Global supply chain: Mobile, telecom, computing

Mobile, telecom, computing trends

IN THE NEWS

Thursday 17 September 2026

iPhone 18 Pro preorders rise up to 20% in Taiwan as foldable Duo debuts

Apple's iPhone 18 Pro and Pro Max are emerging as the main drivers of Taiwan's premium smartphone upgrade cycle, with preorder demand running ahead of last year despite the debut of...

Thursday 17 September 2026

FIT ramps up optical interconnect push as AI race shifts to connectivity

At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...

Thursday 17 September 2026

Apple's AI ambitions are outgrowing the Mac — Nvidia may hold the key

Apple is exploring a return to the enterprise server market with an AI inference system built around future M8 Ultra chips, potentially using Nvidia's NVLink Fusion interconnect te...

Thursday 17 September 2026

Foxconn links FII and FIT to tackle AI infrastructure beyond the chip

Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration —...

Thursday 17 September 2026

Dassault Systemes shifts to AI-native platforms, stakes its next phase on Taiwan

Dassault Systemes marked 20 years in Taiwan with a sharper message about where it plans to go next. The company said it is moving beyond AI-enabled software and toward an AI-native...

Thursday 17 September 2026

Arcadyan expects third-quarter strength as Wi-Fi 7 upgrade cycle builds

Arcadyan Technology expects stronger revenue in the third quarter of 2026 as the network communications market enters its seasonal peak,...

Thursday 17 September 2026

Apple's foldable phone puts thinness, weight in focus

Apple's first foldable phone has sharpened global attention on smartphone design trade-offs, with weight, thickness, and component miniaturization...

Thursday 17 September 2026

Huawei's 3D data center redesign targets the next AI compute density wall

Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and...

Thursday 17 September 2026

Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being...

Thursday 17 September 2026

Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory...

Wednesday 16 September 2026

LEOTEK completes real-world test of AI traffic system at US smart city lab

Leotek Electronics has completed a real-world deployment of its Interlux AI Traffic Signal System in Georgia, highlighting how cities...

Wednesday 16 September 2026

Why Wiwynn chose El Paso for its first US plant

Wiwynn held the grand opening for its first US factory on September 14 local time, choosing El Paso, Texas, over larger cities such...

Wednesday 16 September 2026

Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

Wednesday 16 September 2026

Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle

Artificial intelligence is moving beyond software and into physical systems, and Ennoconn Technology says that shift could create a...

Wednesday 16 September 2026

Samsung reportedly weighs Micron's newest memory for Galaxy S27

Samsung Electronics is reportedly testing Micron's most advanced 1γ LPDDR5X memory for possible use in the Galaxy S27 series, as rising costs around next-generation mobile DRAM...

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