Taiwan's National Science and Technology Council (NSTC) is accelerating efforts to advance chip manufacturing beyond the 1nm node, targeting key breakthroughs in next-generation materials,...

Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...

Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...

Samsung Electronics is aiming to launch its 1nm semiconductor process by 2030 as part of a direct technological competition with rival TSMC. The move seeks to secure leadership in...

Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.

TSMC has not placed orders for high-numerical aperture (High-NA) extreme ultraviolet (EUV) tools and is unlikely to use the technology in 2nm and 1.4nm (A14) process manufacturing,...

Taiwan's Hsinchu Science Park (HSP) will complete the acquisition of land in Longtan, Taoyuan, in the northern part of Taiwan, for TSMC's new 1nm wafer fab within two years, according...