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Friday 16 October 2026
FICG eyes 4x optical communications capacity by 2027
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity...
Friday 16 October 2026
DIGITIMES Insights: China's automakers pursue three humanoid robot strategies as EV supply chains offer 60% overlap
Chinese automakers are accelerating their expansion into humanoid robotics, leveraging artificial intelligence (AI) technologies, electric drive systems, and supply chain resources...
Friday 16 October 2026
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Friday 16 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
AI-driven NAND demand is entering a supercycle, positioning Yangtze Memory Technologies Co. (YMTC) as the fastest-growing memory supplier. According to Counterpoint Technology Market...
Friday 16 October 2026
China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains
China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand...
Friday 16 October 2026
CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
Friday 16 October 2026
Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
Friday 16 October 2026
AI investment risks rise as China models gain ground
As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion...
Friday 16 October 2026
Hesai moves beyond lidar as Kosmo targets physical AI's data bottleneck
As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment — particularly the extreme...
Friday 16 October 2026
China's 90%-localized EUV light source debuts at 15W, exposing the gap to commercial chipmaking
Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization...
Friday 16 October 2026
Manus returns to China's AI agent race with US$500 million reset
As Manus, one of China's more distinctive AI startups, became entangled in the high-profile unwinding of its acquisition by Meta, the startup's failed attempt to capture opportunities...
Friday 16 October 2026
China's YMTC targets 9,600 MT/s with 4F² DRAM design
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Thursday 15 October 2026
SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Thursday 15 October 2026
China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
Thursday 15 October 2026
Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...