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Monday 27 July 2026

South Korea, AMD team up to integrate homegrown NPUs with CPUs and GPUs

South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks to give its AI chip industry practical reference models and a path into the global AI computing supply chain.

Monday 27 July 2026

Samsung converts AMD and OpenAI ties into HBM4 supply wins

Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships that could strengthen its position in the next-generation HBM4 ecosystem after ceding early ground in AI memory to rival SK hynix.

Monday 27 July 2026

Rebellions readies Rebel100 shipments as AI inference demand grows

South Korean AI chip designer Rebellions plans to begin shipping its next-generation Rebel100 accelerator in the second half of 2026, betting that wider use of AI agents and commercial AI services will shift more infrastructure spending from model training toward inference.

Monday 27 July 2026

India's NIELIT and SCL expand access to indigenous semiconductor design kit through eChipHub

India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process Design Kit (PDK) available through the eChipHub platform, supporting semiconductor design education and research as part of the country's India Semiconductor Mission.

Monday 27 July 2026

Qualcomm tells customers chip prices will rise by double digits from September

Qualcomm plans to raise chip prices by a double-digit percentage from September 1, passing higher supplier costs into a smartphone market already strained by memory shortages and AI-related competition for semiconductor capacity.

Monday 27 July 2026

IndieSemiC, Semtech partner on RISC-V IoT platform as India expands semiconductor design ecosystem

Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP) platform that combines general-purpose computing with long-range wireless connectivity for Internet of Things (IoT) applications, according to announcements by DeshGujarat and The Economic Times.

Monday 27 July 2026

Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion plans spanning semiconductors, autonomous driving and robotics.

Monday 27 July 2026

IDMs target AI margins, boosting Taiwan power suppliers

International IDMs such as Texas Instruments (TI) and STMicroelectronics are leaning into AI data-center demand, while the market's shift toward 400V and 800V power architectures is creating a longer runway for power semiconductors. Industry sources said the move could benefit Taiwanese suppliers in midrange products, with pricing gains extending into the second half of 2025 and, in some cases, 2027.

Monday 27 July 2026

AMD widens robotics push with Taiwan IPC partners as it targets Nvidia lead

AMD is deepening its robot and physical AI ambitions, and the move could matter far beyond Taiwan's industrial PC sector. By building a broader partner network in edge AI and robotics, the chipmaker aims to challenge Nvidia as global developers and manufacturers seek cheaper, faster paths to autonomous systems.

Saturday 25 July 2026

Samsung, SK, Hyundai join Jensen Huang and Korea's President Lee at San Francisco AI Summit

South Korean President Lee Jae-myung and a delegation of the country's most powerful business leaders convened with NVIDIA founder and CEO Jensen Huang in Silicon Valley this week, in a series of meetings and public appearances that cast Korea as a cornerstone of the global AI infrastructure push.

Saturday 25 July 2026

Hisense expands AI strategy into energy, chips, and automotive electronics

Hisense outlined a broader AI strategy at its global partner conference in New York, saying it will expand beyond home appliances into semiconductors, smart energy, laser displays, and automotive electronics. The Chinese consumer electronics maker said the plan is designed to widen its AI value chain, strengthen global brand management, and improve user experience and operations.

Saturday 25 July 2026

South Korean leaders meet Nvidia as AI partnerships expand

South Korean President Jae Myung Lee, senior government officials, business executives, and researchers gathered in San Francisco this week for an AI summit with Nvidia and industry partners, highlighting South Korea's efforts to strengthen its artificial intelligence ecosystem and expand international collaboration.

Friday 24 July 2026

AMD says AI shift to inference and agents will reshape data centers

AMD said the artificial intelligence boom is entering a new phase that will force a major redesign of data centers, as demand shifts from model training toward inference, AI agents, and physical AI. At its Advancing AI 2026 event, the company introduced new server, accelerator, and rack-scale products to power the next generation of AI infrastructure.

Friday 24 July 2026

STMicroelectronics lifts data center target as AI optical demand outruns supply, but margin recovery waits on 2027 reshaping

STMicroelectronics raised its cloud AI revenue ambition and guided to a rising gross margin through the second half of 2026, but told analysts on its July 23 second-quarter earnings call that the full profitability recovery hinges on a manufacturing overhaul that will not finish before the end of 2027, and that its near-term ceiling is supply rather than demand.

Friday 24 July 2026

AMD redraws server chip strategy as AI workloads evolve

AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping its roadmap for a world where AI workloads are spreading from training models to enterprise agents. The shift matters globally because it signals that data centers may need more balanced upgrades to CPU, GPUs, and networking.

Friday 24 July 2026

Intel says supply, not demand, is its ceiling as it lifts 2026 capex above US$20 billion

Intel used its second-quarter 2026 earnings call on July 23 to argue that its biggest problem is no longer winning demand but building enough capacity to fill it, telling analysts it will raise capital spending, push its 18A and 14A process nodes forward, and expand a fast-growing custom-silicon business — even as it warned it will still be short of chips through the fourth quarter.

Friday 24 July 2026

AMD's latest 2nm-EPYC rollout signals broader role for CPUs in the AI data center

AMD unveiled its sixth-generation EPYC 9006 server processors, widening its push into AI data centers with chips designed for agentic AI, cloud computing, enterprise workloads, and high-performance computing. The launch suggests CPUs may continue to gain importance even as much of the market remains focused on GPUs.

Friday 24 July 2026

Intel's blowout quarter wins over the bulls, but analysts stay split on the foundry turnaround

Intel's second-quarter results have shifted the Wall Street debate from whether chief executive Lip-Bu Tan's turnaround is working to how durable the AI-driven compute demand behind it will prove, with the sharpest disagreement now centering on the still-unprofitable foundry business and a valuation that has already more than tripled this year.

Friday 24 July 2026

AMD sees AI demand broadening beyond chips, as Helios ramps toward shipment

AMD CEO Lisa Su said demand from cloud service providers and enterprise customers continued to climb rapidly, reinforcing AMD's view that the artificial intelligence (AI) market still has substantial room to grow. The CEO said AI adoption is now moving beyond efficiency gains and into new products, services, and business models.

Friday 24 July 2026

AMD unveils Helios rack-scale AI platform to target hyperscale buildouts

AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers. The system is designed to boost compute density, lower deployment complexity, and offer an open alternative to competing rack-scale architectures for training and inference worldwide.

Friday 24 July 2026

AI server demand powers Intel's fastest growth since 2011, but foundry proof still pending

Intel's second-quarter 2026 results suggest the AI data-center buildout is beginning to pull the chipmaker's long-delayed turnaround forward, even as the payoff from its costliest bet — the contract manufacturing business — remains unproven.

Friday 24 July 2026

AMD splits next-generation data center GPUs for specialized AI demand

AMD unveiled its Instinct MI400 series at its Advancing AI 2026 conference, broadening its push into data center chips with products aimed at different users. For global readers, the move signals how AI infrastructure is becoming more specialized, with implications for cloud builders, governments, researchers, and supercomputing operators worldwide.

Friday 24 July 2026

Amkor, Nvidia widen AI packaging partnership as US capacity expands

Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. The agreement includes a prepayment from Nvidia to support expanded US capacity, highlighting how global demand for AI infrastructure is reshaping supply chains and manufacturing priorities worldwide.

Friday 24 July 2026

China's AI chip share tops 50%, but Nvidia still rules frontier training

China's AI infrastructure build-out is rapidly lifting demand for domestic accelerators, giving Huawei, Alibaba's T-Head Semiconductor, Cambricon and Hygon a larger role in a market once dominated by Nvidia.

Friday 24 July 2026

Trumpf builds EUV moat with 40 years of chip tech

AI demand is continuing to drive global semiconductor investment, lifting the importance of extreme ultraviolet (EUV) lithography once again. Trumpf, the German laser maker and key supplier of CO2 laser light sources for ASML's EUV exposure tools, says its EUV technology was the result of more than 40 years of sustained R&D and more than 20 years of collaboration with ASML to industrialize EUV.

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