The Taiwan Semiconductor Industry Association (TSIA) expects its members' total output to exceed NT$9.1 trillion (US$279.5 billion) in 2026, a 40.9% year-over-year increase driven...
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific announced on October 28 that its board had approved a memorandum of understanding with global e-paper leader E Ink Holdings...
Elite Material Co. (EMC), a copper-clad laminate (CCL) maker, reported record third-quarter 2026 revenue of NT$60.88 billion (US$1.875 billion), driven by strong demand for high-end...
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
2026 will be a breakout year for Taiwan's economic growth, with GDP expanding at a double-digit rate—more than twice China's growth rate, according to a consensus among economic...
South Korean OLED material specialist SFC will continue supplying blue host materials to Samsung Display (SDC) for the OLED material stack used in Apple's upcoming MacBook Pro, according...
Taiwan directs too much public research and development (R&D) funding to its national research institutes, according to Chenming Hu, a former chief technology officer of Taiwan...
Corning's third-quarter results show optical networking becoming a larger driver of the materials maker's business as AI infrastructure expands. Stronger sales and profitability support...
AI is driving a steady upward revision in chip demand, but semiconductor equipment shortages are not the biggest obstacle to expanding AI chip production, according to industry sources...
US materials giant 3M recently entered into a strategic partnership with Taiwanese optical component manufacturer Genius Electronic Optical (GSEO), with plans to acquire a 4.7% stake...
Fujifilm Electronic Materials is expanding its advanced semiconductor materials footprint in South Korea by increasing extreme ultraviolet (EUV) photoresist capacity in Pyeongtaek...
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science...
