Japanese Prime Minister Sanae Takaichi will finalize a five-year plan by the end of 2026 outlining an investment blueprint for 17 strategic sectors. The plan will prioritize semiconductors and gaming for near-term investment, while physical AI and hydrogen are positioned as the next growth drivers.

BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip design with packaging and vehicle testing. ChosunBiz and ZDNet Korea reported the collaboration on October 20.

Nvidia's lead over Huawei in China's AI accelerator market has narrowed by 80% in a year, bringing CEO Jensen Huang's warnings about losing the country's US$50 billion AI chip market closer to reality. According to IDC, Huawei shipped 572,000 Ascend chips in the first half of 2026, securing a 28% market share, just 6pp behind Nvidia, compared with a 31pp gap a year earlier.

Nvidia is positioning the expansion of artificial intelligence as an infrastructure and industrial shift, not simply a software trend. At GTC Berlin, CEO Jensen Huang described an economy spanning energy, computing, AI factories, models, and applications, while urging Europe and telecom operators to build capacity to produce, host, and deploy autonomous AI systems.

Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet growing demand for its accelerated computing and AI factory platforms.

China's IC designers are expanding into high-speed interconnect technologies as AI inference and agent applications fuel demand for server CPUs, memory modules and connectivity chips. Montage Technology expects third-quarter 2026 profit to more than double on stronger DDR5 shipments, while Shenzhen-based Techwinsemi is developing Compute Express Link (CXL) memory expansion controllers. Together, these efforts highlight China's growing interest in AI server connectivity.

Texas Instruments' third quarter suggested the analog chip upturn has moved beyond restocking into a broad-based recovery, and that the company's multi-year build-out of 12-inch wafer capacity is now lifting margins rather than absorbing cash. Revenue rose 28% year on year and 11% sequentially to US$6.06 billion for the quarter ended September 30, 2026.

Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration model to win a place in Nvidia's supply chain. The move could meet customer requirements, but it is raising concerns in South Korea over Samsung Foundry's competitiveness, HBM design control, and the long-term benefits of internal collaboration.

Li Auto's chip and domain controller subsidiary, Mahe Xin Technology, has entered a first-round equity financing agreement worth CNY 1.625 billion (approx. US$243.33 million). The fundraising follows the automaker's recent opening of its in-house technologies to external customers, mirroring similar moves by other Chinese EV companies.

Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their existing supply partnership from 6-inch to 8-inch substrate technology, positioning both companies to meet future demand across electric vehicles (EVs), renewable energy systems, and AI data center power infrastructure.

Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its imaging-sensor expertise creates synergies between components and creative production, while a partnership with Taiwan Semiconductor Manufacturing Co. (TSMC) will support future manufacturing investment.

AMD and Intel plan to consolidate their PyTorch optimizations for x86 processors in oneDNN, aiming to give AI developers a common path to performance improvements across both companies' CPUs and reduce the work of maintaining separate software paths.

Qualcomm CEO Cristiano Amon told employees in a memo on October 19 that the company will conduct global, performance-based layoffs after completing its annual employee evaluations, with notifications expected to begin in November. The move aims to build a stronger performance culture and address the company's continued failure to meet expectations.

The US imposed sanctions on five Chinese entities tied to ex-Google engineer Linwei Ding for theft of trade secrets. The action follows his conviction for stealing confidential AI technology from Google, apparently to benefit Chinese firms.

Physical AI that can sense, reason, control machines and interact with people, Salil Raje, senior vice president of AMD's Embedded Computing Group, said TOPS (trillions of operations per second) no longer adequately measures performance, and that the industry must rethink how it defines performance for systems that require end-to-end, real-time responsiveness.

The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.

Chinese tech giants ByteDance, Alibaba, and Tencent have collectively ordered more than 3 million units of Nvidia's new RTX PRO 5500 graphics cards, representing a total value exceeding US$35 billion, as reported by Reuters.

South Korean IC design firm LX Semicon has deployed AI agents in the development of display driver ICs (DDIs), reducing the design time for a benchmark image-processing engine from 10 days to two. The company said two large-size LCD TV DDI products developed with the technology have reached tape-out, with mass production planned for early to mid-2027 for television panels in Greater China.

Nvidia is positioning its Vera CPU as a central component of data-center infrastructure for agentic artificial intelligence, as multistep reasoning and tool calls increase demand for fast serial processing. The company says CPU resources are gaining importance alongside GPUs, while declining GPU-to-CPU ratios signal a potential redesign of AI computing architectures.

China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and AI computing chips. Yet slower quarterly growth, mounting R&D expenditure and a steep share-price correction have highlighted the gap between the company's operating performance and market expectations.

DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration shows the growing ties between two of China's largest technology firms to sidestep Nvidia.

China's electronic design automation (EDA) industry is consolidating, with Shanghai-based S2C and Wuxi-based HyperSilicon merging into a unified digital front-end EDA platform. Backed by Empyrean Technology and other investors, the deal aims to strengthen domestic capabilities in hardware emulation, chip verification, and simulation.

Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only high-volume fab that can deliver 12-inch indium phosphide (InP) silicon photonics (SiPh) at scale to the industry.

Cumulative shipments of chips incorporating Alibaba DAMO Academy's RISC-V processor intellectual property (IP), branded XuanTie, have surpassed 6 billion, marking a milestone for the open-source architecture as the company expands beyond embedded applications into AI computing, servers, autonomous driving, and robotics.

A research team at Yale University in the US has found that flowing networks made of water or other fluids can store memory like computer chips, leading to the development of a fluidic memory chip with potential applications in soft robots. The team recently published its findings in Physical Review X (PRX).