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NEWS TAGGED OIP ALLIANCE
Monday 16 October 2023
TSMC says OIP ecosystem collaboration brings 15 years of innovation
TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.
Thursday 27 October 2022
TSMC launches OIP 3DFabric Alliance
TSMC has announced the Open Innovation Platform (OIP) 3DFabric Alliance to help customers achieve fast implementation of silicon and system-level innovations and enable next-generation...
BIZ FOCUS
Sep 9, 12:48
Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Friday 12 September 2025
OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
Friday 12 September 2025
WiseLink Announces $10M Bitcoin Allocation as Part of Treasury Strategy in Asia
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Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
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TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
China's YMTC moves into DRAM, teams with CXMT to target HBM market
Exclusive: Taiwan plots quantum leap with IBM, eyeing industry commercialization
Samsung gains edge as Micron falters on Nvidia's HBM4 demands
Intel–NVIDIA alliance: what it means for TSMC, AMD, Arm and the wider industry
Claude AI drives automation over collaboration as job displacement fears mount
Domestic AI chips forecast to capture over half of China's market by 2027
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