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Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle. The more consequential question is what it does with the windfall.
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Tuesday 1 September 2026
Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains
Japanese semiconductor materials suppliers Ajinomoto and Daikin Industries are expanding their presence in Taiwan as the AI boom fuels demand for advanced chip materials and encourages closer cooperation between suppliers and manufacturers.
Tuesday 1 September 2026
Safety rewired: AI, robots on the front line at K-Safety Expo 2026
Hard hats and fire extinguishers will certainly have their place at K-Safety Expo 2026, but visitors arriving at BEXCO in Busan from September 2–4 may find that the modern safety industry increasingly speaks the language of AI, robots, sensors and connected infrastructure.
Tuesday 1 September 2026
K-Safety Expo 2026 to open in Busan, spotlighting AI-driven safety technologies
K-Safety Expo 2026, one of South Korea's leading exhibitions dedicated to the safety industry, will open September 2 at BEXCO in Busan, bringing together companies, government agencies, research institutions, and overseas buyers across disaster prevention, industrial safety, public security, fire and rescue, and transportation and maritime safety.
Tuesday 1 September 2026
Foxlink, Yongwei to sell Shinfox stake, cede control
Foxlink and Yongwei Investment Holdings each held board meetings on the 31st and decided to participate in the tender offer for Shinfox Energy, planning to dispose of their Shinfox shares at NT$0.05 per share. The move would strip the Foxlink Group of control over Shinfox and reduce the financial drag from the renewable energy company's losses.
Tuesday 1 September 2026
Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan
As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first appearance at SEMICON Taiwan 2026, with advanced packaging and glass substrate expert Gang Duan traveling to Taiwan to unveil the company's roadmap for next-generation advanced packaging substrates aimed at AI infrastructure.
Tuesday 1 September 2026
BYD widens overseas lead over Geely, but profits still lag
BYD and Geely Auto were nearly neck and neck in vehicle sales in the first quarter of 2026, raising expectations of a close contest between China's two leading new-energy vehicle makers. The gap widened sharply in the second quarter, however, largely because BYD sold more vehicles overseas. Even so, stronger international sales have yet to reverse the company's profit decline.
Tuesday 1 September 2026
Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs
Chinese large-model developer Z.ai says it can now support large-scale inference using roughly 100,000 domestically produced AI chips, while its GLM models are also moving closer to overseas cloud deployment.
Tuesday 1 September 2026
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
A Chinese court has ordered the freezing of more than CNY2.14 billion (approx. US$318 million) in domestic assets belonging to Dutch semiconductor manufacturer Nexperia and its equipment division. The decision marks the latest escalation in an ongoing legal and geopolitical debate between the Netherlands-based chipmaker and its Chinese parent company, Wingtech Technology.
Tuesday 1 September 2026
China's memory chipmakers post a record 1H — but not all of it came from chips
Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle more precisely than any forecast. They also show how differently each company reached its number: some rode pricing, one rode an acquisition, another rode a stake revaluation, and the largest of them simply arrived at a scale nobody in the sector previously operated at.
Tuesday 1 September 2026
JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts
JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift could influence supply chains beyond China, as more AI and automotive chips rely on the back-end processes it is now prioritizing.
Tuesday 1 September 2026
XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device at Hot Chips 2026 while expanding its work with Samsung Electronics on a rack-scale system.
Tuesday 1 September 2026
Samsung locks 70% of memory output as HBM spot prices soar
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high bandwidth memory (HBM) tightens the broader chip shortage. In some cases, spot prices for memory products are now as much as 5 times the LTA contract price.
Tuesday 1 September 2026
Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll
Huawei Technologies increased first-half revenue in 2026 while profit fell sharply, highlighting the growing cost of its effort to build a self-sufficient technology stack spanning AI chips, smartphones, operating systems and computing infrastructure.
Tuesday 1 September 2026
South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain
A South Korean-Indian joint venture has completed a semiconductor materials plant in South Korea, aiming to strengthen regional supply chains for photoresist materials and reduce reliance on Chinese raw materials.
Tuesday 1 September 2026
Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI chip industry. US export controls have restricted Chinese access to advanced high-bandwidth memory (HBM), making local supply increasingly critical to scaling homegrown AI processors.