OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...

High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...

Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...

Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...

Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...

ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...

Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...

A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...

Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...

MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...

Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...