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Thursday 11 September 2025
Beijing's barriers fail to deter China's SiC players from risky push into 8-inch wafer race
China's SiC industry, once viewed as a critical front in global tech rivalry, has been transformed over the past two years. Breakthroughs in domestic SiC materials and mass production...
Wednesday 10 September 2025
Everlight targets high-performance markets as third-gen semiconductor sales set to double in 2025
Everlight Electronics is ramping up its push into third-generation semiconductors, highlighting new research and market strategies in SiC and GaN at SEMICON 2025. The company emphasized...
Tuesday 9 September 2025
China's JFSemi cracks 12-inch SiC wafer barrier with homegrown laser technology

The global silicon carbide (SiC) market remains centered on 6-inch wafers, with only a few Chinese players moving into 8-inch lines....

Friday 5 September 2025
China's NEV market sees rising adoption of hybrid SiC tech amid price war
China's new energy vehicle (NEV) sector continues to face intense price competition, with domestic manufacturers pushing vehicle prices to unprecedented lows. This aggressive pricing...
Thursday 4 September 2025
China's SiC substrate industry faces setback, seeks strategic pivot
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Thursday 4 September 2025
Tech Forum 2025: China's SiC surge leaves Wolfspeed struggling beyond bankruptcy
Wolfspeed's recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling...
Wednesday 3 September 2025
GCCS poised for growth in China+1 SiC substrate market
Taiwan's GCCS has become a preferred third-party supplier for global semiconductor and EV giants amid China's SiC substrate price wars. Chairman Chung-Chieh Chang expects long-term...
Wednesday 3 September 2025
Taiwan targets new growth in AI chip packaging with silicon carbide substrates
As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...
Wednesday 27 August 2025
Toshiba and SICC collaborate on SiC technology; alliance with Rohm faces bottlenecks
Toshiba's semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China's silicon carbide (SiC) wafer manufacturer...
Saturday 23 August 2025
Japan's last semiconductor stronghold slips under Chinese pressure

Japan's power semiconductor sector, once a global stronghold, is losing ground to fast-rising Chinese rivals as stalled consolidation...

Thursday 14 August 2025
China's leading SiC epitaxy plants see quarterly order surge, signaling market bottom
China's SiC industry faces oversupply as 6-inch substrate prices plunge, prompting a strategic pivot to 8-inch wafers
Monday 11 August 2025
Toshiba's Japan Semiconductor to boost foundry output 50% by 2029, eyes SiC and GaN chips
Japan Semiconductor, a chipmaker under Toshiba, is seeking to significantly expand its contract chip manufacturing operations, aiming to lift output by 50% from 2024 levels by the...
Thursday 7 August 2025
Rohm's operating profit plunges 80% in 1QFY25; new SiC MOSFET launched early to counter China competition
Japanese manufacturer Rohm experienced a significant drop in operating profit during the first quarter of fiscal year 2025. However, the company has decided to accelerate the launch...
Friday 25 July 2025
Wolfspeed collapse triggers Renesas's first interim loss in 5 years
Renesas Electronics posted a net loss of JPY175.3 billion (approx. US$1.19 billion) in the first half of 2025, swinging from a JPY139.5 billion profit a year earlier. It was the Japanese...
Friday 18 July 2025
China's chip surge pushes Japan's JS Foundry into bankruptcy after Taiwan deal stalls
JS Foundry, a Japanese contract chipmaker specializing in power semiconductors, has filed for bankruptcy with the Tokyo District Court after failing to withstand mounting pressure...