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Three Mirrowed In-House Testing Labs
South Korea to start testing 5G-V2X projects in 2Q23
NEWS TAGGED USI
Tuesday 14 December 2021
Taiwan supply chain braces for booming 3rd-gen semiconductor applications
Applications of third-generation semiconductors including SiC and GaN diodes, MOSFETs and related modules are set to take off in 2022, and Taiwan's semiconductor supply chain players...
Thursday 25 November 2021
GaN Systems, USI partner to accelerate GaN adoption in EVs
GaN Systems has announced a strategic partnership with Universal Scientific Industrial (USI), a subsidiary of ASE Technology, to co-develop GaN power modules for the electric vehicle...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Thursday 9 September 2021
USI starts production at new plant in Vietnam
Universal Scientific Industrial (USI) has started production at a new plant in Vietnam, with the facility to focus on manufacturing SiP (system in package) modules for wearables initially,...
Wednesday 4 August 2021
Taiwan backend houses bracing for robust China mature-node chips demand
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
Monday 12 July 2021
ASE Technology to score big in 3Q21 from serving heavyweights
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Friday 23 April 2021
ASE lands FC-AiP orders for new iPad Pro
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Friday 4 December 2020
USI completes acquisition of French EMS Asteelflash
Universal Scientific Industrial, an EMS subsidiary of ASE Technology, has successfully acquired 100% stake in Asteelflash Group from Financiere AFG (FAFG).
Thursday 15 October 2020
ASE provides SiP packaging for Apple-designed UWB chip
Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...
Thursday 15 October 2020
ASE to post slight revenue growth in 4Q20, says report
Backend house ASE Technology is expected to see its consolidated revenue consisting of sales generated by its core IC ATM (assembly, test and material) business and EMS subsidiary...
Thursday 17 September 2020
ASE Technology reportedly lands major SiP orders for new Apple Watch
ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) have reportedly grabbed major system-in-package (SiP) orders for the new Apple Watch Series 6 and Apple...
Tuesday 1 September 2020
USI obtains new SiP orders for Wi-Fi 6E modules
Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...
Tuesday 11 August 2020
ASE Technology in coopetition with Luxshare for new Apple Watch
As Apple may be keen on building a Chinese supply chain led by EMS provider Luxshare Precision Industry, Taiwan-based partners of the US vendor, such as ASE Technology, are quietly...
Monday 3 August 2020
ASE sees pick-up in orders from communication chip segment
ASE Technology Holding expects to generate sequential revenue growth through the fourth quarter of 2019, judging from a substantial pick-up in orders for communications chips.
May 11, 09:31
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Monday 18 April 2022
iCatch and Prophesee collaborate on development of AI vision processor natively compatible with Prophesee Event-based Metavision sensing technologies
The memory industry (1): The era of DRAM driving semiconductor manufacturing process improvement
MacBook Pro shipments seriously delayed by China lockdowns
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Vedanta looking for chip customers in advance
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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