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Wednesday 1 April 2026
Fujitsu plans 1.4nm AI chip Japan-based production with Rapidus
Fujitsu plans to develop a 1.4nm artificial intelligence (AI) chip and outsource its production to Rapidus in Japan, according to Nikkei. The chip is designed for use in servers and related systems, with a focus on low power consumption and domestic manufacturing.
Wednesday 1 April 2026
China memory chip maker Longsys unveils SPU architecture for edge AI storage systems

As AI shifts from cloud training to edge inference, the memory stack is moving beyond data access toward system-level coordination, reshaping controller design, supply chain roles, and value distribution.

Wednesday 1 April 2026
Nvidia's 800V-to-12V push faces industry skepticism
Following Nvidia's promotion of its 800V-to-12V solution at the GPU Technology Conference (GTC) 2026, major power semiconductor and IDM players have successively launched related voltage converters and peripheral chip solutions. These emphasize their capability to directly convert 800V to 12V or 6V within the power supply system, thereby reducing the number of voltage conversion stages and enabling shorter, more direct power transmission paths.
Wednesday 1 April 2026
Nvidia's US$2 billion bet on Marvell turns rivals into ecosystem partners
Nvidia's US$2 billion investment in Marvell signals a shift toward hybrid AI infrastructure, balancing dominance with openness while intensifying competition across custom silicon, networking, and next-generation interconnects.
Wednesday 1 April 2026
China memory chip designer GigaDevice posts record 2025 earnings, locks in US$825 million DRAM supply
GigaDevice Semiconductor reported stronger full-year 2025 results, supported by AI-driven demand and a recovery in the memory cycle. Revenue rose 25.12% year on year to CNY9.2 billion (US$1.33 billion), while net profit increased 49.47% to CNY1.65 billion. Adjusted net profit grew 42.57% to CNY1.47 billion. The company plans a dividend of CNY7.5 per 10 shares.
Wednesday 1 April 2026
Arm, Tesla chip push reshuffles supply chains, lifts AI memory demand
Global technology and semiconductor companies are moving to build independent chip ecosystems to meet rising artificial intelligence (AI) demand, a shift that stands to reshape semiconductor supply chains.
Wednesday 1 April 2026
China GPU maker Biren triples revenue on AI data center demand

Biren Technology reported 2025 revenue of CNY1.04 billion (approx. US$150.47 million), up 207.2% year-over-year, supported by demand from domestic data centers and AI enterprise customers. Gross margin rose to 53.8%, up 0.63pp. The company's BR10X general-purpose GPU remained the main revenue contributor, while its next-generation BR20X is set for launch in 2026.

Wednesday 1 April 2026
China's AI chip demand drives advanced foundry growth amid geopolitical split
Under a push to localize capacity, China's leading domestic foundries are well-positioned to leverage their home market and policy advantages to replicate TSMC's growth trajectory. This momentum is fueled by a virtuous cycle of massive orders supporting substantial R&D and capital expenditure, which is accelerating domestic substitution toward advanced process nodes.
Wednesday 1 April 2026
Samsung's 2nm Exynos 2600 loses to Qualcomm's 3nm on battery and thermals
Samsung's Exynos 2600 application processor (AP), built on the company's 2nm process, lags in battery endurance behind Qualcomm's Snapdragon 8 Elite Gen 5 — a 3nm chip — by about 30%, according to a recent test. This gap has had a tangible impact on Samsung Electronics' Galaxy S26 series, with battery life varying significantly across regions depending on which AP the device uses.
Wednesday 1 April 2026
Lumentum expands InP production in North Carolina to capture AI infrastructure demand across GPU and ASIC ecosystems
US-based optical communications leader Lumentum is making a major investment in core AI data center hardware, reinforcing its strategic position in the AI infrastructure supply chain. As global tech giants continue to ramp up AI computing deployments, demand for high-performance optical interconnect components is surging, and Lumentum's expansion directly responds to this trend.
Tuesday 31 March 2026
MPI probe card lead times stretch to 6 months on AI chip testing surge
Taiwan-based semiconductor testing interface provider MPI Corporation has reported that strong demand from the AI chip testing market has pushed probe card lead times to as long as six months, with visibility for some orders extending up to two years. Chairman Ko Chang-lin expects the company's operations to grow quarter by quarter in 2026, targeting double-digit annual revenue growth and a strong likelihood of reaching a new record high for the full year.
Tuesday 31 March 2026
Flex to acquire Electrical Power Products for US$1.1 billion
Flex said it has reached a definitive agreement to acquire Electrical Power Products (EP2), a specialist in engineered-to-order electrical control and protection systems, as it expands its footprint in critical power infrastructure.
Tuesday 31 March 2026
MediaTek and Airoha deepen telecom open-source platform to challenge Broadcom, Qualcomm in edge AI
Airoha announced on March 30, 2026, that it has expanded the adoption of open-source systems in networking communications, becoming the world's first fiber broadband chip platform vendor to integrate three major open-source systems—OpenWrt, RDK-B, and prplOS—into its own network chips.
Tuesday 31 March 2026
Top 10 chart: Taiwan's AI winners diverge as market corrects ahead of lagging revenue data

By late March, Taiwan's equity market is offering a more nuanced read of the AI infrastructure boom. While accumulated revenue and year-over-year growth through February continue to point to strong structural demand, recent share price movements suggest that the market has begun to recalibrate expectations. The result is a growing divergence between backward-looking financial data and forward-looking capital market signals.

Tuesday 31 March 2026
South Korea invests US$166 million in chip startup Rebellions

South Korea has approved a KRW250 billion (approx. US$166 million) investment in local artificial intelligence (AI) chip startup Rebellions, as part of a government push to build a globally competitive AI chipmaker.

Tuesday 31 March 2026
Huawei poaches top scientist as Germany's tenure rules drive talent away
Huawei has recruited a leading scientist from a German research institute, raising concerns among the German government and academic circles. According to Nikkei Asia, Martin Schell, formerly director of Germany's Fraunhofer Heinrich Hertz Institute (HHI), announced his departure and moved to the UK in March to become research director at Huawei's Bragg Research Center.
Tuesday 31 March 2026
DDI price hikes mainly aim to pass on costs, not boost profits
The recent surge in display driver IC (DDI) price hikes has spread from China to Taiwan, with reports indicating that Taiwanese DDI design firms will begin raising prices starting in the second quarter of 2026 to reflect escalating supply chain costs. Besides DDIs, related chip products such as T-Con, touch ICs, and power management ICs (PMICs) may also see price adjustments depending on negotiations with individual customers. Reported increases range from 5-15%, with some cases reaching up to 20%.
Tuesday 31 March 2026
Commentary: AI drives global tech layoffs, but Intel, QNAP, and Realtek tell different stories

Generative AI is moving from concept to commercial deployment, reshaping the global technology supply chain. It is shifting from a productivity tool to a core enterprise infrastructure. At the same time, layoffs are accelerating across Silicon Valley tech firms, Wall Street institutions, semiconductor companies, and Taiwan IC design houses.

Tuesday 31 March 2026
DIGITIMES Insight: Terafab funding questions emerge as CPU resurgence reshapes AI chip demand
On a recent podcast, DIGITIMES analyst Luke Lin spotlighted Elon Musk's Terafab as a retro IDM bet with major funding questions, while arguing CPUs are resurging in the AI era as inference demand tightens supply and reshapes semiconductor priorities.
Tuesday 31 March 2026
Custom chips demand spike draws Taiwan firms into ASIC arena
While the barriers to entry in cloud AI ASICs remain out of reach for many chip designers, demand for specialized chips at the edge is rising sharply. Across a widening range of applications, customers are seeking greater control at the silicon level, aiming to reduce their reliance on traditional chip giants.
Tuesday 31 March 2026
Vera Rubin compute tray design unfinalized as Nvidia pushes supply diversification
Sources in the passive component supply chain report that Nvidia's next-generation platform architecture, Vera Rubin, is scheduled to enter mass production in the third quarter of 2026 and has drawn significant attention from the global AI computing market. However, the design of the GPU compute tray has yet to be finalized, which could cause slight delays in actual shipment timelines.
Monday 30 March 2026
Commentary: US chip security act ends China's special AI chip supply
The US House Committee on Foreign Affairs passed the Chip Security Act, signaling a decisive move to restrict high-performance computing exports amid rising tech tensions with China. Meanwhile, reports from within China indicate a growing consensus to halt imports of US-origin AI chips altogether.
Monday 30 March 2026
China builds open RISC-V chip platform with Xiangshan, Ruyi OS
China's Chinese Academy of Sciences (CAS) launched next-generation chip and operating system co-development alongside the debut of the Xiangshan open-source processor and Ruyi native OS at the 2026 Zhongguancun Forum.
Monday 30 March 2026
Toshiba, Rohm, Mitsubishi Electric, and partners begin talks on integrating Japanese power device and semiconductor businesses
Toshiba, Rohm, Mitsubishi Electric, and partners begin talks on integrating Japanese power device and semiconductor businesses
Monday 30 March 2026
China's semiconductor capacity share to reach 32% by 2030
The global semiconductor industry is undergoing a structural transformation. SEMI estimates that in 2025, capital expenditures (CapEx) by the four largest US cloud service providers (CSPs) will reach US$400 billion, more than twice the total semiconductor industry CapEx. When including Chinese cloud providers and sovereign AI investments, global AI infrastructure spending could surpass US$1 trillion by 2027.