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    Apple's foldable arrives late to a supply chain already moving on
    16min ago
    China moves to rein in booming energy storage and lithium battery overcapacity
    Sep 10, 18:52
    Taiwan's govt delegation visit Europe, strenthening advanced packaging and SiPh ties
    Sep 10, 18:51
    How Huawei, Xiaomi and Apple diverge in foldable phones
    Sep 10, 18:51
    Global drone supply chains accelerate decoupling from China, Taiwan sees an opening
    Sep 10, 18:51
    NEWS TAGGED SRAM
    Thursday 10 September 2026
    From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation

    Introduction

    Sunday 6 September 2026
    Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
    In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Friday 7 August 2026
    NEO seeks partner by end-2026 for fivefold-density X-SRAM

    AI memory startup NEO Semiconductor has unveiled X-SRAM, a new architecture designed to address the difficulty of scaling conventional...

    Friday 26 June 2026
    Qualcomm HBC takes aim at HBM costs in AI data centers

    Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls...

    Friday 26 June 2026
    IBM breaks sub-1nm barrier with 3D nanostack transistor platform
    On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
    Friday 5 June 2026
    South Korea's only SRAM-CIM IP firm Articron targets edge AI
    South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...
    Tuesday 10 March 2026
    Groq reportedly urges Samsung to expand wafer production as AI chip demand surges
    Groq has reportedly requested Samsung Electronics' foundry division to increase wafer production for its inference AI chips, reflecting the booming market demand. Industry sources...
    Thursday 1 January 2026
    Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways
    The biggest recent news in AI chip development is Nvidia's non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion to acquire Groq's technology license...
    Monday 29 December 2025
    Nvidia's Groq acquisition reshapes AI memory landscape
    Nvidia has reportedly invested US$20 billion to acquire technology licenses from Groq, marking its largest investment to date. The move is drawing significant attention in South Korea...
    Thursday 6 November 2025
    AMICCOM release 2.4GHz Wireless Voice SOC

    AMICCOM released a new generation of 2.4GHz wireless voice SOC in October 2025, named A8103. This SoC, available in a 6x6 QFN package, is targeted at wireless voice applications...

    Tuesday 19 August 2025
    Huawei data center chip stuck on outdated 5nm node, teardown reveals
    A recent teardown of Huawei's new Kunpeng 930 data center processor suggests the chip may still rely on TSMC's five-year-old 5nm manufacturing node. The finding underscores how US...
    Thursday 28 September 2023
    TSMC talks about new 3Dblox 2.0, 3DFabric achievements
    At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
    Friday 3 March 2023
    UMC adds new variant to 28nm eHV designed for next-gen displays
    United Microelectronics (UMC) has introduced 28eHV+, the latest advancement in its 28nm embedded high voltage (eHV) technology. The process node is designed for driver ICs used in...
    Tuesday 13 September 2022
    Avalanche and UMC announce 22nm production of high-density MRAM-based devices for aerospace applications
    US-based Avalanche Technology, a developer of next-generation MRAM technology, and Taiwan-based foundry house United Microelectronics Corporation (UMC), have jointly announced the...
    1/3 pages
    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Semicon_TW