DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support...
Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment...
Government subsidies crucial for new TSMC fab establishment in US
TSMC is in talks with the US government about relevant subsidies for its new wafer fab in Arizona so that the foundry is able to implement the investment plan,...
PhD shortage to challenge TSMC: Q&A with company senior VP of R&D Cliff Hou
Shortages of personnel with PhDs will be a challenge facing TSMC as well as Taiwan's chipmaking industry by 2030, according to Cliff Hou, company senior VP of...
A new chapter for UMC: Q&A with company co-presidents Jason Wang and SC Chien
UMC, once a major rival to TSMC in pursuing advanced manufacturing nodes, decided about two years ago to shift its focus away from joining the race to 10nm and...
SiC MOSFET development: Q&A interview with Hestia Power CEO Lee Chwan-ying
SiC MOSFETs sees fast development and growing demand due to needs for high-voltage and high-power operating environment, but it is quite impossible for them to...
Intel expanding chip output: Q&A with company CEO Bob Swan
Intel will be gradually expanding its foundry production capacity, particularly for 14nm process this year, according to company CEO Bob Swan. Swan and other Intel...
Ready for SiC wafer production: An interview with GlobalWafers chairman Doris Hsu
GlobalWafers, a semiconductor silicon wafer maker, began trial production of SiC wafers in May-June 2019 and plans to start production in small volume in second-quarter...
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...
China foundry HSMC to push chiplet standard formulation, says CEO Shang-yi Chiang
While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes,...
Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales
Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new...
Heterogeneous integration bringing more innovation: Q&A with Etron chairman Nicky Lu
The Taiwan semiconductor industry is gearing up to tap huge business opportunities arising from AI and IoT applications, such as machine learning, cloud to edge...
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the...
China IC supply chain gaining momentum: Q&A with Photronics DNP Mask
As a joint venture between US photomask maker Photronics and Japan's Dai Nippon Printing (DNP), Photronics DNP Mask broke ground in mid-2018 for building a photomask...
Focus on stability: Q&A with Globalfoundries executives
Globalfoundries announced in August 2018 its decision to put 7nm FinFET R&D on hold indefinitely in a move to intensify the company's focus on delivering differentiated...
Staying focused on unique expertise: Q&A with Rohm Semiconductor president Tadanobu Fujiwara
Kyoto-based Rohm Semiconductor has been keen on expanding its overseas sales, but the electronic components maker remains focused on the market segments where...
Cloud services to disrupt IC design process: Q&A with Microsoft Taiwan GM Ken Sun
At the Open Innovation Platform (OIP) Ecosystem Forum held in early October, Taiwan Semiconductor Manufacturing Company (TSMC) announced the launch of OIP Virtual...
Clients play key role in enhancement of Sesto IMRs, says company CEO Michael Leong
Following Sesto Robotics' debut at Semicon Taiwan in 2016 and return to the show in 2017, the Singapore-based automated guided vehicle (AGV) and intelligent mobile...
Taiwan startups should eye applications combining hardware, software, says Gwong Lee, managing director of Translink Capital
Successfully starting his own business twice, Gwong Lee, managing director, Translink Capital, sold his second firm for a high price 15 months after its establishment...
Cobalt solutions best helper for 7nm node: Q&A with Applied Materials expert Jonathan Bakke
While Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung are entering the 7nm process era, the latest cobalt-based process solutions rolled out by Applied...
Custom IC design made easy with GreenPAK solutions: Q&A with Dialog Semiconductor executive Mark Tyndall
After acquiring Silego Technology, a US supplier of configurable mixed-signal ICs (CMIC), for US$306 million in late 2017, UK-based Dialog Semiconductor has launched...
Avoiding cut throat competition: Q&A with SPIL chairman Bough Lin
Bough Lin, chairman of Siliconware Precision Industries (SPIL), has disclosed that it had never occurred to him that his company would one day merge with one of...
Data is like crude oil in new tech era, says Applied Materials VP Erix Yu
After progressing from the PC and network generation in 2000-2010 to the mobile device and social networking generation during 2010-2020, the ever-advancing tech...
Coopetition and coexistence in IC industry: Q&A with ASE COO Wu Tien-yu
The global semiconductor industry is experiencing faster quantitative and qualitative changes along with the increasingly fierce coopetition among wafer foundry,...
