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Tuesday 10 November 2026
Commentary: China's emerging semiconductor investment empire takes quieter route to dominance
A decade ago, China's Tsinghua Unigroup alarmed Taiwan's semiconductor industry with an aggressive acquisition campaign. Under then-chairman Zhao Weiguo, the group acquired Spreadtrum Communications and RDA Microelectronics, sought stakes in Powertech, SPIL and ChipMOS, and publicly expressed interest in integrating MediaTek...
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Wednesday 11 November 2026
Samsung reportedly buys four silicon photonics patents from Rockley
Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US Patent and Trademark Office (USPTO) records. The reported acquisition could strengthen Samsung's intellectual property portfolio in optical interconnect technology as it expands its silicon photonics foundry business to compete with TSMC.
Wednesday 11 November 2026
Samsung targets early 2027 for first 3D Cube-H design kit
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer evaluations to follow, ZDNet Korea reported on November 10, citing an industry source familiar with the plans.
Wednesday 11 November 2026
Nexperia's China split raises costly question: what is Wingtech owed?
Nexperia could eventually reunite its Chinese and international operations despite an unresolved control dispute with Chinese parent Wingtech Technology, acting CEO Stefan Tilger said recently. If the separation becomes permanent, Wingtech's ownership should entitle it to fair compensation.
Wednesday 11 November 2026
Ingentec revenue jumps 79% in first 10 months
Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell 8.59% month-over-month and 18.37% year-over-year to approximately NT$130 million as shipments of specialty gases to Japan, South Korea, and domestic customers declined slightly.
Wednesday 11 November 2026
Smaller memory buyers 'basically shut out' of direct supply, Smith says
Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic components distributor Smith.
Wednesday 11 November 2026
Advantech's Korea business grows 67% in first three quarters, says incoming CEO
Advantech's South Korean business grew 67% in the first three quarters of 2026, as industrial equipment, networking and cloud infrastructure, and healthcare remained its largest local markets. Some South Korean customers and partners have moved edge AI solutions into mass production, while the company is looking to extend its industrial computing and software integration expertise into robotics and energy applications.
Wednesday 11 November 2026
Alibaba files to spin off chip design unit T-Head for Hong Kong IPO
Alibaba filed for a Hong Kong IPO for its chip design unit, T-Head, as a spin-off on November 10. The separate listing would let investors gain direct exposure to the group's chipmaking business as China's AI ecosystem seeks to reduce its reliance on US semiconductors through domestic alternatives.
Wednesday 11 November 2026
China's Nebula project links AI chips to satellites in bid to take computing beyond Earth

Rising AI demand and constraints on power, land and cooling at terrestrial data centers are drawing international interest in space computing. Chinese cloud computing providers are assessing whether the concept can progress from validation to industrial development.

Wednesday 11 November 2026
Anwar's China remarks threaten Taiwan investment in Malaysia
Malaysia's Prime Minister Anwar Ibrahim's comments supporting the one-China principle and the use of force to unify Taiwan continue to weigh on Taiwan-Malaysia ties nearly three months later, raising concerns over Taiwanese companies' willingness to invest in Malaysia.
Wednesday 11 November 2026
China's Huaqin looks beyond AI servers with US$150M wafer foundry investment
China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening upstream semiconductor ties while expanding its AI server and data center businesses.
Wednesday 11 November 2026
China's HISIGK takes a specialty route into lithography with MEMS, AR optics
Jiangsu HISI Semiconductor (HISIGK) has prepared 14 automated lithography systems for delivery across 300mm, 200mm and 150mm wafer platforms, expanding its specialty semiconductor equipment business in markets ranging from MEMS to AR optics and LED chips.
Wednesday 11 November 2026
Qualcomm names Samsung, Micron as memory suppliers in annual filing
Qualcomm has identified Samsung Electronics and Micron Technology as its primary memory suppliers for certain products, including automotive applications, in its fiscal 2026 annual report. The disclosure was absent from the previous two years' filings and comes as Qualcomm's automotive revenue jumped 52%.
Wednesday 11 November 2026
CATL's lithium-air research confronts the endurance problem behind 2,000km EV range
CATL is exploring lithium-air batteries as a long-term research direction, attracting attention to the prospect of electric vehicles travelling more than 2,000km (≈ 1,243 miles) on a charge. That range remains a theoretical scenario, with no announced production battery or vehicle test demonstrating it.
Wednesday 11 November 2026
Taiwan connections draw attention in Jensen Huang controversy

Taiwan has emerged as a key part of the controversy surrounding Nvidia CEO Jensen Huang and Chinese businesswoman Alice Huang, with local media reports pointing to possible introductions through Taiwan's technology and media circles, as well as questions about her visits to the island.

Wednesday 11 November 2026
SK Hynix taps Nvidia to speed up memory chip simulations
SK Hynix is using Nvidia's AI technology and GPU acceleration to speed up memory chip simulations, with improvements in etching-process development and tests of thermal and elastic deformation analysis. As memory structures and manufacturing processes become increasingly complex, the companies are working to reduce simulation time and computational demands to support process optimization during R&D.