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Tuesday 22 September 2026
Acer debuts first Googlebook with 360-degree hinge
Acer has launched its first Googlebook, a new flagship notebook equipped with Gemini Intelligence that combines premium materials, strong performance, smart features, and seamless...
Tuesday 22 September 2026
Chinese AMOLED material suppliers set for revenue gains as Gen 8 fabs boost localization
Chinese AMOLED material suppliers are poised to gain market share as new 8G OLED fabs expand capacity in China. The shift could reshape supply chains for global display buyers, while...
Tuesday 22 September 2026
YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace

China's FD-SOI supply chain is taking shape through a new round of investment. Changcun Capital, the investment platform backed by YMTC,...

Tuesday 22 September 2026
EZconn eyes 2027 high-core fiber ramp as shortages persist

EZconn said global fiber and optical cable supplies remain tight as AI data center demand overtakes demand from traditional telecom...

Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
EV battery demand is going global, yet material supply remains overwhelmingly Chinese

For years, the global EV industry has been characterized by a persistent trend to diversify its manufacturing footprint beyond China...

Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Monday 21 September 2026
Tyntek optical communications MPD ramps quarterly, 2027 capacity triples
Tyntek is rapidly expanding into optical communications as AI data-center demand drives a surge in high-speed transmission needs, with shipments set to rise significantly from the...
Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Sunday 20 September 2026
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
PC component shortages are easing, Acer chairman and CEO Jason Chen said, with memory tight only at the high end of DDR5 and CPUs no longer in short supply. Suppliers across the bill...
Saturday 19 September 2026
Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27

Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...

Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Saturday 19 September 2026
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...