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Friday 17 June 2022
TSMC debuts N2 process utilizing nanosheet transistors
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Thursday 12 May 2022
Winbond to enjoy revenue growth in 2Q22
Despite recent falls in memory chip prices, Winbond Electronics is poised to generate sequential revenue growth in the second quarter of 2022, according to market sources.
Tuesday 8 February 2022
Faraday monthly revenue tops NT$1 billion
Taiwan-based Faraday Technology, a fabless ASIC service and silicon IP provider partnering mainly with United Microelectronics (UMC), saw its monthly revenue exceed NT$1 billion (US$35.9...
Thursday 16 September 2021
Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Tuesday 15 June 2021
Semiconductor revenue increases slightly in 1Q21
Semiconductor revenue in the first quarter of 2021 grew from the previous quarter, marking just the third time that has happened since research firm Omdia began tracking quarterly...
Thursday 20 May 2021
Memory IC sales poised to hit record in 2022, says IC Insights
Fueled by economic recovery and the transition to a digital economy, memory IC sales are forecast to top US$180 billion in 2022, exceeding the previous record high set in 2018, according...
Friday 27 November 2020
Faraday supplies 28eHV memory compilers for mobile OLED driver IC
ASIC design service and IP provider Faraday Technology has announced its memory compilers based on UMC's 28nm embedded High Voltage (eHV) process technology have been subsequently...
Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Friday 10 July 2020
Imec, GF claim breakthrough in AI chip
Imec and Globalfoundries (GF) have jointly announced a hardware demonstration of a new artificial intelligence chip. Based on Imec's analog in memory computing (AiMC) architecture...
Tuesday 21 January 2020
eMemory NeoFuse IP verified for UMC 28nm HV process
Taiwan-based eMemory has announced the availability of NeoFuse IP qualified on United Microelectronics' (UMC) 28nm high-voltage (HV) process for OLED display applications, with key...
Thursday 26 September 2019
M31 develops IP solutions on multiple TSMC specialty processes
M31 Technology has announced its series of developments geared to optimize IP solutions for TSMC's specialty processes.
Monday 14 January 2019
Unigroup starts mass production of 3D NAND backend lines
Unimos Microelectronics, a re-invested memory backend service affiliate of China's Tsinghua Unigroup, has recently kicked off volume production at its 3D NAND memory chips packaging...
Tuesday 28 November 2017
Cypress achieves aerospace-grade QML certification for 65nm and 40nm SRAM devices at UMC
Cypress Semiconductor has claimed its 65nm and 40nm technology platforms are the industry's first to achieve Qualified Manufacturers List (QML) certification for their advance product...
Friday 3 November 2017
Gowin, TSMC team up for 28nm FPGA chips
China-based Gowin Semiconductor has announced the development of its first 28nm FPGA product, the GW3AT-100, fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).
Tuesday 12 September 2017
Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
Jun 30, 09:59
DataVan's smart solutions empower retail industry to meet new demand from new normal
Wednesday 29 June 2022
ADATA launches industrial-grade 31C series 112-Layer 3D NAND (BiCS5) solid state drives
Wednesday 29 June 2022
Digitalization as key for transformation to smart manufacturing: ZNT's detailed market approach to further support valued customers in Asia-Pacific region
Wednesday 29 June 2022
UMC climate goals validated by SBTi
TSMC sees major clients queue up for 3nm process capacity
GF, SMIC may bear the brunt of consumer chips demand downturn
TSMC to initiate about 6% price hike in 2023
Intel cutting Alder Lake CPU prices to attract order pull-ins from PC brands
AMD to launch new-gen desktop CPUs in mid-September
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
Servers with non-Intel CPUs to enjoy rising shipment shares over next two years, says DIGITIMES Research
AIO PC shipment decline to in 2Q22, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – May 2022
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