DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
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Heterogeneous integration bringing more innovation: Q&A with Etron chairman Nicky Lu
The Taiwan semiconductor industry is gearing up to tap huge business opportunities arising from AI and IoT applications, such as machine learning, cloud to edge...
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the...
China IC supply chain gaining momentum: Q&A with Photronics DNP Mask
As a joint venture between US photomask maker Photronics and Japan's Dai Nippon Printing (DNP), Photronics DNP Mask broke ground in mid-2018 for building a photomask...
Focus on stability: Q&A with Globalfoundries executives
Globalfoundries announced in August 2018 its decision to put 7nm FinFET R&D on hold indefinitely in a move to intensify the company's focus on delivering differentiated...
Staying focused on unique expertise: Q&A with Rohm Semiconductor president Tadanobu Fujiwara
Kyoto-based Rohm Semiconductor has been keen on expanding its overseas sales, but the electronic components maker remains focused on the market segments where...
Cloud services to disrupt IC design process: Q&A with Microsoft Taiwan GM Ken Sun
At the Open Innovation Platform (OIP) Ecosystem Forum held in early October, Taiwan Semiconductor Manufacturing Company (TSMC) announced the launch of OIP Virtual...
Clients play key role in enhancement of Sesto IMRs, says company CEO Michael Leong
Following Sesto Robotics' debut at Semicon Taiwan in 2016 and return to the show in 2017, the Singapore-based automated guided vehicle (AGV) and intelligent mobile...
Taiwan startups should eye applications combining hardware, software, says Gwong Lee, managing director of Translink Capital
Successfully starting his own business twice, Gwong Lee, managing director, Translink Capital, sold his second firm for a high price 15 months after its establishment...
Cobalt solutions best helper for 7nm node: Q&A with Applied Materials expert Jonathan Bakke
While Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung are entering the 7nm process era, the latest cobalt-based process solutions rolled out by Applied...
Custom IC design made easy with GreenPAK solutions: Q&A with Dialog Semiconductor executive Mark Tyndall
After acquiring Silego Technology, a US supplier of configurable mixed-signal ICs (CMIC), for US$306 million in late 2017, UK-based Dialog Semiconductor has launched...
Avoiding cut throat competition: Q&A with SPIL chairman Bough Lin
Bough Lin, chairman of Siliconware Precision Industries (SPIL), has disclosed that it had never occurred to him that his company would one day merge with one of...
Data is like crude oil in new tech era, says Applied Materials VP Erix Yu
After progressing from the PC and network generation in 2000-2010 to the mobile device and social networking generation during 2010-2020, the ever-advancing tech...
Coopetition and coexistence in IC industry: Q&A with ASE COO Wu Tien-yu
The global semiconductor industry is experiencing faster quantitative and qualitative changes along with the increasingly fierce coopetition among wafer foundry,...
IGBT outlook in China: Q&A with HHGrace executive Jiye Yang
Insulated gate bipolar transistor (IGBT) is technologically the most advanced device among power electronics and boasts extensive applications ranging from home-use...
Linde LienHwa making new gas production investments in Taiwan
Linde LienHwa, a joint venture between the Germany-based Linde Group and Taiwan-based LienHwa Industrial, is a manufacturer of bulk and electronic specialty gases...
Dual leadership should become long-term management model at TSMC, says Morris Chang
The dual leadership to be enforced at Taiwan Semiconductor Manufacturing Company (TSMC) starting from June 2018 should remain a long-term management model for...
Wireless charging: Q&A with Steven Tateosian, director of IoT and Security Solutions at NXP
The launch of Apple's iPhone 8 and iPhone X has highlighted wireless charging, a function that will also be featured in other smartphine vendors' upcoming models...
Morris Chang sees hurdle for semiconductor development in China
While China is aggressively accelerating the development of its semiconductor industry, a hidden barrier will gradually surface to affect its development, in that...
Service-oriented corporate culture counts most in foundry sector, says Morris Chang
Once describing Intel and Samsung Electronics as "700-pound gorillas" when commenting on his company's two major competitors, Taiwan Semiconductor Manufacturing...
All feasts must come to an end: Q&A with TSMC chairman Morris Chang
Just three days after announcing an encouraging decision that Taiwan Semiconductor Manufacturing Company (TSMC) will build its 3nm wafer fab in Taiwan, the firm's...
Staying focused on profitability: Q&A with UMC co-president SC Chien
United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further...
IDM model no longer viable for Japan semiconductor industry: Q&A with Socionext CEO Yasuo Nishiguchi
Though still a global bellwether in many areas of semiconductor technologies, Japan's semiconductor industry is significantly losing ground in world markets, as...
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data...
The synergy of NXP acquisition: An interview with Qualcomm president Derek Aberle
Qualcomm agreed in late 2016 to buy NXP Semiconductor for about US$47 billion in the biggest-ever deal in the semiconductor industry - a move which clearly indicates...
