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Friday 11 September 2026
China's DRAM supply chain clears another materials hurdle
China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
Friday 11 September 2026
Global drone supply chain accelerates de-China shift, Taiwan wins

Foreign drone makers are increasingly turning to Taiwan as a hub for non-China drone supply chains, drawn by the island's component...

Friday 11 September 2026
AI server tracker: Taiwan's August filings say demand is still accelerating
The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies...
Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
Thursday 10 September 2026
Taiwan quantum leap expands scope to drug and finance
Taiwan's five-year National Quantum Team program is set to conclude in December 2026, and the government's second-stage quantum research initiative will begin in January 2027. The...
Thursday 10 September 2026
Gem Terminal rides China plug rule shift for 8.8% sales growth
Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements...
Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
Thursday 10 September 2026
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
Thursday 10 September 2026
STMicroelectronics ties AI data center carbon cuts to power design, not location
STMicroelectronics (ST) recently shared its perspective on balancing AI growth with sustainability during a press conference in Taiwan. The company emphasized that controlling carbon...
Thursday 10 September 2026
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Wednesday 9 September 2026
Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

Wednesday 9 September 2026
Indonesia bets on a full EV supply chain as BYD opens its Subang plant

Indonesia's industry minister said the country has the resources to build a complete domestic electric vehicle chain, speaking in Subang,...

Tuesday 8 September 2026
Analysis: Imec's EUV edge raises question over how far Taiwan should replicate research fab model
If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR)...
Tuesday 8 September 2026
Shining a Light on the Precision Behind AI and Data Infrastructure

Discussion around advances in AI will often focus on model performance, chip launches, and compute scale. In practice, however, progress increasingly depends on something...