CONNECT WITH US
Monday 13 July 2026
Tencent seeks control of Manus after China blocks Meta's US$2 billion AI deal
Tencent is in talks to become the largest shareholder in Manus, leading a proposed buyback of the AI agent startup after Chinese regulators ordered Meta Platforms to unwind its US$2 billion acquisition.
LATEST STORIES
Tuesday 14 July 2026
China quantum research wins UNESCO, IEEE honors
China's quantum technology research has drawn renewed international academic recognition. The University of Science and Technology of China (USTC) said Chinese Academy of Sciences academician Jianwei Pan has received the third UNESCO-Russia Mendeleev International Prize and later shared the 2026 IEEE Photonics Society Quantum Electronics Award with USTC professor Chaoyang Lu.
Tuesday 14 July 2026
US chases AI talent abroad as China strengthens its homegrown pipeline

The US can no longer close its artificial-intelligence talent gap with China through visa curbs or export controls alone, a new Hoover Institution and Stanford study argues, because China is now producing frontier-model researchers who never trained, worked, or published abroad, even as it also reclaims talent that spent years in American institutions.

Tuesday 14 July 2026
US-funded researchers barred from working with blacklisted Chinese entities from 2027

The US National Science Foundation will prohibit the researchers it funds from collaborating with organizations on Washington's restricted-party lists, a roster heavily populated by Chinese firms and institutions, under a Dear Colleague Letter dated July 8, 2026. The agency said it intends to implement the prohibition in fiscal 2027.

Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking a shift from laboratory research to engineering validation, small-batch tape-outs and early industrialisation.

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
Tuesday 14 July 2026
Commentary: Forget AI chips — China's top science awards reveal what Beijing is actually building
China has nine years left to meet its goal of becoming a global science and technology powerhouse by 2035.
Monday 13 July 2026
China Life commits US$700M to semiconductor fund under Beijing's patient capital strategy

China Life Insurance Company Limited plans to invest CNY4.999 billion (US$697 million) in a new CNY5 billion semiconductor private equity fund, extending Beijing's effort to direct long-term insurance capital into strategic chip technologies.

Monday 13 July 2026
China's 2030 target for 30% NEV adoption raises the stakes for foreign automakers

China is tying its climate agenda more closely to industrial policy. The State Council's newly released Action Plan for Carbon Peaking in the 15th Five-Year Plan sets ambitious targets that could further accelerate domestic new energy vehicle (NEV) adoption while intensifying pressure on foreign automakers.

Monday 13 July 2026
MiniMax bets US$2 billion on AI infrastructure as lock-up selloff deepens its split with Z.ai
Chinese artificial-intelligence developer MiniMax is raising HK$16 billion (approx. US$2.04 billion) through a share placement and convertible bonds to accelerate spending on AI infrastructure and large-model development, pressing ahead with its most capital-intensive phase even as its Hong Kong-listed stock slides and a lock-up expiry unleashes fresh selling. The move underscores how far MiniMax's fortunes have diverged from those of rival Zhipu, the other big Chinese AI name to list in Hong Kong this year.
Monday 13 July 2026
Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the power, water and site development needed to support the expansion.
Monday 13 July 2026
SK Group chair: US investment plan will far exceed US$35B

SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the amount he said the group is already putting into the country—though he did not disclose the plan's size, timing or components.

Monday 13 July 2026
Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build a state-backed 12-inch memory fabrication plant in Shenzhen, a move aimed at easing DRAM shortages while reducing reliance on overseas suppliers amid continued US export controls.

Monday 13 July 2026
China's Nvidia H200 pivot reveals why CUDA still rules AI

China is preparing to allow a limited number of Nvidia H200 AI accelerators into the country, giving Alibaba, ByteDance, and DeepSeek access to advanced computing power while preserving Beijing's broader campaign for semiconductor self-reliance.

Monday 13 July 2026
India opens first CMP pad technology hub in Hyderabad
India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local chipmaking capabilities, reduce dependence on imports, and deepen India's role in a sector that supports electronics production worldwide, from phones to data centers.
Monday 13 July 2026
Taiwan's Jiin Ming joins Japan-Ukraine Drone Cluster talks on drone systems
Taiwanese drone manufacturer Jiin Ming Industry attended the launch press conference for the Japan-Ukraine Drone Cluster (JUDC) at the Foreign Correspondents' Club of Japan (FCCJ) in Tokyo. This marks the company's latest step in expanding its international footprint following its entry into the European market.