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    Tencent, Alibaba, Baidu turn to local AI chips as Nvidia faces policy headwinds
    Sep 17, 18:24
    Jack Ma returns with ambitions for 'China's Oracle'
    Sep 17, 18:23
    Taiwan-Philippines ties deepen as tech expo highlights new supply chain realities
    Sep 17, 18:22
    Samsung joins US health tech initiative to boost medical innovation
    Sep 17, 18:22
    EU and Japan plan joint rare earth development in Greenland to reduce reliance on US-China supply
    Sep 17, 18:22
    Trump's UK visit prompts AI investment pledges to focus on inference
    Sep 17, 18:22
    Home Tech Semiconductors IC design, distribution
    Thursday 18 September 2025
    China turns away from Nvidia as AI rivalry with US enters a new phase

    China's internet regulator has instructed leading technology firms, including Alibaba Group Holding and ByteDance, to stop buying Nvidia's artificial intelligence chips.

    Thursday 18 September 2025
    Nvidia, TSMC face antitrust scrutiny as US-China tensions spotlight market power
    Just as Washington and Beijing are preparing to resume trade talks, China's State Administration for Market Regulation (SAMR) has thrown a wrench into the works. The agency accused Nvidia of violating the country's antitrust laws, putting the company back in the spotlight just months after a controversy over its H20 chips had begun to fade.
    Thursday 18 September 2025
    SpaceX advances D2D plans with EchoStar spectrum deal

    SpaceX is reportedly working with semiconductor manufacturers to develop a custom chip that will enable its upcoming direct-to-device (D2D) satellite communication service, aimed at connecting ordinary smartphones directly to its Starlink satellite network. The service is slated for testing by the end of 2026, marking a major step in the company's ambitious plan to reshape global connectivity.

    Wednesday 17 September 2025
    SMIC initiates testing of domestically produced lithography machines to bypass US sanctions
    In response to US export controls and to reduce reliance on ASML, China has begun testing its first domestically manufactured deep ultraviolet (DUV) lithography machine. According to media reports, SMIC is currently testing immersion-type DUV equipment developed by a Shanghai-based startup, which can support chip production down to 7nm technology nodes.
    Wednesday 17 September 2025
    Taiwan semiconductor industry holds home advantage, says economics minister
    Taiwan's AI server exports have doubled, with manufacturers' GPU and graphics card production capacity fully booked, driving remarkable export growth for the country. Minister of Economic Affairs Kung Ming-hsin stated on September 16 that the success of Taiwan's technology industry is not accidental.
    Wednesday 17 September 2025
    Commentary: Smartphone chipmakers rebrand as Qualcomm, Apple, MediaTek, and Xiaomi refresh product names to stay competitive
    Qualcomm will unveil its latest Snapdragon flagship mobile platform next week and has officially confirmed the chip will be called Snapdragon 8 Elite Gen 5. The move comes as part of a wider trend in the smartphone supply chain, where companies from Apple to MediaTek and Xiaomi have embraced renaming strategies across software, chip platforms, and flagship devices. The wave has fueled speculation that a lack of innovation is prompting the industry to turn to rebranding in search of renewed consumer attention.
    Wednesday 17 September 2025
    China's TI anti-dumping probe likely more symbolic than punitive
    China is reportedly probing whether US-made analog chips are being dumped into its market, a move widely seen as targeting Texas Instruments (TI), the dominant US supplier of analog semiconductors.
    Wednesday 17 September 2025
    China opens anti-dumping probe into US chipmakers amid tariff tensions

    China's Ministry of Commerce has announced a sweeping anti-dumping and anti-subsidy investigation into certain analog ICs imported from the US, in a move widely seen as both a retaliatory response to recent US tariff extensions and a strategic effort to bolster its domestic chip industry.

    Wednesday 17 September 2025
    NXP outlines SDV, robotics, and smart-glasses plans as new leadership prepares to take charge
    Dutch chipmaker NXP Semiconductors plans to complete its CEO transition by October 2025. Current CEO Kurt Sievers, who will remain in the position until then, made what is likely his final visit to Taiwan as chief executive during SEMICON Taiwan 2025. Incoming CEO Rafael Sotomayor also attended the event and met with Taiwanese partners as part of the planned leadership change.
    Wednesday 17 September 2025
    Nvidia's Jensen Huang reverses quantum strategy, bets billions on next computing era
    Nvidia CEO Jensen Huang is making a big U-turn on quantum computing. After years of downplaying the technology's timeline, the tech titan is now pouring money into quantum startups.
    Wednesday 17 September 2025
    Taiwan's IC design industry risks losing No.2 spot to China; government unveils '4H' strategy
    Taiwan's integrated circuit (IC) design industry ranks second worldwide, trailing only the US. However, in recent years, Taiwan's position has become increasingly precarious due to rapid advancements by China. The National Science and Technology Council (NSTC) believes that focusing on two main pillars—advanced chip breakthrough technologies and heterogeneous integration industry drive—while concentrating on key R&D of high-computing power, high-power, high-frequency, and high-energy-efficiency (4H) chips could help Taiwan maintain a lead over China for approximately five more years.
    Tuesday 16 September 2025
    Loongson's first GPU 9A1000 nears tape-out, deliveries slated for 3Q25
    Loongson Technology said it has completed development of its first in-house GPU, the 9A1000, which is moving into tape-out testing. Pending successful results, shipments to customers could start as early as the third quarter of 2025.
    Tuesday 16 September 2025
    SEMICON Taiwan 2025: UK seeks Taiwanese partnerships to overcome domestic chip manufacturing constraints
    The United Kingdom demonstrated a prominent presence at SEMICON Taiwan 2025 last week, reinforcing its position as a key player in innovative technology. The UK Department for Business and Trade and Innovate UK, the national innovation agency, led a delegation of over 30 emerging companies across semiconductor manufacturing, design, testing, and materials sectors to the event.
    Tuesday 16 September 2025
    From FPGA to AI: Fudan Microelectronics confronts US FN4 blacklist head-on
    Shanghai Fudan Microelectronics Group (FMSH), one of China's major IC design companies, has been placed on the US Commerce Department's Entity List with the strict Footnote 4 (FN4) designation. The label requires licenses for all US export-controlled technologies supplied to FMSH, with approvals almost certain to be denied. The FN4 status effectively blocks the company's access to critical chip design tools and manufacturing services, cutting off its development pipeline.
    Tuesday 16 September 2025
    Qualcomm's Snapdragon naming shift coincides with Xiaomi's direct challenge to iPhone 17
    Qualcomm has introduced its latest flagship mobile platform, the Snapdragon 8 Elite Gen 2, built using TSMC's 3nm process and incorporating a customized Oryon core to deliver improved performance. Simultaneously, Chinese consumer electronics giant Xiaomi announced that its next-generation smartphones will bypass the "16" series and launch directly as the Xiaomi 17, 17 Pro, and 17 Pro Max, all powered by Qualcomm's new chip.
    Tuesday 16 September 2025
    Beijing's anti-dumping drive puts US analog chips on notice, clearing path for Chinese alternatives
    The US–China semiconductor dispute has entered a new phase of escalation, with the US Department of Commerce adding 23 Chinese entities to its Entity List, including 13 semiconductor firms spanning Beijing, Shanghai, Shenzhen, Wuxi, and Changsha. The sweeping action underscores Washington's strategic focus on both technology controls and broad regional reach across China's chip ecosystem.
    Tuesday 16 September 2025
    Intel offloads majority stake in Altera to Silver Lake, tightening focus on core business
    Intel Corp. has completed the sale of a controlling stake in its Altera programmable chip unit to private equity firm Silver Lake, marking a significant step in the company's ongoing efforts to streamline operations and concentrate on core businesses.
    Tuesday 16 September 2025
    Immigration raids raise doubts over Samsung’s 2026 Texas fab schedule
    Samsung's ambitious US expansion faces an unexpected obstacle that could derail its 2026 production timeline. A mounting visa crisis, triggered by immigration raids on South Korean workers, is creating ripple effects across the semiconductor industry's most critical supply chains.
    Tuesday 16 September 2025
    Huawei’s Ren says failed Motorola deal set stage for chip self-reliance
    Since Huawei established Shenzhen HiSilicon Semiconductor in 2004, its semiconductor business has supported over two decades of development and innovation within Huawei's product ecosystem. However, from 2000 to 2003, Huawei faced one of its most challenging periods and nearly became a US company. CEO Ren Zhengfei confirmed this long-rumored episode during an interview.
    Tuesday 16 September 2025
    NVIDIA's Rubin CPX may reshape AI memory demand, boosting GDDR7 over HBM
    Nvidia is preparing a potential shake-up in the AI semiconductor memory market with the introduction of its next-generation AI processor, Rubin CPX, which is designed for large-context processing workloads and expected to debut in late 2026. Unlike its flagship AI accelerators that rely on HBM, Rubin CPX will feature 128GB of GDDR7, a move that industry observers say could rebalance demand between the two leading memory types, according to SemiAnalysis, Wide Daily, and ET News.
    Monday 15 September 2025
    Nvidia antitrust ruling clouds US-China trade talks

    US and Chinese officials entered a second day of negotiations in Madrid on Monday, just as Beijing announced a preliminary ruling that Nvidia had violated antitrust conditions linked to its 2020 acquisition of Mellanox Technologies.

    Monday 15 September 2025
    Taiwan's government-built 12-inch fab to come online in 2028, integrating industry and academia capabilities
    TSMC has donated several sets of used 12-inch chipmaking equipment to the government, which has had the Industrial Technology Research Institute (ITRI) under the Ministry of Economic Affairs (MOEA) and the Taiwan Semiconductor Research Institute (TSRI) under the National Institute of Applied Research (NIAR) receive them on its behalf. TSRI has selected a site on the campus of National Yang Ming Chiao Tung University (NYCU) to build a 12-inch wafer fab where proof-of-concept and pilot lines will be installed using the equipment. The facility is expected to officially commence operations in 2028.
    Monday 15 September 2025
    Chipmakers bet big on AI glasses as market momentum builds
    Although the AI glasses market has yet to experience clear explosive growth, major system manufacturers, brands, and startups are continuously increasing their resources and development efforts for new products and solutions. Chipmakers share this high level of anticipation toward the technology trend, marking a stark contrast from their previous cautious stance regarding short-term mass adoption.
    Monday 15 September 2025
    Arm raises stakes in mobile AI with Lumex CSS; debuts C1 CPU and Mali G1-Ultra GPU
    Arm unveiled its Lumex Compute Subsystem (CSS) on September 10 at the Unlocked Summit in Shanghai, signaling its boldest step yet to elevate AI and gaming on flagship smartphones. The platform debuts the C1 CPU cluster based on Armv9.3 and the Mali G1 GPU lineup, headlined by the Mali G1-Ultra with support for second-generation Scalable Matrix Extensions (SME2). Together, they bring edge devices closer to data center-class performance.
    Monday 15 September 2025
    Omnipotent combination of semiconductor and AI ushers in new phase of technological explosion, says former TSMC R&D VP
    Former TSMC R&D vice president Jack Sun, who currently serves as senior vice president at National Yang Ming Chiao Tung University (NYCU), emphasized that semiconductors can no longer be replaced by other technologies. The TSMC Grand Alliance provides all participating companies with opportunities to profit. With AI now accelerating innovation, the combination of "semiconductor + AI" has become almost omnipotent, marking the starting point of the next major technological boom.
    More IC design, distribution coverage
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    Friday 12 September 2025
    SK hynix Completes World's First HBM4 Development and Readies Mass Production
    Friday 12 September 2025
    OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
    Friday 12 September 2025
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