Realtime news
IC manufacturing
  • Cree and STMicroelectronics expand silicon carbide wafer supply agreement
    Cree and STMicroelectronics have announced the expansion and extension of an existing multi-year, long-term silicon carbide wafer supply agreement to more than US$500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree's advanced 150mm silicon carbide...
  • Taiwan received export orders worth US$47.28 billion in October 2019
    Taiwan received export orders worth US$47.28 billion in October 2019, increasing 3.9% sequentially but decreasing 3.5% on year, according to the Ministry of Economic Affairs (MOEA).
  • Jih Lin expects its revenues to resume growth in 2020
    Taiwan-based leadframe maker Jih Lin Technology expects its revenues to resume growth in 2020 on renewed demand for diverse leadframes from international IDMs for packaging automotive power devices such as MOSFET, IGBT, and WBG semiconductors including SiC and GaN components and for processing logic...
  • Taiwan's manufacturing sector has seen three consecutive quarters of on-year declines in production
    Production of Taiwan's manufacturing industry totaled NT$3.37 trillion in the third quarter of 2019, down 7.01% on year, making the third consecutive quarter of on-year declines due mainly to the US-China trade tensions, according to figures from Taiwan's Ministry of Economic Affairs (MOEA).
  • Powertech Technology chairman DK Tsai
    FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that can achieve IC scaling without adopting costly advanced fabrication processes, according to DK Tsai, chairman of Taiwan-based...
  • Semiconductor equipment makers see rising demand
    The three-month average of worldwide billings of North American equipment manufacturers climbed to a 14-month high of US$2.11 billion in October 2019, according to SEMI.
  • All Ring vice president CT Lee
    Taiwan-based backend equipment supplier All Ring Tech is optimistic about its business prospect for 2020 as it has tapped into the supply chains of Taiwan's leading wafer foundry and backend service firms as well as a handset vendor in the US, ready to cash in on growing demand for advanced IC packaging...
  • Intel will be the biggest semiconductor vendor in 2019
    Intel is expected to rank as the largest semiconductor supplier and have sales that are 26% larger than Samsung in 2019, according to IC Insights.
  • The memory sector expects 5G commercialization to drive demand in 2020
    Memory module manufacturers and backend service providers have seen end-market demand pick up recently, and are gearing up to meet 5G-driven demand with their sufficient supplies next year, according to industry sources.
  • UIS has reported net profit surged 44.3% from a year earlier
    Taiwan-based United Information Systems (UIS) has reported net profit surged 44.3% from a year earlier to NT$2.03 billion (US$66.7 million) in the first three quarters of 2019. EPS for the nine-month period came to NT$10.67.
  • Applied Materials has disclosed impressive results for its fourth quarter
    Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Group, has seen its monthly revenues return to an on-year growth track with the company's sales outlook turning more optimistic.
  • Hestia Power CEO Lee Chwan-ying
    SiC MOSFETs sees fast development and growing demand due to needs for high-voltage and high-power operating environment, but it is quite impossible for them to completely replace Si IGBTs (insulated gate bipolar transistors), according to Lee Chwan-ying, CEO of Hestia Power.
  • TSMC and UMC both plan to expand production capacities at their 12-inch wafer fabs in China
    TSMC has committed to building its most advanced fabs in Taiwan, but that doesn't mean that it will stop expanding production capacity elsewhere, particularly China, which is home to some of its biggest clients. Both TSMC and UMC have plans to increase their 12-inch...
  • ShunSin to ramp up capex in 2020
    ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic modules as well as SiP service for 5G mobile communication modules, according to company chairman Frank Hsu.
  • VIA has announced that Formosa Sumco has adopted its AI technologies
    VIA has announced that Formosa Sumco Technology (FST) has adopted its AI technologies to improve process management and production of high quality silicon wafers. By integrating image recognition and intelligent learning algorithms, FST is confident of substantially enhancing defect detection, and...
  • Tong Hsing president Heinz Ru
    Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on robust expansion in CIS packaging business, according to company president Heinz Ru.
  • Foundries to expand 12-inch fab capacity in China
    TSMC and UMC both plan to expand production capacities at their 12-inch wafer fabs in China to satisfy growing demand from local chipmakers.
  • TSMC, UMC to give driver IC designers more capacity support
    While top chip vendors have been keen on securing support from TSMC's cutting edge 7nm and 5nm manufacturing nodes, demand for the foundry house's other processes have also been strong. Now TSMC and its fellow competitor UMC are both set to allocate more of their 12-inch fab capacity to making driver...
  • PSMC has seen improved profitability
    Powerchip Semiconductor Manufacturing (PSMC), a foundry subsidiary of Powerchip Technology, has seen its order visibility improve and managed to return to monthly profits in the second half of 2019.
  • Foxconn Technology Group will step up transforming into a provider of technology services
    Foxconn Technology Group will step up transforming into a provider of technology services by deepening deployments in electric vehicle, smart heath care and robot industries while also strengthening development of core technologies including AI, semiconductor and 5G/6G mobile communications, according...
  • Worldwide silicon wafer area shipments fell for the fourth consecutive quarter
    Worldwide silicon wafer area shipments fell for the fourth consecutive quarter in the third quarter of 2019, according to SEMI.
  • ShunSin sees 3Q19 profits hit 13-quarter high
    ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, has reported net profit shot up 115.7% sequentially to a 13-quarter high of NT$268 million (US$8.78 million) in the third quarter of 2019, with EPS for the quarter reaching NT$2.60.
  • TSMC to build advanced packaging fab
    TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in 2020 as scheduled, which is expected to benefit the semiconductor equipment supply chain, according to industry sources...
  • SMIC has started volume production for 14nm FinFET
    China's Semiconductor Manufacturing International (SMIC) has kicked off volume production of 14nm FinFET chips, and plans to move a newer 12nm FinFET process to risk production by the end of 2019, according to sources familiar with the matter.
  • Demand for 8K TVs is expected to pick up in 2020
    TSMC and UMC are set to allocate more of their available 12-inch fab capacities for the fabrication of display driver ICs in 2020 to satisfy growing demand for applications such as 8K TVs and 5G smartphones, according to industry sources.

China smartphone market and industry – 3Q 2019

Taiwan notebooks – 3Q 2019

China smartphone AP shipments – 3Q 2019

Global LCD panel shipment forecast, 2020 and beyond

Global mobile device shipment forecasts, 2020 and beyond: Smartphones, notebooks and tablets

Taiwan semiconductor foundry sector, 2Q19

© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.