful Compute" at the 2025 TSMC Open Innovation Platform (OIP) Ecosystem Forum in Hsinchu, Taiwan, on Tuesday, Nov. 18, 2025.For more information about GUC.For more information about Ayar Labs.

The rise of generative AI is accelerating digital transformation across traditional industries, and the construction sector is no exception. In an industry long dependent on hands-on expertise and experience sharing, construction companies face mounting challenges including labor shortages, rising costs, project delays, and increasingly stringent regulatory requirements. To address these issues, Shipeng Technology has developed an end-to-end smart construction solution centered on a "Digital Twin + AI Platform," powered by the robust computing capabilities of Amazon Web Services (AWS).Integrating AI, cloud, and digital twin technologies to drive smart constructionAccording to Shibo Lin, founder of Shipeng Technology, the company's core solution revolves around three key pillars: visibility, precision, and control. Covering the entire project lifecycle - from design and construction to operation and maintenance - it establishes a comprehensive digital twin management process. By replacing traditional 2D blueprints with 3D BIM (Building Information Modeling), design conflicts can be identified and resolved before construction begins. The AI platform integrates material and scheduling data, allowing on-site teams to query project progress and cost details using natural language. In addition, AR and sensor technologies enable real-time comparison between physical structures and digital models, ensuring quality and progress remain aligned. The result is a significant reduction in human error and delay risks, along with enhanced data-driven decision-making capabilities.Shipeng Technology leverages AWS cloud computing, AI/ML platforms, and IoT services to handle the massive volume of construction data and 3D model computations. By integrating sensor, image, and progress data in the cloud, the company builds high-precision digital twins that remain perfectly synchronized with the physical site. This architecture not only ensures flexibility, scalability, and security but also enables rapid model updates and data processing within minutes - greatly reducing operational costs and accelerating project delivery. Lin emphasized that AWS's global cloud infrastructure allows the team to focus on application innovation and AI model optimization, truly realizing the vision of bringing "smart construction from cloud to job site."Real-world projects demonstrate efficiency gainsIn a recent major construction project, regulatory changes required a complete redesign. Traditionally, the revision process would take four months. With Shipeng Technology's BIM solution and AWS support, the team completed the entire update and validation in just one week, reducing the timeline by over tenfold and saving substantial downtime costs.In another project, the Startup Terrace A6 Tower in Linkou adopted Shipeng Technology's digital asset management system. Tasks that once took three months - such as inventory verification - are now completed within five to ten minutes. Supported by AWS's real-time data integration and high-performance computing, the platform enables project managers to monitor on-site progress and asset conditions seamlessly. Lin noted that Shipeng Technology aims to make every data point from construction sites actionable, turning real-time insights into the foundation for smarter decisions.From Taiwan to the world: building a cloud ecosystem for smart constructionThrough its participation in the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) project, Shipeng Technology established a presence in Kaohsiung's Startup Terrace and gained access to extensive local industry resources. The project's matchmaking and mentoring programs have helped the company connect with construction partners in southern Taiwan and refine its business presentation and client engagement capabilities. Lin remarked that this industry collaboration model - combining local partnerships with cloud-based coordination - not only accelerates digital transformation in southern Taiwan's construction industry but also strengthens Shipeng Technology's local market foothold.While deepening its presence in Taiwan, Shipeng Technology is actively expanding internationally. Following its strategy of "Taiwan R&D, Japan validation, and global deployment" , the team recently participated in a global startup competition and secured collaboration opportunities with Japanese partners to deploy smart construction solutions overseas. Given Japan's strong demand for construction automation and ESG management, the market serves as the company's first step toward globalization. Moving forward, Shipeng Technology will continue to establish international standards for smart building practices and bringing its digital construction technologies to the world.

As Taiwan faces demographic challenges from a declining birthrate, the food and beverage (F&B) industry is struggling with severe labor shortages. While digital technologies and automation offer solutions for improving operational efficiency and customer satisfaction, many small and medium-sized eateries - such as breakfast shops and family-run restaurants - still rely on manual processes due to limited budgets. This manual process is slow, error-prone, and struggles to meet rising consumer expectations, making it difficult for small businesses to compete with major chains.DotDot Global addresses these challenges with its one-stop F&B technology solution, integrating online ordering, self-checkout, AI queue management, multiple payment options, membership management, and data analytics. This solution enables restaurants to embrace mobile payment trends, streamline workflows, reduce staffing needs, and enhance customer experiences. To date, DotDot Global has successfully implemented its system in more than 15,000 restaurants across Taiwan.According to Ting Hsieh, CEO of DotDot Global, the company's AI Store Manager replaces traditional manual ordering and checkout procedures, enabling restaurants to achieve front-of-house automation. The AI Store Manager includes intelligent ordering, AI-powered queue calling, and Taiwan's first unified cross-domain payment platform that integrates "points, cash, and coupons." It allows flexible use of loyalty points and discounts while seamlessly connecting credit cards, cash, and digital payments. As a result, restaurants can operate efficiently with minimal staffing - sometimes even with just one person running the entire store.Leveraging AWS cloud services to accelerate innovationDotDot Global's solutions are powered by Amazon Web Services (AWS) and built on AWS IoT Core, which provides two-way communication for real-time monitoring of connected devices worldwide. Through Over-the-Air (OTA) remote updates, the company can upgrade system functions or apply security patches to all devices across Taiwan in under 30 minutes - without dispatching engineers. This significantly reduces maintenance costs while ensuring that every client location has immediate access to the latest features, helping restaurants maintain a competitive edge in the fast-evolving F&B technology landscape.Hsieh explained that since entering the F&B technology space, DotDot Global has continuously gathered feedback from restaurant operators to guide product development. The newly launched AI Store Manager integrates multiple AI applications such as voice queue announcements, on-screen notifications, and adaptive prompt customization based on call frequency or style. Additionally, the system can analyze customer behavior and restaurant sales data using AI, providing insights for menu optimization and combo meal recommendations to improve profitability.Building a cross-domain ecosystem with the Unified Payment Interface (UPI)As mobile payment tools continue to diversify, DotDot Global introduced its Unified Payment Interface (UPI) to foster a new, cross-domain payment ecosystem. With a single integration, business partners can support all payment scenarios - from online to offline, cash to digital. DotDot Global is collaborating with POS system providers, vending machine operators, self-checkout solutions, currency exchange kiosks, and claw machine vendors to expand the ecosystem, generating new traffic and value for its partners.Hsieh added that through participation in the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) project, DotDot Global has strengthened collaboration with local industries in Kaohsiung, including parking operators, vending businesses, and F&B brands. The company has also integrated with Agrigo, a cloud-based agricultural e-commerce platform, to enable innovative supply chain payment scenarios. Furthermore, DotDot Global is actively promoting its AI Store Manager and smart restaurant solutions in southern Taiwan, with notable adoption by the well-known Kaohsiung eatery Lao Er Pork Hock on Rice.

Brainport Industries Campus (BIC) is a development project for an industrial park in Eindhoven, the Netherlands. Phase one (BIC 1) has been completed, encompassing 105,000 square meters of existing buildings, surrounding public space, and parking. The site is home to several high-tech manufacturing companies and educational institutions. Expansion plans are currently underway, with the newly expanded BIC 2 campus expected to double the size of BIC 1, reaching 300,000 square meters. More than 40 pioneering companies are already established on the campus. BIC is the largest campus expansion in the Netherlands for years to come.Notably, ASML, the Dutch EUV lithography equipment giant, is considering expanding to the northern part of the BIC 2 campus. In 2024, ASML announced plans to establish a subsidiary in the BIC Industrial Park by 2030, accommodating thousands of employees. The Brainport Industries Campus development company stated that it aims to provide startup facilities, co-innovation spaces and built to suit manufacturing space for high-tech companies.In partnership with Invest Holland and the Brabant Development Agency (BOM), the park will offer Taiwanese companies the option of establishing regional business units or research centers in the Netherlands through support services provided by the industrial park.The campus aims to attract leading companies in cutting-edge technology fields, including semiconductor related technologies, photonics, quantum and additive manufacturing. BIC and Invest Holland jointly unveiled this plan at Semicon Taiwan 2025, offering the access to advanced facilities, a strong open innovation ecosystems and encouraging Taiwan's high-tech industries participating in this collaboration opportunity.

As businesses face dramatic changes in the global market environment, companies worldwide are accelerating their digital transformation efforts, seeking competitive advantages through innovative technologies. Yet, while many departments have embraced automation, legal teams often remain the slowest to digitalize. Manual contract review still dominates daily operations, with a single document taking one to two weeks to pass from sales to legal approval.Such delays not only disrupt decision-making but also affect overall business performance. Addressing this long-standing challenge, LegalSign.ai has launched an end-to-end generative AI legal workflow management platform that accelerates contract and document review with precision and transparency, fundamentally redefining corporate legal operations.According to Chih-Tung Chen, CEO of LegalSign.ai, lengthy manual reviews often force companies to ship products before contracts are finalized - taking on significant legal risk just to maintain business momentum. To tackle these inefficiencies, LegalSign.ai's cross-disciplinary team of legal and AI experts has created a one-stop generative AI legal workflow platform that resolves these long-ignored bottlenecks. The solution is already trusted by leading enterprises such as Acer, CTBC Bank, Cathay Financial Holdings, and ezTravel, proving its value across industries.Integrating legal expertise and generative AI to address three core challengesFounded in 2019 by experienced lawyers and patent attorneys with over 25 years of combined practice, LegalSign.ai operates across Taiwan, the United States, and China. The company's founding mission is to ensure that "legal work is no longer an island buried in paperwork." By combining deep legal expertise with generative AI, LegalSign.ai transforms legal operations into a streamlined, digital, and automated process, helping enterprises manage contracts and risks more efficiently and intelligently.LegalSign.ai's all-in-one platform addresses three major pain points for legal departments - workflow management, compliance auditing, and risk control. Through generative AI, the platform digitalizes the entire contract lifecycle, covering drafting, review, negotiation, signing, execution, archiving, retrieval, and risk management. This comprehensive approach enables enterprises to significantly improve productivity while cutting costs and mitigating legal exposure.Chen explained that the platform integrates three core capabilities: generative AI-powered compliance management, legal workflow lifecycle management, and electronic signature services. For instance, the AI assistant draws on a library of over 400 contract templates to generate legally sound drafts, minimizing hallucinations or logic errors. It can also translate and compare documents, automatically highlighting high-risk clauses to assist in compliance monitoring.Building trustworthy legal AI services on AWSFollowing its recognition with the AWS Generative AI Rising Star Award in 2024, LegalSign.ai joined the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) program in 2025 to further expand its visibility and pursue new business collaborations. The company is implementing Amazon Elastic Compute Cloud (Amazon EC2) to leverage cloud GPUs for enhanced AI computation and inference efficiency, aiming to deliver trusted, enterprise-grade legal AI cloud services globally through AWS cloud infrastructure.Chen emphasized that legal AI differs from typical generative AI applications due to its high data sensitivity and territorial restrictions. Given ongoing data security and regulatory concerns in China, Taiwan has emerged as a trusted hub for legal AI solutions serving international enterprises. Leveraging AWS's global cloud infrastructure, LegalSign.ai is executing a "Chinese-language legal AI + AWS Cloud" strategy to bring Taiwan's legal technology to the world. The company's initial overseas expansion targets Japan and the United States, with current collaboration focused on a bilingual legal AI platform serving multinational corporations.

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries.The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection.The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time. Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own.Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.