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    Shanghai HiSilicon expands DDI push across all display sizes
    4h 13min ago
    Applied Materials CEO outlines a trio of innovation priorities for AI chip race
    4h 13min ago
    China’s domestic AI chips target 3D packaging, optical interconnects and software ecosystems
    4h 13min ago
    AI accelerator growth shifts toward value, not volume
    4h 13min ago
    Analysis: China’s EV exports shift from volume to value as rebates shrink
    4h 14min ago
    NEWS TAGGED TGV
    Tuesday 13 October 2026
    South Korea's YMT targets fivefold rise in glass-substrate plating capacity
    South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
    Tuesday 6 October 2026
    China's glass substrate ramp-up outpaces South Korea with WG Tech targeting 1M sqm
    China's WG Tech has reportedly begun the second phase of investment in its through-glass via (TGV) glass substrate production line, with total future capacity projected to reach 1...
    Thursday 1 October 2026
    Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
    As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...
    Wednesday 30 September 2026
    AI boom draws display makers into semiconductors with glass core substrates and Micro LED
    AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These...
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Wednesday 9 September 2026
    Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
    Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
    Wednesday 9 September 2026
    LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

    LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

    Wednesday 9 September 2026
    Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

    WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

    Wednesday 9 September 2026
    SDC, LGD target advanced glass packaging
    As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
    Tuesday 8 September 2026
    Taiwan panel capacity shifts push TV brands to stock up as LCD price declines slow
    The global LCD TV panel market is gradually moving toward supply-demand balance as activity recovers across the supply chain, with price declines expected to ease in September. The...
    Tuesday 8 September 2026
    Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
    As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
    Tuesday 8 September 2026
    Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO
    AI demand is accelerating advanced packaging and high-speed optical interconnect development, pushing Taiwan display makers Innolux and AUO deeper into the semiconductor supply cha...
    Saturday 29 August 2026
    Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
    As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
    Thursday 27 August 2026
    AI glass substrate race shifts toward reliability and mass production
    The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
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    Research_DB
    BIZ FOCUS
    Oct 13, 16:08
    Chenbro unveils AI rack-level solutions at 2026 OCP Summit
    Thursday 8 October 2026
    Dietary Therapy in Traditional Chinese Medicine and Modern Nutritional Science
    Thursday 8 October 2026
    Edge-Cloud Computing Blocks Scams Before the Click
    Thursday 8 October 2026
    Nuvoton, AMI Empower AI Factories Via Arbel NPCM8XX OpenBMC