中文網
Taipei
Sat, Jun 25, 2022
12:57
partly cloudy
33°C
CONNECT WITH US
NEWS TAGGED ROHM
Friday 29 April 2022
Rohm, Delta team up for GaN power devices
Rohm Semiconductor and Delta Electronics have entered into a strategic partnership to develop and mass produce next-generation gallium nitride (GaN) power devices, according to the...
Thursday 10 February 2022
Third-gen SiC semiconductors to gain ground as EVs move toward 800V
From 2010 to 2020, Tesla set the standard for success in the electric vehicle market, but now US-based luxury battery electric vehicle (BEV) maker Lucid Motors and electric pickup...
Thursday 20 January 2022
SiC power module advantages highlighted as luxury EVs move toward 800V, 800km
Both third-generation semiconductor silicon carbide (SiC) power components and silicon-based insulated gate bipolar transistors (Si-based IGBT) are being used in electric vehicles...
Tuesday 21 December 2021
Battery EVs the main arena for SiC, says Rohm
The wide bandgap (WBG) features of third-generation semiconductors make them particularly suitable for recharging and radio frequency (RF) applications, as silicon carbide (SiC) has...
Wednesday 15 December 2021
Rohm to build facility in Malaysia to increase capacity of analog LSIs, transistors
Rohm and Rohm Wako have announced a plan to build a new production facility at its manufacturing subsidiary in Malaysia, Rohm-Wako Electronics (Malaysia) to increase production capacity...
Friday 24 September 2021
IDMs step up deployments in GaN, SiC devices
IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor...
Friday 17 September 2021
China stepping up deployments in homegrown car-use SiC modules
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Monday 13 September 2021
IDMs, Foxconn, BYD deepening deployments in GaN, SiC devices
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Thursday 26 August 2021
GaN, SiC devices in growing demand, benefiting material analysis labs
As the application market for third-generation semiconductors GaN and SiC devices is on track for rapid expansion, international IDMs including Cree, Infineon, SMT Microelectronics...
Monday 31 May 2021
Rohm to spend JPY400 billion on future expansion
Rohm will inject a total of JPY400 billion (US$3.64 billion) into its expansion through 2025, the Japan-based chip vendor disclosed in its mid-term management plan.
Friday 22 January 2021
Rohm ramping up SiC power device output
Rohm recently held an opening ceremony announcing the completion of a new building at its Apollo plant in Chikugo, Japan. The facility is to enhance the company's production capacity...
Tuesday 19 January 2021
Prices to rise 5-10% for automotive power module leadframes
Taiwan leadframe makers are likely to raise quotes for leadframes for packaging automotive chips and power modules by 5-10% to reflect increased material costs amid increasing demand...
Wednesday 6 January 2021
SiC components to fill 25% of automotive power semiconductor by 2025, says Digitimes Research
SiC (silicon carbide) components pomise great potentials in EV applications, and are expected to account for 25% of automotive power semiconductor by 2025, according to Digitimes...
Thursday 8 October 2020
Rohm rolls out ultra-compact MOSFET for automotive applications
Rohm has unveiled its ultra-compact MOSFET chips sized 1.0x1.0mm, including RV8xxx- and BSS84XHZG-series that meet AEC-Q101 reliability standards for automotive electronics applica...