Yangtze Memory Technology (YMTC) started producing 256Gb TLC chips using its in-house developed 64-layer 3D NAND technology in the first quarter of 2019, with monthly output reaching 5,000 wafers initially. The China-based memory startup has since then ramping up the chip output without disclosing...

Leading-edge processes, defined as sub-28nm technologies, accounted for the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, sub-28nm capacity is forecast to represent about 49% of the IC industry's total capacity, according to IC Insights.

No one could do better than TSMC when it comes to predicting the possible size of next year's 5G smartphone market, as the top foundry house can rely on order visibility from chip clients to support its estimation. Now some industry sources have cited TSMC's internal estimates as expecting global

Judging from TSMC's rising capacity utilization rates, downstream memory device vendors have asked their controller suppliers to build up their inventory in advance, according to industry sources.

Strong demand from the 5G sector is apparently not the only factor driving TSMC's sales growth. The foundry house is gaining growth momentum from better-than-expected sales of Apple's iPhone 11 series for fourth-quarter 2019, and first-quarter...

Taiwan's chipmaking industry, led by TSMC, is gearing up to enter its next stage of growth as chip demand for 5G applications is set to start ramping up substantially next year, according to industry observers.

The semiconductor industry is undergoing a brutal downturn in 2019 - a drop so powerful that it can only be ended by an even more formidable force: the massive economic impact exerted by the deployment of 5G technology, according to IHS Markit.

Bolstered by stable shipment increases, DRAM prices are likely to rebound in the first quarter of 2020 at the earliest after staying flat or experiencing slight fluctuations in the preceding quarter, according to Nanya Technology president Pei-Ing Lee.

The global IC foundry industry output value will grow by a CAGR of 5.3% to reach US$75.42 billion in 2024, the final year of a five-year forecast period, driven by chip demand for 5G, AI and HPC applications, according to Digitimes Research.

Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.

With memory chip prices bottoming out, Adata Technology will likely post another sequential revenue growth in the fourth quarter, according to the memory module manufacturer.

Samsung Electronics has announced its earnings guidance for the third quarter of 2019, expecting consolidated sales to reach KRW62 trillion (US$51.94 billion) and consolidated operating profit to come to KRW7.7 trillion.

Macronix International, which specializes in mask ROM and flash memory, saw its third-quarter revenues surge nearly 60% sequentially to a record high of NT$11.91 billion (US$385.4 million).

Taiwan-based DRAM memory maker Nanya Technology saw its September revenues remain above NT$5 billion (US$161.6 million). Revenues for the third quarter of 2019 came to nearly NT$14.8 billion, rising 19% sequentially.

Macronix International has announced its secure flash memory is adopted for Renesas Electronics' embedded artificial intelligence solutions that use Arm-based processors for a range of AI-intensive applications.

Yangtze Memory Technology (YMTC) is aggressively improving its 64-layer 3D NAND flash memory production yield rate, gearing up to ship the chips for SSD applications in the first quarter of 2020, according to industry sources.

Total wafer shipments in 2019 are expected to decline 6% from last year's historic high, with growth resuming in 2020 and shipments reaching a new high in 2022, according to SEMI.

Kioxia Holdings, formerly Toshiba Memory Holdings, announced on October 1 that it is officially operating under its new corporate identity effective immediately.

Worldwide sales of semiconductors posted a year-over-year decline for the eighth consecutive month in August 2019.

NAND and NOR flash demand for TWS devices, gaming consoles and smartphones has been rising along with the approaching of traditional shopping seasons, providing significant growth momentum for fourth-quarter revenues at backend houses ChipMOS Technologies and Orient Semiconductor Electronics (OSE),...

With suppliers cutting back production and end-market demand picking up on seasonality, NAND flash contract prices have stopped falling in the third quarter and will rise 10% in the fourth quarter, according to industry sources.

Contract prices for DRAM held flat in August 2019, with prices for 8GB PC DRAM modules averaging US$25.50, according to DRAMeXchange.

NAND flash storage solutions will see much stronger demand in 2020 than 2019 driven by the commercialization of 5G networks and devices, according to Wallace Kou, president and CEO of Taiwan-based Silicon Motion Technology, which supplies NAND flash controllers for SSDs.

Macronix International has obtained 19nm SLC NAND chip orders for set-top boxes (STB) with shipments already kicking off, according to company chairman Miin Wu.

Toshiba Memory has announced the launch of a new family of SLC NAND flash memory products for embedded applications. Compatible with the widely-used serial peripheral interface (SPI), Toshiba Memory's second-generation serial interface NAND can be used in a wide range of consumer and industrial applications...