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Thursday 25 June 2026
MediaTek, Google reportedly deepen ASIC ties as SerDes race hits 448G
MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide. Market talk suggests the company may build an upgraded triggerfish product for Google, underscoring how global chipmakers are vying for influence in TPU development.
Thursday 25 June 2026
Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.
Thursday 25 June 2026
OpenAI debuts Broadcom-designed, TSMC-built inference chip as model makers diversify silicon
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.
Thursday 25 June 2026
Qualcomm pushes into data center chips with Dragonfly lineup and Meta deal, taking aim at Nvidia
Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone business and challenge Nvidia's dominance — while courting Chinese demand and leaning on manufacturing partner TSMC.
Thursday 25 June 2026
Nvidia and AWS deepen push to simplify AI infrastructure at scale
Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed, lower costs, and reduce operational complexity across inference, search, and training, which could influence how global enterprises deploy production AI.
Wednesday 24 June 2026
China's LineShine supercomputer tops TOP500, but AI lead remains unclear

China's LineShine supercomputer debuted at No. 1 on the June 2026 TOP500 list, announced at the ISC 2026 conference in Hamburg, becoming the first system to sustain more than two exaflops on the standard HPL benchmark using CPUs only. The result marks the first time since 2017 that a China-based system has led the TOP500 ranking, and reflects Beijing's effort to present a frontier computing system built around domestic processors, interconnects, and software.

Wednesday 24 June 2026
Qualcomm, ByteDance talks signal new phase in China AI chip diversification
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
Wednesday 24 June 2026
MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the semiconductor supply chain.
Wednesday 24 June 2026
Samsung eyes Galaxy Ultra for 2nm Exynos 2700

Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond the standard Galaxy S27 and S27 Plus models and into the premium Galaxy S27 Ultra and Galaxy Z Fold 8, according to The Bell.

Wednesday 24 June 2026
Cerebras leans on OpenAI and AWS as anchor customers, raising questions about concentration
Cerebras Systems' first public quarter highlighted its dependence on a small set of large partners — OpenAI and AWS anchor the business — even as management declined on the call to quantify how much revenue its biggest customers represent (deferring those concentration figures to its SEC filings).
Wednesday 24 June 2026
MediaTek price hike signals broader cost pressure for Taiwan IC design houses
Reports of MediaTek price adjustments appear to confirm a broader pricing trend across Taiwan's IC design sector. Industry sources said many small and mid-sized chip suppliers have spent the past three months discussing potential price increases with customers, but MediaTek's move carries particular significance given its scale and market position.
Wednesday 24 June 2026
Cerebras bets on speed as a product, racing to add data center capacity through 2027
Cerebras Systems used its first earnings call on June 26 to argue that speed is its core advantage and that the entire AI inference market is addressable. It also detailed an aggressive capacity ramp (with new data centers coming online every quarter through the end of 2027) to meet demand, it says, outstrips supply.
Wednesday 24 June 2026
Cerebras posts 92% revenue growth in first public quarter, but warns compute rentals will squeeze margins
Cerebras Systems delivered 92% revenue growth in its first quarter as a public company, but management cautioned that its decision to rent back computing capacity from an existing customer (a move expected to cut cloud margins by 10 to 15 points) will pressure profitability over the next several quarters.
Tuesday 23 June 2026
Smartphone demand and chip supply pressures cloud 2H26 peak season outlook
Market sentiment toward the smartphone industry remains subdued. On the demand side, global smartphone sales have declined for several consecutive weeks during the second quarter of 2026, with only Apple and Huawei showing relative resilience thanks to their strong brand appeal. On the supply side, chip shortages continue to intensify, expanding beyond memory products to include both advanced-node and mature-node semiconductors.
Tuesday 23 June 2026
Intel deepens ties with Taiwan's chip supply chain as October talks expand
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese suppliers in the first quarter of 2026.
Tuesday 23 June 2026
India reportedly plans to launch fresh chip incentive in fiscal 2027
The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials cited by Mint.
Tuesday 23 June 2026
Thailand approves semiconductor strategy, targets investment and talent growth
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development plan to strengthen the country's position in the global chip supply chain.
Tuesday 23 June 2026
MediaTek issues official price hike notice, products facing supply constraints likely to increase first
Taiwanese IC design leader MediaTek has sent a price hike letter to customers, signaling that the current wave of chip price increases is sweeping across the semiconductor market and that the era of chip inflation has arrived.
Tuesday 23 June 2026
Commentary: Google defines AI path to ASI, validates chip boom
Google released a 30,000-word AI roadmap on June 14 that, for the first time, clearly defines AI having the capability of 100 million humans as a key milestone on the path to artificial superintelligence (ASI). The plan outlines a three-stage evolution from today's large models to artificial general intelligence (AGI) and then ASI, reinforcing expectations that AI capabilities will keep expanding at an exponential pace.
Monday 22 June 2026
Groq CEO sees GPU and LPU as complementary as AI compute demand grows
Nvidia's planned US$20 billion strategic deal with Groq is built on a simple logic: as compute gets cheaper, demand keeps expanding. In a recent interview, Groq co-founder and CEO Jonathan Ross explained why Nvidia is expected to combine Groq's LPU with its latest Vera Rubin platform and how GPU and LPU can work as complementary engines in LLM inference.
Monday 22 June 2026
Intel-Nvidia co-developed PC processor to reportedly debut at CES 2028

According to an exclusive report by VideoCardz, Intel's first x86 system-on-chip (SoC) integrating an Nvidia RTX GPU has been added to its internal product roadmap and is expected to launch in the first quarter of 2028, potentially making its public debut at CES 2028.

Monday 22 June 2026
ASMedia launches second transformation plan, targets revenue doubling, AI server market expansion
High-speed transmission IC design company ASMedia Technology held its annual shareholders meeting on June 17, completing a full board reshuffle. ASMedia president Che-Wei Lin stated that 2025 revenue surpassed NT$10 billion (approx. US$316.5 million) for the first time, while earnings per share (EPS) reached NT$72.7. However, amid structural changes in the industry driven by the continued expansion in artificial intelligence (AI) server demand, the PC and motherboard sectors have faced severe crowding-out effects.
Saturday 20 June 2026
FPGA firm Efinix lines up TSMC Japan fab as edge AI business grows
Efinix, a Cupertino-based FPGA startup founded in 2012, is making a push into edge AI with its newly launched Titanium Edge series — a family of chips the company says addresses longstanding power and security limitations in programmable logic devices.
Friday 19 June 2026
Apple to work with Intel on US chip design and manufacturing, Trump says
US President Donald Trump said on June 18 that Apple has agreed to work with Intel to design and manufacture chips in the US, a claim he made in a post on his Truth Social platform.
Friday 19 June 2026
Interview: Oppstar grows ASIC design ties with Japan, South Korea clientele, plans Taiwan office

Founded in 2014, Oppstar is one of the few Malaysian companies operating at the front end of the semiconductor value chain as an IC design house. The company was established by three founders with extensive experience in the IC design industry: Meng Thai Ng, Hun Wah Cheah, and Chun Chiat Tan. Headquartered in Bayan Lepas, Penang, Oppstar opened an office in Kuala Lumpur, Malaysia, in 2022. From its inception, the company positioned itself as a one-stop IC design service provider, initially focusing on 16nm design nodes.