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Thursday 8 October 2026
Lisa Su takes AMD's Korea ties beyond memory to AI
AMD is broadening its Korean partnerships from memory procurement to AI infrastructure and research, as chief executive Lisa Su seeks the supply and technology cooperation needed for the company's planned 2027 expansion in chip shipments.
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Monday 12 October 2026
Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys, on October 5. The partnership aims to expand its potential customer base by helping companies develop custom chips.
Monday 12 October 2026
India's festive smartphone sales may slow as memory costs lift prices
India's key festive smartphone season is set to matter far beyond its borders, as higher memory costs reshape pricing, buying habits, and brand competition in a major emerging market. Counterpoint Research expects unit sales to fall, even as market value rises, highlighting a global shift toward pricier, more selective device upgrades.
Monday 12 October 2026
SK Hynix's US$299 billion chip plan faces military base hurdle
SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production capacity: the planned manufacturing site includes military facilities used by US forces, complicating construction timelines as competition intensifies with Micron Technology and Chinese chipmakers.
Monday 12 October 2026
Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang
PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial Park 3 (BKIP3) in Penang, Malaysia, and plans to create more than 1,000 jobs. Penang Chief Minister Kon Yeow Chow announced the investment on October 7, 2026.
Monday 12 October 2026
Samsung, SK Hynix accept ASML's 10% price hike in parts, report says
Samsung Electronics and SK Hynix have accepted a 10% increase in ASML's replacement-part prices for lithography systems in South Korea, with the higher rates taking effect for deliveries starting in January 2027, The Elec reported on October 11, citing industry sources.
Monday 12 October 2026
LG Display unveils maskless OLED technology, targeting more efficient IT displays
LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing costs as it prepares to expand into the information technology display market.
Monday 12 October 2026
Former iPhone display plant in Japan reportedly to enter AI chip supply chain
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production base for semiconductor package substrates used in artificial intelligence (AI) applications.
Monday 12 October 2026
Kawasaki Heavy Industries bets JPY550 billion on physical AI, robotics
Kawasaki Heavy Industries is betting on physical AI as part of a multibillion-dollar growth plan to modernize factories, address labor shortages, and expand robotics across shipbuilding, aerospace, and healthcare. The move signals how one of Japan's major industrial groups plans to compete in a global market where automation is increasingly central to productivity, resilience, and long-term growth.
Monday 12 October 2026
CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the end of 2026, advancing its efforts to increase memory density and compete in the higher-value server market.

Monday 12 October 2026
Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces manufacturing, packaging, printed circuit board (PCB) yield, partnership, and governance questions, while Intel remains involved and TSMC's role may be limited. Samsung reportedly advances HBM4E high-bandwidth memory validation and glass interposer testing. Vicor expands patent litigation over AI server power systems. Taiwan restricts China-made fiberglass sleeves, and China's new five-year plan prioritizes advanced PCBs, materials, equipment, and domestic investment.
Monday 12 October 2026
Booked before launch, Tata's Dholera fab faces test of turning commitments into wafer volume
Tata Electronics has six customers at different stages of engagement with its Dholera semiconductor fab, including three with what a person familiar with the project described as binding offtake commitments, as the company works to secure demand well before production begins.
Monday 12 October 2026
Taiwan GDP growth hits 11% as government plan for AI dividend advances
Taiwan's gross domestic product (GDP) growth is projected to reach 11.05% in 2026, a 39-year high, driven by its technological advantage in artificial intelligence (AI), semiconductors, and high-performance computing (HPC), and boosting government tax revenue. Consequently, Taiwan's Executive Yuan outlined plans on October 8 to distribute NT$10,000 (approx. US$313) in cash handouts to the public via an "AI dividend" with the first recipients potentially receiving payments as early as January 26, 2027, before the Lunar New Year, subject to budget approval.
Monday 12 October 2026
India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing alongside data center expansion, high-density computing, optical connectivity and GPU deployments.

Sunday 11 October 2026
Changs Ascending September revenue jumps 92% on semiconductor plant buildouts
Changs Ascending said orders tied to semiconductor customers' new plant construction, equipment arrivals, and project acceptance schedules were gradually fulfilled and recognized as revenue, lifting consolidated revenue to NT$79.2 million (approx. US$2.49 million) in September 2026, up 92% from a month earlier and 14% from a year earlier.
Saturday 10 October 2026
Unified memory lifts AI PC ambitions as Chinese open models gain local-inference ground
The hardware boundary separating cloud-scale AI from local inference is becoming increasingly porous as PC vendors expand memory capacity and software platforms make larger open-weight models easier to run directly on devices.