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DIGITIMES Hot Systems
DIGITIMES Hot Systems is on a mission to bring you the latest updates on the hottest hardware, the coolest gadgets, and the best tech-toys being made right now in Taiwan. From motherboards and graphics cards, to phones, portable media players and cameras, if a product has "this is cool" written all over it, you are guaranteed to read about it on DIGITIMES Hot Systems.
IN THE NEWS
Thursday 26 April 2007
Sony unveils three HD AVCHD camcorders
Sony recently announced three AVCHD high-definition (HD) camcorders, the HDR-CX7, HDR-SR7 and HDR-SR5.
Thursday 26 April 2007
StepNote NC1501 adopts VIA C7-M processor, to hit US shelves
VIA Technologies and Everex jointly unveiled the notebook, which features a VIA C7-M processor and will be available through US retailers.
Tuesday 24 April 2007
Fujitsu T671ME-FJ motherboard adopts SiS chipsets
SiS has announced that its SiS671FX chipset is to be used in the new Fujitsu T671ME-FJ motherboard which recently entered mass production.
Tuesday 24 April 2007
OCZ announces StealthXStream 600W power supply
OCZ Technology Group announced its new StealthXStream 600W power supply designed for the value-minded consumer seeking simple, quiet performance.
Tuesday 24 April 2007
IPC makers launch new AMD-based products
Taiwan-based IPC makers Aaeon Technology and Axiomtek recently announced AMD Geode LX-based products.
Tuesday 24 April 2007
NEC Electronics America introduces heat-reducing MOSFETs
NEC Electronics America has announced the availability of two new metal-oxide-semiconductor field-effect transistor (MOSFET) families that help reduce heat generation in servers,...
Tuesday 24 April 2007
Thermaltake announces TMG ND4 cooler for Nvidia 8800GTX cards
Thermaltake Technology recently announced its TMG ND4, a water-cooling solution for Nvidia 8800GTX graphics cards.
Monday 23 April 2007
Samsung develops 4GB DDR2 DIMM via new stacking technology
Samsung Electronics has announced it has developed an all-DRAM stacked memory package using "through silicon via" (TSV) technology.
Thursday 19 April 2007
VIA defines Pico-ITX form factor
VIA Technologies has announced the VIA VT6047 Pico-ITX form factor reference design, a small full-featured x86 motherboard designed for ultra-compact embedded PC systems and appliances...
Thursday 19 April 2007
Dell launches new linear tape-open data storage device
Dell recently announced its Dell PowerVault LTO-4-120, a Linear Tape-Open drive storage device using the LTO-4 specification.
Wednesday 18 April 2007
Beijing IDF: HTC Shift to utilize Intel new mobile platform
High Tech Computer (HTC) has announced at the Intel Developer Forum in Beijing that its new mobile computer, the HTC Shift, will be based on Intel's new Ultra Mobile Platform 2007...
Wednesday 18 April 2007
Beijing IDF: Intel details new products and initiatives
Intel detailed more than 20 new products, technology innovations and industry initiatives aimed at making the Internet, computers and consumer electronics devices much more responsive,...
Wednesday 18 April 2007
Beijing IDF: Toshiba provides 1.8-inch HDDs for Intel next-generation UMPC platform
Toshiba Storage Device Division (SDD) has announced collaboration with Intel to provide a family of 1.8-inch hard disk drive (HDD) solutions for the newest-generation ultra mobile...
Wednesday 18 April 2007
Albatron brings DirectX 10 to mainstream graphics
Albatron Technology has announced three new Nvidia GeForce 8-series GPU-based cards, the 8600GTS, 8600GT and 8500GT, which target the larger mainstream gaming market. Since the launch...
Wednesday 18 April 2007
Micron introduces new power-efficient Aspen DDR2
Micron Technology today introduced its new Aspen DDR2 memory family of energy-efficient products, featuring the low-voltage (LV) DDR2 in reduced chip count (RCC) memory modules.