Fujifilm Electronic Materials is expanding its advanced semiconductor materials footprint in South Korea by increasing extreme ultraviolet (EUV) photoresist capacity in Pyeongtaek...
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science...
As the global foundry leader accelerates construction of advanced-process and advanced-packaging facilities in the US, semiconductor facility engineering integrator Chi Yi Hsin Technology...
Elon Musk is moving ahead with Terafab, as Tesla and SpaceX reportedly negotiate with about 10 South Korean semiconductor materials, components, and equipment suppliers. The discussions...
PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry...
Lam Research is grooming Indian companies to become its suppliers rather than relying only on its global vendor base, a senior executive said, as the US chip equipment maker deepens...
Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea, with Tesla and SpaceX approaching materials, components, and equipment suppliers...
Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million)...
The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...
