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Mar 23, 17:29
Grab expands beyond SEA with strategic push into Taiwan
Grab has unveiled a major move in its international growth strategy, announcing plans to acquire Delivery Hero's Foodpanda delivery business in Taiwan — marking its first significant expansion outside Southeast Asia.
Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into specialized markets such as defense aerospace and semiconductor test interfaces. Currently, special materials account for 50% of its revenue, positioning the company for what it predicts will be a robust order fulfillment phase.

US government disclosures have cast rare light on one of the electric vehicle (EV) industry's most closely guarded supply chains, confirming that LG Energy Solutions (LGES) signed a battery supply agreement worth about US$4 billion with Tesla in July 2025.

Mercedes-Benz Taiwan has officially unveiled the all-new CLA series — the first mass-produced model built on the Mercedes-Benz Modular Architecture (MMA) platform, as announced by company president Mark Raine. Priced from NT$1.87 million (US$58,600), the CLA is aimed at mainstream consumers, with both electric and gasoline variants sharing the same starting price.
At GTC 2026, Nvidia formally unveiled an end-to-end autonomous driving technology stack and announced plans to deploy the full solution through ride-hailing platform Uber. The move is widely seen as a turning point in the intensifying robotaxi race, sharpening the competitive landscape with autonomous driving leader Waymo.
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first self-developed sensor chip. Partnering with strategic collaborator Gkuvision, an imaging solution provider, HiSilicon launched the new generation sports camera "Xiaotu S7PRO MAX" equipped with its proprietary sensor.

Recent reports suggest that Volkswagen may move away from relying on Nvidia's automotive computing platforms, instead increasingly integrating Chinese-made chips into its vehicles.

As global automotive supply chain inventories normalize, the automotive semiconductor market enters a critical transition phase in 2026. DIGITIMES Research indicates that, despite slowing growth in traditional vehicle sales, software-defined vehicles (SDV) and powertrain electrification have become the two core growth drivers for automotive IDMs.

Japan's Honda Motor Co. stunned investors in March 2026 by announcing up to JPY2.5 trillion (approx. US$15.8 billion) in impairment losses tied largely to its troubled push into electric vehicles, underscoring how even one of the industry's most storied innovators has struggled to navigate the global shift away from gasoline engines.
US government disclosures have shed unusual light on a closely guarded corner of the electric vehicle supply chain, confirming that LG Energy Solution signed a battery supply agreement worth KRW6 trillion (approx. US$4 billion) with Tesla in July 2025.

Buffeted by a slower-than-expected shift toward vehicle electrification and electronic architectures—along with the crosscurrents of tariffs and inflation—the global auto market turned in a muted performance in 2025. Yet even as layoffs and restructuring swept through many Western suppliers, Europe's and America's legacy Tier 1 manufacturers managed to hold margins steady, revealing a survival strategy built on internal austerity and external reinvention.

China's auto market is undergoing a sharp realignment in early 2026, as the phaseout of government subsidies exposes deeper competitive strengths — and weaknesses — among the industry's leading players.