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Friday 14 August 2026
China AI chip demand lifts Hygon revenue 67%, Sugon profit 34% as domestic computing expands

Hygon Information posted a 66.5% increase in first-half 2026 revenue as accelerating artificial intelligence deployment and stronger demand for domestically developed computing chips lifted sales of its high-end processors.

Friday 14 August 2026
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove more heat.

Friday 14 August 2026
Chinese analog chipmaker Novosense returns to profit on AI server, auto demand
Suzhou Novosense Microelectronics expects to return to profitability in the first half of 2026, with revenue rising nearly 67% as demand for AI computing infrastructure, automotive electronics, server power supplies, and renewable energy systems lifts semiconductor shipments.
Friday 14 August 2026
AMD reportedly to issue up to US$5B in bonds amid tech debt sale wave
Advanced Micro Devices (AMD) is launching up to US$5 billion in debt offerings, part of a wave of tech companies reaching for capital markets to fund investments in AI-driven technologies. The move comes as the company is competing with both Intel and Nvidia to capture enormous opportunities from data center development and agentic AI.
Friday 14 August 2026
Intel's US$20B equity raise puts Lip-Bu Tan's turnaround strategy to the test

Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly US$19.67 billion in net proceeds, according to a prospectus supplement filed with the US Securities and Exchange Commission.

Friday 14 August 2026
Silicon Motion completes US$1.15 billion zero-coupon bond offering
Silicon Motion Technology has completed a US$1.15 billion convertible bond sale, giving it fresh capital to support growth and debt repayment. For global investors and chip buyers, the financing signals confidence in storage, automotive, and physical AI demand, while also showing how semiconductor firms are using low-cost structures to fund expansion.
Friday 14 August 2026
Alibaba Cloud launches Zhenwu M890 supernode for commercial use
Alibaba Cloud has begun commercial service for its Zhenwu M890 supernode in Ulanqab, Inner Mongolia, giving global customers an early look at how AI infrastructure is shifting toward larger, faster, and more tightly connected systems. The launch could influence future cloud costs, model access, and enterprise AI deployment well beyond China.
Friday 14 August 2026
Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the Design Technology (DT) team at Samsung Electronics' System LSI division, has pointed out that software has already leveraged AI to cut headcount and generate significant gains, but hardware has yet to see clear benefits.
Friday 14 August 2026
PixArt revenue rises on game-console demand as margin pressure grows

PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability for suppliers worldwide. The Taiwanese IC design company said strong sales from game consoles and other product lines lifted revenue in the second quarter of 2026, even as higher costs and a weaker product mix weighed on margins.

Friday 14 August 2026
Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
Thursday 13 August 2026
China AI chip market nears 90% domestic share in 2026—Huawei on course to eclipse Nvidia

China's high-end AI chip market could become almost entirely domestic in 2026, with local solutions expected to take nearly 90% of sales and leave Nvidia, AMD and other overseas suppliers with about 10%.

Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years. At the 2026 OCP APAC Summit, however, Ayar Labs CEO Mark Wade shifted the focus from whether CPO works to whether it can scale commercially.

Thursday 13 August 2026
OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward
Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.
Thursday 13 August 2026
Lightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment
Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a more unified, less fragmented supply chain for photonic interconnects.
Thursday 13 August 2026
Siemens EDA unveils AI-Native Design strategy in South Korea
Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The move could shape how semiconductor tools evolve worldwide, as companies seek faster, more reliable automation across increasingly global supply chains.
Thursday 13 August 2026
Synopsys pushes into system design as Nvidia, AMD and Broadcom move up the stack
Nvidia, AMD and Broadcom are moving beyond chip-level design into subsystems and complete systems, a shift that is increasing the need to account for thermal, electrical, mechanical and other physical effects earlier in the design process, according to Synopsys executives.
Thursday 13 August 2026
NXP expands Malaysia factory to bolster global chip supply resilience

NXP Semiconductors has begun expanding its Petaling Jaya assembly and test site in Malaysia, a move that could support semiconductor supply chains worldwide by adding capacity, automation, and geographic diversification. The project is part of a broader effort to improve manufacturing resilience as global demand and supply risks continue to shape the industry.

Thursday 13 August 2026
Nvidia's compute financing push signals a new phase for AI spending
Nvidia's plan to assemble more than US$500 billion in third-party capital for AI infrastructure could reshape how the industry pays for compute. By bringing major Wall Street firms into the deal, the chipmaker is effectively turning AI capacity into a financeable asset class, with implications for cloud providers, investors, and credit markets.
Thursday 13 August 2026
From lab bench to IPO: How Taiwan's top university aims to turn professors into founders, campus into a unicorn factory

National Tsing Hua University (NTHU), one of Taiwan's leading research universities, has spent more than a decade cultivating a campus culture of professor-led startups — a track record that has already produced companies such as eMemory Technology, Heron Neutron Medical, Advanced Ceramic X (ACX), Apex Biotechnology (ApexBio), and Finesse Technology. Building on that history, the university announced on August 10 that it will expand the scale of its "NTHU Accelerator."

Thursday 13 August 2026
Progate posts record profit on TSMC, Synopsys ecosystem gains
Progate Group Corporation posted record second-quarter and first-half 2026 revenue and profit, as stronger operations and deeper ties with the TSMC, Synopsys, and ASE ecosystems boosted results. The Taiwan-based design services provider said demand from U.S. customers and advanced-process projects also supported its performance.
Wednesday 12 August 2026
OCP APAC 2026: AMD sees AI agents pushing CPU-GPU ratio toward 1:1
AMD expects the shift from chatbots to agentic AI to sharply increase CPU demand alongside GPU acceleration, potentially moving the traditional CPU-to-GPU ratio from roughly 1:4 toward 1:2 or even 1:1.
Wednesday 12 August 2026
OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking at Nvidia, stated at the OCP APAC Summit 2026 — and the manufacturing chain behind them runs heavily through Taiwan.

Wednesday 12 August 2026
Nvidia reportedly planning trillion-parameter Nemotron 4 in open-source push

Nvidia is intensifying its open-source strategy through its upcoming trillion-parameter model in the Nemotron 4 family, which is meant to compete with the world's leading open-source models, according to The Information. While this may put it in the awkward position of vying against its customers, the chipmaker's advocacy for open-source AI could see the company benefit from more chip sales across the board.

Wednesday 12 August 2026
OCP APAC 2026: Applied Materials exec calls for hardware co-optimization to solve AI power crisis

Speaking at the OCP APAC Summit in Taipei, Subi Kengeri, Corporate Vice President and General Manager of Systems to Materials at Applied Materials, delivered a keynote warning that the artificial intelligence boom faces a critical bottleneck: energy efficiency.

Wednesday 12 August 2026
Japan's US$430B 2040 chip plan hinges on Rapidus 2nm

Japan has drawn up a plan for more than JPY370 trillion (approx. US$2.33 trillion) in combined public and private investment across 17 strategic sectors, including AI and space, through fiscal 2040, which runs from April 2040 to March 2041.