Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).The company said that, "Under the theme 'Innovative AI, Sustainable tomorrow' we plans to showcase a wide range of next generation memory solutions optimized for AI and will work closely with customers to create new value in the AI era."SK hynix has previously operated both a SK Group joint exhibition and a customer exhibition booth at CES. This year, the company will focus on the customer exhibition booth to expand touchpoint with key customers to discuss potential collaboration.The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with 36GB, which demonstrated industry's fastest speed of 11.7Gbps, and is under development aligned with customers' schedules.12-layer HBM3E product with 36GB which will drive the market this year will also be presented. In particular, the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with customer and demonstrate its role within AI systems.In addition to HBM, the company plans to showcase SOCAMM2, a low-power memory module specialized for AI servers, to demonstrate the competitiveness of its diverse product portfolio in response to the rapidly growing demand for AI servers.Also, SK hynix will exhibit its lineup of conventional memory products optimized for AI, demonstrating its technological leadership across the market. The company will present its LPDDR6, optimized for on-device AI, offering significantly improved data processing speed and power efficiency compared to previous generations.In NAND flash, the company will present its 321-layer 2Tb QLC product, optimized for ultra-high capacity eSSDs, as demand surges from rapid expansion of AI data centers. With best-in-industry integration, this product significantly improves power efficiency and performance compared to previous generation QLC products, making it particularly advantageous in AI data center environments where lower power consumption is needed.The company will set up an 'AI System Demo Zone' where visitors can experience how its AI system memory solution that is being prepared for the future, interconnect to form AI ecosystem.In this zone, the company will present customized cHBM optimized for specific AI chip or system, PIM based AiMX, CuD which conducts computing in memory, CMM-Ax that integrated computing capabilities into CXL memory, and Data-aware CSD.For cHBM(Custom HBM), due to specific interest from customers, a large-scale mock-up has been prepared to allow visitors to visually sight its innovative structure. As the competition of the AI market shifts from mere performance to inference efficiency and cost optimization, this visualizes a new design approach that integrates part of computation and control functions into HBM which was handled by conventional GPU or ASIC in the past."As innovation triggered by AI accelerates further, customers' technical requirements are evolving rapidly," Justin Kim, President & Head of AI Infra at SK hynix, said. "We will meet customer needs with differentiated memory solutions. With close cooperation with customers, the company will create new value to contribute to the advancement of the AI ecosystem."SK hynix's next-generation AI memory products on display at CES 2026. Credit: SK hynix

Portwell, Inc., a leading provider of industrial and embedded computing solutions and a subsidiary of Posiflex Technology Inc., today announced its strategic investment in Wincomm Corporation, acquiring a 41% ownership stake and becoming its major shareholder.Wincomm Corporation, headquartered in Hsinchu, Taiwan, is a well-established innovator in the touchscreen computer market, with a strong foothold in medical equipment, smart healthcare and industrial automation sectors. Its diverse Human-Machine Interface (HMI) computer and display portfolio includes medical-grade panel PCs, embedded touch displays, and peripherals, as well as rugged industrial-grade solutions such as wide-temperature and high-brightness panel PCs, waterproof stainless-steel displays, and IECEx, ATEX, C1D2/C2D2-certified explosion-proof panel PCs."This investment marks a significant milestone in Portwell's growth direction," said Ken Guan, President of Portwell, Inc. "By joining forces with Wincomm, we are not only reinforcing our presence in the medical computing space but also expanding our capabilities across factory automation, petrochemical, and military applications. The synergy between our product lines and business models will enhance our overall competitiveness and customer satisfaction, while driving innovation in Edge AI and embedded computing."

As AI applications rapidly expand across PCs, mobile devices, and content creation workflows, there is a parallel surge in demand for high-resolution video, real-time generative content, and on-device inference. This transition is redefining storage within system architectures: it is no longer just a matter of capacity planning, but a critical determinant of performance, bandwidth, and reliability.To address this, AGI Technology has sharpened its strategy and will debut next-generation storage solutions at CES 2026, targeting the high-speed and usability demands of the AI era. PresidentMiranda Lee pointed out that while high specs are now "table stakes" across the market, the real differentiator going forward will be how well products adapt to real-world scenarios - and whether brands can sustain stable delivery and consistent quality.Miranda emphasized that AI is doing more than just driving capacity growth; it is fundamentally changing how data is utilized.First, edge computing and multi-task content creation are becoming the norm. This increases the frequency of data access and the need for mobility, transforming storage devices from auxiliary components into critical links in modern production workflows. Second, pricing dynamics are reshaping consumer behavior. As the cost of high-end storage and memory rises, the market is witnessing more "buy-down" purchasing and phased expansion: users tend to select mid-range configurations initially, supplementing capacity with external devices later. Third, high speed and capacity are increasingly becoming entry requirements rather than differentiators. With interfaces such as PCIe Gen4/Gen5 and USB4 continuing to advance, adhering to these specifications has become a baseline standard that all brands must meet.Consequently, AGI Technology is moving beyond differentiation through specifications alone. The company is transitioning its brand identity from a component manufacturer defined by performance metrics to a solutions provider centered on usage scenarios. This strategic realignment ensures that while AGI continues to advance speed and capacity benchmarks, it also integrates robust reliability and environmental durability into its core design philosophy. Miranda emphasizes that while performance is a baseline requirement, enhancing stability and durability addresses the practical demands of mobile and outdoor workflows. This comprehensive approach creates tangible added value for users requiring consistent performance under pressure.AGI Technology will center its CES presence around a scenario-driven strategy that prioritizes reliability and practical application. According to Miranda, CES has long served as a vital stage for showcasing AGI's technological prowess. However, the company's recent strategy emphasizes private, high-level briefings over traditional exhibit formats. By moving toward a semi-exclusive engagement model, AGI can more effectively align its product roadmap with customer needs, ultimately strengthening brand loyalty and enhancing the performance of its international channels.At CES 2026, AGI is set to translate its strategic vision into a powerhouse lineup of tangible innovations, headlined by next-generation storage solutions tailored for the AI era. Leading the charge is a 6nm PCIe Gen5 SSD capable of blistering speeds up to 11,000 MB/s. By leveraging an advanced 6nm process, AGI has significantly reduced power consumption and thermal overhead, making flagship-tier performance more accessible for real-world deployment. Complementing this is AGI’s 10,000 MT/s low-latency DDR5 RGB memory, built for the rigorous demands of AI-native platforms. Furthermore, AGI is expanding its portable portfolio with three specialized external SSDs catering to content creators, outdoor adventurers, and power users, reinforcing the brand's focus on versatile, high-speed data management.Miranda emphasized that for AGI Technology, 2026 marks more than just another hardware iteration; it represents a strategic pivot in both brand identity and operational philosophy. The company is steadily evolving from a component supplier into a user-centric storage solutions brand. While continuing to push the boundaries of PCIe and USB performance, AGI is doubling down on real-world utility - tailoring products to excel in mobility, professional content creation, and long-term data archiving.She emphasized that in an era of ubiquitous AI and high-performance computing, true value transcends raw benchmarks; it is defined by unwavering reliability when it matters most. Whether capturing a split-second extreme sports feat, a creator's unrepeatable live recording, or years of cherished family milestones, storage devices house more than just data - they safeguard irreplaceable moments. Through a commitment to durable, high-performance design, AGI Technology aims to earn user trust across every scenario, transforming their brand promise, 'Preserve Your Uniqueness,' from a slogan into a lifelong digital legacy.Project K10 DDR5 - 10,000 MT/s Overclocking Flagship.Credit: AGI TechnologyProject S10 PCIe Gen5 SSD - 11,000 MB/s Performance with TSMDC 6nm Controller.Credit: AGI TechnologyNew Series of Portable SSD – Combination of High-Speed, Durability and Capacity.Credit: AGI Technology

As the world faces urgent climate challenges, governments worldwide are pledging to reach net-zero emissions by 2050, positioning clean energy at the core of energy transitions. Solar photovoltaic (PV) systems, known for their renewable and low-pollution attributes, have emerged as a crucial pillar in global net-zero strategies. However, as the solar market expands rapidly, a wave of PV module decommissioning is emerging. Recycling has become an increasingly pressing environmental issue. According to estimates from the International Renewable Energy Agency (IRENA), the cumulative volume of end-of-life solar panels awaiting recycling will reach 730 million tons by 2050, creating an urgent and massive processing demand.In response, TSGC has introduced its innovative PV Circulator solution, featuring a unique physical, chemical-free, and heat-free dismantling technology rarely found globally. The solution enables complete separation of aluminum frames, glass, junction boxes, solar cells, back sheets and EVA layers - achieving a 99.3% material recovery rate. In recent years, TSGC has partnered with multiple recycled-materials companies to establish a circular materials ecosystem. The company will also showcase a breakthrough hydrogen-production technology - using recovered crystalline-silicon solar cells - at CES 2026, signaling its ambition to capture emerging opportunities in the global sustainable economy.TSGC Co-Founder and Distinguished Professor at the Department of Greenergy, National University of Tainan, Dr. Yao-Hsiang Fu, noted that current industry recycling technologies remain limited. Most recyclers remove only aluminum frames and wiring, while other components - difficult to separate at high purity - are typically incinerated in brick kilns and repurposed as tile materials. This results in the loss of high-value materials such as silver and silicon. "A single solar module contains approximately 0.6 kg of silicon and 4.8 grams of silver, representing far greater economic value than most people imagine," Fu emphasized. TSGC has already helped its partners obtain Taiwan's first license for PV module recycling and repurposing, marking a significant milestone for Taiwan's solar recycling industry.Rising ESG demands fuel the global sustainable economyTraditional PV recycling methods heavily rely on high-temperature thermal processing or chemical dissolution, which require significant energy consumption and may generate toxic gases and wastewater. Furthermore, these methods struggle to recover high-purity silicon wafers, silver, and copper in forms suitable for reuse. As a result, California has explicitly banned the disposal of solar panels through incineration or landfilling, accelerating the search for more environmentally friendly and economically viable recycling pathways.In 2024, TSGC received approval from the California Department of Toxic Substances Control (DTSC), becoming the seventh company in California certified for solar panel recycling - and the only company capable of fully dismantling and recovering all materials. TSGC is currently in discussions with the six existing recyclers in the state. By transferring collected PV modules to TSGC for processing, these companies will gain significantly higher material-recovery revenue than through conventional methods.Fu emphasized that as global sustainability awareness continues to rise, carbon-related regulations are rapidly evolving. For example, the EU's Carbon Border Adjustment Mechanism (CBAM) already requires imported products to demonstrate low - or negative-carbon footprints. Products without transparent material sourcing and emissions data will struggle to enter international markets. Therefore, PV recycling is no longer merely an environmental solution - it is becoming a strategic driver of circular-economy development and international trade competitiveness. Identifying this pivotal moment, TSGC is positioned to lead the industry with a complete system for material recovery, reuse, and hydrogen production.High mobility represents TSGC's key advantage in entering the US marketTSGC has partnered with Taiwan Tech Arena (TTA) to strengthen its global footprint through participation in major international exhibitions and increased media exposure. The company has received recognition at events such as CES in the United States and VivaTech in France, boosting its global visibility and indirectly contributing to the approval of its solar panel recycling license issued by the California Department of Toxic Substances Control (DTSC).Fu noted that the United States hosts numerous utility-scale solar farms, many of which are approaching their 20-year operational lifespan - making solar panel recycling an imminent challenge. The TSGC PV Circulator offers exceptional mobility, allowing for on-site disassembly and material separation directly at the project location, significantly reducing transportation costs and providing a major competitive edge in the U.S. market.Looking ahead, TSGC will continue leveraging Taiwan's green energy R&D capabilities and global collaboration opportunities to further expand the applications of recycled solar materials across the energy, chemical, and green manufacturing sectors, strengthening the company's strategic role in the global sustainable economy.Credit: TSGC

Driven by the worldwide push for net-zero emissions and the rise of the circular economy, sustainability has become a central priority across the technology sector. The introduction of a dedicated sustainability zone at recent CES events further underscores how green materials and environmental innovation technologies have emerged as focal points at global tech exhibitions. Renouvo, a company with more than two decades of experience in biomaterials, is among the key players gaining increased attention in this industry shift.At CES 2026, Renouvo will unveil its new Low-Carbon Materials Platform, which integrates its proprietary negative-carbon technology with AI. The platform is designed to help global brands make measurable progress toward carbon-neutrality commitments, while expanding Renouvo's reach into the US consumer electronics supply chain.Founder and CEO Chris Huang noted that the company is honored to have been selected by TTA to participate in CES. He observed that major US consumer electronics brands are accelerating their ESG initiatives, actively seeking new materials with negative-carbon or low-carbon attributes - whether for device enclosures or protective packaging components. In recent years, several international brands have approached Renouvo for collaboration, aiming to reduce carbon emissions at the material source and achieve verifiable sustainability outcomes.Unique hydrogen-bonding patent and third-party verification strengthen material reliabilityRenouvo has long focused on plant-based materials, with a core mission of converting agricultural residues and biomass waste into market-ready low-carbon materials and plastic-free solutions. Beyond its own line of eco-friendly tableware, the company develops low-carbon and carbon-neutral materials for brand partners in the EU, Australia, and other regions, facilitating real-world adoption of circular-economy practices.According to Huang, although the number of companies offering recycled or "eco-friendly" materials has grown rapidly, truly durable, safe, and internationally deployable low-carbon materials remain scarce. Renouvo distinguishes itself by using agricultural waste - such as bagasse and spent coffee grounds - as primary feedstock, enhanced by its proprietary hydrogen-bonding technology. This innovation addresses the common limitations of plant-based materials, including softening and insufficient durability, while simultaneously delivering carbon-capture and carbon-sequestration benefits that reduce emissions at the source.To strengthen material credibility, Renouvo partners extensively with third-party verification bodies to establish comprehensive carbon footprint (CFP) reports, quantifying emissions across the entire product life cycle - from raw materials to manufacturing and final shipment. These transparent, verifiable datasets enable Renouvo's materials to be adopted in international supply chains and serve as a reliable foundation for brands evaluating ESG performance. Huang emphasized that the ability to provide clear, measurable carbon-reduction data is one of Renouvo’s most significant differentiators in the global materials marketplace.Negative-carbon materials integrated with AI strengthen adoption efficiency, with a focus on the US marketA major highlight of Renouvo's return to CES in 2026 is the debut of a new platform that integrates its carbon-negative material technology with AI. The platform analyzes key parameters - including material composition, process-level carbon emissions, durability, and cost structure - providing brands with comprehensive evaluation data prior to adoption. This significantly shortens material verification cycles and accelerates the transition from testing to mass production.Renouvo has participated in the TTA competition for two consecutive years and continues to seek CES exhibition opportunities, driven by the US market's increasingly stringent sustainability requirements for materials. Major US brands now demand verifiable evidence of carbon-neutral commitments and transparent supply-chain metrics. By leveraging visibility from CES and TTA, Renouvo aims to expand collaboration with leading US technology and consumer electronics companies, accelerate global adoption of negative-carbon materials, and position itself as a key partner in supporting multinational brands' sustainability strategies.Looking ahead, Renouvo plans to continue enhancing its AI-enabled materials platform, expand its carbon-footprint database, and strengthen customized service capabilities. The company's objective is to become a strategic partner for North America's top green-materials supply chains within the next three years. Huang emphasized that sustainability cannot remain at the level of slogans or declarations - it must be verifiable and quantifiable. Only when brands can clearly track and measure carbon-reduction outcomes will sustainable materials become mainstream, which is the core message Renouvo aims to deliver worldwide.Renouvo's diverse product portfolio. Credit: Renouvo

Cancer is no longer considered untreatable, yet improving the accuracy and timeliness of diagnostics and treatment remains one of the most pressing challenges in clinical practice. Traditional cancer detection methods carry inherent limitations: tissue biopsies are highly invasive, causing discomfort and risk for patients, while blood-based biochemical tumor markers often lack specificity and fail to clearly differentiate between pathological signals and normal physiological fluctuations. As a result, liquid biopsy - valued for its safety, convenience, and ability to complement traditional pathology - has rapidly emerged as a global trend in cancer diagnostics.Developed by CytoAurora and distributed and supported by HUA TEC International, the Nano CAST AI semiconductor liquid tumor imaging system integrates semiconductor processes, AI imaging analysis, optical engineering, molecular pathology, and precision mechanics. The next-generation cancer cell detection platform will officially make its public debut at CES 2026, drawing significant attention from both medical and semiconductor communities.Chung-Er Huang, Chairman of HUA TEC International, noted that CytoAurora has long focused on single-cell biotechnology and device development, offering highly accurate solutions for genomic and protein-level analysis. To support the specialized needs of medical equipment deployment - installation, training, and maintenance - HUA TEC was established to lead Nano CAST's commercialization and technical support, helping hospitals and health examination centers rapidly adopt the system. The platform is already in clinical use at institutions such as Tzu Chi Hospital and Taipei Tzu Chi Hospital.According to Chien-Hsiang Tang, Vice President of HUA TEC International, Nano CAST utilizes semiconductor wafer-level surface modification to efficiently capture target cells circulating in the bloodstream. The system integrates precision mechanics and optical modules to automate cell capture, staining, and imaging. AI-driven image analysis then identifies and differentiates cancer cells from other cell types, enabling clinicians to execute targeted cell isolation, image interpretation, and downstream diagnostic analysis directly from blood samples.Nano CAST Supports the Full Cancer Care CycleAs semiconductor processes continue to advance, complex biochemical analyses that once required large laboratory setups can now be executed through highly integrated semiconductor biochips - making real-time testing more accessible and scalable. While genomic sequencing remains the most common application of such semiconductor-enabled medical technologies, HUA TEC is one of the few Taiwanese companies to extend semiconductor-based diagnostics into protein and biomarker analysis, particularly demonstrating strong breakthroughs in the field of liquid biopsy for oncology.Huang explained that Nano CAST is built upon two core components: the Cell Reveal Series and the CMS 200. The Cell Reveal Series uses semiconductor biochip technology to isolate specific or abnormal cells, forming nanoscale structures through plasma treatment, etching, and chemical modification that significantly enhance cell capture efficiency. The CMS 200 serves as the AI-driven imaging system that rapidly and objectively interprets captured cell and tissue images.Together, the system covers the complete clinical pathway of cancer care - from early detection of rare circulating tumor cells in blood, to monitoring treatment response, to identifying minimal residual disease (MRD) after therapy. By providing clinicians with earlier, more precise, and more actionable insights into disease progression, Nano CAST strengthens decision-making across the continuum of cancer management.TTA's High-Impact Global Pavilion Strategy Helps Drive Expansion into Central Asia, Europe, and the USAfter achieving notable milestones in Taiwan and obtaining BSI ISO 13485:2016 certification for medical device quality management, HUA TEC has accelerated its international expansion in recent years, establishing a presence in Thailand, Singapore, Japan, and Hong Kong. The company plans to further extend its footprint into Central Asia in 2026 as part of its broader global medical collaboration strategy.Huang emphasized that HUA TEC's consecutive participation in CES is driven by the strong curatorial and matchmaking capabilities of Taiwan Tech Arena (TTA). TTA's expertise in pavilion design, international outreach, and cross-border business facilitation significantly elevates the global visibility of Taiwanese startups. This enables companies such as HUA TEC to directly engage with major medical distributors, technology corporations, and investment groups across Europe and the United States, accelerating their path to market adoption.He stressed that Nano CAST demonstrates proven clinical performance, verifiable technical foundations, and scalability for commercial manufacturing - making CES the most important launchpad for HUA TEC's entry into the US and European markets. Through CES, the company aims to pursue strategic partnerships, initiate local clinical validations, and expand cross-border commercial activities, ultimately establishing a solid international presence. HUA TEC seeks to ensure that Taiwan's advanced semiconductor-enabled liquid biopsy technologies gain broader adoption across global clinical settings.The Nano CAST Cancer Solution for cancer cell detection. Credit: HUA TEC

In recent years, digital twin technology has quickly gained traction across industries. With the rapid maturation of AI and big data analytics, enterprises can now build highly accurate, real-time synchronized virtual models, enabling predictive maintenance, process optimization, and other benefits that were once difficult to realize. MetAI, invited by Taiwan Tech Arena (TTA) to join CES 2026, will showcase its proprietary AI - and 3D-driven MetGen digital twin platform, formally signaling its intent to capture opportunities in the US smart warehousing sector.MetAI co-founder and CEO Daniel  Yu noted that the US is home to some of the world's largest warehousing market, driven by digitalization efforts from major retailers such as Amazon, Walmart, and Costco. As such, the US has become MetAI's primary target for overseas expansion. "We are honored to receive TTA's invitation to exhibit at CES 2026," Yu said, expressing appreciation for TTA's comprehensive support - from pre-show preparation and customer matchmaking to presentation guidance - which has strengthened the company's confidence in entering the US market.AI fused with 3D technology : Digital twins generated in minutesFounded in 2023, MetAI focuses on developing MetGen, the first AI-native, domain-specific generative platform designed for real-to-sim and sim-to-real integration. By leveraging its proprietary AI and 3D synthesis architecture, MetGen automatically converts traditional CAD and 2D design files into SimReady (simulation-ready) 3D digital twin environments. The platform also incorporates AI, 3D simulation, physics modeling, and automation control logic, enabling users in warehousing, advanced manufacturing, semiconductors, and automation equipment to design, validate, and simulate workflows in a virtual environment before real-world deployment.MetAI further supports the creation of large-scale, high-fidelity synthetic datasets within the digital twin environment, giving AI models access to virtually unlimited training material. This capability accelerates production-line design and product development, while enabling enterprises to derive optimized strategies in simulation before applying them in real operations.By integrating NVIDIA Omniverse with MetAI's proprietary generative models, complex digital twin environments that once required months or even years to build can now be automatically generated in minutes, effectively resolving one of the industry's most persistent adoption barriers: excessively long deployment timelines. The company currently focuses on three key application areas - smart warehousing, semiconductors, and data centers - and completed a US$4 million seed round in 2025, backed by leading investors including Kenmec Mechanical and NVIDIA, making it one of the few Taiwan startups to receive a direct strategic investment from NVIDIA.According to Yu, traditional digital twin development relies heavily on manual data processing, resulting in implementation cycles that may stretch across several months or even longer than a year. Even with newer solutions emerging, model inaccuracies often lead to costly revisions. "MetAI combines AI with 3D generation to directly interpret 2D blueprints such as CAD or BIM files and automatically construct complete 3D twin environments," Yu explained.This approach reduces the typical modeling workload - from hundreds or thousands of hours - to just a few minutes, while delivering high consistency and zero structural error. It enables companies to rapidly plan production lines, build virtual sandboxes for robot training or logistics flow optimization, and significantly boost deployment efficiency.Establishing a US headquarters to capture smart warehousing and advanced manufacturing opportunitiesDespite being a relatively young company, MetAI has quickly secured partnerships with several high-profile enterprises, thanks to the uniqueness and technical depth of its solutions. In addition to working with TSMC, MetAI is collaborating with Kenmec to fully reconstruct the Chief Global Logistics's smart logistics center  into a virtual environment, creating a highly realistic digital twin featuring physics-accurate modeling, executable control logic, and AI-driven optimization capabilities.According to Yu, the rise of AI has prompted Taiwanese startups to shift their mindset - no longer focusing solely on the domestic market but aiming directly at the world's largest and most innovation-driven arenas. "The US has exceptionally strong demand for smart warehousing solutions. We are actively preparing to establish our US team and headquarters, which will include a local team, customer support, and a technical service center. This will place us closer to key customers and significantly enhance our ability to execute in the North American market," Yu said.Yu added that MetAI will continue to strengthen its real-to-sim and sim-to-real capabilities, while expanding integration with a broader ecosystem of automation hardware. The company aims to build an end-to-end twin platform that spans design, simulation, and deployment. Ultimately, MetAI seeks to enable enterprises to advance smart warehousing and smart factory transformations at minimal cost and with maximum speed.MetAI partners with Kenmec to build a high-fidelity virtual smart logistics center. Credit: MetAI

SEOUL, South Korea—December 24, 2025—BOS Semiconductors, a fabless semiconductor company specializing in automotive and physical AI semiconductors, today announced that it will participate in CES 2026, the world's largest technology exhibition, taking place in Las Vegas, USA from January 6–9, 2026. At the event, BOS will unveil an AI Box demo designed for next-generation mobility.At CES 2026, BOS will highlight its strategy aligned with major industry trends, including the advancement of autonomous driving, the shift toward Software Defined Vehicles (SDVs), and the expansion of Physical AI. Through the demonstrations, BOS will present how to anticipate emerging needs in mobility AI environments - such as: Support for a wide range of AI models based on CNN and Transformer architectures, Flexible scalability and integration with existing automotive electronic systems, Real-time perception and decision-making enabled by physical AI.To support these capabilities, BOS will showcase AI model demos powered by its AI Box integrating the high-performance AI accelerator Eagle-N. The AI Box is an external AI computing module that allows automakers (OEMs) to add an "AI brain" to vehicles without replacing existing in-vehicle infotainment (IVI) systems, enabling fast AI expansion with minimal platform change.With the AI Box, OEMs can minimize changes to their existing systems while extending high-performance AI functionality independently. This approach accelerates adoption of advanced AI capabilities not only in new vehicles but also in facelift models - updated versions of existing vehicles with enhanced design and features - reducing development cost and time while improving long-term product competitiveness.The AI Box is based on an on-device AI architecture, delivering several advantages. Sensitive data such as voice and video can be processed directly inside the vehicle rather than being transmitted to the cloud, strengthening privacy protection and data security. It also ensures stable AI operation regardless of network connectivity, improving overall reliability. Over the long term, the AI Box can reduce total cost of ownership (TCO) by lowering cloud traffic, inference, and storage costs. In addition, it offers strong scalability without requiring server expansion as the number of users increases.BOS' AI Box is designed to integrate flexibly with existing vehicle systems through multiple interfaces, enabling an efficient AI vehicle architecture based on clear role separation: AI-intensive functions are handled by the AI Box, while existing systems continue performing their original roles. At the booth (Venetian Expo, Hall A, Booth #50017), BOS will demonstrate on-device AI models that combine Vision-Language Models (VLMs) and Large Language Models (LLMs) based on the AI Box architecture. The demo will also be showcased at the Tenstorrent Demo Room as well."Through our AI Box demo with Eagle-N at CES 2026, we will present a practical approach for effectively scaling AI capabilities even on existing mobility system," said Jason (Jeongseok) Chae, Vice President and Head of Strategic Marketing & Sales at BOS. "We aim to evolve beyond automotive semiconductors and become a core semiconductor company leading the era of Physical AI."

Service robots are moving quickly into healthcare, security, and public environments. Yet their increasing reliance on visual and spatial perception technologies has introduced a major hurdle: uploading raw visual data to the cloud now poses significant privacy and regulatory risks. European and U.S. regulators have recently designated mobile image collection as a high-risk activity, shifting the robotics industry from a "performance-driven" model to one fundamentally shaped by compliance requirements. This shift is redefining what it takes for robotic systems to scale safely and legally.To address these emerging requirements, DeCloak Intelligences has developed a portfolio of privacy-preserving AI systems that rearchitect how visual intelligence is handled at the edge. This includes DeCloakFace, designed for safeguarding personal biometric traits; DeCloakVision, tailored for medical and caregiving environments; and the company's third-generation core platform DeCloakBrain, developed specifically for autonomous robotics. DeCloakBrain functions as a generic AI decision-making engine for robotic autonomy, enabling spatial perception and task execution without relying on sensitive visual data, making it a foundational technology for future large-scale deployments across regulated environments.According to DeCloak President Dr. Yao-Tung Tsou, the company's core innovation lies in "privacy-by-design at the data source," ensuring that all sensor inputs - such as images and numerical data - undergo irreversible de-identification directly on edge devices at the moment of capture. This is achieved through multilayer techniques integrating differential privacy on edge hardware, image anonymization, spatial computing, global visual fusion, and federated learning. With its proprietary irreversible de-identification technology, DeCloakBrain maintains high-accuracy, low-latency decision-making without using original sensor data. The technology is already modularized across software and hardware, enabling rapid, secure deployment and seamless integration with AMRs, medical service robots, humanoids, and quadruped robots, while supporting scalability in both performance and functionality.From a compliance standpoint, DeCloakBrain aligns with stringent privacy regulations in the US and EU. This allows international customers to meet privacy and safety requirements for public spaces, medical applications, and defense-related use cases, mitigating cross-border deployment risks. Dr. Tsou emphasized that DeCloak's intelligent system is built upon years of accumulated datasets, patented de-identification models, VLM/VLA scenario libraries, and long-standing integration experience with global robotics supply chains. This foundation forms a difficult-to-replicate ecosystem for privacy-preserving intelligence, offering verifiable data protection and robust multi-device interoperability.DeCloak enters a pivotal scale-up year as Japan, US, and Europe markets take shapeIn its global expansion strategy, DeCloak identifies Japan as its fastest-moving commercialization market, with public-space monitoring and smart healthcare positioned as the initial priority sectors. The company's integrated systems for these applications have completed deep technical alignment and are now progressing into phased deployment.In the United States, market development is led by partners specializing in military and law-enforcement robotics. Their systems - already used in defense and policing scenarios - are undergoing military - and police-grade certification, targeting applications such as public-area patrol and security inspection. In Europe, where data and imaging regulations are among the world's strictest, DeCloak follows a software-licensing and system-integration model that enables local manufacturers to rapidly incorporate privacy-protection capabilities into existing hardware platforms.Looking ahead, DeCloak plans to scale shipments across Taiwan and Japan while supporting major clients in deploying smart healthcare, public-space security, and related applications. Japan is expected to become the company's first overseas market to reach meaningful revenue scale. In the United States, following nearly a year of testing DeCloakBrain hardware and software modules with military and law-enforcement partners, the company anticipates entering a "mass production and shipment" phase in 2026, covering use cases such as defense systems, public-area surveillance, and inspections in high-risk operational environments.Additionally, DeCloak's US partners will arrange on-site demonstrations for key customers during CES 2026, serving as a critical evaluation step prior to formal procurement. Europe will enter a full-scale development phase in 2026, centered on software licensing and system integration, enabling manufacturers in Poland, the UK, Germany, and other regions to meet stringent regulatory requirements while adopting solutions for smart healthcare, public-space monitoring, and data-privacy protection.President Dr. Yao-Tung Tsou emphasized that as DeCloak's multi-market strategy matures, the company is positioned at a crucial inflection point where technological readiness converges with commercial acceleration. He noted that 2026 will mark DeCloak's transition from "technology completed" to "global scale-up," with the company committed to expanding real-world deployments and advancing privacy-preserving intelligence and autonomous robotics onto the global stage - defining the next generation of AI-driven robotic intelligence standards.DeCloak's next-generation privacy-preserving AI universal decision platform for robotic systems. Credit: DeCloak

The Taipei City Government is rolling out a new phase of its innovation strategy. To advance the "Three Arrows for Startups" policy and strengthen the city's competitiveness within the global innovation ecosystem, the "InnoPad Taipei," located in Nangang and spanning approximately 5,300 square meters, has completed preliminary planning and is scheduled to officially launch in mid-2026. The hub will serve as the first landing point for international startups establishing operations in Taiwan.Nangang: a convergence hub for startups, building a cross-domain innovation networkIn recent years, Nangang has rapidly evolved into a major innovation and technology hub in Taipei. With its strategic three-rail transit convergence and proximity to high-tech industry clusters - including Neihu Technology Park, Nangang Software Park, and the Taipei Bioinnovation Park - as well as Nangang Exhibition Center, the district has become a concentrated center for leading enterprises and talent. Recognizing this locational advantage, the city has positioned InnoPad Taipei as a nexus where enterprises, accelerators, investors, and domestic and international startups converge, fostering an ecosystem for cross-regional and cross-disciplinary innovation collaboration. The hub connects Taipei's complete entrepreneurial resource chain - including incubators, corporate partners, international accelerators, and local startup communities - to build a comprehensive one-stop international landing service system. This will help startups rapidly access local resources, expand business opportunities, and strengthen engagement and collaboration within the global ecosystem.Three core functional zones: meeting diverse startup needsThe hub's interior is organised around three major functional zones tailored to the needs of startups at different stages: Co-working Area: Flexible workspace for early-stage teams seeking quick landing and agile operations.Independent Office Zone: Suitable for growing teams that requires stable, dedicated office space.Meeting and Co-creation Spaces: Supporting corporate partnership discussions, Demo Days, medium to large-scale events, and cross-domain exchanges.What makes the hub even more attractive is that teams signing a one-year contract will receive complimentary company registration services, significantly lowering administrative barriers to entrepreneurship. International teams with a clear landing plan can also apply directly for residency and receive hands-on consulting support.Building a city-level accelerator network, connecting corporate needs and global marketsThe hub will host a network of startup accelerators, including general-purpose and corporate accelerators, offering services such as entrepreneurial mentorship, fundraising consulting, technology integration, corporate partnerships, and international market expansion pathways. Together, these will form a complete "startup growth acceleration chain."The city government emphasized that related strategies will be coordinated across departments and continuously adjusted to ensure the hub remains aligned with global innovation trends over the long term.More than a building - a growth engine for Taipei's startup ecosystemThe Taipei City Government stresses that the hub's core value goes far beyond providing office space. Its mission is to build a long-term, sustainable innovation ecosystem.The hub will: Provide comprehensive one-stop landing services, regularly host international startup showcases, organize cross-border matchmaking events and Demo Days, offer corporate networking sessions, entrepreneurship courses, and strategy workshops, and bring together global entrepreneurs, legal entities, incubators, and investors.Through these initiatives, the hub aims to attract more international teams to establish operations, collaborate, and invest in Taipei - further elevating the city's visibility on the global innovation map.Taipei's next leap: becoming a global entrepreneur-friendly cityThe city government stated that "InnoPad Taipei" represents a significant milestone in advancing Taipei's innovation and technology policies. The city is committed to creating an open, welcoming, and competitive startup ecosystem and will continue to promote international collaboration, helping more entrepreneurs realize their dreams in Taipei and expand globally, ultimately establishing Taipei as a truly global entrepreneur-friendly city.