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Thursday 27 August 2026
Doosan thins memory-package CCL insulation to 13µm
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...
Thursday 27 August 2026
Nvidia's inventory build shifts upstream as memory costs bite
Nvidia closed its second fiscal quarter with US$31.6 billion of inventory, but the more consequential change is what that inventory now consists of. Work in process and raw materials...
Thursday 27 August 2026
Tri-fold, rollable foldables intensify materials supply chain battle
Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
Thursday 27 August 2026
Apple, Huawei foldables to collide in September, lifting ultra-thin glass, hinge and cooling demand
Huawei and Apple are set to intensify competition in foldable smartphones in September, accelerating demand across a supply chain spanning foldable OLED panels, ultra-thin glass, hinges,...
Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
Wednesday 26 August 2026
Eternal Materials reports July revenue gain as advanced packaging demand strengthens
Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion...
Wednesday 26 August 2026
BOE, 3M expand materials partnership as foldable OLED competition intensifies
BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
Tuesday 25 August 2026
Nexperia China rebuilds 12-inch local supply chain after 330 days
Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...
Tuesday 25 August 2026
TSMC suppliers reportedly plan Taiwan plant for critical chipmaking tubing
Taiwan's semiconductor supply chain is moving to close a gap that turned costly during the industry's last major crunch: the plastic tubing that carries chemicals through chip fabs...
Tuesday 25 August 2026
Applied Materials executive says data centers set new AI competition standard

Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of...

Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
Monday 24 August 2026
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
Monday 24 August 2026
German auto industry hardens stance against Chinese competition
Germany's top auto industry lobby, the German Association of the Automotive Industry (VDA), is overhauling its strategy as it hardens its stance on China. The group has said China...
Monday 24 August 2026
Taiwan semiconductor materials hit golden opportunity
Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...