IC manufacturing
  • Intel started placing equipment and materials orders for EUV fabrication processes
    Intel in May unveiled plans to launch its 7nm products in 2021, and it is now stepping up efforts towards achieving that goal. It has started placing equipment and materials orders for EUV fabrication processes since August. Meanwhile,...
  • Semiconductor firm executives seeking government assistance
    Several leaders from semiconductor firms and organizations have paid a visit to Taiwan's president Tsai Ing-wen, asking the government to tackle the two biggest issues facing the country's IC industry: a lack of talent and a lack of basic research.
  • ASE plans to set up 15 lights-out fabs by the end of 2020
    Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end packaging operations, according to CM Chen, senior director of its automation and information engineering division.
  • Billings among North American manufacturers of semiconductor production equipment dropped
    Billings among North American manufacturers of semiconductor production equipment dropped both sequentially and on year in August 2019, but stayed above US$2 billion, according to SEMI.
  • CHPT president Scott Huang
    Wafer test solution provider Chunghwa Precision Test Tech (CHPT) has announced the development of over-the-air (OTA) test solutions for mmWave 5G devices, including mmWave antenna-in-package (AiP) modules, and is showcasing the newly-developed OTA test solutions at the ongoing Semicon Taiwan 2019.
  • Semiconductor merger and acquisition activity strengthened in the first eight months of 2019
    After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019, according to IC Insights.
  • Intel, Samsung and TSMC gearing up for EUV process manufacturing
    Intel has started placing equipment and materials orders for EUV fabrication processes since August, and is stepping up its pace of orders, according to industry sources.
  • iST refutes PSI accusation
    Taiwan-based Integrated Service Technology (iST) has maintained it has injected a lot of manpower and resources into in-house development of technologies while sticking to its established policy of respecting and safeguarding intellectual property rights.
  • ASE Technology Holding COO Tien Wu
    The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and memory chips but will also extend to domains beyond those not currently covered by Moore's Law, according to Tien Wu,...
  • TSMC chairman Mark Liu believes Moore's Law will continue to drive semiconductor growth in decades
    Some may think Moore's Law is reaching its limits, but for TSMC, it is still very much alive. The world's number one pure-play foundry is already conducting 3nm process R&D. TSMC chairman Mark Liu believes Moore's Law will continue...
  • Foxconn pushing into the semiconductor industry
    The Foxconn Group's development direction in the semiconductor industry will primarily focus on vertical integration, aiming to become a solution provider and devoting its investments mainly to light-asset businesses such as IC design, according to Bob Chen, vice president of the company's Semiconductor...
  • Innolux has teamed up with ITRI to develop FOPLP technology
    Innolux has teamed up with Taiwan's government-sponsored Industrial Technology Research Institute (ITRI) to develop fan-out panel-level packaging (FOPLP) technology, which will be ready for volume production in three years, according to CK Wei, an associate vice president of technology development...
  • TSMC has already kicked off 3nm process R&D
    TSMC has already kicked off 3nm process R&D, according to Philip Wong, VP of corporate research at the pure-play foundry. And with the evolution of Moore's Law, the company could make 2nm or even 1nm node manufacturing possible, said Wong.
  • China semiconductor firms are keenly luring talent away from chipmakers in Taiwan and South Korea
    China-based semiconductor firms are keenly luring talent away from chipmakers in Taiwan and South Korea by offering much higher pays, seeking to shorten time for technology development and narrow technological gaps with leading players, according to CY Lu, president of Taiwan-based memory chipmaker...
  • Semicon Taiwan 2019 features speakers including TSMC chairman Mark Liu
    Moore's Law will continue to drive semiconductor industry growth in decades to come, but Taiwan's IC sector is in need of sufficient engineers to support its development, according to TSMC chairman Mark Liu.
  • PSI has filed a lawsuit with the Taiwan IP court against Integrated Service Technology
    Wafer reclaim and thinning specialist Phoenix Silicon International (PSI) has filed a lawsuit with the Taiwan IP court against Integrated Service Technology (iST) accusing it of infringing its patent concerning wafer thinning process technology.
  • Semicon Taiwan 2019 opens
    Semicon Taiwan 2019 opens today, focusing on cutting-edge technologies, including those concerning 5G and AI, with its forums to feature heavyweight speakers from TSMC, ASE and others.
  • PTI has obtained orders for HPC solutions from China- and Taiwan-based fabless firms
    Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking applications from China- and Taiwan-based fabless firms, according to sources familiar with the matter.
  • Advantest is presenting its latest solutions for 5G during the Semicon Taiwan 2019
    Semiconductor test equipment supplier Advantest is presenting its latest solutions for 5G, next-generation memory, automotive and power device applications during the Semicon Taiwan 2019 that kicks off today.
  • The lead time for production of 7nm chips at TSMC has extended to nearly six months
    TSMC's clients reportedly have been eager to secure the foundry's 7nm production ccapacity, as strong demand from the smartphone and for the advanced node has resulted in tight supply with lead time extending. TSMC is expected to set...
  • Semiconductor market to rebound in 2020
    The global semiconductor market sales are forecast to increase 5-7% in 2020 following a decline this year, according to SEMI.
  • ASE will have its fan-out packaging technology ready in 2020
    Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP) modules and RF (radio frequency) front-end modules (FEM) for use in 5G devices, according to industry sources.
  • Win Semiconductors president Kyle Chen
    GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor foundry demand for 5G applications, according to company president Kyle Chen.
  • Corning to showcase an expanded range of precision glass substrates at Semicon Taiwan
    Corning has disclosed it will showcase an expanded range of precision glass substrates and supporting technologies for the semiconductor and consumer electronics industries at Semicon Taiwan.
  • 5G smartphone market to boom in 2020
    The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand, according to industry sources.

Taiwan handsets – 2Q 2019

Taiwan LCD monitors – 2Q 2019

Taiwan small- to mid-size LCD panels – 2Q 2019

Taiwan semiconductor foundry sector, 2Q19

Global AIO PC shipment forecast and industry analysis, 2019

Global AP demand forecast, 2017-2022

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