As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic about the potential of Panel Level Packaging (PLP) to take the baton. With its inherent advantages, such as transforming substrates from round to square, PLP is positioned to become the new mainstream technology for AI chip packaging.

BOE Technology staged a strong comeback in 2024 after two years of sluggish growth, with both its LCD and OLED segments driving a sharp rebound in revenue and profit. The company reported full-year revenue of CNY198.381 billion (approx. US$27.22 billion), up 13.66% year-over-year. Net profit attributable to shareholders jumped 108.97% to CNY5.323 billion, while non-recurring net profit surged 706.6% to CNY3.837 billion. Basic earnings per share came in at CNY0.14.

Samsung Display (SDC), South Korea's top panel supplier, has filed a fresh OLED patent infringement lawsuit against China's BOE Technology, intensifying an already heated legal standoff between the world's leading display makers.

Ennostar, a leading developer in compound semiconductors, showcased major advancements in Micro LED technology at Touch Taiwan 2025, with a dual focus on innovation at both the component and application levels. The centerpiece of its exhibition included a cutting-edge GemiLED platform and a transparent 30-inch automotive display now ready for mass production.