DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
Semiconductor knows no borders: Q&A with Silicon Catalyst partners
While many might be deterred by the hefty costs of starting a semiconductor company, there are still many other entrepreneurs with a silicon dream knocking on...
Partnerships towards global leaderships: Q&A with Ashwin Pershad, Tech Mahindra country head in Taiwan
Taiwanese companies planning to invest in India might have second thoughts in the wake of a riot at Wistron's plant in Narasapura stemming from salary disputes...
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top...
Pandemic-triggered structural changes: Q&A with ASE Technology COO Tien Wu
ASE Technology has turned optimistic about the IC backend industry prospects for the first half of 2021 with high capacity utilization to linger in diverse processes...
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to...
5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are...
Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support...
Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment...
Government subsidies crucial for new TSMC fab establishment in US
TSMC is in talks with the US government about relevant subsidies for its new wafer fab in Arizona so that the foundry is able to implement the investment plan,...
PhD shortage to challenge TSMC: Q&A with company senior VP of R&D Cliff Hou
Shortages of personnel with PhDs will be a challenge facing TSMC as well as Taiwan's chipmaking industry by 2030, according to Cliff Hou, company senior VP of...
A new chapter for UMC: Q&A with company co-presidents Jason Wang and SC Chien
UMC, once a major rival to TSMC in pursuing advanced manufacturing nodes, decided about two years ago to shift its focus away from joining the race to 10nm and...
SiC MOSFET development: Q&A interview with Hestia Power CEO Lee Chwan-ying
SiC MOSFETs sees fast development and growing demand due to needs for high-voltage and high-power operating environment, but it is quite impossible for them to...
Intel expanding chip output: Q&A with company CEO Bob Swan
Intel will be gradually expanding its foundry production capacity, particularly for 14nm process this year, according to company CEO Bob Swan. Swan and other Intel...
Ready for SiC wafer production: An interview with GlobalWafers chairman Doris Hsu
GlobalWafers, a semiconductor silicon wafer maker, began trial production of SiC wafers in May-June 2019 and plans to start production in small volume in second-quarter...
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...
China foundry HSMC to push chiplet standard formulation, says CEO Shang-yi Chiang
While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes,...
Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales
Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new...
Heterogeneous integration bringing more innovation: Q&A with Etron chairman Nicky Lu
The Taiwan semiconductor industry is gearing up to tap huge business opportunities arising from AI and IoT applications, such as machine learning, cloud to edge...
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the...
China IC supply chain gaining momentum: Q&A with Photronics DNP Mask
As a joint venture between US photomask maker Photronics and Japan's Dai Nippon Printing (DNP), Photronics DNP Mask broke ground in mid-2018 for building a photomask...
Focus on stability: Q&A with Globalfoundries executives
Globalfoundries announced in August 2018 its decision to put 7nm FinFET R&D on hold indefinitely in a move to intensify the company's focus on delivering differentiated...
Staying focused on unique expertise: Q&A with Rohm Semiconductor president Tadanobu Fujiwara
Kyoto-based Rohm Semiconductor has been keen on expanding its overseas sales, but the electronic components maker remains focused on the market segments where...
Cloud services to disrupt IC design process: Q&A with Microsoft Taiwan GM Ken Sun
At the Open Innovation Platform (OIP) Ecosystem Forum held in early October, Taiwan Semiconductor Manufacturing Company (TSMC) announced the launch of OIP Virtual...
Clients play key role in enhancement of Sesto IMRs, says company CEO Michael Leong
Following Sesto Robotics' debut at Semicon Taiwan in 2016 and return to the show in 2017, the Singapore-based automated guided vehicle (AGV) and intelligent mobile...
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