DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
Notebook chip overbooking concerns: Q&A with Edom chairman Wayne Tseng
Pandemic-driven demand for notebooks supporting remote work and study has brought explosive growths in orders for CPUs, power management ICs (PMIC), display driver...
Taiwan offers handsome subsidies to spur homegrown EVs production
The government in Taiwan is keenly joining forces with manufacturers to develop electrical vehicles (EVs), offering handsome subsidies to encourage homegrown production...
Opportunities amid macro uncertainty: Q&A with Avnet Asia-Pacific president Prince Yun
The coronavirus pandemic, coupled with the escalating US-China trade war, have prompted businesses to revise their roadmaps and goals for 2020. Disruptions brought...
IT ecosystem transformation: Q&A with Inventec chairman Tom Cho
The global IT ecosystem is undergoing fundamental changes in the wake of the coronavirus pandemic and US-China trade tensions. Inventec, as one of the major ODMs...
Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng
Taiwan's flexible PCB specialist Flexium Interconnect has seen its business operations improve significantly, reportedly as a result of entering the supply chain...
FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment...
Beyond ruggedized IPCs: Q&A with Getac chairman James Hwang
Taiwan-based ruggedized industrial PC (IPC) maker Getac has been transforming its business and is adopting a business model of a system integrator (SI) to expand...
Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the...
Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing...
Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The...
Positioned as LaaS provider: Q&A with WPG CEO Frank Yeh
As the largest electronics distributor in Asia, WPG Holdings continues to expand and diversify its offerings particularly those for 5G, AI and automotive electronics...
Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales
Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new...
China IC supply chain gaining momentum: Q&A with Photronics DNP Mask
As a joint venture between US photomask maker Photronics and Japan's Dai Nippon Printing (DNP), Photronics DNP Mask broke ground in mid-2018 for building a photomask...
Focus on stability: Q&A with Globalfoundries executives
Globalfoundries announced in August 2018 its decision to put 7nm FinFET R&D on hold indefinitely in a move to intensify the company's focus on delivering differentiated...
Security and management key to digital manufacturing: Q&A with Identify 3D CSO Stephan Thomas
As digital manufacturing is gradually becoming an important part of the worldwide manufacturing industry, data security and supply chain management are major concerns...
Stay focused: Q&A with NXP executive Steve Owen
NXP Semiconductors has gone through several periods of restructuring since its departure from Philips, followed by privatization, and mergers and acquisitions...
Farewell to low-price business model: Q&A with Lelon president Wu Chih-min
A continued rally in MLCC prices has been pushing up prices for other passive components including capacitors, which Lelon Electronics specializes in. For Lelon...
Coopetition and coexistence in IC industry: Q&A with ASE COO Wu Tien-yu
The global semiconductor industry is experiencing faster quantitative and qualitative changes along with the increasingly fierce coopetition among wafer foundry,...
Wireless charging demand promising: Q&A with Dialog CEO Jalal Bagherli
As a global leader in providing rapid charging solutions, Dialog Semiconductor has demonstrated its prowess in power management for smartphones and other applications...
GMobi shifting gears aiming for automotive market
Internet of Things (IoT) is becoming powerful driving forces of business transformation. The technologies to connect devices for monitoring and managing things...
Geared up for car-use market: Q&A with Macronix chairman Miin Wu
NOR flash memory supplier Macronix International is looking to expand its presence in the automotive market, and aims to become the largest supplier of NOR flash...
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