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    NEWS TAGGED TGV
    Friday 6 November 2026
    Nvidia reportedly buys glass substrate samples from Korea's JNTC
    South Korea's JNTC has joined Nvidia's purchasing supplier list and is supplying paid samples of through-glass via (TGV) substrates, including 2mm-thick glass cores, The Elec...
    Thursday 22 October 2026
    High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion
    As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...
    Tuesday 20 October 2026
    TPK targets 2028 TGV mass production with NT$6 billion investment
    TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...
    Friday 16 October 2026
    BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
    Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
    Tuesday 13 October 2026
    South Korea's YMT targets fivefold rise in glass-substrate plating capacity
    South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
    Tuesday 6 October 2026
    China's glass substrate ramp-up outpaces South Korea with WG Tech targeting 1M sqm
    China's WG Tech has reportedly begun the second phase of investment in its through-glass via (TGV) glass substrate production line, with total future capacity projected to reach 1...
    Thursday 1 October 2026
    Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
    As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...
    Wednesday 30 September 2026
    AI boom draws display makers into semiconductors with glass core substrates and Micro LED
    AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These...
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Wednesday 9 September 2026
    Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
    Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
    Wednesday 9 September 2026
    LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

    LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

    Wednesday 9 September 2026
    Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

    WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

    Wednesday 9 September 2026
    SDC, LGD target advanced glass packaging
    As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
    Tuesday 8 September 2026
    Taiwan panel capacity shifts push TV brands to stock up as LCD price declines slow
    The global LCD TV panel market is gradually moving toward supply-demand balance as activity recovers across the supply chain, with price declines expected to ease in September. The...
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    Thursday 29 October 2026
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