CONNECT WITH US
Monday 24 August 2026
AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models (LLMs) toward collaborative teams of AI agents with different roles and capabilities. He also revisited the seven-layer AI architecture he previously proposed, contrasting it with NVIDIA CEO Jensen Huang's five-layer "cake."
Monday 24 August 2026
Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category is now moving toward a three-tier hardware architecture of the brain, cerebellum, and peripheral nerves. He said the shift is reshaping the market and setting the stage for rapid growth through 2030.

Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.
Saturday 22 August 2026
Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond
Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers to overcome before fully autonomous driving becomes a reality, and a key part of this is the "eyes" of the car.
Friday 21 August 2026
Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation platform targeting large-model training and inference while improving programmability, ease of use, performance, power efficiency and chip area.
Friday 21 August 2026
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the way. Supply-chain sources say the chip has already returned from fabrication, completed initial power-on testing and moved into the device integration stage.
Friday 21 August 2026
TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles
A new collaboration between TIER IV and Renesas could shape how self-driving and software-defined vehicles are built worldwide, as automakers seek more flexible platforms for AI-driven features. The effort aims to combine open-source software, advanced chips, and scalable tools that may accelerate safer mobility across markets from Asia to Europe to North America.
Friday 21 August 2026
Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the other 26 manufacturers grew more than twice as fast.
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy," DIGITIMES chairman Colley Hwang said on August 20 at a forum exploring future trends in the semiconductor industry. He also warned that Taiwan's AI data center capacity is about one-sixth of South Korea's.

Thursday 20 August 2026
Taiwan chip designers see automotive demand rebound
Major European and US companies and Taiwan-based IC design firms are seeing a notable recovery in automotive chip demand so far in 2026, spanning smart cockpit platforms, advanced driver-assistance systems (ADAS), analog ICs, display driver ICs (DDIs), Ethernet chips, camera-sensing chips, audio chips and interface chips.
Thursday 20 August 2026
Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged Optics (CPO), with digital camera shipments confirmed to top 4 million units in 2026.
Thursday 20 August 2026
Fudan Microelectronics profit jumps 339%, FPGA localisation gains traction
Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment gains, while tightening global FPGA supply is creating fresh opportunities for Chinese suppliers.
Thursday 20 August 2026
Robotics leaders present future of physical AI, but also deployment challenges
Tech leaders converged at the 2026 International Robotic Forum on August 19, where they laid out their visions for the evolution and next stages of physical AI. They noted that a robot's success does not lie simply in demonstrations or prototypes, but in whether it can function in real-world settings like factories, address safety concerns, and meet the needs of real customers.
Thursday 20 August 2026
WPG sees chip supply remaining tight into 2027, plans NT$15 billion convertible bond sale

Taiwan-based IC distributor WPG Holdings expects AI-driven semiconductor demand to remain strong into 2027, with capacity tight across both advanced and mature process nodes, even as rising memory prices weigh on smartphone and PC shipments.

Thursday 20 August 2026
Sunplus expects automotive orders to rise in 3Q26 as memory costs threaten demand

Taiwanese IC design house Sunplus Technology expects its automotive orders to strengthen further in the third quarter of 2026, but warned that rising memory and component costs could weigh on overall market demand and dampen customers' willingness to place orders.

Thursday 20 August 2026
AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained by memory availability. At the same time, capacity at the world's leading advanced chipmakers has been fully booked, turning packaging capacity and memory allocation into major challenges for the broader AI market.

Wednesday 19 August 2026
Nvidia H200 chips reach China as imports remain limited
ByteDance and Tencent have each received about 10,000 Nvidia H200 processors in mainland China in recent weeks, the Financial Times reported, marking the clearest sign yet that Beijing's import reviews are translating into meaningful deliveries after months of regulatory uncertainty.
Wednesday 19 August 2026
Taiwan seeks shift from drone supplier to strategic partner in entering US market
Industry figures and analysts from Taiwan and the United States gathered on August 19 at an international unmanned aerial vehicles (UAVs) forum to discuss how Taiwan can move beyond its traditional role as a components supplier and become a strategic partner in the global drone supply chain. The discussion takes place at a time when drones have become the frontier of warfare, and countries such as the US are looking to build non-China drone supply chains.
Wednesday 19 August 2026
Socionext taps Intel 18A-P process for high-performance compute chiplet development
Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data centers, edge computing, and artificial intelligence (AI).
Wednesday 19 August 2026
Google and AMD target post-GPU era with Frozen v2 and Taalas
Advanced Micro Devices (AMD) recently announced its acquisition of Canadian AI chip startup Taalas to sharpen its competitive edge in AI inference. Taalas' core technology bakes model weights directly onto the silicon rather than relying on traditional high-bandwidth memory (HBM).
Wednesday 19 August 2026
Modi to inaugurate Semicon India 2026 as government courts global chipmakers
Indian Prime Minister Narendra Modi will inaugurate the fifth edition of Semicon India on September 17 at Yashobhoomi (India International Convention and Expo Centre) in New Delhi, with the three-day event running through September 19 under the theme "Silicon to Systems: Building the Ecosystem," according to ETV Bharat and the Statesman.
Wednesday 19 August 2026
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek

Market speculation that AMD is working with Google on technology for its v10-generation tensor processing unit (TPU) has prompted questions over the potential impact on Google's existing application-specific integrated circuit (ASIC) partners, including Broadcom and MediaTek.

Wednesday 19 August 2026
Airoha, MediaTek back IC Plus against Realtek in switches

Ethernet chipmaker IC Plus said on August 17 that its operations in 2026 have improved significantly after Airoha Technology took a stake and joined its management, while resources from MediaTek also provided substantial support. The company said it turned profitable in the first half of the year.

Wednesday 19 August 2026
Samsung moves ahead of SK Hynix in 1d DRAM development race

Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM, before SK hynix. According to The Bell, citing industry sources, Samsung is targeting September 2026 for completion, while SK hynix is aiming for December 2026, giving Samsung a lead of about one quarter.

Tuesday 18 August 2026
Rockchip profit jumps 62% as edge AI chips scale across devices

China AIoT chip designer Rockchip posted record first-half 2026 results, with revenue rising 40.6% year on year to CNY2.88 billion (US$427 million) and net profit surging 61.73% to CNY859 million, supported by accelerating edge AI adoption.