Intel in May unveiled plans to launch its 7nm products in 2021, and it is now stepping up efforts towards achieving that goal. It has started placing equipment and materials orders for EUV fabrication processes since August. Meanwhile,...

Several leaders from semiconductor firms and organizations have paid a visit to Taiwan's president Tsai Ing-wen, asking the government to tackle the two biggest issues facing the country's IC industry: a lack of talent and a lack of basic research.

Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end packaging operations, according to CM Chen, senior director of its automation and information engineering division.

Billings among North American manufacturers of semiconductor production equipment dropped both sequentially and on year in August 2019, but stayed above US$2 billion, according to SEMI.

Wafer test solution provider Chunghwa Precision Test Tech (CHPT) has announced the development of over-the-air (OTA) test solutions for mmWave 5G devices, including mmWave antenna-in-package (AiP) modules, and is showcasing the newly-developed OTA test solutions at the ongoing Semicon Taiwan 2019.

After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019, according to IC Insights.

Intel has started placing equipment and materials orders for EUV fabrication processes since August, and is stepping up its pace of orders, according to industry sources.

Taiwan-based Integrated Service Technology (iST) has maintained it has injected a lot of manpower and resources into in-house development of technologies while sticking to its established policy of respecting and safeguarding intellectual property rights.

The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and memory chips but will also extend to domains beyond those not currently covered by Moore's Law, according to Tien Wu,...

Some may think Moore's Law is reaching its limits, but for TSMC, it is still very much alive. The world's number one pure-play foundry is already conducting 3nm process R&D. TSMC chairman Mark Liu believes Moore's Law will continue...

The Foxconn Group's development direction in the semiconductor industry will primarily focus on vertical integration, aiming to become a solution provider and devoting its investments mainly to light-asset businesses such as IC design, according to Bob Chen, vice president of the company's Semiconductor...

Innolux has teamed up with Taiwan's government-sponsored Industrial Technology Research Institute (ITRI) to develop fan-out panel-level packaging (FOPLP) technology, which will be ready for volume production in three years, according to CK Wei, an associate vice president of technology development...

TSMC has already kicked off 3nm process R&D, according to Philip Wong, VP of corporate research at the pure-play foundry. And with the evolution of Moore's Law, the company could make 2nm or even 1nm node manufacturing possible, said Wong.

China-based semiconductor firms are keenly luring talent away from chipmakers in Taiwan and South Korea by offering much higher pays, seeking to shorten time for technology development and narrow technological gaps with leading players, according to CY Lu, president of Taiwan-based memory chipmaker...

Moore's Law will continue to drive semiconductor industry growth in decades to come, but Taiwan's IC sector is in need of sufficient engineers to support its development, according to TSMC chairman Mark Liu.

Wafer reclaim and thinning specialist Phoenix Silicon International (PSI) has filed a lawsuit with the Taiwan IP court against Integrated Service Technology (iST) accusing it of infringing its patent concerning wafer thinning process technology.

Semicon Taiwan 2019 opens today, focusing on cutting-edge technologies, including those concerning 5G and AI, with its forums to feature heavyweight speakers from TSMC, ASE and others.

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking applications from China- and Taiwan-based fabless firms, according to sources familiar with the matter.

Semiconductor test equipment supplier Advantest is presenting its latest solutions for 5G, next-generation memory, automotive and power device applications during the Semicon Taiwan 2019 that kicks off today.

TSMC's clients reportedly have been eager to secure the foundry's 7nm production ccapacity, as strong demand from the smartphone and for the advanced node has resulted in tight supply with lead time extending. TSMC is expected to set...

The global semiconductor market sales are forecast to increase 5-7% in 2020 following a decline this year, according to SEMI.

Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP) modules and RF (radio frequency) front-end modules (FEM) for use in 5G devices, according to industry sources.

GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor foundry demand for 5G applications, according to company president Kyle Chen.

Corning has disclosed it will showcase an expanded range of precision glass substrates and supporting technologies for the semiconductor and consumer electronics industries at Semicon Taiwan.

The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand, according to industry sources.