SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory (HBM4), signaling the start of a new technological arms race in next-generation memory chips.
Tencent said its cloud business has fully integrated with China's mainstream domestic chips, marking a milestone in its AI and cloud computing roadmap unveiled at the 2025 Tencent Global Digital Ecosystem Summit.
In a significant strategic pivot, Google is preparing to move its custom-built Tensor Processing Units (TPUs) beyond its own cloud infrastructure—marking a bold step toward monetizing its advanced AI chips through a "hardware-as-a-service" model, rather than traditional chip sales.