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NEWS TAGGED RAPIDUS
Wednesday 7 October 2026
Rapidus adds Malaysian chip designers to its semiconductor network
Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The...
Monday 5 October 2026
Japan's strategic push to reclaim silicon supremacy with Rapidus
In a major effort to rebuild its national semiconductor industry, Japanese contract chipmaker Rapidus plans to partner with 17 domestic and international design firms to broaden its...
Thursday 24 September 2026
LSTC links with Rapidus to revive Japan's advanced chipmaking

Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans...

Friday 18 September 2026
Rumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home

If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed...

Monday 14 September 2026
Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
Fujitsu is preparing to take its advanced AI CPU overseas, with sales set to begin as early as 2027 in Japan, the US, and Asia. The company is betting on Monaka, a high-efficiency,...
Monday 24 August 2026
Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips...

Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Wednesday 12 August 2026
Japan's US$430B 2040 chip plan hinges on Rapidus 2nm

Japan has drawn up a plan for more than JPY370 trillion (approx. US$2.33 trillion) in combined public and private investment across 17 strategic...

Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
Friday 24 July 2026
Rapidus expands Hokkaido chip hub with packaging and analysis

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...

Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Friday 17 July 2026
Taiwan-Japan AI tech forum seeks closer partnerships

A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives...

Thursday 9 July 2026
AI demand pushes TSMC, Samsung to raise foundry prices — Rapidus aims to undercut 2nm

Rising demand for AI chips is changing how foundries set prices, giving TSMC and Samsung Electronics more leverage while forcing new...

Tuesday 16 June 2026
Rapidus signs UK chip pact in push for 2nm customers

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...