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Tuesday 21 April 2026
BYD reassesses Malaysia factory project as talks stall with the government

In August 2025, the Chinese electric vehicle (EV) maker BYD announced plans to build a completely knocked-down (CKD) assembly plant at the KLK Technology Park in Tanjung Malim, Malaysia's Perak state, with operations expected to begin in 2026

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Wednesday 22 April 2026
Gangwon's expanding semiconductor cluster comes with global implications
South Korea's Gangwon Province is accelerating the development of a semiconductor cluster centered on Wonju, Chuncheon, and Gangneung, aiming to build a full ecosystem. Global supply chains could gain a new hub built on strengths in smart medical semiconductors, geographic proximity to major fabs, and growing Taiwan partnerships that may diversify sourcing and innovation
Wednesday 22 April 2026
Naver, TCS partner on AI and cloud in India during Korea-India summit
Naver has signed a strategic partnership with Tata Consultancy Services (TCS) to jointly develop artificial intelligence (AI) and cloud services in India, marking one of the cooperation deals concluded during a Korea-India summit visit
Wednesday 22 April 2026
CXMT fills LPDDR4X gap as non-China CSPs seek capacity
Memory giant ChangXin Memory Technologies (CXMT) is stepping in to fill the consumer market shortfall left by Samsung Electronics' planned phase-out of LPDDR4X production. With memory costs soaring and supply tightening, roughly 40% of CXMT's capacity will reportedly be reserved for LPDDR4X, while the remaining 60% is dedicated to advanced DDR5 and LPDDR5 products
Wednesday 22 April 2026
CXMT HBM3 timeline slips, mass production unlikely in 2026
China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory (HBM3), according to Korean media reports
Wednesday 22 April 2026
China's humanoid robot makers eye RISC-V over Nvidia Jetson
At the second humanoid robot half-marathon held in the Beijing Economic-Technological Development Area (E-Town), several "Linglong 2.0" humanoid robots powered by a RISC-V AI CPU — the K3 chip — completed the race, standing out as one of the event's key technical highlights
Wednesday 22 April 2026
SJSemi's blockbuster IPO reorders China's chip packaging landscape
Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial intelligence continues to accelerate
Wednesday 22 April 2026
The survivor's listing: How XDXCT escaped insolvency to target China's STAR market
China's domestic GPU push has gained a new contender in the capital markets race. Xiangdi Xian Computing Technology (Chongqing) Co., also known as XDXCT, has formally launched pre-IPO preparations after signing a financial advisory agreement with CSC Financial Co., marking a strategic shift from survival mode to expansion
Wednesday 22 April 2026
Micron's Sanand ramp shifts India chip debate from milestone to manufacturing system
Micron Technology's Sanand assembly, test, marking, and packaging plant has given India something it lacked until recently: a live semiconductor manufacturing operation with global supply-chain relevance
Tuesday 21 April 2026
Enflame tests IPO path with fast growth, Tencent reliance, and rising losses
Enflame is moving closer to a STAR Market listing, highlighting a central tension in China's AI chip sector: strong demand and rapid revenue growth have yet to translate into a sustainable business model
Tuesday 21 April 2026
Samsung plans NAND expansion at P5 on AI-driven price gains
Surging demand for NAND flash, fuelled by artificial intelligence workloads and data centre expansion, is pushing memory makers into a new investment cycle, with Samsung Electronics and SK Hynix accelerating capacity plans after years of restraint
Tuesday 21 April 2026
China unveils 10 measures for Taiwan; Taiwan's MOEA affirms independent economic goals
Chinese authorities announced 10 new policies related to Taiwan following the meeting between China's president Xi Jinping and the chairperson of the Kuomintang political party in Taiwan, Cheng Li-Wun
Tuesday 21 April 2026
Huawei flags smartphone price pressure, broadens AI device portfolio
Huawei used its latest product launch to deliver a dual message: rising component costs are tightening smartphone pricing margins, even as the company accelerates its push across AI-driven devices — from flagship phones to PCs and wearables — built around its in-house chips and HarmonyOS ecosystem
Tuesday 21 April 2026
Samsung scales MRAM to 8nm, setting 5nm showdown with TSMC in 2027
Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM) in the intensifying global AI semiconductor race
Tuesday 21 April 2026
Seiko Epson unveils long-term vision for sustainable growth
Seiko Epson, which marked its 50th anniversary in 2025, recently launched a long-term vision plan, the Engineered Future 2035, addressing AI, geopolitical shifts, and digital transformation challenges. The company emphasized using return on invested capital (ROIC) as a key management metric to optimize capital allocation, realign its business portfolio, and concentrate resources on growth sectors to enhance operational performance and core value
Tuesday 21 April 2026
China amping up DRAM integration: GigaDevice expands into DRAM through CXMT tie-up
GigaDevice is moving into DRAM through a KRW1 trillion (US$680 million) related-party deal, combining CXMT's manufacturing capacity with its own sales network in a move that could reshape the global supply landscape