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IN THE NEWS
Monday 24 August 2026
Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category...

Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
Monday 24 August 2026
CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
Saturday 22 August 2026
Supermicro's internal probe clears senior management in export-control case
Super Micro Computer (NASDAQ: SMCI) said Thursday that an internal investigation run by its independent directors found no evidence that any current senior manager knew of an alleged...
Friday 21 August 2026
Vecow eyes robotics growth as North America, EMEA account for 65% of business
Taiwan industrial computer supplier Vecow is stepping up its push into robotics and edge AI, with North America and Europe, the Middle East and Africa (EMEA) together accounting for...
Friday 21 August 2026
Top 4 CSPs boost AI infrastructure; volume ramping of 800G switches fuels Accton's growth
Major global cloud service providers (CSPs) continue to scale up investments in AI infrastructure. According to the latest DIGITIMES research report, combined capital expenditures...
Friday 21 August 2026
Huawei, China power giant Huaneng explore AI compute-power coordination
China Huaneng Group said on August 20 that chairman Wen Shugang and president Zhong Guodong recently visited Huawei in Shenzhen, where they met Huawei founder Ren Zhengfei to discuss...
Friday 21 August 2026
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026
Honor Robot Phone moves from concept to mass production

With the official launch of Honor's new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers...

Friday 21 August 2026
Research Insight: 2028 key year for optical interconnects in AI racks
Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
Friday 21 August 2026
800VDC adoption in AI data centers is set to reshape power chip demand
A shift to 800VDC power architectures in next-generation AI data centers is gathering pace, with implications for GPU planning, power semiconductor demand, and rack design. Many vendors...
Friday 21 August 2026
Taiwan export orders near US$98 billion in July, with US as top buyer
Taiwan's export orders climbed by US$207.3 billion, or 52.5%, in the first seven months of 2026 compared with the same period in 2025, according to data released on August 20 by the...
Friday 21 August 2026
Alibaba's 45% AI cloud jump masked by 75% capex surge and margin squeeze
Alibaba Group's June quarter is the clearest statement yet that the company now runs as an AI infrastructure business with an e-commerce cash engine attached, rather than the other...
Friday 21 August 2026
Unitree chief says humanoid robots are not yet ready for mass real-world work
Unitree Technology's soaring debut underscored investor enthusiasm for humanoid robots, but the company's founder said the industry still faces key limits before machines can perform...
Friday 21 August 2026
Alibaba guides AI cloud revenue toward US$10 billion run-rate next quarter
Alibaba is signaling that its most capital-intensive bet yet — a three-year, CNY380 billion (US$56.33 billion) buildout of AI compute — is starting to compound into a self-reinforcing...