Global supply chain: Mobile, telecom, computing

Mobile, telecom, computing trends

IN THE NEWS

Monday 17 August 2026

Record orders, yet profits squeezed: Asia-Pacific electronics supply chain caught in cost crunch

Global Electronics Association survey data show that demand across the global electronics manufacturing industry maintained steady...

Monday 17 August 2026

Nvidia closing in on US$100B credit guarantee deal for OpenAI's Ohio data center

Nvidia is approaching an agreement to provide credit guarantees of around US$100 billion for OpenAI's 10GW data center in Ohio, among the largest AI infrastructure projects ever, according...

Monday 17 August 2026

Nokia axes 1,600 jobs and Hangzhou R&D center in deepening China telecom retreat

Nokia is accelerating its retreat from China, closing its Hangzhou R&D center and cutting about 1,600 jobs as shrinking market access,...

Monday 17 August 2026

OCP APAC 2026: When AI starts running the hardware that runs it

The tech industry has long been fixated on one persistent bottleneck: the physical limitations of high compute in the AI era. But what if the industry's focus, rather than pouring...

Monday 17 August 2026

Topoint's high-end drill bits hit 56% share ahead of schedule, aims to double capacity by end of 2028

Printed circuit board (PCB) drill bit manufacturer Topoint Technology stated during its second-quarter 2026 earnings call that strong...

Monday 17 August 2026

AI server growth is lifting Taiwan ODM revenue, but margins now face the harder test

Taiwan's top six original design manufacturers are seeing AI servers become the main revenue engine in 2026, but the boom is also bringing heavier exposure to expensive GPUs, CPUs,...

Monday 17 August 2026

Weekly news roundup: AI expansion fuels supernodes, post-HBM memory, liquid cooling and supply-chain shifts

This week's most-read stories traced the AI boom across the stack, from supernodes and next-generation memory to liquid cooling, solar power, telecom services and PCB demand. Below...

Monday 17 August 2026

LG, Nvidia deepen ties on humanoid robots, AI factories, and vehicles

LG said on Wednesday that it is developing a next-generation bipedal humanoid robot with Nvidia technology, a move that could influence how factories, vehicles, and service robots...

Monday 17 August 2026

AI server tracker: Demand drives strong growth across Taiwan's CCL, design services, substrate, and testing supply chains

Taiwan's AI server supply chain continued to show strong growth in July 2026, with revenue rising across copper-clad laminate (CCL), design services, substrates, and testing. All four...

Monday 17 August 2026

India roundup: India's electronics push gains momentum as water, China ties and chip incentives collide

India's electronics and AI infrastructure ambitions are accelerating, but mounting environmental...

Monday 17 August 2026

DFI accelerates edge AI rollout in 2H26 with ‘Right Compute’ strategy

Industrial PC (IPC) maker DFI held its second-quarter 2026 earnings conference on August 14, reporting a sharp improvement in profitability as its embedded, intelligent automation...

Sunday 16 August 2026

China's AI supernode build-out turns more chips into more computing power

China is accelerating construction of its national computing network, and a growing share of new capacity is likely to use supernodes...

Sunday 16 August 2026

Taiwan Mobile launches tender offer for Systex, targeting majority control

Taiwan Mobile said on August 12 that its board approved a tender offer for Systex Corporation common shares through its wholly owned subsidiary Taiwan Cellular, with the goal of lifting...

Sunday 16 August 2026

Edgecore pushes all-optical networking for distributed AI data centers

Edgecore Networks said distributed AI infrastructure will become more important as data centers run into limits on power, space, and cooling. Speaking at the 2026 OCP APAC Summit,...

Saturday 15 August 2026

Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

2/1881 pages