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NEWS TAGGED RAPIDUS
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Wednesday 12 August 2026
Japan's US$430B 2040 chip plan hinges on Rapidus 2nm

Japan has drawn up a plan for more than JPY370 trillion (approx. US$2.33 trillion) in combined public and private investment across 17 strategic...

Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
Friday 24 July 2026
Rapidus expands Hokkaido chip hub with packaging and analysis

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...

Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Friday 17 July 2026
Taiwan-Japan AI tech forum seeks closer partnerships

A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives...

Thursday 9 July 2026
AI demand pushes TSMC, Samsung to raise foundry prices — Rapidus aims to undercut 2nm

Rising demand for AI chips is changing how foundries set prices, giving TSMC and Samsung Electronics more leverage while forcing new...

Tuesday 16 June 2026
Rapidus signs UK chip pact in push for 2nm customers

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
Thursday 14 May 2026
Japan expands push to secure legacy chip supply chain

Japan is broadening its semiconductor support strategy by expanding subsidies for domestic production of legacy chips, aiming to strengthen...

Thursday 23 April 2026
Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
Monday 13 April 2026
Japan funds AI chip ecosystem around Rapidus

Japan is accelerating efforts to rebuild a domestic advanced semiconductor ecosystem, with Rapidus at the center of a state-backed push...

Thursday 9 April 2026
Why global chipmakers want to join TSMC's certified supply chain
TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's...