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Monday 27 September 2021
Highlights of the day: Taiwan IC vendors to raise prices
Increasing foundry and materials costs are prompting some major IC vendors in Taiwan to decide to raise their product prices in fourth quarter of 2021. In China, many components makers are being affected by the Chinese government's decision to cut power supply to industrial users in line with its carbon reduction policy. PCB suppliers will find out this week whether Apple will increase or cut orders for the iPhone 13 series.
Monday 27 September 2021
SEMICON Taiwan rescheduled to December 28-30
SEMICON Taiwan 2021 will be held from December 28-30, according to the organizer.
Monday 27 September 2021
China stepping up development of homegrown 3rd-gen semiconductor supply chain
China with its 14th 5-year Plan (2021-2025) will be stepping up the development of the country's homegrown third-generation semiconductor industry supply chain, according to industry observers.
Monday 27 September 2021
Taiwan IC vendors poised to raise prices in 4Q21
Several Taiwan-based IC design houses are poised to raise their chip prices starting the fourth quarter of 2021 to reflect rising manufacturing costs, according to industry sources.
Friday 24 September 2021
Lite-on CEO expects chip shortage to ease in 2H22
The supply chain shortage has not seen any relief in 2021, particularly when it entered the third-quarter traditional electronic peak season. Market demand has increased, but overall production capacity has not.
Friday 24 September 2021
Highlights of the day: AMD, MediaTek reportedly in JV talks
AMD and MediaTek are said to be seeking to form a joint venture that will develop notebook applications integrating Wi-Fi, 5G and high-transmission technologies. Other chip vendors in Taiwan are also hoping MediaTek to play a leading role in the local supply chain to compete with Qualcomm in the mmWave 5G market. In the EV market, Thailand has ambitious goals for its car manufacturing sector.
Friday 24 September 2021
MediaTek urged to lead Taiwan mmWave 5G chips supply chain
Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources.
Friday 24 September 2021
Qualcomm dominates cellular baseband market in 2Q21, says Strategy Analytics
The global cellular baseband processor market grew 16% on year to US$7.2 billion in the second quarter of 2021, according to Strategy Analytics. Qualcomm capitalized on iPhone 12 design-wins and mid-range Android momentum to capture 52% revenue share during the quarter.
Friday 24 September 2021
DDI backend firms to enhance advanced testing capacity
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are looking to enhance their high-end testing capability, eyeing promising growth in demand for automotive DDIs, according to industry sources.
Friday 24 September 2021
IDMs step up deployments in GaN, SiC devices
IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor materials, according to industry sources.
Friday 24 September 2021
AMD, MediaTek reportedly in talks to form JV
Speculation has been circulating in the chipmaking market that AMD and MediaTek are in talks to form a joint venture that will be dedicated to developing SoC solutions combining Wi-Fi, 5G and high transmission technologies for notebook applications.
Thursday 23 September 2021
Intel to hold groundbreaking ceremony for new fabs on September 24
Intel is scheduled to hold a groundbreaking ceremony for the construction of two new fabs in Arizona on September 24. Company CEO Pat Gelsinger and local government officials will participate in the ceremony to mark what Intel claims is the largest private-sector investment in the history of Arizona.
Thursday 23 September 2021
Chromebook demand turns to 15-inch models
Chromebooks with 14- to 15-inch displays are currently having the worst shortages as orders from the education segment are shifting from the elementary to middle school levels - which are commonly using 11.6-inch models for their study-from-home needs - to high school and college levels, according to Acer chairman and CEO Jason Chen.
Thursday 23 September 2021
Nan Ya to scale up ABF substrate output for AMD processors
Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which is expected to help the US chipmaker significantly drive up its shipments, according to industry sources.
Thursday 23 September 2021
Samsung: Uphill battle in foundry business?
According to market research reports, the global wafer foundry market size was about US$82 billion in 2020, with TSMC having a 55% global market share, and Samsung taking only 15%. In terms of profit in the global wafer foundry sector, TSMC took nearly 85%, compared with less than 5% for Samsung. In other words, TSMC's profit in wafer foundry business was 17 times Samsung's. Evidently, the two players are competing in different divisions. But why has Samsung been so constantly provocative? Why is South Korea going all-out, vowing to be a dominant power in the global semiconductor industry by 2030?
Thursday 23 September 2021
Semiconductor equipment billings drop in August
August billings among North American manufacturers of semiconductor production equipment decreased 5.4%, bringing an end to an eight-month period of consecutive increases.
Wednesday 22 September 2021
Highlights of the day: NAND chip supply may turn tight in 2H22
NAND flash pices may stablize in 2022, but supply is likely to turn tight in the second half of next year, according to Silicon Motion's president. Meanwhile, Chinese memory maker YMTC is ready to volume produce 128-layer QLC NAND flash, initially targeting consumer SSDs. And in a recent interview by DIGITIMES, Harish Krishnaswamy, CTO and co-founder of MixComm, and Marzieh Veyseh, CTO/CPO and co-founder of SiTune, talked about their views on the development of mmWave market, latest chip crunch, and the Satcom market opportunities.
Wednesday 22 September 2021
5G drives double-digit growth for 6th straight quarter in smartphone APs, says Strategy Analytics
For the sixth straight quarter, the global smartphone applications processor (AP) market clocked a double-digit on-year revenue increase in the second quarter of 2021, according to Strategy Analytics.
Wednesday 22 September 2021
MediaTek releases Kompanio 900T AP for tablets
MediaTek has recently launched the Kompanio 900T AP for Android-based tablets and expects the chip to help it maintain the leadership in the Android tablet AP market.
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according to industry sources.
Friday 17 September 2021
Highlights of the day: International EV and semiconductor makers team up for SiC modules
Following in the footsteps of International IDMs and automakers to promote their SiC components for EVs, China auto and semiconductors makers are also preparing their homegrown SiC chips and modules for EV applications. After the announcement to develop SiC components a few weeks ago, Foxconn continues its investment in EV business with PPT in Thailand to expand its EV supply chains to Southeast Asia. In addition to EV manufacturing, its maintenance service recently has aroused many discussions from different sides, due to the eight-year warrants of early Tesla Model S and Model X being expired soon.
Friday 17 September 2021
MediaTek to recruit more innovative staff in India, says PTI
Taiwan-based chipmaker MediaTek announced its plans to recruit more innovation staff in India to support local manufacturing, according to PTI, although the actual number of new employees they are looking for is not disclosed.
Friday 17 September 2021
China stepping up deployments in homegrown car-use SiC modules
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Friday 17 September 2021
MediaTek keen on enriching design talent pool
MediaTek has expanded its recruitment scale in Taiwan, looking to hire an additional over 2,000 design engineers to support its business expansion goals.