DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
Government subsidies crucial for new TSMC fab establishment in US
TSMC is in talks with the US government about relevant subsidies for its new wafer fab in Arizona so that the foundry is able to implement the investment plan,...
PhD shortage to challenge TSMC: Q&A with company senior VP of R&D Cliff Hou
Shortages of personnel with PhDs will be a challenge facing TSMC as well as Taiwan's chipmaking industry by 2030, according to Cliff Hou, company senior VP of...
Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the...
Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing...
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...
China foundry HSMC to push chiplet standard formulation, says CEO Shang-yi Chiang
While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes,...
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the...
Coopetition and coexistence in IC industry: Q&A with ASE COO Wu Tien-yu
The global semiconductor industry is experiencing faster quantitative and qualitative changes along with the increasingly fierce coopetition among wafer foundry,...
Dual leadership should become long-term management model at TSMC, says Morris Chang
The dual leadership to be enforced at Taiwan Semiconductor Manufacturing Company (TSMC) starting from June 2018 should remain a long-term management model for...
Morris Chang sees hurdle for semiconductor development in China
While China is aggressively accelerating the development of its semiconductor industry, a hidden barrier will gradually surface to affect its development, in that...
Service-oriented corporate culture counts most in foundry sector, says Morris Chang
Once describing Intel and Samsung Electronics as "700-pound gorillas" when commenting on his company's two major competitors, Taiwan Semiconductor Manufacturing...
All feasts must come to an end: Q&A with TSMC chairman Morris Chang
Just three days after announcing an encouraging decision that Taiwan Semiconductor Manufacturing Company (TSMC) will build its 3nm wafer fab in Taiwan, the firm's...
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data...
Era of Silicon 4.0: TSIA chairman talks about virtual Moore's Law
With 2015 being the 50th anniversary of Moore's Law, one of the hottest topics that has continued to be discussed up until now in the semiconductor industry has...
7nm process is essential for semi industry: Q&A with Globalfoundries CTO Gary Patton
Gary Patton, a 30-year veteran in the semiconductor industry, joined Globalfoundries as CTO in July 2015. He now shoulders the responsibility of building up the...
Industry integration, 5G and IoT applications: Q&A with Qualcomm president Derek Aberle
Qualcomm president Derek Aberle spared his time with Digitimes for an exclusive interview recently and shared his insights into a number of major issues...
14nm process to bring healthy competition among foundries: Q&A with Globalfoundries senior VP Chuck Fox
The move by Globalfoundries to acquire IBM's semiconductor business unit and to team up with Samsung Electronics to aggressively step into the 14nm process market...
Green buildings: Q&A with Arthur Chuang, director of TSMC's New Fab Planning and Engineering Division
Taiwan Semiconductor Manufacturing Company (TSMC) has received Leadership in Energy and Environmental Design (LEED) certifications for its green buidlings. Digitimes...
Focus on advanced processes: Q&A with Alchip chairman Kinying Kwan
Founded in 2003 by semiconductor veterans from Silicon Valley and Japan, Alchip provides silicon design and manufacturing services for companies developing complex...
Emerging markets to drive China foundries' growth: Q&A with Digitimes Research analyst Nobunaga Chai
China's foundries may not be able to compete head-to-head against the industry's global top-three players in the most advanced process technologies, but their...
MEMS mass production to lead to increased foundry outsourcing: Q&A with Siimpel CEO Chee Kwan
Increasing global demand for smartphones has resulted in related advancements in handset functionality and increased competition among component suppliers. In...
