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NEWS TAGGED SOUTH KOREA
Tuesday 1 September 2026
Safety rewired: AI, robots on the front line at K-Safety Expo 2026
Hard hats and fire extinguishers will certainly have their place at K-Safety Expo 2026, but visitors arriving at BEXCO in Busan from September 2–4 may find that the modern safety...
Tuesday 1 September 2026
Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand
Samsung Electro-Mechanics disclosed on September 1 that it has concluded a single sales and supply contract worth KRW1.072 trillion (about US$778.9 million) for MLCCs, equal to 9.5%...
Tuesday 1 September 2026
K-Safety Expo 2026 to open in Busan, spotlighting AI-driven safety technologies
K-Safety Expo 2026, one of South Korea's leading exhibitions dedicated to the safety industry, will open September 2 at BEXCO in Busan, bringing together companies, government agencies,...
Tuesday 1 September 2026
XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...
Tuesday 1 September 2026
Samsung locks 70% of memory output as HBM spot prices soar
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
Tuesday 1 September 2026
South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain
A South Korean-Indian joint venture has completed a semiconductor materials plant in South Korea, aiming to strengthen regional supply chains for photoresist materials and reduce reliance...
Tuesday 1 September 2026
SK Hynix explores Intel as second source for HBM base dies
SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
Monday 31 August 2026
Update: SK Hynix breaks silence on Japan expansion rumors
To capture surging global demand for memory chips driven by artificial intelligence (AI), SK Hynix is actively exploring manufacturing and investment options in Japan.
Monday 31 August 2026
The 72.4% dominance: China's battery lead is now a chemistry problem for South Korea
The global battery space has long been characterized by China's overwhelming dominance, leaving other established players subdued and struggling to establish a foothold in the industry...
Monday 31 August 2026
South Korea risks 'HBM 2.0' trap in emerging CPO market
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Monday 31 August 2026
Chinese robotaxis head for Seoul as Pony.ai and FutureLink plan a 200-vehicle fleet
A Chinese autonomous driving vendor is set to take a commercial position in a market whose own robotaxi industry has yet to clear the hurdle to commercialization. Pony.ai and South...
Saturday 29 August 2026
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...
Friday 28 August 2026
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
Friday 28 August 2026
Samsung eyes zHBM products from 2029 as heat remains key hurdle
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...