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NEWS TAGGED VISERA
Tuesday 24 December 2019
ASE, VisEra to enjoy robust demand for in-display fingerprint sensors
ASE Technology and VisEra Technologies are both being pinpointed as among the backend houses set to enjoy robust demand for optical in-display fingerprint sensors, according to industry...
Wednesday 14 August 2019
Wafer-level backend demand promising
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
Tuesday 16 January 2018
Xintec to see orders for 3D sensing from iPhone and Android camps
Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
Tuesday 11 August 2015
TSMC board approves US$1.2 billion for advanced technology capacity expansion
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$1.237 billion for expanding capacity for advanced-node manufacturing,...
Thursday 30 June 2011
OmniVision to buy wafer-level lens manufacturing unit from JV
OmniVision Technologies has announced plans to buy the wafer-level lens production operations from VisEra Technologies, its joint venture with Taiwan Semiconductor Manufacturing Company...
Wednesday 8 June 2011
TSMC subsidiary VisEra granted AEO customs clearance privileges
VisEra Technologies, a Taiwan-based maker of CMOS image sensors and wafer-level optical lens modules spun off from Taiwan Semiconductor Manufacturing Company (TSMC), has obtained...
Tuesday 29 September 2009
TSMC veteran resumes R&D helm
Taiwan Semiconductor Manufacturing Company (TSMC) on September 28 announced the appointment of Shang-Yi Chiang, a former TSMC vice president of R&D, as its senior VP of R&D...
Thursday 17 September 2009
VisEra announces new LED packaging technology
VisEra Technologies, a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), has announced a new high-power LED packaging technology based on 8-inch silicon wafer, which...
Tuesday 14 April 2009
TSMC and subsidiaries to benefit from launch of next-generation iPhone
Taiwan Semiconductor Manufacturing Company (TSMC) and two of its subsidiaries – packaging and testing house Xintec and color filer (CF) maker VisEra Technologies – are...