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Thursday 9 April 2026
Aspeed and ASMedia propelled to top IC design ranks
Although Taiwanese firms have largely missed the core AI chip development battlefield, a few with critical technological barriers have broken through—most notably Aspeed and ASMedia. These two companies boast remarkable profitability and capital market performance that even outpace MediaTek, Taiwan's largest IC design firm. Significantly, their founding management teams mostly originated from the once-dominant PC chipset giants Silicon Integrated Systems (SiS) and VIA Technologies.
Thursday 9 April 2026
Why global chipmakers want to join TSMC's certified supply chain
TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's Rapidus, China's Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor, Nexchip Semiconductor, and even Tesla CEO Elon Musk are actively engaging with Taiwan's semiconductor supply chain.
Thursday 9 April 2026
Cyient Semiconductors closes US$85M majority stake in Kinetic Technologies, accelerating India-led power IC scale
India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India, offering global customers broader access to custom silicon, ASSP products, and enhanced engineering and manufacturing resources, and accelerate deployment of advanced power management solutions across computing and industrial markets worldwide.
Thursday 9 April 2026
China accelerates semiconductor equipment localization; Korean firms eyeing Taiwan as orders slip
In response to US semiconductor sanctions and to accelerate AI industry development, China is aggressively promoting localization in semiconductor manufacturing. While South Korean equipment makers initially viewed this as an opportunity to expand in the Chinese market, the gradual implementation of a "50% localization rule" is now beginning to impact orders. Rapid technological progress by Chinese equipment vendors is expected to further squeeze foreign suppliers' presence in China.
Thursday 9 April 2026
Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing
The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as key details of the partnership remain undisclosed.
Thursday 9 April 2026
Geopolitics and AI is redrawing the global chip packaging landscape
The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds in Taiwan and China.
Wednesday 8 April 2026
DIGITIMES analyst discusses Apple's Siri evolution, AI agent trends, and Samsung's 2nm reality
In his podcast, DIGITIMES senior analyst Luke Lin discussed Apple's upcoming evolution of Siri. The new version is expected to integrate Google's Gemini and allow users to select their preferred chatbot, including ChatGPT, Claude, or xAI's Grok. While some market analysts suggest Apple may use this approach to control distribution and charge listing fees, Lin is skeptical of that interpretation.
Wednesday 8 April 2026
China's AI and cloud firms step up use of domestic chips
China's leading AI and cloud companies are shifting toward domestically produced AI chips, a move with global implications for supply chains, technology competition, and cloud services. The trend could reduce demand for foreign semiconductors while accelerating China's practical deployment of AI on homegrown platforms, affecting international vendors and developers alike.
Wednesday 8 April 2026
Taiwan warns of Beijing's covert push to poach AI and chip talent

According to the latest report submitted by Taiwan's National Security Bureau to the Legislative Yuan, China is increasingly targeting Taiwan in an effort to circumvent international technological restrictions. Beijing has set its sights on Taiwan's high-tech sectors—particularly artificial intelligence (AI), semiconductors, and precision machinery—seeking to lure companies to establish operations or maintain a presence in China under the framework of its 15th Five-Year Plan.

Wednesday 8 April 2026
Hygon revenue jumps 68% on AI compute demand, expands CPU–GPGPU platform
China's domestic compute chipmaker Hygon Information Technology reported strong earnings growth, underscoring its rising role in China's AI and data center infrastructure buildout.
Wednesday 8 April 2026
Analysis: ASML earnings preview; SK Hynix and TeraFab already facing EUV capacity difficulties
Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season in releasing industry outlooks. This time, ASML will hold its earnings call for the first quarter of 2026 a day earlier on April 15, and is expected to outline how memory manufacturers and new large-scale logic foundries will reshape the semiconductor manufacturing landscape.
Wednesday 8 April 2026
Broadcom, Google, and Anthropic alliance faces MediaTek competition
Broadcom recently announced two major partnership developments. The first is with Google on its Tensor Processing Unit (TPU) application-specific integrated circuits (ASICs), with the collaboration set to extend through 2031. This means that Broadcom will continue to generate related revenue from multiple future generations of Google's TPU products.
Wednesday 8 April 2026
Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround
Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the IDM approach and a potential turning point in Intel's turnaround strategy.
Wednesday 8 April 2026
Commentary: China's AI chip dilemma revisits a familiar semiconductor fork in the road
The global AI race is no longer just about who builds the fastest chip. Increasingly, it is about who writes the rules.
Wednesday 8 April 2026
Arm reportedly plans to sell AGI CPUs in China despite core licensing ban
Arm recently unveiled its first self-developed AGI CPU, marking a significant milestone as the company shifts from a pure technology IP licensor to a standard CPU supplier competing directly with Advanced Micro Devices (AMD), Ampere, and Intel.
Tuesday 7 April 2026
IndieSemiC eyes India's general-purpose chip gap with Kaynes OSAT deal
India-based fabless startup IndieSemiC is betting that its new OSAT partnership with Kaynes Semicon can help it move from RF modules into vertically integrated chip products. However, the company acknowledged that the headline volume tied to the collaboration is still based on expected customer adoption rather than firm orders.
Tuesday 7 April 2026
FOPLP and WMCM emerge as key to fan-out packaging competitive field
The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a key next-generation solution for applications such as AI mobile devices and high-performance computing (HPC). As a result, it has become a new battleground actively pursued by both foundries and OSAT providers.
Tuesday 7 April 2026
Arm's three-pronged approach increases pressure on x86 in cloud CPU market
Market sentiment toward the future of Arm CPUs in cloud AI is increasingly positive. According to Counterpoint Research, x86 architectures have maintained overwhelming dominance in cloud AI CPUs over the past three years. However, starting in the second half of 2026, Arm CPU penetration is expected to rise rapidly.
Tuesday 7 April 2026
Global AI chip suppliers compete as TSMC remains top foundry partner
As the artificial intelligence (AI) era advances, approximately 133 companies are actively developing or selling AI chips, according to a SEMIEcosystem report citing Jon Peddie Research. Major suppliers include Nvidia, AMD, Broadcom, and Google, alongside numerous startups focusing on edge AI solutions.
Tuesday 7 April 2026
Google's chip revisions raise questions for MediaTek's growth plans

Recent reports suggest that Google has once again made engineering changes to its Tensor Processing Unit, or TPU, pushing the chip's tape-out to around mid-2026. The product in question—known as the v8x and designed by MediaTek—has raised fresh concerns about whether MediaTek can scale its application-specific integrated circuit, or ASIC, business as planned this year.

Tuesday 7 April 2026
Anthropic secures 3.5 GW of next-gen compute via landmark alliance with Google and Broadcom

Anthropic, Google, and Broadcom today announced a massive expansion of their strategic partnership, unveiling a multi-year roadmap that secures approximately 3.5 gigawatts (GW) of next-generation AI computing capacity for Anthropic.

Tuesday 7 April 2026
Analysis: NVLink licensing reshapes semiconductor alliance; potential Broadcom truce
In September 2025, Nvidia CEO Jensen Huang made a rare joint livestream appearance with Intel CEO Pat Gelsinger to announce a US$5 billion equity investment in Intel. In March 2026, Nvidia followed up with a US$2 billion investment in Marvell Technology. Why Huang is investing in potential competitors so aggressively remains a question.
Tuesday 7 April 2026
With Vera, Nvidia stops borrowing and starts building its own CPU muscle
Since artificial general intelligence (AGI) depends heavily on the CPU, Nvidia CEO Jensen Huang aims to build the most efficient "AI factory" by tightly controlling CPU development. At GTC 2026, Nvidia aggressively promoted its next-generation self-developed Arm-based CPU designed specifically for agentic AI.
Monday 6 April 2026
Smartphone order cuts hit IC design as recovery pushes to 2027
Market sentiment toward the 2026 smartphone outlook has turned increasingly pessimistic. On the supply side, rising component costs have expanded beyond memory to include across-the-board chip price hikes, making it unclear whether the initial round of handset price increases seen in early 2026 will be the only one.
Saturday 4 April 2026
Memory interface chip maker Montage sees DDR5 surge drive 2025 growth
Montage Technology reported full-year 2025 revenue of CNY5.46 billion (US$750 million), up 49.9% year on year, while net profit rose 58.4% to CNY2.24 billion, broadly in line with expectations. Adjusted net profit reached CNY2.02 billion, up 62.0%, reflecting solid underlying demand.