ASE Technology and VisEra Technologies are both being pinpointed as among the backend houses set to enjoy robust demand for optical in-display fingerprint sensors, according to industry...
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$1.237 billion for expanding capacity for advanced-node manufacturing,...
OmniVision Technologies has announced plans to buy the wafer-level lens production operations from VisEra Technologies, its joint venture with Taiwan Semiconductor Manufacturing Company...
VisEra Technologies, a Taiwan-based maker of CMOS image sensors and wafer-level optical lens modules spun off from Taiwan Semiconductor Manufacturing Company (TSMC), has obtained...
Taiwan Semiconductor Manufacturing Company (TSMC) on September 28 announced the appointment of Shang-Yi Chiang, a former TSMC vice president of R&D, as its senior VP of R&D...
VisEra Technologies, a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), has announced a new high-power LED packaging technology based on 8-inch silicon wafer, which...
Taiwan Semiconductor Manufacturing Company (TSMC) and two of its subsidiaries – packaging and testing house Xintec and color filer (CF) maker VisEra Technologies – are...