In China's push to stimulate economic growth by undertaking new infrastructure projects, artifical intelligence (AI) plays the role of facilitating digital transformation and upgrades...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...

Google Taiwan has announced a project to promote digital transformation at Taiwanese companies.

Taiwan's automotive PCB makers have seen their third-quarter 2020 shipments significantly rebound sequentially thanks to capacity utilization rates at auto plants in the US and Europe...

DRAM maker Nanya Technology has reported August revenue slipped 0.8% sequentially to a six-month low of NT$4.87 billion (US$166 million).

Micron Technology has claimed its GDDR6X is the world's first to power system bandwidth up to one terabyte per second (TB/s). Working with Nvidia, Micron debuted GDDR6X in the new...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

Foxconn Technology Group has taken a step forward shaping its EV empire as its plan of forming a joint venture with Hua-chuang Automobile Information Technical Center (HCAITC) gained...

Delta Electronics has announced its electric vehicle (EV) charging station in Yokohama, jointly developed and operated by the Taiwan-based company and Japan's energy firm Idemitsu...

China is aggressively building its own SiC components supply chain for EV and other emerging applications, and as many as 14 makers are engaged in the development and production of...

Automotive diode demand has started picking up since July after staying stagnant for months, and Taiwanese makers are stepping up deployments in IGBT and SiC power components seeking...

MediaTek and Qualcomm have introduced their new AI-capable mobile SoC chips designed specifically for gaming smartphones - the Helio G95 and Snapdragon 732G respectively.

Samsung Electronics has announced mass production of 16Gb LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology, at its second production line in Pyeongtaek.

Acer has partnered with Oplus, a smart home solution provider, to develop AI platforms for smart home applications.