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REALTIME NEWS
Taiwan capacitor maker Chinsan locks in Thailand AI server capacity through 2026
Semiconductors
21min ago
NEWS TAGGED OIP ALLIANCE
Monday 16 October 2023
TSMC says OIP ecosystem collaboration brings 15 years of innovation
TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.
Thursday 27 October 2022
TSMC launches OIP 3DFabric Alliance
TSMC has announced the Open Innovation Platform (OIP) 3DFabric Alliance to help customers achieve fast implementation of silicon and system-level innovations and enable next-generation...
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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CPU shortage more acute than memory; industry awaits Intel 18A yield improvement
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
AMD's 2nm defection to Samsung dents TSMC's AI grip
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
Qualcomm moves into custom DRAM with CXMT for smartphones
Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
Samsung Foundry comeback takes shape—AI chips, HBM4 lift 4nm demand
Foxconn breach underscores rising cybersecurity threats facing Apple suppliers
Singapore pushes ASEAN semiconductor alliance as AI reshapes global supply chains
TSMC adds four executives in latest reshuffle as US investment and succession push accelerate
Full list
RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
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