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Friday 23 October 2026
JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion
JCET Group lifted third-quarter revenue 13.53% year-over-year to CNY11.43 billion (approx. US$1.71 billion) and net profit attributable to shareholders 59.99% to CNY773 million. For the first nine months of 2026, revenue rose 7.96% to CNY30.95 billion, while net profit climbed 69.58% to CNY1.62 billion. Profit excluding non-recurring gains and losses increased 99.17% to CNY1.56 billion.
Thursday 15 October 2026
Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon Photonics Technology Applications Expo. Spurred by surging demand for AI, high-performance computing (HPC), and high-speed data transmission, the new additions will run alongside the established Smart Manufacturing and Smart Display exhibitions, creating a unified platform spanning semiconductor technologies, optical communications, intelligent manufacturing, and end applications.
Wednesday 2 September 2026
Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that while the advanced packaging sector offers massive commercial opportunities and a bright outlook, the industry still has critical gaps to address across both hardware and software.
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies including FOPLP, CoPoS, and Glass Core. Manz Asia general manager Robert Lin said yield will determine whether Glass Core can move into mass production.
Monday 13 July 2026
Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced packaging. The expansion is meant to meet surging global demand for high-compute chips and advanced packaging technology.
Monday 29 June 2026
AI demand drives Foundry 2.0 market revenue up 23% in 1Q26, says Counterpoint
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators and advanced packaging, according to Counterpoint Research.
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and ICsmart.
Tuesday 5 May 2026
Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials
Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials supply chain. The move aims to leverage tariff advantages, lower manufacturing costs, and ample labor to boost overseas competitiveness.
Tuesday 28 April 2026
Strong demand and advanced packaging execution drive Amkor's upbeat quarter
Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packaging.
Friday 24 April 2026
SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing to accelerate investments in advanced packaging.

Wednesday 18 February 2026
Analysis: 2nm shifts chipmaking from scaling to chiplet integration

The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance gains are increasingly driven by heterogeneous integration rather than monolithic shrink, reshaping how power, performance, area, and cost are optimized.

Monday 2 February 2026
SMIC reportedly sets up advanced packaging research institute in Shanghai
As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with SMIC chairman Liu Xunfeng attending the unveiling ceremony, marking a new stage in the company's advanced packaging research and development efforts.
Thursday 15 January 2026
Exclusive: T-Glass shortage ripples through memory and advanced packaging markets

The global memory industry is confronting a growing capacity crunch, one that is increasingly rippling upstream to a shortage of glass fiber cloth, an obscure but indispensable material in advanced semiconductor packaging.

Thursday 6 November 2025
ASML reframes its China strategy with advanced packaging debut of TWINSCAN XT:260
ASML has introduced the TWINSCAN XT:260, its first lithography system purpose-built for 3D integration and advanced packaging. The launch marks a major step beyond front-end wafer production as lithography expands into mid- and back-end processes, unlocking new opportunities for 3D heterogeneous integration in the post-Moore era.
Friday 31 October 2025
ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026
Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials (ATM) revenue is expected to rise 3-5% sequentially. Full-year 2025 ATM revenue in USD is projected to increase more than 20%, with advanced packaging revenue reaching US$1.6 billion as planned, and full-year 2026 revenue anticipated to rise by an additional $1 billion.
Friday 31 October 2025
UMC and Samsung present advanced packaging trends at APDC 2025
STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging. The forum invited experts from academia and industry, presenting many of STATS ChipPAC's blueprints for advanced packaging and testing technologies.
Thursday 30 October 2025
Singapore leverages advanced packaging to capture share of US$1 trillion chip market
Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling Singapore's ambition to become a global center for advanced semiconductor packaging research and commercialization as artificial intelligence reshapes the industry.
Thursday 30 October 2025
'Semiconductor paradox' defines next chip boom, says director of Singapore's SSIA

Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging Developers Conference (APDC) that the industry must strengthen collaboration and local networks to navigate geopolitical and resource challenges as it moves toward a projected US$1 trillion market by 2030.

Thursday 30 October 2025
STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge is no longer invention itself, but turning invention into a manufacturable, scalable reality.
Sunday 12 October 2025
Inside Tesla's plan to rewire itself for AI future

Long known for its disruptive innovations in electric vehicles, Tesla is now undergoing a deeper transformation, one that extends far beyond cars. As artificial intelligence (AI) reshapes industries and geopolitical tensions disrupt global supply chains, Tesla's recent move toward lower-priced EVs signals a broader organizational pivot: a long-term strategy that places AI, robotics, and semiconductor self-reliance at the core of its future.

Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to debut in early 2026.
Thursday 17 July 2025
Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging and testing firms are showing surprising resilience. Strong demand for high-performance computing (HPC) chips—driven by the global boom in artificial intelligence (AI)—is helping Taiwan's outsourced semiconductor assembly and test (OSAT) giants maintain steady growth into the second half of 2025.

Monday 19 May 2025
AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the country intensifies its technology upgrade initiatives, the back-end supply chain has become a strategic pillar, with major players ramping up both revenue and innovation.
Tuesday 13 May 2025
Hanwha Semitech establishes new R&D center to meet surging demand for TCB equipment
South Korean TC bonder (TCB) manufacturer Hanwha Semitech recently announced an organizational restructuring aimed at strengthening its development capabilities for next-generation semiconductor equipment. This move is expected to accelerate the innovation of new semiconductor device technologies.
Thursday 8 May 2025
Innolux strengthens leadership as it accelerates transformation beyond display panels

Innolux Corporation, one of the world's leading panel manufacturers, held its annual general meeting this week. During the meeting, shareholders elected a new nine-member board, including five independent directors. Following the meeting, the board reappointed Jim Hung as Chairman and CEO, reinforcing his leadership amid a pivotal moment in the company's transformation.