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Thursday 28 May 2026
Solidigm appoints co-CEOs to split operations and growth responsibilities
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities...
Thursday 28 May 2026
SK Hynix turns Big Tech's memory scramble into tougher supply terms
SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give...
Thursday 28 May 2026
Wonik IPS secures Visionox XR display etcher order for Kunshan OLED line
Chinese display maker Visionox is moving ahead with a major extended reality display production project in Kunshan, strengthening China's push into high-pixel-density OLED panels for...
Thursday 28 May 2026
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...
Thursday 28 May 2026
QRT eyes aerospace, defense growth with portable chip radiation tester

South Korean semiconductor testing company QRT is expanding its equipment business with a portable chip radiation reliability testing...

Wednesday 27 May 2026
Facing Chinese rivals, Hyundai accelerates robotaxi plans and cost cuts
As Chinese automakers intensify a global price war, South Korea's Hyundai Motor Group is responding on two fronts at once: accelerating its push into autonomous mobility while pressing...
Wednesday 27 May 2026
Samsung wage deal pushed through by chip workers, widening bonus divide
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide...
Wednesday 27 May 2026
SK Hynix seeks to embed cooling inside HBM to beat the heat
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
Wednesday 27 May 2026
TSMC and Micron's fabs expanding; how do Samsung and SK Hynix's bonus systems come into play?
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

Tuesday 26 May 2026
Advantech deepens partnerships in South Korea to push hybrid edge for manufacturing AI
Advantech has deepened partnerships with Nvidia, AMD, and South Korean startups to push a hybrid edge architecture for manufacturing AI, promising faster on-site inference and continuous...
Tuesday 26 May 2026
Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon...

Monday 25 May 2026
Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix
Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply...
Monday 25 May 2026
Weekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment
Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:
Monday 25 May 2026
Samsung Electro-Mechanics secures large silicon capacitor supply contract
Samsung Electro-Mechanics (Semco)'s KRW1.5 trillion (approx. US$990 million) silicon capacitor supply contract with a major global company could reshape component supply for AI servers,...