News tagged TGV at DIGITIMES

NEWS TAGGED TGV

Thursday 10 September 2026

Spirox TGV inspection capable of scanning entire substrate in 20 minutes

As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...

Thursday 10 September 2026

Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Wednesday 9 September 2026

Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders

Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...

Wednesday 9 September 2026

LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

Wednesday 9 September 2026

Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Wednesday 9 September 2026

SDC, LGD target advanced glass packaging

As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...

Tuesday 8 September 2026

Taiwan panel capacity shifts push TV brands to stock up as LCD price declines slow

The global LCD TV panel market is gradually moving toward supply-demand balance as activity recovers across the supply chain, with price declines expected to ease in September. The...

Tuesday 8 September 2026

Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission

As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...

Tuesday 8 September 2026

Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO

AI demand is accelerating advanced packaging and high-speed optical interconnect development, pushing Taiwan display makers Innolux and AUO deeper into the semiconductor supply cha...

Saturday 29 August 2026

Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?

As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...

Thursday 27 August 2026

AI glass substrate race shifts toward reliability and mass production

The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...

Friday 21 August 2026

FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Tuesday 11 August 2026

MA-tek reports record July revenue on glass-substrate testing demand

Materials Analysis Technology, or MA-tek, said its first-half 2026 results reached record levels and July revenue set a monthly record for a fifth straight month, while demand grew...

Thursday 6 August 2026

FOPLP leads production as CoPoS advances glass packaging

AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...

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Sep 18, 14:29

SK hynix Launches 'SK hynix Ventures' in Silicon Valley

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