One of a handful of startups aiming to attack Broadcom's dominance in Ethernet switching emerges from stealth mode this week. Nephos spun out of Taiwan's Mediatek and will push packaging technology from TSMC to a new level.

In an attempt to regain its mojo, Toshiba will double down on traditional products that are seen as part of promising growth segments.

Evan Blass is back with information on the Galaxy S8. According to Blass, the device will now release on April 28th. This sets the date back by one week. Reasons for the delay include alleged quality control and production delays for the Snapdragon 835, on both Samsung and Qualcomm's ends. Blass isn't sure about the exact reason though, only that the rumored release will now take place a week later.

Industry watchers predicted SK Hynix may join hands with Taiwanese company Foxconn, also known as Hon Hai Precision Industry, to acquire Toshiba's chip business. Foxconn's Chairman Terry Gou has been "very serious" about bidding for Toshiba's memory chip business.

Apple is developing a new camera with "3D sensing and modeling capabilities" that could "reinvent the user experience" to be included in a redesigned iPhone expected to launch later this year, according to new research from KGI Securities analyst Ming-Chi Kuo seen by Business Insider.

"We don't expect many projects on our latest high-end chip," Mediatek Co-Chief Operating Officer Jeffrey Ju told reporters in a press briefing Monday at the Mobile World Congress here. "For now, we think less than 10 smartphone models will adopt this high-end X30 chip."

Despite a turbulent past, Windows PCs with ARM are making a grand return later this year, but only with Qualcomm chips. Another big ARM chipmaker, MediaTek, is sitting out the opportunity to put its ARM-based chips in Windows PCs because the company sees it as a limited opportunity.

Xiaomi has managed to secure itself a decent shipment of Snapdragon 835 chipsets for use in the company's upcoming high-end smartphone, Mi6.

Intel split the Cyclone 10 into the performance-oriented GX and low-power optimized LP series. The GX series uses TSMC's 20nm process and is geared for a number of uses in the industrial, automotive, and broadcast markets. These include machine vision, robotics, infotainment, Advanced Driver Assistance Systems, and audiovisual applications.

Despite the rumors that Samsung was hogging all the Snapdragon 835s for itself, Sony has brought a device with Qualcomm's top-of-the-line 2017 SoC to MWC.

Samsung will sell modified versions of the Galaxy Note 7 in emerging markets, including India and Vietnam, according to Hankyung, which claims the move is designed to help Samsung minimise losses and avoid a potential environmental fine.

Intel's modems aren't as good as Qualcomm's, but the company scored a major victory last year when some of its modems began shipping in some models of Apple's iPhone 7.

China's state-backed Tsinghua Unigroup is pushing for an initial public offering of its mobile chip unit, Unigroup Spreadtrum RDA, in 2018, sources told Nikkei Asian Review.

Most of the hand-wringing over the fate of Moore's Law focuses on the ever-shrinking silicon transistor. But increasingly researchers are concerned with another critical part of the infrastructure: the copper wires that connect individual transistors to form complex circuits.

The South Korea tech giant's reputation among the general public in the US fell 42 positions after the Note 7 debacle, while Amazon maintained its top spot for the second straight year.

How will this affect Samsung's businesses? For the time being, they seem to flourish or flounder no matter who the company's titular leader is.

Samsung hopes to avoid another disastrous recall by adding a third battery supplier for its new smartphone.

An upcoming Apple iPhone is likely to have a customized wireless charging system made with Broadcom, according to JPMorgan analyst Harlan Sur.

HTC's presence among major US carriers is waning as the company is shifting its focus away from low-end smartphones to more expensive handsets.

TetraVue, a company setting out to arm autonomous cars with ultra high-resolution 3D image-capturing smarts, announced it has raised $10 million from Robert Bosch Venture Capital, Nautilus Venture Partners, Samsung Catalyst Fund, and Foxconn.

Apple will in the coming months start assembling its lower-priced iPhone SE models at a contract manufacturer's plant in the southern Indian technology hub of Bengaluru, an industry source with direct knowledge of the matter said on Friday.

Apple's widely expected 5.8-inch iPhone with an edge-to-edge OLED display will feature a front-facing 3D laser scanner for facial recognition, corroborating previous rumors, according to JPMorgan analyst Rod Hall.

For what Intel's data center chief Diane Bryant called the upcoming "10nm+" node, as well as the 7nm manufacturing node to follow, Intel's data center chips will be first on those lines.

This amended complaint also expands the accused products to include the Apple iPhone 7 and iPhone 7 Plus which use Intel's PMB5750 transceiver chip, which is based on Intel's SMARTi architecture.

An Apple patent grant on Tuesday suggests the company is looking to leverage its LuxVue acquisition to integrate display technology capable of reading a user's fingerprint without a dedicated sensor, a design feature rumored to see release with "iPhone 8."

Intel's Atom C2000 processor family has a fault that effectively bricks devices, costing the company a significant amount of money to correct. But the semiconductor giant won't disclose precisely how many chips are affected nor which products are at risk.

Researchers at MIT have developed a low-power chip specialized for automatic speech recognition that could result in a power savings of up to 99%.

Apple is in discussions with China's BOE Technology to supply next-generation displays for future iPhones, a key component that's being provided by a Samsung Electronics unit, people familiar with the matter said.