The Chinese subsidiary of Nexperia, the Dutch semiconductor manufacturer, has moved to secure wafer capacity from domestic suppliers to support production of key products in 2026, according to documents reviewed by Reuters. The shift underscores a widening rupture between the China operation and its European parent, as disputes over corporate governance and control continue to reshape the company's global supply chain
Samsung has recruited semiconductor veteran John Rayfield, formerly a vice president at AMD, to bolster its Exynos GPU and system IP roadmap, signaling a renewed effort to regain competitiveness in mobile and AI-focused SoC design
Samsung Electronics and SK Hynix are reportedly intensifying their competition to supply Nvidia's sixth-generation high-bandwidth memory (HBM), known as HBM4. The new HBM4 will be used in Nvidia's next-generation AI accelerator, Rubin, expected to launch in the second half of 2026
Pan Jit International Inc. signed a definitive agreement on December 18, 2025, to acquire a 95% stake in Torex Vietnam Semiconductor, a move aimed at expanding the Taiwanese firm's manufacturing footprint and scaling its automotive-grade chip production. The transaction follows an initial memorandum of understanding signed in February 2025 and initiates the formal equity transfer process between the companies
As the global automotive industry remains focused on tariff barriers and policy battles, Chinese automakers have quietly advanced their overseas strategies into a new phase, aiming for massive export volumes and deep ties to local markets
India's tightening AI governance rules are no longer just shaping compliance strategies. They are beginning to influence where artificial intelligence workloads are deployed, pushing sensitive applications toward India-hosted and on-premise infrastructure
King Yuan Electronics (KYEC) is accelerating its expansion efforts in Taiwan and Singapore to address rising demand for AI chip testing services. The Taiwanese testing and assembly firm plans to establish its first overseas manufacturing base in Singapore, aiming to commence mass production by 2027, according to KYEC chairman C.K. Lee
AOI Electronics, a Japan-based semiconductor assembly and test provider, has entered into a business alliance with India's Kaynes Semicon Private Limited and Japan's Mitsui to support the establishment of a semiconductor back-end processing business in India
Samsung Electronics launched its first tri-fold smartphone, the Galaxy Z TriFold, in Taiwan on December 18. The company announced on December 19 that the entire initial shipment had sold out on launch day
According to Nikkei, Yuichi Hotta, president of TSMC's Japan Advanced Semiconductor Manufacturing (JASM), confirmed on December 19 that construction of the second wafer fabrication plant in Kikuyo Town, Kumamoto Prefecture, is continuing. This statement counters recent reports by Japanese media suggesting the project had stalled.
Apple's iPhone 17 series has achieved strong sales following its September 10 launch, with the standard iPhone 17 maintaining its price despite upgraded specifications. This contributed to sales initially surpassing expectations and sustaining momentum through October, leading the iPhone 17 to capture over 20% of the market share in China during that month
Wistron's board approved a new investment plan on December 19 to expand AI server and networking production. The company will build a new factory in Vietnam for network products and increase AI server capacity at its Hsinchu campus. To support this growth, Wistron authorized up to NT$21.528 billion (approx. US$683 million) for machinery and facility upgrades at Hsinchu, aiming to meet rising AI demand
India is bolstering its semiconductor ecosystem through strategic overseas acquisitions, potential integration into Apple's supply chain, and specialized domestic manufacturing, while navigating delays in major facility ramp-ups