LITEON Technology is actively capitalizing on the AI boom by restructuring its data center infrastructure around megawatt-scale power, rack and liquid cooling. The company has developed high-density 800 VDC power architectures and advanced cooling systems to support massive, next-generation AI accelerators.At COMPUTEX 2026, LITEON hosted the "AI Summit Panel" on the opening day, themed "Powering the AI-driven Future: Scaling AI Across Architecture, Systems, and Infrastructure." Moderated by Colley Hwang, Chairman of DIGITIMES, the Panel brought together industry leaders from NVIDIA, Infineon and GIGABYTE to examine how AI is reshaping the technology landscape. The discussion highlighted how rapid AI adoption is driving structural changes brought across the ecosystem, particularly in data center infrastructure and power demand. As AI scales, power availability and efficiency are becoming central considerations, with AI factories emerging as a defining paradigm in the next phase of industry development.Hwang opened by noting that AI has become a key driver of global productivity growth and is expected to generate trillions of dollars in economic value. As a result, infrastructure and deployment models are being fundamentally reshaped, with data centers rapidly evolving into AI factories. In this transition, the availability and reliability of energy have emerged as critical enablers of large-scale deployment, elevating power and cooling from supporting functions to core elements of system architecture.More than just chips, AI revolution requires huge energyNVIDIA Senior Director, HPC and AI Hyperscale infrastructure Solutions, Dion Harris spoke first. He referenced NVIDIA CEO Jensen Huang's speech in the NVIDIA GTC Taipei held in the previous day, addressing the "five-layer cake" analogy to illustrate AI from being just a software tool into a vast, vertically integrated industrial system. At the very bottom of the cake is "energy". Before the AI can showcase real-time intelligence, the systems fundamentally rely on efficient and stable power supply."Building AI factories goes beyond compute-you have to power them, cool them, and run them reliably to truly monetize AI," said Dion Harris at NVIDIA. "Infrastructure and energy play a critical role in determining token cost and performance per watt. As Jensen Huang's‘five-layer cake’ illustrates, without strong foundational layers, higher-level innovation cannot scale. This is why ecosystem collaboration is essential."Harris further mentioned NVIDIA DSX platform as a blueprint for AI factory development, defining how next-generation infrastructure is designed, built and operated. Under this framework, AI factories are evolving to support rapidly growing token demand driven by today's AI applications. He emphasized that achieving optimal token cost and performance per watt ultimately relies on strong ecosystem collaboration, noting that partners like LITEON play a critical role in delivering the power, cooling, and operational capabilities required to support frontier and open-source AI workloads at scale.Dr. Sergio Rossi, Vice President of Application Marketing at AI and Power division of Infineon Technologies, noted that AI adoption accelerates, the key competitive bottleneck is shifting from compute to energy, especially in regions such as Europe where electricity availability has become increasingly constrained. That's the reasons why LITEON, NVIDIA, GIGABYTE and Infineon engage in collaboration to have several steps forward to make sure the design is using the right technology, architecture and solutions for securing AI development to use energy in the most efficient manner."Just improving energy efficiency by a few percentage points can translate into saving power at the scale of an entire city, highlighting how critical efficiency has become in AI data center development," said Dr. Serio Rossi.Rossi further highlighted that the AI ecosystem is facing three key complexities, including acceleration, with development cycles shortening from 30 months to 6 months; increasing architectural complexity driven by the adoption of 800 VDC in next-generation data centers; and rapid innovation in power technologies such as SiCs and GaNs to enhance energy efficiency. To address these challenges, he emphasized the importance of close ecosystem collaboration, where infrastructure stakeholders work together to anticipate future demand and align on technology roadmaps with partners such as Infineon at an early stage. This enables faster development cycles and accelerates innovation in power and infrastructure solutions for evolving AI requirements.Leo Wang, EMEA regional Product & Marketing Lead at Giga Computing, talked about how the company collaborates with industry leaders to advance AI performance through hardware innovation and liquid-cooled server solutions optimized for AI workloads. He noted that as AI infrastructure evolves, the focus is extending beyond server performance to broader data center challenges, particularly in power and thermal management.Wang added that maximizing the value generated from available energy is becoming a key industry priority, making close ecosystem collaboration essential. Leveraging Taiwan's strong supply chain and close engagement with global partners, this collaboration is helping to establish scalable deployment models and best practices for global AI adoption."We are now dealing with increasingly heterogeneous machines, from training systems to different AI applications, so power and space both need to be carefully managed, as all of these resources are limited," said Leo Wang at Giga Computing, "Everything comes down to how we build a proper data center and a proper environment to serve the server in a consistent way. It is no longer just about building servers, but about optimizing at the data center level to ensure power is allocated and utilized in an effective and efficient way."From Power to Infrastructure: Enabling the Next Phase of AI ScalingIn response to the energy and infrastructure challenges highlighted in the panel, LITEON showcased its integrated capabilities across power, mechanical, and thermal systems to support next-generation AI infrastructure at COMPUTEX 2026. LITEON debuts 800 VDC liquid-cooled power rack, alongside a comprehensive portfolio of solutions, including the 110kW power shelf for NVIDIA Vera Rubin NVL72 platforms and the 280kW in-rack CDU. Together, these offerings address the growing demand for high-density and energy-efficient AI infrastructure, demonstrating LITEON's ability to integrate power delivery, thermal management, and system design to support scalable AI deployment, and reinforcing its role as a key enabler in the evolution toward megawatt-scale AI data centers.

Clientron, a premier global provider of smart endpoint solutions, today announced a strategic partnership with Parallels, a global leader in cross-platform and virtualization solutions. Through this collaboration, Clientron will bring Parallels Workspace solutions including Parallels RAS (Remote Application Server), Parallels Browser Isolation and Parallels DaaS to organizations across Southeast Asia, offering a simple, flexible, and secure alternative for businesses looking to modernize digital workspaces and reduce IT cost and complexity.In today's hybrid work era, IT teams across Southeast Asia are increasingly burdened by "Legacy VDI Platforms" and are increasingly looking for ways to simplify digital workspace management, reduce operational overhead, and improve cost efficiency. Parallels Workspace solutions address these challenges with streamlined deployment, flexible infrastructure support, and cost-effective application and desktop delivery across hybrid and multi-cloud environments."Businesses want to stop using old and costly systems," said Vivienne Weng, Vice President at Clientron. "Parallels is a great way to reduce the work for IT teams. With Clientron's high-performance hardware, we help IT managers in Asia move away from expensive setups to a smarter and easier way to manage their workspaces.""Many organizations across Southeast Asia are currently seeking solutions to modernize their digital workspace strategies," said Asif Khan, Country Sales Manager at Parallels. "As a strong mid-market enabler, Parallels helps organizations simplify application and desktop delivery with secure, flexible solutions designed for hybrid and multi-cloud environments - backed by competitive and cost-effective pricing. Together with Clientron, we're expanding access to these modern workspace solutions across the region."Key Advantages of Clientron x Parallels:1. Cost-Effective Seamless Access: Smoothly run critical apps on Mac, Windows, or Linux platforms while cutting Total Cost of Ownership (TCO); 2. Deployment Without Complexity: Parallels Workspace Solutions can be deployed in hours with minimal specialized training; 3. Ultimate IT Flexibility: Support workloads across hybrid, multi-cloud, and on-premises environments, protecting enterprises from vendor lock-in; 4. Stronger Security: Modern encryption and login technology to keep your data safe with high-class protection while staying fast and smooth; and 5. Localized Southeast Asia Support: Dedicated focus on key Southeast Asian markets including Malaysia, Thailand, the Philippines, Taiwan, Vietnam, and Indonesia, helping customers and partners access localized expertise, deployment support, and faster regional engagement.Moving forward, Clientron will continue to expand its footprint in Asia, working closely with channel partners to promote Parallels solutions and help enterprises build 'Smart Secure Workspaces' for the future.Deliver secure apps and desktops via Parallels RAS with simple VDI and seamless remote access.Credit: Clientron

Rugged edge computing brand – Cincoze will participate in Automate 2026 in Chicago, USA, from June 22–25 (Booth #861). Under the theme of "Empowering Smart Automation with Edge AI," Cincoze will present its complete range of Edge AI computing and automation solutions across four dedicated zones, including DIN-Rail Computers, Industrial Panel PCs and Monitors, Rugged Embedded Computers, and GPU Embedded Computers.DIN-Rail Computers Zone: The Optimal Computing Platform for Smart Manufacturing and Machine VisionThe Machine Computing — MAGNET product line is engineered for machine vision and smart manufacturing. The flagship MD-3000 Series, winner of the 2026 iF Design Award, will be on display, showing its powerful computing performance, flexible expandability, compact form factor, and DIN-rail installation. In addition to wide temperature and wide voltage support and EN 61000-6-2/6-4 industrial environment EMC compliance, the MD-3000 Series is powered by Intel Core desktop-class CPUs and supports up to 96 GB of DDR5 memory and dual NVMe SSDs, effortlessly handling the high-speed image processing and large-scale data storage demands of machine vision. The modular scalable architecture supports 2-, 4-, or 6-slot expansion decks with a variety of I/O interfaces, PoE modules, M.2 slots, and storage options to meet diverse integration needs. At just 150 mm in height, the compact chassis mounts on DIN rails for flexible deployment in production-line control cabinets, overcoming the challenges of space-constrained installations.Industrial Panel PCs and Monitors Zone: Complete HMI Solutions for Modern Factory ApplicationsThe Display Computing — CRYSTAL product line offers nearly 250 configurations of industrial panel PCs and monitors, covering a wide range of computing performance levels, screen sizes, display ratios, and touch technologies for harsh indoor industrial environments, high-brightness outdoor settings, and open-frame equipment integration. The entire series supports a wide temperature range and a wide voltage input, and is waterproof and dustproof, making it the go-to choice for HMI solutions in demanding industrial environments. The newly launched CV-200 Series features a ≤ 3 mm ultra-slim bezel design that combines performance with aesthetics. Its 178° wide viewing angle, Full HD resolution, and anti-glare coating ensure crisp, clear visuals even in bright indoor lighting. IP66-rated front panel protection, paired with wet touch tracking technology and EN 61000-6-2/6-4 industrial environment EMC compliance, enables long-term, reliable operation in harsh environments, making it an outstanding intelligent management solution for automated factories.Rugged Embedded Computers Zone: Built for Complex and Demanding Industrial EnvironmentsThe Rugged Computing — DIAMOND product line features six product series, all carrying UL safety certification to meet stringent international safety requirements. They support a wide temperature range and a wide voltage input, with industrial-grade protection for high levels of ruggedness and reliability, ensuring worry-free deployment. Customers can select the right model based on desired performance, form factor, power consumption, and industry-specific certification requirements. The newest model, launched in 2026 and the highlight of the show, is the DX-1300 Series, a high-performance compact embedded computer. It supports the latest Intel Arrow Lake-S Core Ultra 200S processor and up to 6400 MHz DDR5 ECC memory, providing ample computing power for Edge AI applications and high-end image processing. Extensive I/O options and diverse expansion capabilities cover all application needs. The compact chassis, combined with a high-end processor and versatile expandability, makes it particularly well-suited for applications that demand high performance in space-constrained installations.GPU Embedded Computers Zone: Full Coverage for Every Edge AI Workload, from Light to HeavyThe GPU Computing — GOLD product line features three series designed to meet different tiers of AI application needs. The GJ Series is purpose-built for entry-level, Light AI applications, featuring NVIDIA Jetson SoM GPUs that deliver efficient AI acceleration with minimal power consumption. For mid-range AI workloads, the GM Series, which supports MXM GPU modules, is the recommended choice. On display is the award-winning GM-1100 Series, recipient of the 2025 Red Dot Design Award and the 2026 Taiwan Excellence Award, delivering outstanding computing performance in a compact chassis, combined with industrial-grade ruggedness and environmental resilience for autonomous mobility equipment, automotive, and image recognition applications. The GP Series excels at Heavy AI workloads, supporting Intel Core CPUs and up to two 300W full-length GPU cards. Three patented designs for expansion, thermal management, and vibration-resistant locking address key user pain points and help customers tackle the most complex and demanding Edge AI applications.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers."The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," said SK hynix, adding that "We will work closely with partners for mass production in a timely manner." The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models. These enhancements improve data processing capabilities for AI training and inference.The HBM4E reduces data transfer latency through its latest interface and design optimization while maintaining stable operation in high-bandwidth environments. This enables customers to increase efficiency in processing data for AI datacenters and large-scale computing systems. SK hynix utilizes Advanced MR-MUF technology for HBM4E products to achieve a 48GB capacity in a 12-layer stack while ensuring structural stability. In particular, the company has also improved heat resistance by 17 percent, compared to the preceding HBM4, enabling stable operation of memory chips in high-performance computing environments.SK hynix has successfully supplied optimized memory solutions to customers based on its expertise in the mass production and supply of HBM3, HBM3E, and HBM4. Leveraging its market-proven product reliability and supply capabilities, the company will support the development of next-generation infrastructure while helping address AI system bottlenecks. "SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise," said Ahn Hyun, President and Chief Development Officer, adding, "Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator."Credit: SK hynix

Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material and Celeritas HM001 is a near-zero CTE material. Used together in a single stackup, they bring board CTE below 10 ppm/°C while simultaneously delivering Tier 9 electrical performance.Every hyperscaler building AI infrastructure is confronting the same pair of converging constraints. As AI accelerators scale beyond reticle limits, thermomechanical mismatch between silicon (2–4 ppm/°C) and standard PCB materials (~18 ppm/°C) produces catastrophic reflow warpage, package bow, and solder joint fatigue. Simultaneously, the explosive growth in data rates, driven by HBM, UCIe, and chip-to-chip interconnect operating at 100+ Gbps, is pushing signal integrity requirements beyond what standard PCB dielectrics can support. The industry has been searching for two separate solutions to two separate problems. ACCM has built one material family that addresses both.The industry's leading proposed fix of solid glass substrates remains positive in CTE and does not address the electrical side at all. ACCM today announced Celeritas HM50 and Celeritas HM001, which together solve both problems simultaneously. Programs can start today.Celeritas HM50 FEA – Standard PCB at 18 ppm/°C (left) vs. PCB with HM50 at 10 ppm/°C (right). FR4 PCB baseline fails JEDEC qualification, while the PCB with HM50 shows >100× improvement. Warpage and Package Bow are reduced by 64%, and 81%, respectively. Combined HM50+HM001 stackups achieve even lower effective CTE.Keshav Amla, COO of Advanced Chip & Circuit Materials, said,"Rather than incrementally tuning stackups, we are applying a breakthrough materials innovation to remove a fundamental limitation that has constrained system scaling. HM50, with its negative CTE of -8 PPM/°C, drives the effective CTE of the board down. Even with heavy copper designs, you could tune a board down to 12, 10, 8 PPM/°C or lower. And where next-generation data rates demand extreme loss performance, HM001 replaces those layers with a Tier 9 loss material that has a near-zero CTE. Together, they give designers headroom they simply have not had before."The HM Class of materials matches each layer type in an AI accelerator stackup with a material purpose-built for it: HM50 for the power planes, HM001 for the signal layers. As AI accelerators grow in scale, the industry has long struggled with two separate problems — boards warping under thermal stress, and signal loss at extreme data rates. ACCM's Celeritas material family tackles both within a single solution. Celeritas HM50 counteracts the thermal expansion mismatch that causes warpage and solder joint failures, enabling designs that previously failed industry qualification to now meet it with significant margin. Celeritas HM001 addresses the signal integrity side, supporting the data rate demands of next-generation AI interconnects while also contributing to thermal stability. Together, the two materials give chip and board designers headroom that standard PCB materials have not been able to provide. For more details, please visit here.Credit: Advanced Chip and Circuit Materials

As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation technologies, from enterprise data centers (EDCs) and AI PCs to the Internet of Things (IoT) and 6G communications, require unprecedented bandwidth. However, as data rates climb, ensuring signal integrity during semiconductor testing becomes exponentially more difficult. Even slight impedance mismatches or signal degradation can trigger false failures, compromise yields and delay critical product launches.To address these fundamental industry challenges, Smiths Interconnect, a Molex company, has introduced the DaVinci Gen V test socket. Built upon a patented mechanical foundation, this fifth-generation coaxial test socket provides an out-of-the-box solution engineered to overcome impedance tuning and signal degradation hurdles. The product rigorously tests semiconductor chips during manufacturing to ensure they deliver ultra-reliable, lab-grade accuracy in high-volume production environments.Core Mechanical InnovationsThe performance of the DaVinci Gen V is rooted in its core mechanical innovations. A new signal cavity design allows for superior impedance control, establishing a cleaner and more reliable signal path. This is achieved through enhanced conductor-to-ground concentricity, which minimizes signal degradation and surpasses all previous DaVinci series models. The socket utilizes spring probe technology featuring a homogeneous alloy plated with gold to ensure better grounding. These precision probes deliver a consistent, stable contact resistance averaging as low as 33 milliohms and boast a long contact life that has been tested up to 500,000 insertions.Electrical Performance and Signal IntegrityThe electrical performance of the DaVinci Gen V sets a new benchmark for semiconductor validation. Designed to overcome the physical challenge of scaling impedance for next-generation chips, the socket supports staggering digital speeds. It enables unprecedented signaling speeds of up to 224Gbps PAM-4 for AI accelerators and speeds beyond 100 GHz for future 6G networks.In terms of RF characteristics, the DaVinci Gen V delivers a bandwidth greater than 84 GHz at a -1 dB insertion loss. The architecture utilizes a short signal path with a 4.90mm test height and the impedance can be precisely tuned to match the system or be defined as needed.Operational and Manufacturing AdvantagesBeyond raw speed, the DaVinci Gen V is engineered for streamlined, scalable manufacturing. The socket accommodates high co-planarity and features a tri-temp design capable of operating in extreme environments ranging from -55°C to 150°C. This robust mechanical performance ensures that the exact same socket can be utilized across manual test, bench test and high-volume manufacturing production test stages, guaranteeing consistency.Recognizing that modern integrated circuits are rapidly growing in complexity and size, the DaVinci Gen V was designed to easily accommodate an increase in next-generation ASIC (application specific integrated circuit) sizes. Despite this scalability, it maintains full compatibility with existing test hardware and PCB socket footprints. This backward compatibility allows manufacturers to transition effortlessly, saving costs, reducing development cycles and significantly accelerating time-to-market. The socket is also highly serviceable in the field, permitting the replacement of a single probe or the full array, and can be cleaned while the system is running using a cleaning surrogate.Target End Markets and Proven ApplicationsThe broad capabilities of the DaVinci Gen V make it well suited for a wide range of advanced semiconductor applications. Target end markets include data center processors such as CPUs and GPUs, AI accelerators and ASICs, high-performance computing and tensor processors, network switches and FPGA-based 224G SerDes devices, as well as autonomous vehicle and ADAS chips. As demand for higher bandwidth and faster data processing continues to grow, these applications require increasingly stringent testing accuracy and signal integrity performance.Its effectiveness in high-stakes, high-volume environments is already proven. Since the product's launch, Smiths Interconnect has secured a key program with a leading technology company to support their advanced AI GPU accelerator chips.Building on this initial success, the company was subsequently awarded a next-generation accelerator chip program with the same partner. This continued partnership  underscores the superior performance, innovation, and reliability of Smiths Interconnect’s test socket technology.The DaVinci Gen V test socket redefines high-speed semiconductor testing by combining advanced, patented insulated metal technology with precision impedance tuning. It effectively eliminates measurement errors while guaranteeing lab-grade accuracy and repeatability in robust production settings. By enabling the reliable validation of high-bandwidth devices, the DaVinci Gen V ensures that manufacturers are fully equipped to meet the performance demands and future-readiness requirements of tomorrow's most complex integrated circuits. Contact Smiths Interconnect  to learn more.DaVinci Gen V supports AI accelerators, GPUs and data center processors. Credit: Smiths Interconnect

The global semiconductor industry is undergoing profound transformation-not only in process technologies and transistor density, but also in the composition of its workforce. Taiwan, the undisputed center of advanced semiconductor manufacturing, is increasingly attracting a new generation of technical talent: female engineers. By choosing Taiwan as the starting point of their professional journeys, these women are bridging the gap between academic training and industrial practice, while bringing fresh perspectives to a field that depends on precision, resilience, and collaboration.The Industrial Development Administration under the Ministry of Economic Affairs is committed to building a comprehensive support and training ecosystem for international talents in Taiwan. The program covers key semiconductor technologies, cross-cultural communication, and local integration, while also leveraging online learning resources that connect talent across regions.Designed to help outstanding international students and professionals transition smoothly into Taiwan's semiconductor industry, the initiative provides early exposure to the local industrial ecosystem and offers diverse mentorship and support services to strengthen long-term adaptation and career development in Taiwan. Through these efforts, Taiwan aims to foster a more inclusive environment for global talent while enhancing the international competitiveness of its semiconductor industry.Through the stories of Phan Thi Kim Ngan from Vietnam and Alyana Denise Ramirez from the Philippines, a broader narrative emerges-one defined by perseverance, cross-cultural adaptation, and a shared ambition to shape the future of technology.A Strategic Choice: Why Taiwan?For many aspiring engineers across Southeast Asia, Taiwan represents the pinnacle of the global semiconductor industry-a place where innovation is not only developed, but realized at scale.Alyana Denise Ramirez, an A3 EE Assistant Engineer at ASE and a student at I-Shou University, says she came to Taiwan driven by both purpose and opportunity. For her, working in Taiwan provides a critical pathway to career growth, allowing her to directly apply academic knowledge in real industrial settings.Phan Thi Kim Ngan, who recently completed her Master of Science in Electrical Engineering at National Yang Ming Chiao Tung University (NYCU), shares a similar perspective. Coming from Vietnam-a rapidly developing economy with strong momentum in manufacturing and services-she found Taiwan' highly specialized ecosystem in semiconductors, AI, and computer science to be a decisive attraction.  "Taiwan is the leader in semiconductor manufacturing in the world, and there is no better place to learn the most advanced technology in semiconductor than here," said Ngan.This close proximity to the "real industry" is one of the strongest motivations for international students who want to see their ideas move beyond the classroom and into production lines that power the global technology supply chain.The Female Edge in EngineeringWhen asked what unique perspectives female engineers bring to the industry, both women point to structured thinking, adaptability, and diversity in problem-solving.Alyana observes that female engineers often bring stronger attention to detail and greater creativity when addressing technical challenges. This helps prevent solutions from becoming one-dimensional and ensures that multiple perspectives are considered before final decisions are made.For Kim Ngan, building influence within a team - especially in multinational environments - is less about speaking the most and more about building reliability over time.By consistently following through on commitments and communicating clearly, she found that trust and influence develop naturally.The Philosophy of Consistent Small ImprovementsEntering the high-pressure world of semiconductor manufacturing and AI development can be intimidating. Kim Ngan recalls her early experiences in team discussions, where she often felt uncertain and hesitant to speak up.Rather than trying to solve every challenge at once, she adopted a philosophy of steady, incremental growth."Growth does not come from sudden breakthroughs, but from consistent small improvements," Kim Ngan says.This methodical mindset often meant spending nearly an hour preparing a single question for her supervisor-ensuring both clarity and confidence before speaking. Such discipline reflects the essence of engineering: breaking down complex challenges into manageable, solvable steps.Bridging Cultural and Communication GapsWhile technical challenges are significant, cultural adaptation can be equally demanding. For Alyana, the greatest challenge was not engineering itself, but language. "Chinese is not my forte," she admits, noting that learning Mandarin has been one of the most difficult aspects of both studying and working in Taiwan. She hopes to pursue a master's degree abroad in the future after gaining more professional experience and further advancing her career.Language barriers remain one of the key challenges in retaining international talent. Recognizing this, ASE provides Mandarin classes to support foreign employees' workplace integration. Alyana believes language is essential-not only for work efficiency, but also for building friendships and stronger professional relationships.Kim Ngan also observed distinct workplace differences in Taiwan, particularly in how professionals think, communicate, and present ideas during meetings. During her internship at Micron, she learned that even seemingly small pieces of data can influence decisions across multiple teams.This experience taught her that engineering is not only about technical accuracy, but also about how ideas are communicated, applied, and shared across highly collaborative environments.Corporate Support and the Pursuit of StabilityTaiwan's semiconductor companies increasingly understand that attracting talent is only half the challenge-retention is the true long-term priority. As a result, many companies are building workplace environments that emphasize employee well-being, career development, and long-term stability.Specialized Healthcare: ASE provides female-focused healthcare services, including pap smears and pregnancy-related health checkups through its on-site clinics.Mentorship: Supervisors and team leaders offer constructive feedback and help international engineers prepare for major presentations, reducing anxiety and strengthening confidence.Financial & Career Growth: Competitive salaries and clearly defined career development paths are key reasons many foreign professionals choose to remain in Taiwan long-term.Daily Life Stability: Public safety, convenient transportation such as HSR and MRT systems, and accessible 24-hour public amenities create a stable and low-stress living environment.Integration Beyond the WorkplaceLife for these engineers extends far beyond laboratories and cleanrooms. Integration into local communities often happens through shared everyday experiences-playing tennis with Taiwanese colleagues, gathering during Lunar New Year celebrations, singing together, and sharing traditional foods from home.Kim Ngan finds comfort in the similarities between Taiwanese and Vietnamese cuisine, while also enjoying introducing her colleagues to Vietnamese spring rolls. These moments of cultural exchange help foster the trust and mutual understanding that she believes form the foundation of strong teams.A Message to the Next GenerationBoth women share a clear message for young female students in their home countries: the opportunity is real, and the door is open.Alyana encourages them not to fear continuous learning or change. Kim Ngan offers equally practical advice: "You do not need to be fully ready to begin-you only need to be willing to make mistakes and keep learning."Taiwan's semiconductor industry is more than a collection of factories; it is an ecosystem that offers a genuine stepping stone for ambition, growth, and long-term career development.As Kim Ngan prepares to begin her full-time career at Micron following graduation, her journey stands as proof that with curiosity, persistence, and the right support system, the future of engineering is becoming increasingly global-and increasingly female.By emphasizing consistency, reliability, and the connection between theory and practice, these women are not simply participating in the industry-they are helping lead its transformation toward a more inclusive and innovative future.   

JMicron Technology Corp., a global leader in high-speed Bridge IC solutions, today announced it will unveil its flagship innovations at COMPUTEX 2026. Building on years of proven expertise in high-speed interface technologies and strong market recognition, JMicron will present a portfolio centered on extreme performance, intelligent backup, and hyperscale expansion, demonstrating its continued momentum in advancing the digital storage ecosystem.In response to the stringent demands for performance and data protection in big data and professional storage markets, JMicron introduces three key controllers: JMS591, JMS591U, and JMB595.JMS591 is purpose-built for multi-bay HDD array applications, supporting USB 20G and eSATA interfaces. In RAID 0 mode, it delivers read/write performance exceeding 2000 MB/s, providing a powerful foundation for NAS and DAS systems.JMS591U targets enterprise and professional users, integrating JMicron's exclusive Offline Clone & Erase technology. It enables 1-to-4 high-speed duplication and DoD-compliant data sanitization, offering a one-touch solution for data migration and security compliance.JMB595 is a high-performance PCIe Gen4 x4 to 16-port SATA III expansion controller. Through cascading architecture, it can scale to connect up to 240 storage devices, ideally suited for hyperscale data centers and surveillance storage infrastructures."JMicron has long been committed to transforming complex high-speed transmission technologies into intuitive and powerful hardware solutions," said Ming-Cheng Lin, VP of Sales and Marketing at JMicron."The products showcased at COMPUTEX not only push storage performance beyond the 2000 MB/s milestone, but also precisely address customers' critical needs in large-capacity storage and security compliance through integrated RAID engines and offline cloning technologies. We are not merely a chip supplier—we are a strategic partner helping customers build a solid foundation in the data-driven era."JMicron cordially invites global partners and media representatives to visit its booth at COMPUTEX 2026. Through face-to-face engagement and forward-looking technology demonstrations, JMicron looks forward to exploring the future of storage innovation together and ushering in a new era of high-efficiency data transmission and intelligent data management.

Solid State Storage Technology Corporation (SSSTC), a subsidiary of Kioxia Corporation and a leading global SSD provider, is showcasing its enterprise SSDs designed for immersion cooling and engineered for AI-driven data centers, along with a comprehensive portfolio of industrial and enterprise SSD solutions.As generative AI and high-density computing evolve, thermal management is critical. To address this, SSSTC has optimized its SSDs for immersion cooling environments by enhancing corrosion resistance through specialized materials, component protection, and structural design. The lineup includes the SATA ER3, ER4, and ER5 series, as well as the PCIe U.2 PJ1 and EJ5 series.These SSDs are optimized for immersion cooling environments, where systems are submerged in non-conductive dielectric fluids. By leveraging the high heat capacity and convective properties of liquids, heat can be efficiently dissipated through fluid circulation and heat exchange. This approach reduces reliance on traditional air cooling while improving Power Usage Effectiveness (PUE) and overall system reliability.SSSTC is also highlighting a range of industrial and enterprise SSDs optimized for AI and edge applications. Industrial SSDs support Edge AI and harsh environment deployments, with operating temperatures ranging from -40-degrees Celsius to 85degrees Celsius, along with anti-vibration and shock-resistant designs for outdoor and industrial environments. The pSLC architecture enhances endurance for sustained write-intensive workloads, while a multi-tier PLP (Power Loss Protection) framework -  including hardware PLP, firmware PLP, and PLN -  provides flexible data protection.Enterprise eTLC SSDs are designed to deliver stable performance for AI workloads, offering endurance options of 1 and 3 DWPD over a five-year period for varying workload intensities. Under sustained workloads, they maintain more than 90% random IOPS consistency, minimizing performance fluctuations. Firmware optimized for high-density computing enables low latency operation, while capacitor-based PLP and immersion cooling support ensure reliable performance in demanding deployment environments.With more than 18 years of in-house firmware development expertise, SSSTC understands diverse storage requirements across industries and provides flexible customization options, including configurable over-provisioning, lifespan and capacity optimization, performance and power tuning, and application-specific firmware development. SSSTC remains committed to helping customers build stable, efficient, and sustainable AI storage infrastructures.Founded in 2008, SSSTC became a subsidiary of Kioxia Corporation in 2020 and delivers high-quality SSDs through in-house firmware and NAND expertise. For more information, visit the SSSTC website.Remark: PCIe is a registered trademark of PCI-SIG.Credit: SSSTC

The global semiconductor landscape is undergoing a fundamental shift, moving from a focus on raw training power to the practical complexities of large-scale deployment. In an in-depth interview, Wallace Kou, President and CEO of Silicon Motion, detailed how the generative AI has evolved beyond its initial stages. While the market's early gaze was fixed almost exclusively on NVIDIA's GPUs, the High Bandwidth Memory (HBM), and the CoWoS advanced packaging technology, Kou argues that the industry is now entering the "Inference" era that is turning previous under-estimation about storage's importance on their head.The Shift from Training to InferenceThe turning point for this realization occurred during the NVIDIA GTC conference in March 2026. CEO Jensen Huang unveiled the Vera Rubin architecture, a move that signaled a massive spike in demand for NAND flash memory. During the initial AI boom, the industry was preoccupied with training massive models, a process that relies heavily on the lightning-fast throughput of HBM. However, as these models move into the inference phase - where they are actually used by end-users to generate content or solve problems - the access to context, historical data, and massive datasets storage become the primary bottleneck.Kou notes a dramatic shift in market sentiment. Only two years ago, storage was often an afterthought in the AI conversation; today, it is a critical scarcity. "There is currently not a single global cloud service provider or major smartphone manufacturer whose demand for DRAM and NAND is being fully satisfied," Kou observed. This supply-demand gap has triggered a financial windfall for storage module manufacturers and memory giants, with some stock prices skyrocketing up to tenfold as the market reacts to persistent shortages and rising prices.Technical Paradigm Shift: CMX and the Infrastructure of ThoughtAt the heart of this transition is a new architecture introduced by NVIDIA: the CMX Context Memory Storage platform. This architecture is designed specifically to handle the "KV Cache" (Key-Value Cache), which allows AI models to remember the context of a conversation or a complex task during the inference process.The hardware requirements for the CMX architecture are staggering in their scale and technical demands. Each individual Rubin GPU requires 16TB of dedicated storage to function effectively within this framework. At a system-level scale, a single NV72 Vera-Rubin setup can demand more than 1 Petabyte, or 1,000 Terabytes, of total storage capacity. Beyond mere capacity, the CMX architecture facilitates direct GPU access to storage, a feature that bypasses traditional latency bottlenecks and ensures that AI inference remains fluid and responsive.While this creates a massive commercial opportunity for the storage industry, it also places an unprecedented strain on NAND production. Kou emphasizes that this is not just a cloud-based phenomenon. The explosion of Edge AI - AI processed locally on devices - is further complicating the supply chain. For instance, driven by major players like Meta, the market for smart glasses is expected to reach 60 million units this year. These wearable devices require high-performance embedded storage, creating a secondary front in the war for NAND capacity.Silicon Motion's Role: Solving the QoS BottleneckAs the world's leading NAND controller maker, Silicon Motion sits at the intersection of these competing demands. The primary technical challenge in modern AI environments is maintaining Quality of Service (QoS). In a multi-tenant cloud environment, where multiple GPUs are accessing shared storage simultaneously for different inference tasks, data transfer speeds can often fluctuate or drop.To solve this, Silicon Motion has deployed its proprietary PerformaShape technology. This technology ensures that even under heavy, concurrent workloads, the transmission speed remains stable. By stabilizing these data flows, Silicon Motion has positioned itself as an "indispensable stabilizer" in the AI ecosystem.Beyond data path optimization, Silicon Motion is also extending its role into system-level infrastructure by providing enterprise-grade boot drives for leading AI GPU, TPU, and DPU platforms, ensuring system reliability and fast initialization at scale.The Crisis of Imbalance: Kou's "Capacity Persuasion" EffortsDespite the record-breaking revenues, Kou is deeply concerned about the "shadows" lurking behind this prosperity. The current memory market is suffering from a dangerous imbalance. To maximize profits and satisfy the insatiable hunger of AI cloud giants, major manufacturers like Samsung, SK Hynix, and Micron are funneling the majority of their capital expenditure (CAPEX) into HBM and DDR5 production.This strategic pivot has effectively "squeezed" the production capacity available for standard NAND flash. Kou warns that this "AI squeezing effect" could lead to a collapse in traditional sectors. Over the past eight months, Kou has embarked on a global mission, meeting with leaders at Samsung, SK Hynix, Kioxia, SanDisk, YMTC, and Micron. His message is one of "capacity persuasion": he is urging these giants to reserve a portion of their production lines for the automotive, PC, and smartphone industries."If these foundational industries break because they cannot find parts, Edge AI will have no 'soil' to grow in," Kou warned. He believes that a total focus on the high-margin AI server market could eventually backfire, destroying the broader technology ecosystem that supports AI development.A Stabilizing Strategy: From Cloud to EdgeSilicon Motion is positioning itself as the "transition enabler" for an industry in flux amid an expected 2–3 year supply shortage. As NAND manufacturers concentrate their internal resources on AI-driven initiatives, they are increasingly outsourcing non-core and mainstream projects, such as PCIe Gen5 controllers and embedded solutions. In this shift, Silicon Motion has emerged as a preferred partner to fill the resulting gap.At the same time, as rising prices weigh on demand in the PC and smartphone markets, the company is helping customers pivot toward automotive and AIoT applications, including rapidly growing segments such as smart glasses, which are seeing a surge in shipments this year.One of the most critical areas is the automotive sector, where Silicon Motion has spent a decade building a presence. While memory giants might see automotive requirements as "niche" or low volume compared to AI servers, Kou views them as essential to global stability. When major OEMs consider abandoning these specialized demands due to capacity constraints, Silicon Motion steps in to ensure the global automotive supply chain does not grind to a halt."We are not just looking for a surge in revenue; we want to fulfill our responsibility to the industry," Kou said. By providing stable controllers and storage solutions for AIoT and automotive applications, Silicon Motion is effectively repairing the cracks in a fractured global supply chain.Future Outlook: 2027 and BeyondThe current supply-demand imbalance is not a temporary glitch but a structural reality that Kou expects to persist until at least late 2027 or 2028. Several factors make it nearly impossible to add capacity quickly, for example, land acquisition is increasingly difficult. The lead time for building specialized cleanrooms and procuring critical equipment now exceeds one year.Kou predicts that while the DRAM shortage might begin to ease by the end of 2027, the relief for NAND will likely come even later. In this high-pressure environment, Silicon Motion's role as a key stabilizing force becomes increasingly important.Particularly in emerging sectors such as smart IoT and automotive applications, Silicon Motion delivers reliable controller and storage solutions, filling the vacuum left by production shifts at major manufacturers or by projects lacking sufficient engineering support.By helping global clients navigate the complexities of geopolitics and capacity wars, Silicon Motion aims to ensure that the AI revolution leads to a steady, sustainable future rather than a chaotic collapse of the broader tech industry.AI inference boom fuels supply-demand imbalance until 2027-2028, says Wallace Kou. Credit: Silicon Motion